CN103785991A - Plane welding method for large-area copper plates - Google Patents
Plane welding method for large-area copper plates Download PDFInfo
- Publication number
- CN103785991A CN103785991A CN201210424518.9A CN201210424518A CN103785991A CN 103785991 A CN103785991 A CN 103785991A CN 201210424518 A CN201210424518 A CN 201210424518A CN 103785991 A CN103785991 A CN 103785991A
- Authority
- CN
- China
- Prior art keywords
- copper coin
- plane
- copper
- welding
- large area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/18—Sheet panels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/12—Copper or alloys thereof
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Abstract
The invention discloses a plane welding method for large-area copper plates. The large-area copper plates comprise two copper plates and a soldering flux. The method comprises the welding steps: firstly, finishing, grinding and polishing the planar surfaces of the two large-area copper plates, and washing impurities including powder on the surfaces; secondly, uniformly spraying the alloy soldering flux on the upper plane of a lower copper plate; thirdly, regularly overlapping the lower plane of the upper copper plate and the upper plane of the lower copper plate, and pressing and horizontally placing the soldering flux in a special plane furnace for the vacuum welding of the large-area copper plates; fourthly, heating the special plane furnace for the vacuum welding of the large-area copper plates, so as to uniformly and integrally weld the two copper plates; and fifthly, stopping heating the special plane furnace for the vacuum welding of the large-area copper plates, and naturally cooling the integral large-area copper plate to room temperature along with the special plane furnace for the vacuum welding of the large-area copper plates. The integral large-area copper plate is taken out from the furnace, so as to clear solder burrs on the peripheral edges of the integral large-area copper plate, grinding and polishing. The plane welding method is used for an HL-2M controlled nuclear fusion research experimental apparatus.
Description
Technical field
The present invention relates to a kind of conductor welding method, especially larger areas of copper board plane welding method.
Background technology
At present, known welding method, what relate to is the cross section welding of weldment, or the facet welding method of weldment.
Summary of the invention
Develop rapidly in order to adapt to modern science and technology, the active demand of scientific experiment, production practices, the invention provides a kind of larger areas of copper board plane welding method, novel, reasonable in design, method is feasible, firm welding, meets HL-2M controlled nuclear fusion research experiment device completely.
The present invention solves the new solution that its technical problem adopts: larger areas of copper board plane welding method, is made up of upper copper coin, lower copper coin, scolder.Welding step is:
1st, by the plane surface fine finishining of copper coin, lower copper coin in large area, polish, polishing, the foreign material such as lip-deep powder are cleaned up;
2nd, by solder: tin 95-97%, silver-colored 3-5%, mix, stir, be sprinkled upon equably on the upper plane surface of lower copper coin: 0.3-0.5mm;
3rd, the lower plane surface of upper copper coin and the upper plane surface stack of lower copper coin are neatly coincided together, compress scolder, lie in a horizontal plane in Special vacuum welding larger areas of copper board plane stove;
4th, in overall large area copper coin is housed Special vacuum welding larger areas of copper board plane stove heat: 280-300 ℃, time: 15-20 minute, makes copper coin and lower copper coin in large area be welded into equably an entirety;
5th, the Special vacuum welding larger areas of copper board plane stove that stops being internally equipped with overall large area copper coin is heated, entirety large area copper coin naturally cools to normal temperature with Special vacuum welding larger areas of copper board plane stove, overall large area copper coin is taken out in Special vacuum welding larger areas of copper board plane stove, remove scolder burr on overall large area copper coin edge, polish, polishing.
Remarkable beneficial effect of the present invention is, large area copper coin and scolder be in Special vacuum welding larger areas of copper board plane stove entirety, simultaneously, evenly heat be heated, welding, cooling, be out of shape very littlely, be not oxidized with air is isolated, weld even, firm, firm.
Accompanying drawing explanation
Fig. 1 is D structure schematic diagram of the present invention.
In figure: 1, upper copper coin 1 ', lower copper coin 2, scolder
The specific embodiment
Below in conjunction with drawings and Examples, the invention will be further described.
In Fig. 1, by upper copper coin 1, lower copper coin 1 ', the larger areas of copper board plane welding method that forms of scolder 2.Welding step is:
1st, by copper coin in large area 1, lower copper coin 1 ' plane surface fine finishining, polish, polishing, the foreign material such as lip-deep powder are cleaned up;
2nd, by solder: tin 96.5%, silver 3.5%, mix, stir, be sprinkled upon equably lower copper coin 1 ' upper plane surface on: 0.4mm;
3rd, by the lower plane surface of upper copper coin 1 and lower copper coin 1 ' upper plane surface stack neatly coincide together, compress scolder, lie in a horizontal plane in Special vacuum welding larger areas of copper board plane stove;
4th, in overall large area copper coin is housed Special vacuum welding larger areas of copper board plane stove heat: 295 ℃, the time: 18 minutes, make an entirety of copper coin 1 and lower copper coin 1 in large area ' be welded into equably;
5th, the Special vacuum welding larger areas of copper board plane stove that stops being internally equipped with overall large area copper coin is heated, entirety large area copper coin naturally cools to normal temperature with Special vacuum welding larger areas of copper board plane stove, overall large area copper coin is taken out in Special vacuum welding larger areas of copper board plane stove, remove scolder burr on overall large area copper coin edge, polish, polishing.
Claims (2)
1. a larger areas of copper board plane welding method, is characterized in that: it comprises: upper copper coin (1), lower copper coin (1 ') scolder (2).
2. larger areas of copper board plane welding method according to claim 1, is characterized in that: welding step is:
1st, by the plane surface fine finishining of copper coin in large area (1), lower copper coin (1 '), polish, polishing, the foreign material such as lip-deep powder are cleaned up;
2nd, by solder: tin 95-97%, silver-colored 3-5%, mix, stir, be sprinkled upon equably on the upper plane surface of lower copper coin (1 '): 0.3-0.5mm;
3rd, the lower plane surface of upper copper coin (1) and the upper plane surface stack of lower copper coin (1 ') are neatly coincided together, compress scolder, lie in a horizontal plane in Special vacuum welding larger areas of copper board plane stove;
4th, in overall large area copper coin is housed Special vacuum welding larger areas of copper board plane stove heat: 280-300 ℃, time: 15-20 minute, makes copper coin in large area (1) and lower copper coin (1 ') be welded into equably an entirety;
5th, the Special vacuum welding larger areas of copper board plane stove that stops being internally equipped with overall large area copper coin is heated, entirety large area copper coin naturally cools to normal temperature with Special vacuum welding larger areas of copper board plane stove, overall large area copper coin is taken out in Special vacuum welding larger areas of copper board plane stove, remove scolder burr on overall large area copper coin edge, polish, polishing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210424518.9A CN103785991A (en) | 2012-10-27 | 2012-10-27 | Plane welding method for large-area copper plates |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210424518.9A CN103785991A (en) | 2012-10-27 | 2012-10-27 | Plane welding method for large-area copper plates |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103785991A true CN103785991A (en) | 2014-05-14 |
Family
ID=50662274
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210424518.9A Pending CN103785991A (en) | 2012-10-27 | 2012-10-27 | Plane welding method for large-area copper plates |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103785991A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105057984A (en) * | 2015-08-10 | 2015-11-18 | 中国原子能科学研究院 | Method for improving deformation resistance of copper workpiece |
| WO2021056778A1 (en) * | 2019-09-25 | 2021-04-01 | 烟台台芯电子科技有限公司 | Welding process for cladding copper on back surface of wafer |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0747476A (en) * | 1993-08-09 | 1995-02-21 | Honda Motor Co Ltd | Resistance welding method for each copper |
| JPH10193135A (en) * | 1997-01-16 | 1998-07-28 | Hitachi Cable Ltd | Joining method for metallic member |
| CN2555974Y (en) * | 2002-11-05 | 2003-06-18 | 王承东 | Large piece white steel composite plate |
| CN101543934A (en) * | 2009-03-12 | 2009-09-30 | 宁波江丰电子材料有限公司 | Target material structure and method for producing the same |
| CN101648303A (en) * | 2009-05-08 | 2010-02-17 | 宁波江丰电子材料有限公司 | Welding method of target materials and back plates |
| CN103177798A (en) * | 2011-12-22 | 2013-06-26 | 泰科电子日本合同会社 | Flexible conductor and method of manufacturing the flexible conductor |
-
2012
- 2012-10-27 CN CN201210424518.9A patent/CN103785991A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0747476A (en) * | 1993-08-09 | 1995-02-21 | Honda Motor Co Ltd | Resistance welding method for each copper |
| JPH10193135A (en) * | 1997-01-16 | 1998-07-28 | Hitachi Cable Ltd | Joining method for metallic member |
| CN2555974Y (en) * | 2002-11-05 | 2003-06-18 | 王承东 | Large piece white steel composite plate |
| CN101543934A (en) * | 2009-03-12 | 2009-09-30 | 宁波江丰电子材料有限公司 | Target material structure and method for producing the same |
| CN101648303A (en) * | 2009-05-08 | 2010-02-17 | 宁波江丰电子材料有限公司 | Welding method of target materials and back plates |
| CN103177798A (en) * | 2011-12-22 | 2013-06-26 | 泰科电子日本合同会社 | Flexible conductor and method of manufacturing the flexible conductor |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105057984A (en) * | 2015-08-10 | 2015-11-18 | 中国原子能科学研究院 | Method for improving deformation resistance of copper workpiece |
| WO2021056778A1 (en) * | 2019-09-25 | 2021-04-01 | 烟台台芯电子科技有限公司 | Welding process for cladding copper on back surface of wafer |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140514 |