CN103779511A - Method for manufacturing OLED encapsulation - Google Patents
Method for manufacturing OLED encapsulation Download PDFInfo
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- CN103779511A CN103779511A CN201410038307.0A CN201410038307A CN103779511A CN 103779511 A CN103779511 A CN 103779511A CN 201410038307 A CN201410038307 A CN 201410038307A CN 103779511 A CN103779511 A CN 103779511A
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- China
- Prior art keywords
- diode
- plate
- glass cover
- encapsulating material
- organic
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
Abstract
The invention discloses a method for manufacturing OLED encapsulation. According to the method for manufacturing the OLED encapsulation, a base 1, partition walls 2, a glass cover plate 4, an organic encapsulating material strip 3 and an organic light emitting diode 5 are used. The method for manufacturing the OLED encapsulation comprises the steps that the organic light emitting diode 5 is formed on the base 1, a circle of partition walls 2 which surround the diode 5 are formed around the diode 5, a cover plate which is formed by adhesion of the organic encapsulating material strip 3 and the glass cover plate 4 is arranged on the partition walls 2, and the cover plate covers the diode 5. The organic encapsulating material comprises 30% of quartz sand, 30% of polyimide, 20% of acrylonitrile-butadiene-styrol copolymer or polyethylene or polypropylene, and 20% of zinc oxide. The quartz sand, the polyimide, the acrylonitrile-butadiene-styrol copolymer or polyethylene or polypropylene and the zinc oxide are mixed and sintered to form the material strip. The material strip adheres to the glass cover plate through a clear binder which is frequently used in the field.
Description
Technical field
The present invention relates to Organic Light Emitting Diode (OLED) Display Technique field, relate to the encapsulation of OLED, relate in particular to a kind of encapsulating structure of larger-size oled panel.
Background technology
Organic electroluminescent LED (OLED) is a kind of all solid state, active illuminating, high brightness, high-contrast, ultra-thin and ultra-light, low-power consumption, without characteristics such as angle limitations, operating temperature range are wide, be considered to the emerging application technology of follow-on flat-panel screens.But, the part-structure of OLED display is especially positioned at electrode wherein and Organic Light Emitting Diode for extremely responsive such as the external environmental factor such as oxygen and steam, needs in actual use device to be encapsulated and make device and water vapour and oxygen isolated useful life with prolongation OLED.
To adopt dissimilar epoxy resin, inorganic material and/or the organic material by formation sealing after ultraviolet light polymerization for a kind of method of OLED encapsulation at present.Although this encapsulating method can provide good mechanical strength conventionally, under a lot of environment, these sealings fail to provide enough obstructing capacities to water vapour and oxygen.
Adopting the sealing of welding glass material is the method for packing of another OLED device, and the method has excellent sealing property, moistureproof damp proof.But for the large-size organic LED panel of (being conventionally not less than 10 cun), in the use procedure of panel, when cover plate and/or substrate are subject to self gravitation or the local extruding of external force and bending time, can make glass cover-plate contact with the Organic Light Emitting Diode on substrate, thereby Organic Light Emitting Diode is squeezed and damages.。
Summary of the invention
A manufacture method for OLED encapsulation, substrate 1, division wall 2, glass cover-plate 4, organic encapsulating material bar 3, Organic Light Emitting Diode 5.In substrate 1, be formed with OLED 5, around diode 5, form around diode 5 one circle division wall 2, on division wall 2, arrange organic encapsulating material bar 3 and glass cover-plate 4 adhere to each other form cover plate, cover diode 5 from above.
Organic encapsulating material is 30% quartz sand, 30% polyimides, 20% acrylonitrile-butadiene-styrene copolymer or polyethylene or polypropylene, 20% zinc oxide; Above-mentioned 4 kinds of material mixed sinterings are formed to material strips, use the conventional clear binder in this area that material strips and glass cover-plate are bonded together.
Wherein, the thickness of glass cover-plate is 30-40mm, and the thickness of organic encapsulating material bar is 30-40mm.Physical separation wall height is the arbitrary height value between 0.5mm or 1mm or 30mm or 0.5～30mm, and thickness is the arbitrary height value between 1mm or 3mm or 50mm or 1～50mm.
Accompanying drawing explanation
Fig. 1 is the generalized section of OLED encapsulating structure of the present invention.
Embodiment
In order to make the clearer understanding of those skilled in the art technical scheme of the present invention, below in conjunction with accompanying drawing, its embodiment is described.
OLED encapsulation, substrate 1, division wall 2, glass cover-plate 4, organic encapsulating material bar 3, Organic Light Emitting Diode 5.In substrate 1, be formed with OLED 5, around diode 5, form around diode 5 one circle division wall 2, on division wall 2, arrange organic encapsulating material bar 3 and glass cover-plate 4 adhere to each other form cover plate, cover diode 5 from above.Wherein physical separation wall height is the arbitrary height value between 0.5mm or 1mm or 30mm or 0.5～30mm, and thickness is the arbitrary height value between 1mm or 3mm or 50mm or 1～50mm.Wherein the increase of height value can effectively solve the problem of damaging Organic Light Emitting Diode and/or electrode when large scale oled panel is subject to external force extruding; The corresponding increase of one-tenth-value thickness 1/10 simultaneously, its object is to increase the mechanical strength of encapsulating structure.And one-tenth-value thickness 1/10 is more obvious to the barriering effect of steam and oxygen etc. after increasing.Use organic encapsulating material to form strip; be bonded together with glass cover-plate is stacked; be formed on together above whole encapsulation, cover plate as a whole, with from above encapsulation; such structure; improve the obstructing capacity to oxygen, aqueous vapor, can support glass cover-plate below, make glass plate be not easy distortion simultaneously; if intensity makes enough greatly glass plate be out of shape, also can protect Organic Light Emitting Diode.Wherein the thickness of glass cover-plate is 30-40mm, and the thickness of organic encapsulating material bar is 30-40mm.
Wherein organic encapsulating material bar is transparent material, in order to realize better protection against the tide and tolerance function, proves by experiment, uses the material combining below, can, under 90% relative humidity condition, at 90 degrees Celsius, keep the sealing property of 8000 hours.
Organic encapsulating material is 30% quartz sand, 30% polyimides, 20% acrylonitrile-butadiene-styrene copolymer or polyethylene or polypropylene, 20% zinc oxide.
Above-mentioned 4 kinds of material mixed sinterings are formed to material strips, use the conventional clear binder in this area that material strips and glass cover-plate are bonded together.
Certainly; the present invention also can have other various embodiments; in the situation that not deviating from spirit of the present invention and essence thereof; those of ordinary skill in the art are when making according to the present invention various corresponding changes and distortion, but these corresponding changes and distortion all should belong to the protection range of the appended claim of the present invention.
Claims (1)
1. a manufacture method for OLED encapsulation, substrate 1, division wall 2, glass cover-plate 4, organic encapsulating material bar 3, Organic Light Emitting Diode 5.In substrate 1, be formed with OLED 5, around diode 5, form around diode 5 one circle division wall 2, on division wall 2, arrange organic encapsulating material bar 3 and glass cover-plate 4 adhere to each other form cover plate, cover diode 5 from above.
Organic encapsulating material is 30% quartz sand, 30% polyimides, 20% acrylonitrile-butadiene-styrene copolymer or polyethylene or polypropylene, 20% zinc oxide; Above-mentioned 4 kinds of material mixed sinterings are formed to material strips, use the conventional clear binder in this area that material strips and glass cover-plate are bonded together.
Wherein, the thickness of glass cover-plate is 30-40mm, and the thickness of organic encapsulating material bar is 30-40mm.Physical separation wall height is the arbitrary height value between 0.5mm or 1mm or 30mm or 0.5～30mm, and thickness is the arbitrary height value between 1mm or 3mm or 50mm or 1～50mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410038307.0A CN103779511B (en) | 2014-01-26 | 2014-01-26 | A kind of manufacture method of OLED encapsulation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410038307.0A CN103779511B (en) | 2014-01-26 | 2014-01-26 | A kind of manufacture method of OLED encapsulation |
Publications (2)
| Publication Number | Publication Date |
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| CN103779511A true CN103779511A (en) | 2014-05-07 |
| CN103779511B CN103779511B (en) | 2016-01-20 |
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| CN201410038307.0A Active CN103779511B (en) | 2014-01-26 | 2014-01-26 | A kind of manufacture method of OLED encapsulation |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110140599A1 (en) * | 2009-12-10 | 2011-06-16 | Samsung Mobile Display Co., Ltd. | Organic light-emitting display apparatus |
| US20110315977A1 (en) * | 2009-03-16 | 2011-12-29 | Konica Minolta Holdings, Inc. | Organic electronic panel and method for manufacturing organic electronic panel |
| US20120205698A1 (en) * | 2011-02-14 | 2012-08-16 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device, display device, and method for manufacturing the same |
| CN102820432A (en) * | 2011-06-08 | 2012-12-12 | 乐金显示有限公司 | Organic light emitting device and method for manufacturing the same |
| US8421353B2 (en) * | 2010-12-14 | 2013-04-16 | Samsung Display Co., Ltd. | Organic light emitting diode display with specific sealing member |
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2014
- 2014-01-26 CN CN201410038307.0A patent/CN103779511B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110315977A1 (en) * | 2009-03-16 | 2011-12-29 | Konica Minolta Holdings, Inc. | Organic electronic panel and method for manufacturing organic electronic panel |
| US20110140599A1 (en) * | 2009-12-10 | 2011-06-16 | Samsung Mobile Display Co., Ltd. | Organic light-emitting display apparatus |
| US8421353B2 (en) * | 2010-12-14 | 2013-04-16 | Samsung Display Co., Ltd. | Organic light emitting diode display with specific sealing member |
| US20120205698A1 (en) * | 2011-02-14 | 2012-08-16 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device, display device, and method for manufacturing the same |
| CN102820432A (en) * | 2011-06-08 | 2012-12-12 | 乐金显示有限公司 | Organic light emitting device and method for manufacturing the same |
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| CN103779511B (en) | 2016-01-20 |
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