CN103786310B - A kind of IMD binder shaping mould - Google Patents

A kind of IMD binder shaping mould Download PDF

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Publication number
CN103786310B
CN103786310B CN201210434777.XA CN201210434777A CN103786310B CN 103786310 B CN103786310 B CN 103786310B CN 201210434777 A CN201210434777 A CN 201210434777A CN 103786310 B CN103786310 B CN 103786310B
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CN
China
Prior art keywords
plate
solid public
die
ejector retainner
punch
Prior art date
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Active
Application number
CN201210434777.XA
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Chinese (zh)
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CN103786310A (en
Inventor
吴伟初
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DOSHAN WANGTU HUIKENG PRINTING Co Ltd
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DOSHAN WANGTU HUIKENG PRINTING Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Priority to CN201210434777.XA priority Critical patent/CN103786310B/en
Publication of CN103786310A publication Critical patent/CN103786310A/en
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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/26Moulds
    • B29C45/263Moulds with mould wall parts provided with fine grooves or impressions, e.g. for record discs
    • B29C45/2632Stampers; Mountings thereof
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/40Removing or ejecting moulded articles
    • B29C45/4005Ejector constructions; Ejector operating mechanisms

Abstract

A kind of IMD binder shaping mould of the present invention, comprise ejector spring, thimble, ejector retainner plate, base plate, solid public plate down, Neto, die, endoporus punch, upper solid public plate and panel, ejector spring is supported and is terminated in ejector retainner plate below, ejector retainner plate is fixed with thimble, base plate is positioned at ejector retainner plate top, solid public plate is positioned at base plate top down, solid public plate arranges the groove of fixing endoporus punch down, solid public plate top arranges die down, Neto is set in die, thimble is through base plate and lower solid public plate, die top arranges holding pad, holding pad top arranges solid public plate, upper solid public plate arranges the groove of solid punch, die and holding pad arrange accommodating described punch, the groove of Neto, panel is positioned at solid public plate top, between upper solid public plate and holding pad, bounce device is set. production efficiency of the present invention is high, improves finished product rate and product quality, thereby has significantly reduced the production cost of product.

Description

A kind of IMD binder shaping mould
Technical field
The present invention relates to a kind of shaping mould, specifically, relate to the IMD binder that a kind of drawing effect is good, production efficiency is highShaping mould.
Background technology
The Chinese of IMD: decoration technique inside mold, also claims to exempt from application techniques. English name: In-MoldDecoration,IMD is surface decoration technique international in fashion at present, surface sclerosis transparent membrane, middle printing pattern layer, back side injection molded layers, oilIn the middle of China ink, can make product rub resistance, prevent that surface from being scratched, and can keep for a long time the distinctness of color to be difficult for fading.
Traditional plastic processing technology cannot meet the demand of New Times gradually, and light, thin, short and small consumer electronics producesThe new line of product and environmental consciousness, IMD technology is exactly to arise at the historic moment on this basis. Because the plurality of advantages of (IMD) is suitable forThe plastic product of 3C, household electrical appliances, LOGO inscription plate and auto parts, particularly current popular phone housing and various instrument face plate.
Early stage mould structure is simple, and plasthetics mostly is hand ejection, and its production efficiency is low, cost is higher, along with societyCan be increasing to the demand of plastic cement products, hand ejection cannot meet the needs of present suitability for industrialized production.
And when existing mould die sinking, interior de-meeting is ejected simultaneously, cause large (the stretching highly of moulding radianExceeding 6mm) product can be because of interior de-ejecting force and wrinkling around, and the stretching of final products highly exceedes 6mm and just cannot produce.
Summary of the invention
The present invention has overcome shortcoming of the prior art, and a kind of IMD binder shaping mould is provided, and its production efficiency is high,The good product consistency arriving, defect rate is low.
In order to solve the problems of the technologies described above, the present invention is achieved by the following technical solutions:
A kind of IMD binder shaping mould, comprises ejector spring, thimble, ejector retainner plate, base plate, lower solid public plate, Neto, die, pressureFlitch, endoporus punch, punch, upper solid public plate and panel, described ejector spring is supported and is terminated in described ejector retainner plate below, described ejector retainner plateBe fixed with described thimble, described base plate is positioned at described ejector retainner plate top, and described lower solid public plate is positioned at described base plate top, described underGu public plate arranges the groove of fixing described endoporus punch, described lower solid public plate top arranges described die, in described die, arrangesNeto, described thimble is through described base plate and lower solid public plate, and described die top arranges holding pad, and described holding pad top arrangesUpper solid public plate, described solid public plate arranges the groove of fixing described punch, described die and holding pad arrange accommodating described punch,The groove of Neto, described panel is positioned at described solid public plate top, and the dress of upspringing is set between described solid public plate and described holding padPut.
Further, between described ejector retainner plate and described base plate, plate is set.
Further, in described ejector retainner plate below, ejector spring, a screw rod is set, described screw rod is through described ejector retainner plate, solidBe connected to described base plate.
Further, described ejector spring bottom arranges cushion block, the affixed described screw rod of described cushion block.
Further, described plate is U-shaped plate.
Further, described ejector retainner plate both sides are provided with backing plate, and the corresponding described U-shaped plate of described backing plate is provided with storage tank.
Further, described bounce device comprises stop screw, and described stop screw upper end is fixed in described solid public plate, instituteState and on stop screw, be socketed spring.
Further, described panel arranges downward red needle, and described red needle is through described punch.
Further, the affixed downward guide pillar of described panel, described guide pillar through described solid public plate, holding pad, die withAnd lower solid public plate.
Compared with prior art, the invention has the beneficial effects as follows:
Production efficiency of the present invention is high, improves finished product rate and product quality, thereby has significantly reduced the production of productCost.
Plate plays position-limiting action, and thimble can not push up Neto, when Neto can be along with die sinking and eject, has ensuredThe sheet material forming out can not produce because of the ejecting force of Neto wrinkling around, has increased after plate, and the stretching of product is highSpend from the 6mm that can only stretch before, bring up to the highest 40mm of stretching once, and increased substantially the quality of product.
Brief description of the drawings
Accompanying drawing is used to provide a further understanding of the present invention, together with embodiments of the present invention for explaining the present invention,Be not construed as limiting the invention, in the accompanying drawings:
Fig. 1 is three-dimensional structure diagram of the present invention;
Fig. 2 is upward view of the present invention;
Fig. 3 is that the A-A of Fig. 2 is to cutaway view;
Fig. 4 is decomposition chart of the present invention.
In figure:
1---cushion block; 2---ejector spring;
3---thimble; 4---ejector retainner plate;
5---base plate; 6---lower solid public plate;
7---Neto; 8---die;
9---endoporus punch; 10---punch;
11---above solid public plate; 12---panel;
13---holding pad; 14---groove;
15---red needle; 16---screw rod;
17---guide pillar; 18---stop screw;
19---spring; 20---U-shaped plate;
21---backing plate; 22---storage tank;
23---moulding glue; 24---product.
Detailed description of the invention
Below in conjunction with accompanying drawing, the preferred embodiments of the present invention are described, should be appreciated that preferred reality described hereinExecute example only for description and interpretation the present invention, be not intended to limit the present invention.
As shown in Figures 1 to 4, a kind of IMD binder shaping mould of the present invention, comprise cushion block 1, ejector spring 2, thimble 3,Ejector retainner plate 4, base plate 5, lower solid public plate 6, Neto 7, die 8, endoporus punch 9, punch 10, upper solid public plate 11 and panel 12, ejectSpring 2 supports and terminates in ejector retainner plate 4 belows, the affixed cushion block 1 in ejector spring 2 belows, and ejector retainner plate 4 is fixed with some thimbles 3, thimble 3For Neto 7 is come from mold ejection, base plate 5 is positioned at ejector retainner plate 4 tops, and lower solid public plate 6 is positioned at base plate 5 tops, lower solid publicPlate 6 arranges the groove 14 of fixing endoporus punch 9, and endoporus punch 9 is positioned at this groove 14, and lower solid public plate 6 tops arrange die 8,The interior Neto 7 that arranges of die 8, the interior moulding glue 23 that arranges of Neto 7, forms product 24 between punch 10 and moulding glue 23, and thimble 3 passesBase plate 5, lower solid public plate 6 and Neto 7, die 8 tops arrange holding pad 13, and holding pad 13 tops arrange solid public plate 11, onGu public plate 11 arranges the groove 14 of solid punch 10, die 8 and holding pad 13 arrange the groove 14 of accommodating punch 10, Neto 7, facePlate 12 is positioned at solid public plate 11 tops, and panel 12 arranges downward red needle 15, and red needle 15 is passed punch 10, upper solid public plate 11 and pressure13 of flitch arrange bounce device. Ejector retainner plate 4 belows, the interior screw rod 16 that arranges of ejector spring 2, screw rod 16 is through ejector retainner plate 4, solidBe connected to described base plate 5.
The affixed downward guide pillar 17 of panel 12, guide pillar 17 is through upper solid public plate 11, holding pad 13, die 8 and lower solid publicPlate 6, when all parts motion, guide pillar 17 plays the effect of guiding.
Bounce device comprises stop screw 18, and public plate 11 is fixed in stop screw 18 upper ends, cover on stop screw 18Connect spring 19, punch 10 moves up under the effect of spring 19.
In the time that needs manufacture stretches highly high product 24, between ejector retainner plate 4 and base plate 5, insert U-shaped plate 20, U-shaped is insertedPlate 20 one end can be fixed on forming machine, and U-shaped plate 20 makes thimble 3 can not push up Neto 7, and what Neto 7 can be along with die sinking is sameTime and eject, increased substantially the quality of product 24.
Ejector retainner plate 4 both sides are provided with backing plate 21, and the corresponding U-shaped plate 20 of backing plate 21 is provided with storage tank 22, and U-shaped plate 20 exposes pressureForming machine is fixed in one end of material shaping mould, and U-shaped plate 20 is placed in ejector retainner plate 4 tops through the storage tank 22 on backing plate 21.
Finally it should be noted that: these are only the preferred embodiments of the present invention, be not limited to the present invention, althoughWith reference to embodiment, the present invention is had been described in detail, for a person skilled in the art, it still can be to aforementionedThe technical scheme that each embodiment records is modified, or part technical characterictic is wherein equal to replacement, but allWithin the spirit and principles in the present invention, any amendment of doing, be equal to replacement, improvement etc., all should be included in protection of the present inventionWithin scope.

Claims (5)

1. an IMD binder shaping mould, is characterized in that: comprise ejector spring, thimble, ejector retainner plate, base plate, lower solid public plate, inHolder, die, holding pad, endoporus punch, punch, upper solid public plate and panel, described ejector spring is supported and is terminated in described ejector retainner plate below,Described ejector retainner plate is fixed with described thimble, and described base plate is positioned at described ejector retainner plate top, and described lower solid public plate is positioned at described base plateTop, described lower solid public plate arranges the groove of fixing described endoporus punch, and described lower solid public plate top arranges described die, described inNeto is set in die, and described thimble is through described base plate and lower solid public plate, and described die top arranges holding pad, described binderPlate top arranges solid public plate, and described solid public plate arranges the groove of fixing described punch, and described die and holding pad arrange appearancePut the groove of described punch, Neto, described panel is positioned at described solid public plate top, between described solid public plate and described holding padBounce device is set, between described ejector retainner plate and described base plate, plate is set, in described ejector retainner plate below, ejector spring, arrange oneScrew rod, described screw rod passes described ejector retainner plate, is fixed in described base plate, and described ejector spring bottom arranges cushion block, described cushion blockAffixed described screw rod, described plate is U-shaped plate.
2. a kind of IMD binder shaping mould according to claim 1, is characterized in that: described ejector retainner plate both sides are provided with backing plate,The corresponding described U-shaped plate of described backing plate is provided with storage tank.
3. a kind of IMD binder shaping mould according to claim 1 and 2, is characterized in that: described bounce device comprises spacingScrew, described stop screw upper end is fixed in described solid public plate, on described stop screw, is socketed spring.
4. a kind of IMD binder shaping mould according to claim 1 and 2, is characterized in that: described panel arranges downward rushingPin, described red needle is through described punch.
5. a kind of IMD binder shaping mould according to claim 1 and 2, is characterized in that: affixed downward the leading of described panelPost, described guide pillar is through described solid public plate, holding pad, die and lower solid public plate.
CN201210434777.XA 2012-11-02 2012-11-02 A kind of IMD binder shaping mould Active CN103786310B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201210434777.XA CN103786310B (en) 2012-11-02 2012-11-02 A kind of IMD binder shaping mould

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Application Number Priority Date Filing Date Title
CN201210434777.XA CN103786310B (en) 2012-11-02 2012-11-02 A kind of IMD binder shaping mould

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CN103786310A CN103786310A (en) 2014-05-14
CN103786310B true CN103786310B (en) 2016-05-18

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Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105643909A (en) * 2014-11-05 2016-06-08 佛山市王土汇铿印刷有限公司 Mold assembly for reverse edge covering

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1897669A1 (en) * 2005-06-29 2008-03-12 Nissha Printing Co., Ltd. Die for injection compression molding
CN101357500A (en) * 2007-07-31 2009-02-04 深圳市群达行精密模具有限公司 Inset decoration injection molding method and film hot compacting and cutting integration mold
CN202021768U (en) * 2011-04-21 2011-11-02 浙江大安装饰件有限公司 Mold for IMD (in-mold decoration) injection molding
CN202895599U (en) * 2012-11-02 2013-04-24 佛山市王土汇铿印刷有限公司 In-mold decoration (IMD) pressing forming die

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1897669A1 (en) * 2005-06-29 2008-03-12 Nissha Printing Co., Ltd. Die for injection compression molding
CN101357500A (en) * 2007-07-31 2009-02-04 深圳市群达行精密模具有限公司 Inset decoration injection molding method and film hot compacting and cutting integration mold
CN202021768U (en) * 2011-04-21 2011-11-02 浙江大安装饰件有限公司 Mold for IMD (in-mold decoration) injection molding
CN202895599U (en) * 2012-11-02 2013-04-24 佛山市王土汇铿印刷有限公司 In-mold decoration (IMD) pressing forming die

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