CN103777446A - Chip assembly, imaging system and manufacturing method of chip assembly - Google Patents
Chip assembly, imaging system and manufacturing method of chip assembly Download PDFInfo
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- CN103777446A CN103777446A CN201410053226.8A CN201410053226A CN103777446A CN 103777446 A CN103777446 A CN 103777446A CN 201410053226 A CN201410053226 A CN 201410053226A CN 103777446 A CN103777446 A CN 103777446A
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Abstract
The invention relates to a chip assembly used for projection. The chip assembly comprises multiple layers of imaging substrates which are sequentially overlapped, a black filtering substrate and a substrate fixing part, wherein each imaging substrate is provided with image information in a carving mode, the black filtering substrate is located on a lateral surface of the multiple layers of imaging substrates, and the substrate fixing part fixes the multiple layers of imaging substrates and the black filtering substrate. The invention further discloses an imaging system comprising the chip assembly and a manufacturing method of the chip assembly. Compared with the prior art, the chip assembly improves the saturability and texture of images.
Description
Technical field
The present invention relates to the method for making of a kind of wafer assemblies for projection, the imaging system that contains this wafer assemblies and this wafer assemblies.
Background technology
In recent years, bulky and heavy cathode-ray tube (CRT) (CRT) projector, is replaced by products such as Ye Ji projector and digital light processing (DLP) projectors gradually.These products have characteristic frivolous and that portability is high, and can be directly and digital product link so that image projecting is shown.
Generally speaking, existing projector adopts based on principle colour wheel, that utilize spatial light modulator, white light is sequentially divided into ruddiness, blue light and green glow, then by the cooperation of projection lens, carries out the demonstration of coloured image.In projection arrangement, first the white light that light source provides passes through collimating optics part, then reflexes to colour wheel.Colour wheel comprises Red lightscreening plate, green color filter and blue color filter, by the rotation of colour wheel, by white light in order fast filtering become ruddiness, green glow and blue light, and directive spatial light modulator.Controller receives the vision signal of input, and synchronizes with colour wheel, and view data is issued to spatial light modulator.Afterwards, projection lens focuses on projection on screen by the redness through ovennodulation, green and blue light beam again, and the image of three kinds of primary colors is combined, and forms full-color image on screen.
Accompanying drawing 1 is traditional color structural representation of taking turns of circle.As shown in Figure 1, the color wheel of traditional circle comprises being provided with only to allow in white light and just allows corresponding to each colored optical wavelength the color filter passing through; Be provided with the shaft coupling that is used for fixing color filter; And be provided with the motor of the generation torque being connected on shaft coupling.Circular color wheel, under the dragging of motor, drives shaft coupling and fixed thereon 's color filter to be rotated, and therefore can isolate successively colorama.
But, adopt said sequence colour, utilize RGB (RGB) three primary colors colour wheel to realize colored method, exist following problem.
First, the expressive force of image and color saturation are inadequate.
Secondly, the utilization factor of light source is not high, and theoretical value is less than 1/3.In order to overcome this weakness, improve the utilization factor of light, and then adopted RGB+W (red, green, blue and white) four segment color wheels, but can reduce picture color saturation degree owing to increasing W section color filter, therefore the proportion of its shared colour wheel can not be excessive.So due to the restriction of colour wheel and optical system, the utilization factor of light is still lower.
Again, the white light that said method is normally realized by colour wheel separates, and in circular color wheel is rotated on one side, light will pass through color filter; At this moment luminous energy by great useful area, just can filter how many ripples, and pure color brightness increases the increase of the RGB filter field along with coloured silk wheel, and the diameter that coloured silk is taken turns is larger, and pure color brightness and image quality are better.If reduce the size of this color wheel, will produce problems such as reducing image quality.But increase colour wheel, can increase size, weight and the noise of projector equipment, and therefore this problem just becomes projector equipment miniaturization and a light-weighted burden.
And, on circular colour wheel, think that coating chromatic needs very large expense equably, and rejection rate is high.
In addition, colour wheel is tumbler, and it is poor compared with fixture aspect fiduciary level, and rate of wear is also very high, so be easier to break down.
And the optical filter that colour wheel adopts adopts the methods such as decoration method, Pigments method, print process, electrochemical plating and ink-jet method to make conventionally, cannot take into account simple process, high precision, requirement cheaply.
Summary of the invention
For the problem of existing existence, the object of the invention is to provide the method for making of a kind of wafer assemblies for projection, the imaging system that contains this wafer assemblies and this wafer assemblies, to strengthen the expressive force and the color saturation that show image, improve light source utilization factor, make the manufacture craft of image easy, be convenient to imaging system miniaturization.
In order to achieve the above object, according to an aspect of the present invention, provide a kind of wafer assemblies for projection, this wafer assemblies comprises stacked successively multi layer substrate, is carved with image information on substrate; Black light filter substrate, is positioned on multi layer substrate, for covering halation; Substrate fixture, fixes multi layer substrate and black light filter substrate.
Further, substrate comprises former material and is plated on the filter coating of all kinds on former material; Former material thickness is 0.5-1MM, and material is optics ultrawhite high temperature resistant ultrathin glass, and substrate is divided into the disk that diameter is 25-52MM, or is divided into rectangle, square, rhombus, the shapes such as ellipse.
Further, on substrate, be carved with image information comprise use laser equipment eliminate the unwanted filter coating of monochrome image on each substrate according to monochrome image information and monochrome image information, and the thickness of the filter coating of skiving monochrome image different parts, thereby on substrate, form image information.
Further, it is circular or square filter coating that black light filter substrate has central authorities breakdown, the Edge preserving of filter coating.
Further, substrate fixture is located by coordinate points, and above-mentioned substrate is positioned and fixed, and substrate fixture can be frame.
Further, multi layer substrate comprises three layers of substrate, is respectively red, yellow, blue or red, yellow, green.Between multi layer substrate, can adopt compacting or viscose glue or other modes etc. to carry out stacked placement.
According to a further aspect in the invention, provide a kind of imaging system that contains this wafer assemblies.This imaging system comprises light source, condenser, and spatial light modulator, projection lens group, controller, with above-mentioned wafer assemblies.
According to a further aspect in the invention, provide a kind of for making the method for making of above-mentioned wafer assemblies.
The method comprises the following steps:
Step 5, locate by coordinate points, above-mentioned image substrate is positioned and fixed, make and form wafer assemblies.
Further, step 1 also comprises that former material thickness is 0.5-1MM, and material is optics ultrawhite high temperature resistant ultrathin glass, and substrate is divided into the disk that diameter is 25-52MM, or is divided into rectangle, square, rhombus, the shapes such as ellipse.
Further, step 1 also comprises makes respectively four kinds of color filter coating substrates, is respectively the first look, the second look, the 3rd look and the 4th color base sheet, and wherein the 4th look is black.
Further, step 2 also comprises that extracting monochrome image information is to extract the first color image information, the second color image information and image three-colo(u)r information.
Further, step 4 also comprises according to the first color image information, the second color image information, image three-colo(u)r information and each image thicknesses information, the filter coating of each respective color is punctured or partly punctured, obtain the first color image substrate, the second color image substrate and image three-colo(u)r substrate, the filter coating of the 4th color base sheet is carried out to laser breakdown, make the black filter coating of substrate center breakdown, laser engraving forms circle or square, retain the black filter coating of substrate edge, obtain four-color image substrate.
Further, step 5 above-mentioned image substrate is positioned and fixing method specifically comprises: 1, the second color image substrate obtaining in the first color image substrate obtaining in step 4 and step 4 is located in location instrument to the fixing two color image substrates that produce of viscose glue compacting; 2, the image three-colo(u)r substrate obtaining in step 4 and described two color image substrate location viscose glues, compacting are fixed and produced image three-colo(u)r substrate; 3, the four-color image substrate obtaining in step 4 and described image three-colo(u)r substrate location viscose glue, compacting are fixed, covered the place that surrounding does not need printing opacity, produce four tomographic image substrates, thereby reduce or prevent the generation of image halation; 4, finally with the fixing above-mentioned each image substrate of frame, form final wafer assemblies.
Further, the first look, the second look, the 3rd look are respectively red, yellow, blue.Or first look, the second look, the 3rd look are respectively red, yellow, green.
As mentioned above, the present invention compared with prior art has the following advantages: the present invention utilizes invisible laser nano technology to puncture formation substrate to color filter, and multiple substrates are suppressed and formed wafer assemblies, thereby improve color realism and production efficiency, realize miniaturization and the lightweight of projector equipment, increase color saturation, color is even, prevent halation, reduction expense, produces easily.
Except above-mentioned objects and advantages of the present invention, about other object and advantage by the detailed description by following and accompanying drawing, can be clearer.
Accompanying drawing explanation
Fig. 1 is traditional color structural representation of taking turns of circle.
Fig. 2 is the cross-sectional view of wafer assemblies of the present invention.
Fig. 3 is wafer assemblies method for making schematic flow sheet of the present invention.
Embodiment
Below in conjunction with drawings and Examples, the invention will be further described, should be noted, below describing is only use for example, and the present invention is not limited to following embodiment:
As shown in Figure 2, wafer assemblies of the present invention (being a kind of optical module) comprises successively and on imaging substrate 1,2,3, is carved with image information for stacked multilayer imaging substrate 1,2,3; And black light filter substrate 4, be positioned at multilayer imaging substrate 1,2,3 sides, black light filter substrate 4 near middle region because black coating is eliminated, therefore can pass through for light, its fringe region is used for shutting out the light and passes through, be used for covering halation, prevent that light from forming aperture on projectile while passing through the edge of black light filter substrate or imaging substrate; Substrate fixture, by fixing to multilayer imaging substrate 1,2,3 and black light filter substrate 4.Preferably, when use, the more close light source of black light filter substrate.
Substrate comprises former material and is plated on the filter coating of all kinds on former material.Make the size of lamp sheet according to current lamps & lanterns factory, substrate is divided, form the substrate of suitable dimension and shape.Preferably, the size of substrate can be 10-100MM, and shape can be the shapes such as circle, rectangle, square, rhombus, ellipse.
Former material can be selected resistant to elevated temperatures optical material, can be optics ultrawhite high temperature resistant ultrathin glass, as soda-lime glass, or plating SiO2 film or flexible mylar material, or other ultrawhite high temperature resistant ultrathin material.Conventionally, former material layer thickness is 0.3-5MM, can certainly be as required, select other suitable thickness.
Filter coating can have multiple color as required, and is take four kinds of colors as example in the present embodiment, i.e. the first look filter coating, the second look filter coating, the 3rd look filter coating, and the 4th look filter coating.Wherein, the color of the first look filter coating is for example red, and the color of the second look filter coating is for example yellow, and the color of the 3rd look filter coating is for example blue, and the color of the 4th look filter coating is for example black.Should be noted, the color of filter coating is selected the only use for giving an example here, and the present invention is not construed as limiting it.Can be according to the requirement of image to be displayed, plate the filter coating of other colors, as replaced blue filter coating with green filter film, also can plate red as fuchsin, the filter coating such as pale red, the filter coating such as yellow as orange, pale yellow, the filter coating such as blue as light blue, dark blue.The colourity of each filter layer meets colored filter standard, and thickness meets the thickness requirement of the each color picture element of colored filter.
Here, as demonstrative example, the first imaging substrate 1 is red substrate, and the second imaging substrate 2 is yellow substrate, and the 3rd imaging substrate 3 is blue substrate, and the 4th substrate 4 is black light filter substrate 4.Between multi layer substrate 1,2,3,4, can adopt compacting or viscose glue or other modes etc. to carry out stacked placement.
On substrate, be carved with image information comprise use laser equipment eliminate the unwanted filter coating of monochrome image on each substrate according to monochrome image information and monochrome image information, and the thickness of the filter coating of skiving monochrome image different parts, thereby on substrate, form image information.
For image to be shown, the image information of needs is extracted, isolate required monochrome image, as red image information, yellow image information, blue image information, and above-mentioned image information is deposited in laser equipment.Also the thickness data message of each monochrome image is decided simultaneously, and be stored into equally in laser equipment.According to each monochrome image thickness data message of storage, this data message is carried out to manual synchronizing, the place that each monochrome image is needed increases and decreases colourity, form multicolor image information, and save data enters in laser equipment.
According to the monochrome image information of storing in laser equipment and monochrome image thickness data message, on substrate, use laser technology, use cold light source as the invisible light such as infrared ray, ultraviolet light source light source or visible light source, on-chip color filter is punctured, according to the monochrome image information of storing in laser equipment, eliminate the unwanted color film of each monochrome image by laser spots, and the thickness of skiving required image different parts film, image information on substrate, formed.The penetrability of breakdown color filter will change image color.
Wherein first, second, and third substrate 1,2,3 is the substrate of homochromy same image not, has not homochromy monochrome image information.
The filter coating of the 4th color base sheet 4 is carried out to laser breakdown, make substrate lean on ectocentral black filter coating breakdown, for example circle is square or the transmission region of irregular present situation in laser engraving formation, retains the black filter coating of substrate edge, obtains black light filter substrate 4.Advantageously, in the time completing imaging substrate, if no longer wish to show into completely while looking like on-chip whole pattern, can, by means of form erose transmission region on black light filter substrate 4, look like on-chip pattern thereby be optionally shown as.
The above-mentioned substrate 1,2,3 with image information is located in location instrument, and stacked placement, can adopt viscose glue compacting fixing.Substrate 4 is laminated in substrate 1,2,3 sides.Between substrate 4 and substrate 3, can also adopt viscose glue compacting fixing.Substrate fixture is located by coordinate points, and above-mentioned substrate 1,2,3,4 is positioned and fixed, and substrate fixture can be for example frame.Substrate stator shape and substrate match, and are advisable to be applicable to fixed substrate.
Red, yellow, blue three layers of substrate to stack order interchangeable.
Above-mentioned imaging substrate is owing to having each layer of filter coating of different-thickness, thereby produce different penetrabilitys, can guarantee that white light produces change color while seeing through ground floor, the second layer, the 3rd layer of substrate, what reach color comprehensively goes back original image, finally realize the abundant of image color, there is relief image thereby form.
The present invention also provides a kind of imaging system that contains this wafer assemblies.This imaging system comprises light source, condenser, spatial light modulator, projection lens group, controller, and above-mentioned wafer assemblies.
As shown in Figure 3, wafer assemblies method for making of the present invention specifically comprises the following steps:
The first step: make monochromatic filter coating substrate
Make former material, use vacuum coating technology on former material, to plate optical filtering planar film of all kinds, thereby form substrate of all kinds.Make the size of lamp sheet according to current lamps & lanterns factory, substrate is divided, form the substrate of suitable dimension and shape.Preferably, the size of substrate can be 10-100MM, and shape can be the shapes such as circle, rectangle, square, rhombus, ellipse.
Former material can be selected resistant to elevated temperatures optical material, can be optics ultrawhite high temperature resistant ultrathin glass, as soda-lime glass, or plating SiO2 film or flexible mylar material, or other ultrawhite high temperature resistant ultrathin material.Conventionally, former material layer thickness is 0.3-5MM, can certainly be as required, select other suitable thickness.
Optical filtering planar film can have multiple color as required, and is take four kinds of colors as example in the present embodiment, i.e. the first look filter coating, the second look filter coating, the 3rd look filter coating, and the 4th look filter coating.Wherein, the color of the first look filter coating is for example red, and the color of the second look filter coating is for example yellow, and the color of the 3rd look filter coating is for example blue, and the color of the 4th look filter coating is for example black.Should be noted, the color of filter coating is selected the only use for giving an example here, and the present invention is not construed as limiting it.Can be according to the requirement of image to be displayed, plate the filter coating of other colors, as replaced blue filter coating with green filter film, also can plate red as fuchsin, the filter coating such as pale red, the filter coating such as yellow as orange, pale yellow, the filter coating such as blue as light blue, dark blue.The colourity of each filter layer meets colored filter standard, and thickness meets the thickness requirement of the each color picture element of colored filter.
Here,, as demonstrative example, make and form the first red substrate, the second yellow substrate, the 3rd blue substrate and the 4th black substrate.
Second step: separate monochrome image
Adopt and separate monochrome image software, the image that needs are shown carries out monochrome and separates.
For image to be shown, the image information of needs is extracted, isolate required monochrome image, as red image information, yellow image information, blue image information, and above-mentioned image information is deposited in laser equipment.Also the thickness data message of each monochrome image is decided simultaneously, and be stored into equally in laser equipment.
Conventionally, can first extract red image information, then extract yellow image information, then extract blue image information.
The 3rd step: the film thickness of determining different colours image
According to each monochrome image thickness data message of storage, this data message is carried out to manual synchronizing, the place that each monochrome image is needed increases and decreases colourity, form the multicolor image information that comprises multiple image information, and save data enters in laser equipment.
The 4th step: use laser technology to form image substrate
According to the monochrome image information of storing in laser equipment and monochrome image thickness data message, on substrate, use laser technology, eliminate the unwanted color film of each monochrome image, and the thickness of skiving required image different parts film, form image substrate.Can certainly use other engraving processes, for example the method for chemistry.
Regulate laser equipment, use cold light source as the invisible light such as infrared ray, ultraviolet light source light source or visible light source, adopt laser technology, on-chip color filter is punctured in various degree, according to the monochrome image information of storing in laser equipment, eliminate the unwanted color film of each monochrome image by laser spots; According to the monochrome image thickness data message of storing in laser equipment, the thickness of skiving required image different parts film, forms image substrate.
According to the requirement of memory image in laser equipment, laser spot is adjusted to nano-dot size by shaping or the type of focusing, and laser energy is adjusted to and can makes color filter puncture, substrate is carried out to laser scanning, on color filter, every microsecond punctures corresponding nano dot or partly punctures nano dot, thereby allows white light pass.The penetrability of breakdown color filter will change image color.
Concrete, for the red image information of extracting, on red substrate, puncture.Retaining red color filter is original thickness, and when red color filter is not breakdown, the color that red color filter absorbs other light only allows red dark red by just having produced; According to the different-thickness of red image information extracting, the thickness of red color filter is partly punctured, 3/4 punctured or the puncturing of other ratios, thereby the penetrability of red color filter is increased, reduce and absorb other color, thereby produce at prime, fuchsin, red image in various degree such as pale red grade.The final red image substrate that forms.
By that analogy, for yellow image information and thickness information, blue image information and the thickness information thereof extracted, carry out puncturing or partly puncture or partly puncturing of the similar on-chip filter coating to respective color, thereby produce yellow or blue image in various degree, form yellow or blue image substrate.
Wherein first, second, and third image substrate is the substrate of homochromy same image not, has not homochromy monochrome image.
The filter coating of the 4th color base sheet is carried out to laser breakdown, make substrate breakdown near the black filter coating of middle section, laser engraving forms the square or irregular present situation of circle, retains the black filter coating of substrate edge, obtain four-color image substrate, do not need the place of printing opacity in order to cover surrounding.
Interchangeable to the order that punctures or partly puncture red, yellow, blue, black color filter in above-mentioned steps.
The 5th step: form image wafer assemblies
On the basis of ground floor red image substrate, second layer yellow image substrate, the 3rd layer of blue image substrate and the 4th layer of black image substrate of above-mentioned acquisition, according to the following step image wafer assemblies that completes.
1, ground floor image substrate and second layer substrate are located in location instrument to the fixing two color image substrates that produce of viscose glue compacting.
First on the former figure of computer, do 3-4 coordinate points or need to make other various forms of coordinate patterns according to image, so that pattern is positioned, then according to isolated required monochrome image, the same position on each monochrome image arranges a corresponding 3-4 coordinate points.Ground floor substrate and second layer substrate pass on indicator screen by camera in location instrument, according to on-chip each coordinate points location, ground floor substrate is accurately located and is overlapped with second layer substrate image, then sticky without the fixing two color image substrates that produce of shadow glue laminated system.
2, the 3rd layer of substrate and two color image substrates location viscose glue, compacting are fixed to generation image three-colo(u)r substrate.
The 3rd layer of substrate and two color image substrate coordinate points location, image color is accurately located coincidence, sticky without shadow glue, the fixing image three-colo(u)r substrate that produces of compacting.
3, the 4th layer of substrate and image three-colo(u)r substrate location viscose glue, compacting are fixed to the full-color image substrate of generation.
The 4th layer of substrate is black light shield layer, with image three-colo(u)r substrate location viscose glue, compacting, covers the place that surrounding does not need printing opacity, forms four tomographic image substrates.
4, finally with the fixing each tomographic image substrate of frame, form image wafer assemblies.
Frame shape and substrate match, and are advisable to be applicable to fixed substrate.
Interchangeable to the definite sequence of red, yellow, blue three layers of substrate in above-mentioned steps.
The image wafer assemblies being made into according to above-mentioned flow process, according to the different-thickness of each layer of filter coating, produce different penetrabilitys, to guarantee that white light produces change color while seeing through ground floor, the second layer, the 3rd layer of filter coating, what reach color comprehensively goes back original image, finally realize the abundant of image color, there is relief image thereby form.
Completed the making of image wafer assemblies with upper type.
Embodiment 1: a kind of method for making of image wafer assemblies
1, make monochromatic filter coating substrate
On glass at the optics ultrawhite high temperature resistant ultrathin that 0.5MM is thick, use vacuum coating technology to plate red filter coating, Yellow filter film, blue filter coating, black filter coating, form red substrate 1, yellow substrate 2, blue substrate 3, black substrate 4.Substrate is divided into the disk that diameter is 30MM.
2, separate monochrome image
According to showing image, be separated into red image, yellow image, blue image.And on the former figure of computer, do 3-4 coordinate points pattern is positioned, the same position on each monochrome image arranges a corresponding 3-4 coordinate points simultaneously.
3, determine the film thickness of each color image
The film thickness of each color image is carried out to manual synchronizing, and film thickness is deposited in laser equipment.
4, use laser technology to form image substrate
(1) substrate 1 is fixed on the platform of laser equipment, according to the red monochrome image separating, laser energy and spot definition are adjusted to suitable size, opening and closing by programmed control laser, and light beam is had an effect with red filter coating in default area of the pattern, by the momentary action of laser, color filter proper proportion (thickness) is punctured.
(2) substrate 2 is fixed on the platform of laser equipment, according to the yellow monochrome image separating, laser energy and spot definition are adjusted to suitable size, opening and closing by programmed control laser, and light beam is had an effect with Yellow filter film in default area of the pattern, by the momentary action of laser, color filter proper proportion (thickness) is punctured.
(3) substrate 3 is fixed on the platform of laser equipment, according to the blue monochromatic image separating, laser energy and spot definition are adjusted to suitable size, opening and closing by programmed control laser, and light beam is had an effect with blue filter coating in default area of the pattern, by the momentary action of laser, color filter proper proportion (thickness) is punctured.
(4) substrate 4 is fixed on the platform of laser equipment, laser energy and spot definition are adjusted to suitable size, opening and closing by programmed control laser, and light beam is had an effect in default area of the pattern with black filter coating, make the black filter coating of substrate center breakdown by the momentary action of laser, form the transmission region of round square or irregular present situation, retain the black filter coating of substrate edge.
5, the fixing image substrate that forms
(1) on substrate 1, according to on-chip each coordinate points location, make substrate 1 accurately locate and overlap with the image of substrate 2, thereby substrate 2 is fixed on substrate 1, then sticky without the fixing two color image substrates that produce of shadow glue laminated system.
(2) according to on-chip each coordinate points location, substrate 3 is closely adhered to the surface of substrate 2 and fixes, sticky without shadow glue, the fixing image three-colo(u)r substrate that produces of compacting.
(3) according to on-chip each coordinate points location, substrate 4 is closely adhered to the surperficial and fixing of substrate 3, glue without shadow glue, compacting and fix, cover the place that surrounding does not need printing opacity, produce four tomographic image substrates.
(4) finally with the fixing each tomographic image substrate of round edge frame, form image wafer assemblies.
In sum, the imaging system that the invention provides a kind of wafer assemblies, contain this wafer assemblies and the method for making of this wafer assemblies, the image color that this wafer assemblies generates is abundant, there is texture and stereoscopic sensation, over-colored is inferior rich and varied layer by layer, makes image have better vitality.
Although the present invention discloses as above with preferred embodiment; so it is not in order to limit the present invention; without departing from the spirit and scope of the present invention, when doing a little change and retouching, therefore protection scope of the present invention is when being as the criterion of defining depending on claim for those skilled in the art.
Claims (10)
1. a wafer assemblies, this wafer assemblies comprises successively stacked multilayer imaging substrate, it is characterized in that, on imaging substrate, is carved with image information; This wafer assemblies also comprises black light filter substrate, is positioned at multilayer imaging substrate side; Substrate fixture, fixes multi layer substrate and black light filter substrate.
2. wafer assemblies according to claim 1, wherein, substrate comprises former material and is plated on the filter coating of all kinds on former material.
3. wafer assemblies according to claim 2, wherein, on substrate, be carved with image information comprise use laser equipment eliminate the unwanted filter coating of monochrome image on each substrate according to monochrome image information, and the thickness of the filter coating of skiving monochrome image different parts, thereby on substrate, form image information.
4. wafer assemblies according to claim 1, wherein, black light filter substrate has the breakdown filter coating for circular square or irregular present situation of central authorities, the Edge preserving of filter coating.
5. wafer assemblies according to claim 1, wherein, multilayer imaging substrate comprises three layers of substrate, can adopt compacting or adhesive-layer to stack and put between multilayer imaging substrate.
6. wafer assemblies according to claim 5, wherein, three layers of imaging substrate are respectively redness, yellow, blue substrate or redness, yellow, green sheet.
7. an imaging system, this imaging system comprises light source, condenser, spatial light modulator, projection lens group, controller, is characterized in that, this imaging system also comprises the wafer assemblies as described in claim 1-6.
8. a wafer assemblies method for making, for making the wafer assemblies as described in claim 1-6, is characterized in that the method comprises the following steps:
Step 1, use former material to plate filter coating of all kinds thereon, make monochromatic filter coating substrate;
Step 2, image to be shown is separated to monochrome image, extract the thickness information of monochrome image information and each monochrome image, and be stored into laser equipment;
Step 3, manually the thickness information of described each monochrome image is proofreaied and correct, the place that each monochrome image is needed increases and decreases colourity, determines the filter coating thickness of each monochrome image different parts, and is stored into laser equipment;
Step 4, according to the monochrome image information of storing in laser equipment and monochrome image film thickness information, use laser technology, eliminate the unwanted filter coating of monochrome image on each monochromatic filter coating substrate base, and the thickness of the filter coating of skiving monochrome image different parts, image substrate formed;
Step 5, locate by coordinate points, above-mentioned image substrate is positioned and fixed, make and form wafer assemblies.
9. wafer assemblies method for making according to claim 8, wherein, step 4 also comprises according to the first color image information, the second color image information, image three-colo(u)r information and each image thicknesses information, the filter coating of each respective color is punctured or partly punctured, obtain the first color image substrate, the second color image substrate and image three-colo(u)r substrate, the filter coating of the 4th color base sheet is carried out to laser breakdown, make the black filter coating of substrate center breakdown, laser engraving forms circle or square, retain the black filter coating of substrate edge, obtain four-color image substrate.
10. wafer assemblies method for making according to claim 8, wherein, step 5 above-mentioned image substrate is positioned and fixing method specifically comprises: 1, the second color image substrate obtaining in the first color image substrate obtaining in step 4 and step 4 is located in location instrument to the fixing two color image substrates that produce of viscose glue compacting; 2, the image three-colo(u)r substrate obtaining in step 4 and described two color image substrate location viscose glues, compacting are fixed and produced image three-colo(u)r substrate; 3, the four-color image substrate obtaining in step 4 and described image three-colo(u)r substrate location viscose glue, compacting are fixed, covered the place that surrounding does not need printing opacity, produce four tomographic image substrates, thereby reduce or prevent the generation of image halation; 4, finally with the fixing above-mentioned each image substrate of fixture, form final wafer assemblies.
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| CN104656352A (en) * | 2015-03-18 | 2015-05-27 | 达靖虹 | Chip module, imaging system and chip module production method |
| CN105319814A (en) * | 2015-12-01 | 2016-02-10 | 达靖虹 | Device and method for automatically replacing wafer modules |
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| CN104656352A (en) * | 2015-03-18 | 2015-05-27 | 达靖虹 | Chip module, imaging system and chip module production method |
| CN105319814A (en) * | 2015-12-01 | 2016-02-10 | 达靖虹 | Device and method for automatically replacing wafer modules |
| CN105319814B (en) * | 2015-12-01 | 2017-04-19 | 达靖虹 | Device and method for automatically replacing wafer modules |
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| CN103777446B (en) | 2015-03-25 |
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