CN103781611A - Method for producing resin composite molded body and resin composite molded body - Google Patents
Method for producing resin composite molded body and resin composite molded body Download PDFInfo
- Publication number
- CN103781611A CN103781611A CN201280043230.5A CN201280043230A CN103781611A CN 103781611 A CN103781611 A CN 103781611A CN 201280043230 A CN201280043230 A CN 201280043230A CN 103781611 A CN103781611 A CN 103781611A
- Authority
- CN
- China
- Prior art keywords
- forming body
- shot forming
- insulation layer
- thermal insulation
- mould
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/72—Heating or cooling
- B29C45/73—Heating or cooling of the mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/02—Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means
- B29C2033/023—Thermal insulation of moulds or mould parts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
- B29C2945/76—Measuring, controlling or regulating
- B29C2945/76494—Controlled parameter
- B29C2945/76531—Temperature
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
- B29C2945/76—Measuring, controlling or regulating
- B29C2945/76494—Controlled parameter
- B29C2945/76618—Crystallinity
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/16—Making multilayered or multicoloured articles
- B29C45/1657—Making multilayered or multicoloured articles using means for adhering or bonding the layers or parts to each other
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2081/00—Use of polymers having sulfur, with or without nitrogen, oxygen or carbon only, in the main chain, as moulding material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0037—Other properties
- B29K2995/0041—Crystalline
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Provided is a technique such that, in the production of a resin composite molded body by means of a double-layer molding method, even when using a crystalline thermoplastic resin, it is possible to sufficiently increase the degree of crystallization of the crystalline thermoplastic resin even without performing heat treatment on the resin composite molded body, while increasing the adhesion force between a primary molded body and a secondary molded body. A primary molded body used in the double-layer molding is produced using an insulated runner mold, wherein an insulating layer is formed at a portion of the cavity surface, with the condition that the mold temperature is no greater than 10 DEG C less than the cold crystallization temperature (Tc1) of the crystalline resin configuring the primary molded body.
Description
Technical field
The present invention relates to manufacture method and the resin molding compound body of resin molding compound body.
Background technology
Crystalline thermoplastic resin is because physical property such as generally having excellent mechanical strength, heat resistance, chemical proofing, electrical characteristics is widely used as the raw material of the parts of automotive part, electronics electronic unit, chemical machinery etc.
As mentioned above, the resin-formed body take crystalline thermoplastic resin as raw material is used as the parts of various uses, according to the difference of parts, for having the reasons such as complicated shape, sometimes multiple resin-formed bodies is engaged to manufacture.As joint method, known have the joint based on bonding agent, the mechanical engagement based on bolt etc. etc.
But, in the situation of the method that use bonding agent engages, exist the cost of bonding agent high, cannot fully improve the problems such as adhesive strength.In addition, use in the situation of the method that bolt etc. engages, expenses, fixing bothersome, weight increase etc. becomes problem.
On the other hand, for injection moulding welding (the double method of forming etc.), laser welding, hot plate welding, vibration welded, ultrasonic fusing etc., it can engage with the short time, and, do not use bonding agent, metal parts, therefore can not produce the problems such as consumed cost, weight increase, environmental pollution.In the middle of above-mentioned welding process, particularly the injection moulding welding such as double method of forming is owing to engaging with one-shot forming body in the moulding of post forming body, and therefore productivity ratio is high.But, while using crystalline thermoplastic resin, there is the dhering strength tendency on the low side of one-shot forming body and post forming body.
Therefore, following technology is disclosed in patent documentation 1: the mode reducing with the degree of crystallinity of the crystalline thermoplastic resin that contains in one-shot forming body is adjusted, and improves the dhering strength of one-shot forming body and post forming body.The technology of recording according to patent documentation 1, even in the situation that using crystalline thermoplastic resin, also can improve the dhering strength of one-shot forming body and post forming body.
Prior art document
Patent documentation
Patent documentation 1: Japanese kokai publication hei 06-47830 communique
Summary of the invention
the problem that invention will solve
But, in the technology of recording at patent documentation 1, one-shot forming body in resin molding compound body is noncrystalline state, or is the degree of crystallinity state lower than desired degree of crystallinity of the crystalline thermoplastic resin that contains in the one-shot forming body in resin molding compound body.For this is compensated, there is pair resin molding compound body to carry out heat treated to improve the method for above-mentioned degree of crystallinity, but the resin molding compound that the technology of recording by patent documentation 1 obtains know from experience the change in size occurring when heat treated large, the problem, the method for not solving in prior art such as in the time of heat treated, crack.
The object of the present invention is to provide a kind of technology, it is in the process based on double method of forming manufacture resin molding compound body, even if also can improve the closing force of one-shot forming body and post forming body in the situation that using crystalline thermoplastic resin, even and if also can fully not improve the degree of crystallinity of crystalline thermoplastic resin to the above-mentioned this heat treatment of resin molding compound body enforcement.
for the scheme of dealing with problems
The inventor etc. conduct in-depth research repeatedly in order to address the above problem.Found that, in the time that a part for the cavity surface of mould forms thermal insulation layer and use this mould to manufacture resin-formed body, can in resin-formed body, form region and the high region of degree of crystallinity that degree of crystallinity is low.Based on this understanding, if use in a part for cavity surface be formed with the heat insulation mould of thermal insulation layer, in mold temperature for forming the cold crystallization temperature (T of crystalline resin of one-shot forming body
c1under ℃ following condition of)-10, manufacture the one-shot forming body for double moulding, only have required part to become the state that degree of crystallinity is low, the major part of resin-formed body is the state that degree of crystallinity fully improves, thus, even in the inferior exposure of hot environment, the change in size being caused by the crystallization of crystalline thermoplastic resin is also less.Found that, can control the problem of the generations such as crackle, can address the above problem, thereby complete the present invention.More specifically, the invention provides following technical scheme.
(1) a kind of manufacture method of resin molding compound body, it is characterized in that, described resin molding compound body possesses the one-shot forming body being obtained by the moulding of crystalline thermoplastic resin combination, and have and the post forming body at second junction surface that the first junction surface engages, part surface of aforementioned one-shot forming body, the method comprises following operation: aforementioned one-shot forming body is configured on mould, to the thermoplastic resin composition who injects molten condition in mould, thereby manufacture and engage with aforementioned the second junction surface the resin molding compound body forming by aforementioned the first junction surface, aforementioned one-shot forming body is to use the heat insulation mould that is formed with thermal insulation layer in a part for cavity surface, be the cold crystallization temperature (T that forms the crystalline resin of aforementioned one-shot forming body in mold temperature
c1under the following condition in)-10 ℃, manufacture, aforementioned thermal insulation layer is formed on: aforementioned cavity surface, except the part contacting with pre-composition surface roughly whole upper, this pre-composition surface is the presumptive area at aforementioned the first junction surface of formation.
(2), according to the manufacture method of the resin molding compound body (1) described, wherein, aforementioned post forming body is to be the cold crystallization temperature (T that forms the crystalline thermoplastic resin of aforementioned post forming body in mold temperature
c1under ℃ above condition of)+10, manufacture.
(3) according to the manufacture method of the resin molding compound body (1) or (2) described, wherein, aforementioned one-shot forming body is made up of poly arylidene thio-ester based resin composition.
(4) according to the manufacture method of the resin molding compound body (3) described, wherein, aforementioned one-shot forming body is to be to manufacture under the condition below 100 ℃ in the mold temperature of aforementioned heat insulation mould.
(5) a resin molding compound body, it is by the method manufacture described in any one in (1)～(4).
the effect of invention
According to the present invention, in the process based on double method of forming manufacture resin molding compound body, even if also can improve the closing force of one-shot forming body and post forming body in the situation that using crystalline thermoplastic resin, even and if the degree of crystallinity that also can fully improve crystalline thermoplastic resin such as do not heat-treat.When degree of crystallinity is fully enhanced, even in the inferior exposure of hot environment, the change in size being caused by the crystallization of crystalline thermoplastic resin is also less, thereby the problem such as can not crack.
Accompanying drawing explanation
Fig. 1 is the figure that schematically shows the resin molding compound body that following explanation uses, and (a) is stereogram, is (b) MM cutaway view.
Fig. 2 is the figure that schematically shows one-shot forming body, post forming body, (a) is the upward view that schematically shows one-shot forming body, is (b) top view that schematically shows post forming body.
Fig. 3 schematically shows as the formed body of the one-shot forming body of present embodiment with for the manufacture of the figure of the mould of this formed body, (a) being the figure that schematically shows the bottom surface of the one-shot forming body before integrated with post forming body, is (b) cutaway view for the manufacture of the die cavity of the heat insulation mould of one-shot forming body.
Fig. 4 is the cutaway view schematically showing for the manufacture of the die cavity of the mould of the post forming body of present embodiment.
Fig. 5 is the figure that schematically shows the resin molding compound body of manufacturing in Embodiment B, (a) is stereogram, is (b) NN cutaway view.
Fig. 6 is the figure schematically showing as the formed body of the raw material of one-shot forming body, (a) is stereogram, is (b) OO cutaway view.
The specific embodiment
Below embodiments of the present invention are described.It should be noted that, the present invention is not limited to following embodiment.
Manufacture method of the present invention is to manufacture the method for one-shot forming body and the integrated resin molding compound body of post forming body by the double method of forming.
One of feature of the present invention is the manufacture method of one-shot forming body, as the double method of forming, can adopt conventional method.Below, with possess tabular one-shot forming body and discoid post forming body resin molding compound body be fabricated to example come the present invention will be described.It should be noted that, although describe as an example of the formed body of simple shape example, how manufacture method of the present invention no matter one-shot forming body, post forming shape all can be implemented.
Fig. 1 is the figure that schematically shows the resin molding compound body that following explanation uses, and (a) is stereogram, is (b) MM cutaway view.As shown in Figure 1, resin molding compound body 1 possesses tabular one-shot forming body 10 and discoid post forming body 20, and one-shot forming body 10 forms by junction surface 2 is integrated with post forming body 20.
(a) of Fig. 2 is the upward view that schematically shows one-shot forming body 10, and (b) of Fig. 2 is the top view that schematically shows post forming body 20.One-shot forming body 10 possesses the first junction surface 101 engaging with post forming body 20.In the present embodiment, the first junction surface 101 is scopes that the dotted line in (a) of Fig. 2 is irised out.On the other hand, post forming body 20 has the second junction surface 201 engaging with one-shot forming body 10.In the present embodiment, the second junction surface 201 is depicted as whole of the circular end face of discoid post forming body as Fig. 2 (b).Form junction surface 2 by the first junction surface 101 and the second junction surface 201.
The roughly flow process of the manufacture method of above-mentioned resin molding compound body 1 is as follows: first, manufacture one-shot forming body 10, then, this one-shot forming body 10 is configured on mould, finally, in mould, inject thermoplastic resin composition, thereby in moulding post forming body 20, make one-shot forming body 10 and post forming body 20 integrated.
In the present invention, manufacture one-shot forming body 10 owing to using following methods, therefore in improving the dhering strength of one-shot forming body 10 and post forming body 20, even if the post processing such as do not heat-treat and also can form the high state of degree of crystallinity of one-shot forming body 10.
[manufacture method of one-shot forming body]
One-shot forming body 10 be use in a part for cavity surface be formed with the heat insulation mould of thermal insulation layer, in mold temperature for forming the cold crystallization temperature (T of crystalline resin of one-shot forming body 10
c1under ℃ following condition of)-10, manufacture.Cold crystallization temperature (T
c1) refer to the temperature of carrying out crystallization by the time that the resin of the inadequate state compacted under of crystallization heats up.Cold crystallization temperature (T
c1) can obtain as follows: the resin of melting is cooling rapidly, solidify and pulverize, it is used to differential scanning heat measurement instrument (DSC), flex point or the crystallization exothermal peak of the heat curve while intensification by the speed with 10 ℃/min are obtained.In addition, die cavity refers to the whole space of mould inside for potting resin.
First, the material that forms one-shot forming body 10 is described.The present invention is the invention that solves the problem occurring in the time using crystalline thermoplastic resin.Therefore, one-shot forming body 10 is made up of crystalline thermoplastic resin combination.
Crystalline thermoplastic resin combination comprises crystalline thermoplastic resin.In the present invention, the kind of crystalline thermoplastic resin is not particularly limited, can uses the crystalline thermoplastic resins such as mylar such as the polyarylene sulfide resins such as polyphenylene sulfide, polybutylene terephthalate (PBT) resin.In addition, also can be used in combination multiple crystalline thermoplastic resin.Especially, while using the polyarylene sulfide resins such as polyphenylene sulfide, there is the closely sealed tendency dying down between resin-formed body, and according to the present invention, even in the case of using this polyarylene sulfide resin composition that is difficult to form tough joint, also can fully improve the bond strength between resin-formed body.
In addition, crystalline thermoplastic resin combination can contain the additives such as other resins, existing known various inorganic organic fillers, fire retardant, ultra-violet absorber, heat stabilizer, light stabilizer, colouring agent, carbon black, releasing agent, plasticizer in the scope of damaging not significantly effect of the present invention.In addition, crystalline thermoplastic resin combination can be also only contain trace impurity etc., the thermoplastic resin composition that formed by crystalline resin substantially.
Then, the concrete manufacture method of one-shot forming body is described.(a) of Fig. 3 schematically shows the bottom surface with the integrated one-shot forming body 10 before of post forming body, and (b) of Fig. 3 schematically shows the section for the manufacture of the die cavity of the heat insulation mould 3 of one-shot forming body 10.
In the time that existing conduct integrated with post forming body 20, the surface of the one-shot forming body 10 shown in (a) of Fig. 3 is used to form the pre-composition surface F in the region at the first junction surface 101
1with except above-mentioned pre-composition surface F
1region F in addition
2.
In the present embodiment, in the cavity surface of heat insulation mould 3 with pre-composition surface F
1contact part do not form thermal insulation layer 31, with region F
2the roughly whole face of contact is formed with thermal insulation layer 31.Even thermal insulation layer 31 if thermal conductivity low, have with the thermoplastic resin composition of high temperature and contact the heat resistance that also can not produce the degree of rough sledding, the material of formation thermal insulation layer 31 is not particularly limited.In addition, roughly whole face comprises whole, is whole in present embodiment.
As the material that meets the desired heat resistance of thermal insulation layer 31 and thermal conductivity, can list: the resin that the heat resistances such as polyimide resin are high, thermal conductivity is low, the porous ceramics such as porous zirconia.Below these materials are described.
As the object lesson of polyimide resin, can list: PMA (PMDA) quasi-polyimide, biphenyltetracarboxyacid acid quasi-polyimide, the polyamidoimide that uses trimellitic acid, bismaleimide amine resins (BMI/triazines etc.), benzophenone tetrabasic carboxylic acid quasi-polyimide, acetylene end polyimides, TPI etc.Wherein, be particularly preferably the thermal insulation layer being formed by polyimide resin.As the preferred material beyond polyimide resin, for example, can list TFE etc.In addition, thermal insulation layer can contain resin, the additive etc. except polyimide resin, TFE in the scope of not damaging effect of the present invention.
The method that cavity surface at heat insulation mould 3 is formed to the thermal insulation layer 31 of polyimide resin is not particularly limited.For example preferably by following method at the interior formation thermal insulation layer 31 of heat insulation mould 3.
Can list: can form the solution coat of the polymer precursors such as the polyimide precursor of macromolecule thermal insulation layer at the metal covering of the expectation of heat insulation mould 3, heating makes solvent evaporation, and then heat and carry out polymerization materialization, form thus the method for the thermal insulation layers such as polyimide film 31; Make the method for the high molecular monomer of heat resistance, for example PMA acid anhydride and 4,4-diamino-diphenyl ether vapor deposition polymerization; Or, for the mould of flat shape, use the macromolecule thermal isolation film of suitable adhering method or bonding band shape macromolecule thermal isolation film to be attached to the expectation part of the metal covering of heat insulation mould 3, form the method for thermal insulation layer 31.In addition, also can form polyimide film, and then be chromium (Cr) film, titanium nitride (TiN) film of dura mater in its surface formation as metal.
The thermal insulation layer 31 being made up of above-mentioned resin requires the thermal conductivity that has can be according to purposes etc. and different, but is particularly preferably below 2W/mK.It should be noted that, above-mentioned thermal conductivity adopts the value obtaining by the method for recording in embodiment.
Thickness to thermal insulation layer 31 is not particularly limited, and can suitably set preferred thickness according to the material, the shape of formed body etc. that use.When thermal insulation layer 31 is made up of polyimide resin, if the thickness of thermal insulation layer 31 is more than 20 μ m, can obtain sufficiently high effect of heat insulation, therefore preferably.The thickness that is formed at the thermal insulation layer 31 of the cavity surface of above-mentioned heat insulation mould 3 can be uniformly, also can comprise the position that thickness is different.
In addition, as zirconia contained in porous zirconia, be not particularly limited, stabilized zirconia, partially stabilized zirconia, stabilized zirconia all can not.Stabilized zirconia refers to the at room temperature also material of stabilisation of cubic crystal zirconia, the mechanical properties such as intensity and toughness, abrasion performance excellence.In addition, partially stabilized zirconia refers at room temperature also some residual state of regular crystal zirconia, while being subject to external stress, can occur from regular crystal to monoclinic martensite transfor mation, particularly can suppress the be full of cracks aggravating due to the effect of tensile stress growth, there is high Po Huai Tough.In addition, stabilized zirconia does not refer to the zirconia of not using stabilization agent stabilisation.It should be noted that, can be used in combination be selected from stabilized zirconia, partially stabilized zirconia and not in stabilized zirconia at least two or more.
As the stabilization agent containing in stabilized zirconia, partially stabilized zirconia, can adopt existing known conventional substances.For example can list: yittrium oxide, cerium oxide, magnesia etc.Consumption to stabilization agent is also not particularly limited, and its consumption can suitably be set according to purposes, use material etc.
In addition, also can use porous zirconia porous ceramics in addition, porous zirconia durability compared with other porous ceramics is high.Therefore, be formed with the heat insulation mould 3 of the thermal insulation layer 31 being made up of porous zirconia if used, be not easy to produce the rough sledding such as distortion of thermal insulation layer 31, therefore, the quantity of products formed that can carry out continuously moulding is many, and the productivity ratio of products formed is very high.
For the raw material that is used to form thermal insulation layer 31, not damaging in the scope of effect of the present invention, except above-mentioned zirconia, stabilization agent, can also contain existing known additive etc.
The method that uses above-mentioned raw materials to form thermal insulation layer 31 is not particularly limited, preferably adopts metallikon.By adopting metallikon, easily the thermal conductivity of porous zirconia is adjusted to desired scope.In addition, also can the problem such as significantly not reduce because the inside at porous zirconia excessively forms mechanical strength that bubble produces thermal insulation layer.By so utilizing spraying plating to form thermal insulation layer 31, the structure of thermal insulation layer 31 can become and be suitable for purposes of the present invention.
The formation of the thermal insulation layer 31 based on spraying plating for example can be carried out as follows.First, make raw materials melt become liquid.Make this liquid accelerate and collide the metal covering of the expectation of heat insulation mould 3.Finally, make collision and be attached to the expectation of heat insulation mould 3 metal covering raw material solidify.So, form very thin thermal insulation layer 31 at the metal covering of the expectation of heat insulation mould 3.By further making the raw material of melting collide and be solidificated on the thermal insulation layer 31 that this is very thin, can adjust the thickness of thermal insulation layer 31.Wherein, make the curing method of raw material can use existing known cooling way, also can it be solidified by simple placement.In addition, method of spray plating is not particularly limited, can from the existing known methods such as arc spraying, plasma spraying, flame coating, suitably selects preferred method.
The thermal conductivity of the thermal insulation layer 31 being made up of porous ceramics can be according to suitable adjustment such as the purposes of products formed.In the present invention, be preferably below 2W/mK, more preferably more than 0.3W/mK and below 2W/mK.If thermal conductivity is more than 0.3W/mK, the strength decreased that the thermal insulation layer 31 too much causing due to the bubble in thermal insulation layer 31 can occur hardly causes the productivity ratio of injection-molded article significantly to reduce, therefore preferably.Especially, if the thermal conductivity of thermal insulation layer 31 is more than 0.7W/mK, existence meeting is suppressed at the strength decreased of the thermal insulation layer too much being caused by the bubble in thermal insulation layer 31 31 tendency of very little scope, therefore preferably.It should be noted that, above-mentioned thermal conductivity adopts the value obtaining by the assay method of recording in embodiment.In addition, in the time that thermal insulation layer forms sandwich construction, the thermal conductivity (λ) of thermal insulation layer can be obtained as follows: obtain low-density layer and high-density layer thermal conductivity separately, if the thermal conductivity of low-density layer is that (λ l), the thermal conductivity of high-density layer is for (λ h), the thickness of low-density layer is with respect to the ratio of the thickness of thermal insulation layer entirety during for (t), use the formula of [1/ λ]=[t/ λ l]+[(1-t)/λ h] to calculate, obtain thus.
Thickness when thermal insulation layer 31 is made up of porous zirconia, thermal insulation layer 5 is not particularly limited, more than being preferably 200 μ m, more preferably more than 500 μ m and below 1000 μ m.More than 500 μ m, the intensity of zirconia thermal insulation layer increases if, therefore preferably.In addition, if the thickness of thermal insulation layer 31 is below 1000 μ m, molding cycle can be not elongated, therefore preferably.
The method that uses the heat insulation mould 3 of making described above to manufacture one-shot forming body is specifically described.
To the crystalline thermoplastic resin combination of the interior injection molten condition of heat insulation mould 3.The part contacting with thermal insulation layer 31 for crystalline thermoplastic resin combination in heat insulation mould 3, molten condition, the heat that the crystalline thermoplastic resin combination of molten condition has is not easy to be discharged to outside heat insulation mould 3.And the part not contacting with thermal insulation layer 31 for the crystalline thermoplastic resin combination of molten condition (part contacting with pre-composition surface F1), the heat that the crystalline thermoplastic resin combination of molten condition has is easily discharged to outside heat insulation mould 3.
For the part contacting with thermal insulation layer 31, the heat having due to the crystalline thermoplastic resin combination of molten condition is not easy to be discharged to outside heat insulation mould 3, and therefore the crystalline thermoplastic resin combination of molten condition can slowly solidify.As a result, the part contacting with thermal insulation layer 31 can be cured under the state of degree of crystallinity that has fully improved crystallinity thermoplastic resin.
For the part contacting with the metal covering that does not form thermal insulation layer 31 of heat insulation mould 3, the heat having due to the crystalline thermoplastic resin combination of molten condition is easily discharged to outside heat insulation mould 3, therefore near its contact-making surface, the crystalline thermoplastic resin combination of molten condition is by cooling rapidly.As a result, under the state that the above-mentioned part not contacting with thermal insulation layer 31 can fully not improve in the degree of crystallinity of crystalline thermoplastic resin, be cured.
Want to be divided into as mentioned above high part and the low part of degree of crystallinity of degree of crystallinity of crystalline thermoplastic resin, mold temperature need to be adjusted to the cold crystallization temperature (T of crystalline thermoplastic resin
c1below)-10 ℃.More preferably (T
c1)-80 ℃ above and (T
c1below)-20 ℃.In the time that crystalline thermoplastic resin combination contains crystalline resin of more than two kinds, can decide according to the crystalline thermoplastic resin of main component the condition of mold temperature here.
Especially,, in the time using polyarylene sulfide resin composition as crystalline thermoplastic resin combination, can make mold temperature is below 100 ℃.Be below 100 ℃ owing to can making mold temperature, therefore can carry out the temperature adjustment of mould for water.
By using above-mentioned this heat insulation mould 3 and carry out moulding under the condition of specific mold temperature, can form the low state of degree of crystallinity of the crystalline thermoplastic resin at F1 place, pre-composition surface.Due to the easy melting of the low part of degree of crystallinity, contact with this part with molten condition if be therefore used to form the thermoplastic resin composition of post forming body, can form firmly junction surface.
As mentioned above, in the present embodiment, in the mould 3 for the manufacture of one-shot forming body 10, the part that can contact with the pre-composition surface F1 of one-shot forming body 10 does not all form thermal insulation layer 31.Although it is effective for improving one-shot forming body 10 with the bond strength of post forming body 20 that this pre-composition surface F1 does not all form the mode of thermal insulation layer, even if but existing the part that is formed with thermal insulation layer also can fully improve bond strength, preferably also form thermal insulation layer 31 in a part of pre-composition surface F1 in a part of pre-composition surface F1.This be due to, the area that is formed with thermal insulation layer 31 in the area of the whole cavity surface of mould 3 is larger, the region that the degree of crystallinity of the crystalline thermoplastic resin of one-shot forming body inside has fully improved is larger, and change in size when one-shot forming body 10 is exposed to high temperature is less.
In addition, in the present embodiment, in the cavity surface of the mould 3 for the manufacture of one-shot forming body 10 with other faces F
2the whole face of part of contact is formed with thermal insulation layer 31.This thermal insulation layer 31 is for form the region of the degree of crystallinity that has fully improved crystallinity thermoplastic resin at one-shot forming body 10, in the time above-mentioned degree of crystallinity can being increased to desired degree, even with other faces F
2the part of contact also can not arrange thermal insulation layer 31.Here, degree of crystallinity refers to fully: use and do not form the mould of thermal insulation layer and the condition of mold temperature is set as to T
c1the degree of crystallinity of+15 ℃ of resins of crystalline thermoplastic when crystalline thermoplastic resin combination is carried out to moulding.
In addition, in the present embodiment, one-shot forming body 10 only engages with post forming body with the junction surface 2 at a place, but also can there be many places at junction surface 2, in addition, can also be that multiple formed bodys engage with one-shot forming body 10.In the situation that multiple formed bodys engage with one-shot forming body 10, as long as the part contacting with the following part of one-shot forming body 10 in the cavity surface of mould 3 forms thermal insulation layer 31, described part is the part not engaging with other formed bodys in the surface of one-shot forming body 10.
Then, in the present embodiment, use the post forming bodily form die for forming 4 shown in Fig. 4 to manufacture one-shot forming body 10 and the integrated resin molding compound body 1 of post forming body 20.Fig. 4 schematically shows the section of post forming bodily form die for forming 4.
The post forming bodily form die for forming 4 using in present embodiment is point two-part moulds, the mould 40 of one side possesses first die cavity 401 that can hold one-shot forming body, and the mould 41 of opposite side has as flowing into the thermoplastic resin composition of molten condition and forming second die cavity 411 in the space of post forming body.
First, in the first die cavity 401 of the mould 40 of a side, hold one-shot forming body 10.Then, make post forming bodily form die for forming 4 become closed state, the resin combination of molten condition is filled into the second die cavity 411.Finally, after being filled into thermoplastic resin composition's cooling curing of the second die cavity 411, open post forming bodily form die for forming 4, take out resin molding compound body 1.
Mold temperature while forming post forming body 20 is adjusted to the degree of crystallinity that can fully improve the crystalline thermoplastic resin that forms post forming body 20.Conventionally, use the mould that does not form thermal insulation layer as shown in Figure 4.Mold temperature while using the mould that does not form thermal insulation layer is preferably the cold crystallization temperature (T of the crystalline thermoplastic resin that forms post forming body 20
c1more than)+10 ℃, more preferably (T
c1more than)+15 ℃.
Embodiment
< material >
Crystalline thermoplastic resin combination 1: contain 60 quality % polyphenylene sulfide (cold crystallization temperature (T
c1) be 125 ℃) and the resin combination of 40 quality % glass fibres
Crystalline thermoplastic resin combination 2: polyphenylene sulfide (Polyplastics Co., Ltd. manufacture, " FORTRON(registration mark) 1130T6 ", cold crystallization temperature (T
c1) be 125 ℃)
Thermal insulation layer formation material: polyimides (thermal conductivity 0.22(W/mK))
(mensuration of thermal conductivity)
The thermal conductivity of thermal insulation layer calculates as follows: with Measurement By Laser Flash thermal diffusivity, with DSC measure displacement method in specific heat, water (according to JIS Z8807 solid gravity test method) measure proportion, calculate by [thermal conductivity]=[thermal diffusivity × specific heat × proportion].
< embodiment A >
One-shot forming body is of a size of long 65mm × wide 12.5mm × thick 3mm.For the mould of die cavity with this size, prepare the mould that possesses the mould of thermal insulation layer and do not possess thermal insulation layer.In addition, for the mould that possesses thermal insulation layer, do not form thermal insulation layer in the part contacting with the pre-composition surface of the predetermined portions as engaging with post forming body, form thermal insulation layer in other parts.In addition, the thickness of thermal insulation layer is made as 200 μ m.Use these moulds and crystalline thermoplastic resin combination 1 to manufacture embodiment and the required one-shot forming body of comparative example.The condition of the mold temperature during for manufacture one-shot forming body, is shown in table 1.
Be of a size of with respect to the length direction of one-shot forming body in the size with length direction in the mould of die cavity (die cavity is of a size of long 130mm × wide 12.5mm × thick 3mm) of 2 times and lay one-shot forming body, take the moulding post forming body identical with one-shot forming shape (the pre-composition surface of one-shot forming body is as the side of the wide 12.5mm × thick 3mm of one end).In forming post forming body injecting wherein crystalline thermoplastic resin combination 1, make one-shot forming body and post forming body integrated.In addition, the mold temperature when moulding of post forming body is shown in table 1.In addition, do not form thermal insulation layer in the cavity surface of the mould that is used to form post forming body.
For each resin molding compound body, use cupping machine (ORIENTEC Co., Ltd. manufactures, RTC-1325) to stretch in the mode that one-shot forming body and post forming body are ripped, the breaking load at mensuration junction surface.Measurement result is shown in table 1.
[table 1]
As shown in Table 1, by using part to there is the mould of thermal insulation layer, can improve the bond strength of one-shot forming body and post forming body.
< Embodiment B >
Embodiment in Embodiment B and comparative example have been manufactured the resin molding compound body shown in property illustrated in Figure 5.Fig. 5 (a) is stereogram, and (b) of Fig. 5 is NN cutaway view.One-shot forming body is that the formed body combination shown in 2 Fig. 6 is obtained.Wherein, Fig. 6 (a) is stereogram, and (b) of Fig. 6 is OO cutaway view.The part representing with dot pattern of Fig. 6 (a) is equivalent to pre-composition surface.In addition, the digital unit of the size in presentation graphs is mm.
Use is formed with the formed body of the shape shown in mould, crystalline thermoplastic resin combination 2 has been manufactured Fig. 6 (a) with injection molding method of thermal insulation layer.Use with not the forming thermal insulation layer, be formed with the mould of thermal insulation layer in other parts with a part that the part representing contacts of the Fig. 6 as pre-composition surface (a).The thickness of thermal insulation layer is 200 μ m.The condition of mold temperature is shown in table 2.In addition manufacture, the formed body of 2 same shapes.
In order to manufacture resin molding compound body as shown in Figure 5, the state against each other with the opening edge face of above-mentioned 2 formed bodys is placed in mould.Then, in mould, inject crystalline thermoplastic resin combination 2, manufacture resin molding compound body.The condition of mold temperature is shown in table 2.
For gained resin molding compound body, implement annealing in process (140 ℃, 2 hours), confirm whether resin molding compound body has crackle.
[table 2]
As shown in Table 2, the one-shot forming body of the formation resin molding compound body obtaining by manufacture method of the present invention is owing to being to use the local mould that is formed with thermal insulation layer to manufacture, and therefore the degree of crystallinity of the crystalline thermoplastic resin in one-shot forming body has obtained abundant raising.Therefore, even resin molding compound body is implemented to annealing in process, the change in size that also confirms one-shot forming body is little, and one-shot forming body does not crack.
During in conjunction with the result of above embodiment A and Embodiment B, by can according to the results verification of embodiment A to the raising of bond strength can judge that degree of crystallinity as near the crystalline thermoplastic resin pre-composition surface of the formed body of one-shot forming body is suppressed must be lower.In addition, can think, in other parts, the degree of crystallinity of crystalline thermoplastic resin has obtained abundant raising.
description of reference numerals
1 resin molding compound body
10 one-shot forming bodies
101 first junction surfaces
20 post forming bodies
201 second junction surfaces
2 junction surfaces
3 moulds
31 thermal insulation layers
4 post forming bodily form die for forming
The mould of 40 1 sides
401 first die cavitys
The mould of 41 opposite sides
411 second die cavitys
Claims (5)
1. the manufacture method of a resin molding compound body, it is characterized in that, described resin molding compound body possesses the one-shot forming body being obtained by the moulding of crystalline thermoplastic resin combination and has and the post forming body at second junction surface that the first junction surface engages, part surface of described one-shot forming body
The method comprises following operation: described one-shot forming body is configured on mould, to the thermoplastic resin composition who injects molten condition in mould, engages with described the second junction surface the resin molding compound body forming by described the first junction surface thereby manufacture,
Described one-shot forming body be use in a part for cavity surface be formed with the heat insulation mould of thermal insulation layer, in mold temperature for forming the cold crystallization temperature (T of crystalline resin of described one-shot forming body
c1under ℃ following condition of)-10, manufacture,
Described thermal insulation layer is formed on: described cavity surface, except the part contacting with pre-composition surface roughly whole upper, this pre-composition surface is the presumptive area that forms described the first junction surface.
2. the manufacture method of resin molding compound body according to claim 1, wherein, described post forming body is to be the cold crystallization temperature (T that forms the crystalline thermoplastic resin of described post forming body in mold temperature
c1under ℃ above condition of)+10, manufacture.
3. the manufacture method of resin molding compound body according to claim 1 and 2, wherein, described one-shot forming body is made up of polyarylene sulfide resin composition.
4. the manufacture method of resin molding compound body according to claim 3, wherein, described one-shot forming body is to be to manufacture under the condition below 100 ℃ in the mold temperature of described heat insulation mould.
5. a resin molding compound body, it is by the method manufacture described in any one in claim 1～4.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011197602A JP2013056517A (en) | 2011-09-09 | 2011-09-09 | Method for manufacturing resin composite molded body and resin composite molded body |
| JP2011-197602 | 2011-09-09 | ||
| PCT/JP2012/068370 WO2013035443A1 (en) | 2011-09-09 | 2012-07-19 | Method for producing resin composite molded body and resin composite molded body |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103781611A true CN103781611A (en) | 2014-05-07 |
Family
ID=47831895
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280043230.5A Pending CN103781611A (en) | 2011-09-09 | 2012-07-19 | Method for producing resin composite molded body and resin composite molded body |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2013056517A (en) |
| KR (1) | KR20140059799A (en) |
| CN (1) | CN103781611A (en) |
| WO (1) | WO2013035443A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105291449A (en) * | 2014-06-26 | 2016-02-03 | 宝理塑料株式会社 | Composite molding product and manufacturing method thereof |
| CN106794610A (en) * | 2014-09-11 | 2017-05-31 | 东芝机械株式会社 | Apparatus and method for producing light diverging lens |
| CN110248792A (en) * | 2017-02-03 | 2019-09-17 | 宝理塑料株式会社 | The joint method of synthetic resin |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07108563A (en) * | 1993-10-14 | 1995-04-25 | Sekisui Chem Co Ltd | Manufacture of laminated molding |
| CN1252023A (en) * | 1997-04-16 | 2000-05-03 | 哈斯基注模系统有限公司 | Partical crystallation of amorphous plastic articles and apparatus thereof |
| JP2011056753A (en) * | 2009-09-09 | 2011-03-24 | Polyplastics Co | Method for producing injection molded product |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2621232B2 (en) * | 1987-10-02 | 1997-06-18 | 株式会社村田製作所 | Cases for housing electronic components and cases used for them |
| JP2007253462A (en) * | 2006-03-23 | 2007-10-04 | Japan Steel Works Ltd:The | Injection molded product and manufacturing method of thermally welded injection-molded product |
-
2011
- 2011-09-09 JP JP2011197602A patent/JP2013056517A/en not_active Withdrawn
-
2012
- 2012-07-19 WO PCT/JP2012/068370 patent/WO2013035443A1/en active Application Filing
- 2012-07-19 KR KR1020147006237A patent/KR20140059799A/en not_active Application Discontinuation
- 2012-07-19 CN CN201280043230.5A patent/CN103781611A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07108563A (en) * | 1993-10-14 | 1995-04-25 | Sekisui Chem Co Ltd | Manufacture of laminated molding |
| CN1252023A (en) * | 1997-04-16 | 2000-05-03 | 哈斯基注模系统有限公司 | Partical crystallation of amorphous plastic articles and apparatus thereof |
| JP2011056753A (en) * | 2009-09-09 | 2011-03-24 | Polyplastics Co | Method for producing injection molded product |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105291449A (en) * | 2014-06-26 | 2016-02-03 | 宝理塑料株式会社 | Composite molding product and manufacturing method thereof |
| CN105291449B (en) * | 2014-06-26 | 2018-11-20 | 宝理塑料株式会社 | Composite molded article and its manufacturing method |
| CN106794610A (en) * | 2014-09-11 | 2017-05-31 | 东芝机械株式会社 | Apparatus and method for producing light diverging lens |
| CN106794610B (en) * | 2014-09-11 | 2019-05-14 | 东芝机械株式会社 | For producing the device and method of light diverging lens |
| CN110248792A (en) * | 2017-02-03 | 2019-09-17 | 宝理塑料株式会社 | The joint method of synthetic resin |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2013035443A1 (en) | 2013-03-14 |
| KR20140059799A (en) | 2014-05-16 |
| JP2013056517A (en) | 2013-03-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103781611A (en) | Method for producing resin composite molded body and resin composite molded body | |
| TWI522224B (en) | Mold manufacturing method | |
| WO2011030707A1 (en) | Process for producing injection-molded article | |
| CN103842155A (en) | Method for producing welded body | |
| TW201302426A (en) | Production method for injection-molded article | |
| CN103764375A (en) | Welded body manufacturing method | |
| CN102555153B (en) | Composite forming body, production method thereof and in-mould label | |
| CN103764360B (en) | Mold | |
| CN103402731A (en) | Production method for injection-molded article | |
| JPWO2013031905A1 (en) | Mold and mold manufacturing method | |
| JP2012144036A (en) | Compound molded article, method for manufacturing compound molded article, and in-mold label | |
| TW201307025A (en) | Production method for injection-molded article | |
| WO2014132702A1 (en) | Insulated mold and molding manufacturing method | |
| TW201325858A (en) | Die and method for producing resin molded body |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140507 |