CN103777298A - Tightness packaging method for optical fiber - Google Patents
Tightness packaging method for optical fiber Download PDFInfo
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- CN103777298A CN103777298A CN201410052456.2A CN201410052456A CN103777298A CN 103777298 A CN103777298 A CN 103777298A CN 201410052456 A CN201410052456 A CN 201410052456A CN 103777298 A CN103777298 A CN 103777298A
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Abstract
The invention discloses a tightness packaging method for optical fiber. The method comprises the steps that a naked-fiber window is formed in the optical fiber to be sealed and packaged in an air mode, the optical fiber is cleaned, the naked-fiber window is covered with ceramic glue, after the ceramic glue is cured, the optical fiber is arranged in a through hole of a module box in a penetration mode, welding flux is added, the module box is heated so that the welding flux can be melted, and finally cooling is carried out. According to the tightness packaging method, the ceramic glue with the thermal expansion coefficient close to that of the optical fiber is adopted for being formed on the optical fiber in advance, the thermal expansion coefficients of the ceramic glue and the optical fiber are nearly matched, and therefore pressure stress on the optical fiber in the tightness packaging process can be reduced, and the polarization property and the extinction ratio of the optical fiber are ensured.
Description
Technical field
The present invention relates to optical communication technology field, particularly a kind of airtight packaging method for optical fiber.
Background technology
Optical fiber is fibre-optic writing a Chinese character in simplified form, and is a kind of light conduction instrument that utilizes the total reflection principle of light in the fiber that glass or plastics are made and reach.The kind of optical fiber is a lot, according to purposes difference, and also difference to some extent of needed function and performance.Wherein, polarization maintaining optical fibre can transmission line polarized light, generally polarization state is applied in than more sensitive instrument, as interferometer or laser instrument, or be used in being connected between light source and external modulator etc., in the every field of the national economy such as space flight, aviation, navigation, industrial manufacturing technology and communication, all there is application.Take optical coherence detection in basic interferometric optical fiber sensor, use polarization maintaining optical fibre can guarantee that linear polarization is constant, improve relevant signal to noise ratio, to realize the high-acruracy survey to physical quantity.
In optical communication and sensor field, be widely used airtight optical fiber fabrication and become device to carry out signal transmission.Present stage, optical fiber air tightness assembly is generally made and between optical fiber and modular cartridge, is realized impermeability and be connected by welding manner, and this welding can make the leak rate of whole device be less than 1 × 10
-8atm.cc/s.When welding, by heating module box, modular cartridge is passed to heat on scolder scolder is melted.In general, welding optical fiber generally uses scolding tin (gold-plated optical fiber could weld with scolding tin) or low temperature glass solder.In order to reduce cost, sealing mode generally: first peel optical fiber coating off, then seal by the mode of low temperature glass solder and Can welding.As shown in Figure 1,011 represents that optical fiber, 012 represents that glass solder, 013 represents Can to its structure.Also some manufacturer can locate filling epoxy resin at the naked fibre of internal optical fiber, but the thermal expansivity of resin is generally in 500-600 × 10
-7/ K, with optical fiber 5 × 10
-7the thermal expansivity of/K differs larger.The compressive stress that polarization maintaining optical fibre can bear under the larger temperature difference of welding is larger, polarisation-affecting characteristic.
And the thermal expansivity of low temperature glass solder is 60 × 10
-7/ K, the thermal expansivity of compo pipe is 49 × 10
-7/ K, and the thermal expansivity of optical fiber is 5 × 10
-7/ K, known, the thermal expansivity of scolding tin is approximately than high two orders of magnitude of the thermal expansivity of optical fiber, and glass solder thermal expansivity is approximately than the high order of magnitude of optical fiber.Due to the difference between optical fiber expansion coefficient and scolder, scolder thawing is risen again and can cause differential contraction stress to polarization maintaining optical fibre to normal temperature, polarization characteristic is lowered, thereby can causes polarization maintaining optical fibre extinction ratio characteristic greatly to reduce.For example, when polarization maintaining optical fibre and displacement acquisition sensor, spectral interference instrument or fixed point detector combine, desired extinction ratio is 20db or larger, and along with the increase of extinction ratio, with respect to the deviation of optical fiber, degree of accuracy aspect also can go down.Wherein, extinction ratio refers to analyzer with respect to seen through light intensity and the ratio of minimum through light intensity by the maximum of analyzer.
Therefore, how both to have guaranteed optical fiber air tightness, the stress bearing while reducing again optical fiber welding, thus not affecting optical parametric, this is those skilled in the art's technical matterss urgently to be resolved hurrily always.
Summary of the invention
In view of this, the invention provides a kind of airtight packaging method for optical fiber, adopt thermal expansivity and the approaching ceramic glue of optical fiber to take shape in advance on optical fiber, because thermal expansivity between the two almost mates, thereby can reduce the compressive stress that optical fiber is subject in the time of air-tight packaging, guarantee polarization characteristic and the extinction ratio of optical fiber.
For achieving the above object, the invention provides following technical scheme:
For an airtight packaging method for optical fiber, comprising:
Steps A: the optical fiber for the treatment of level Hermetic Package is outputed to naked fine window;
Step B: clean described optical fiber;
Step C: cover ceramic glue on described naked fine window;
Step D: described ceramic glue is arranged in described optical fiber in the through hole of modular cartridge after solidifying;
Step e: add scolder;
Step F: heat described modular cartridge described scolder is melted;
Step G: cooling.
Preferably, in above-mentioned airtight packaging method, after step G, also comprise:
Step H: on the described optical fiber that is positioned at described modular cartridge end position, epoxy glue is set;
Step I: put into high low temperature circulating box and circulate.
Preferably, in above-mentioned airtight packaging method, one end of described modular cartridge is provided with the first counterbore for filling described scolder, the other end is provided with the second counterbore for filling described epoxy glue, the described epoxy glue of described modular cartridge one end is covered in the outside of described the first counterbore, and the described epoxy glue of the other end is filled in described the second counterbore.
Preferably, in above-mentioned airtight packaging method, described the first counterbore and described the second counterbore are coaxial, and be coaxially arranged with location shoulder hole between the two, in the shoulder hole of described location near one end diameter of described the second counterbore less and with the diameter adaptation of described optical fiber, in the shoulder hole of described location near one end diameter of described the first counterbore large and with solidify after the diameter adaptation of described ceramic glue.
Preferably, in above-mentioned airtight packaging method, step B is specially: with optical fiber described in the sticky alcohol wipe of dust-free paper, then shake and wash with alcohol, finally dry up with nitrogen.
Preferably, in above-mentioned airtight packaging method, step C is specially:
Step C1: described optical fiber is positioned in the moulding shoulder hole in mould to one end that in described moulding shoulder hole, diameter is less and described optical fiber adaptation, one end and the shape adaptation that needs the described ceramic glue of shaping that diameter is larger;
Step C2: pour into described ceramic glue;
Step C3: described ceramic glue curing molding.
Preferably, in above-mentioned airtight packaging method, described mould comprises sole piece and upper cover, described sole piece and described on cover and be respectively arranged with the first step trough and the second step trough, described the first step trough and described the second step trough form described moulding shoulder hole.
Preferably, in above-mentioned airtight packaging method, in described sole piece and described upper cover, one is provided with guidepost, and another is provided with the pilot hole corresponding with described guidepost adaptation and position.
Preferably, in above-mentioned airtight packaging method, described mould is silica gel mould.
Preferably, in above-mentioned airtight packaging method, step I is specially: put into high low temperature circulating box and circulate 23 to 25 hours.
Can find out from technique scheme, the invention provides in airtight packaging method, first, on the bare wire window of optical fiber, solidify to form ceramic glue and wrap layer, allow ceramic glue the naked fine window place of optical fiber the guarded by location for welding; And then penetrating together in the modular cartridge that needs welding with the optical fiber of ceramic glue, weld mutually with modular cartridge at ceramic glue external application scolder; Afterwards modular cartridge is heated, in heating process, ceramic glue bears scolder and shrinks the compressive stress forming, and optical fiber bears compressive stress substantially or seldom, thereby maintains the polarization characteristic of optical fiber; Finally, on heating arrangement, pull down the modular cartridge with optical fiber.Further, after the modular cartridge with optical fiber is cooling, fill respectively epoxy glue at modular cartridge two ends with the position that welding optical fiber contacts, further to guarantee the impermeability of optical fiber.
In technique scheme, the thermal expansivity of ceramic glue is 4.5 × 10
-7/ K to 5.5 × 10
-7between/K, because the difference of thermal expansion coefficient between ceramic glue and the optical fiber of the present invention's use is 0.5 × 10
-7/ K, even less, make to have suppressed to greatest extent the caused impact of difference due to thermal expansivity, so can effectively prevent that the polarization characteristic of optical fiber from reducing (therefore being particularly useful for the air-tight packaging of polarization maintaining optical fibre), guarantees the extinction ratio of optical fiber better.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, to the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skills, do not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is the structural representation that optical fiber of the prior art carries out air-tight packaging;
The structural representation of the optical fiber that is provided with naked fine window that Fig. 2 provides for the embodiment of the present invention;
The sole piece of the mould that Fig. 3 provides for the embodiment of the present invention partly cut open figure;
Position counter structure schematic diagram between sole piece and the optical fiber of the mould that Fig. 4 provides for the embodiment of the present invention;
Mounting structure schematic diagram between mould and optical fiber that Fig. 5 provides for the embodiment of the present invention;
The structural representation of the mould that is perfused with ceramic glue that Fig. 6 provides for the embodiment of the present invention;
Position counter structure schematic diagram between ceramic glue and the sole piece of mould that Fig. 7 provides for the embodiment of the present invention;
The structural representation of the optical fiber that is provided with ceramic glue that Fig. 8 provides for the embodiment of the present invention;
The front elevation of the sole piece of the mould that Fig. 9 provides for the embodiment of the present invention;
The axonometric drawing of the sole piece of the mould that Figure 10 provides for the embodiment of the present invention;
The front elevation of the upper cover of the mould that Figure 11 provides for the embodiment of the present invention;
The axonometric drawing of the upper cover of the mould that Figure 12 provides for the embodiment of the present invention;
Figure 13 for the embodiment of the present invention provide solidify after cylindrical ceramic glue partly cut open figure;
Figure 14 for the embodiment of the present invention provide solidify after the one-piece construction schematic diagram of cylindrical ceramic glue;
The modular cartridge that Figure 15 provides for the embodiment of the present invention partly cut open figure;
The one-piece construction schematic diagram of the modular cartridge that Figure 16 provides for the embodiment of the present invention;
Mounting structure schematic diagram between modular cartridge and optical fiber that Figure 17 provides for the embodiment of the present invention;
Between the modular cartridge that Figure 18 provides for the embodiment of the present invention and optical fiber, be provided with the structural representation of scolder;
Structural representation after the scolder that Figure 19 provides for the embodiment of the present invention melts;
Setting position and the structural representation of the epoxy glue that Figure 20 provides for the embodiment of the present invention on modular cartridge;
The process chart of the airtight packaging method for optical fiber that Figure 21 provides for the embodiment of the present invention.
Wherein, the naked fine window of 101-, 102-sole piece, 103-upper cover, 104-pilot hole, 105-optical fiber, 106-ceramic glue, 107-guidepost, 201-modular cartridge, 202-scolder, 203-epoxy glue, 204 second counterbores, 205-the first counterbore.
Embodiment
The invention discloses a kind of airtight packaging method for optical fiber, adopt thermal expansivity and the approaching ceramic glue of optical fiber to take shape in advance on optical fiber, because thermal expansivity between the two almost mates, thereby can reduce the compressive stress that optical fiber is subject in the time of air-tight packaging, guarantee polarization characteristic and the extinction ratio of optical fiber.
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is only the present invention's part embodiment, rather than whole embodiment.Based on the embodiment in the present invention, those of ordinary skills, not making the every other embodiment obtaining under creative work prerequisite, belong to the scope of protection of the invention.
Refer to Fig. 2-Figure 21, the structural representation of the optical fiber that is provided with naked fine window that Fig. 2 provides for the embodiment of the present invention, the sole piece of the mould that Fig. 3 provides for the embodiment of the present invention partly cut open figure, position counter structure schematic diagram between sole piece and the optical fiber of the mould that Fig. 4 provides for the embodiment of the present invention, mounting structure schematic diagram between mould and optical fiber that Fig. 5 provides for the embodiment of the present invention, the structural representation of the mould that is perfused with ceramic glue that Fig. 6 provides for the embodiment of the present invention, position counter structure schematic diagram between ceramic glue and the sole piece of mould that Fig. 7 provides for the embodiment of the present invention, the structural representation of the optical fiber that is provided with ceramic glue that Fig. 8 provides for the embodiment of the present invention, the front elevation of the sole piece of the mould that Fig. 9 provides for the embodiment of the present invention, the axonometric drawing of the sole piece of the mould that Figure 10 provides for the embodiment of the present invention, the front elevation of the upper cover of the mould that Figure 11 provides for the embodiment of the present invention, the axonometric drawing of the upper cover of the mould that Figure 12 provides for the embodiment of the present invention, Figure 13 for the embodiment of the present invention provide solidify after cylindrical ceramic glue partly cut open figure, Figure 14 for the embodiment of the present invention provide solidify after the one-piece construction schematic diagram of cylindrical ceramic glue, the modular cartridge that Figure 15 provides for the embodiment of the present invention partly cut open figure, the one-piece construction schematic diagram of the modular cartridge that Figure 16 provides for the embodiment of the present invention, mounting structure schematic diagram between modular cartridge and optical fiber that Figure 17 provides for the embodiment of the present invention, between the modular cartridge that Figure 18 provides for the embodiment of the present invention and optical fiber, be provided with the structural representation of scolder, structural representation after the scolder that Figure 19 provides for the embodiment of the present invention melts, setting position and the structural representation of the epoxy glue that Figure 20 provides for the embodiment of the present invention on modular cartridge, the process chart of the optical fiber air tightness method for packing that Figure 21 provides for the embodiment of the present invention.
The airtight packaging method for optical fiber that the embodiment of the present invention provides, comprising:
Steps A: first the optical fiber 105 use heating peelers for the treatment of level Hermetic Package are opened to the naked fine window 101 of about 3mm left and right, held successfully the optical fiber of window as shown in Figure 2;
Step B: clean optical fiber 105, be specially, with the sticky alcohol wipe optical fiber 105 of dust-free paper, then shake and wash with alcohol, finally dry up with nitrogen;
Step C: cover ceramic glue 106 on naked fine window 101, as shown in Figure 8, one end of naked fine window 101 is coated with ceramic glue 106, not coated ceramic glue 106 of the exposed setting of the other end;
Step D: after ceramic glue 106 solidifies, optical fiber 105 is arranged in the through hole of modular cartridge 201, as shown in figure 17;
Step e: add scolder 202, as shown in Figure 18 and Figure 19, in specific embodiment, welding optical fiber generally uses scolding tin (gold-plated optical fiber could weld with scolding tin) or low temperature glass solder;
Step F: heating module box 201 melts scolder 202;
Step G: take suitable temperature lowering curve to lower the temperature.
In order further to increase the impermeability of optical fiber, after step G, also comprise:
Step H: on the optical fiber 105 that is positioned at modular cartridge 201 end positions, epoxy glue 203 is set, as shown in figure 20;
Step I: put into high low temperature circulating box and circulate 23 to 25 hours, be preferably 24 hours.
Need to further illustrate at this, above-mentioned ceramic glue refer to there is waterproof, protection against the tide and isolated air property and there is good bubble-tight ceramic glue, be generally used in the prior art the construction fields such as flooring sealing or decoration.
Visible, in the airtight packaging method that the embodiment of the present invention provides, first on the bare wire window 102 of optical fiber 105, solidify to form cylindrical ceramic glue 106, allow ceramic glue naked fine window 102 places of optical fiber the guarded by location for welding; And then penetrating together in the modular cartridge 201 that needs welding with the optical fiber 105 of ceramic glue 106, weld mutually at ceramic glue 106 external application scolders 202 and modular cartridge 201; Afterwards modular cartridge 201 is heated, in heating process, ceramic glue 106 bears scolder 202 and shrinks the compressive stress forming, and optical fiber bears compressive stress substantially or seldom, thereby maintains the polarization characteristic of optical fiber; Finally, on heating arrangement, pull down the modular cartridge 201 with optical fiber 105, fill respectively epoxy glue 203 at cooled modular cartridge 201 two ends with the position that welding optical fiber contacts, further to guarantee its impermeability.
In technique scheme, the thermal expansivity of ceramic glue is 4.5 × 10
-7/ K to 5.5 × 10
-7between/K, because the difference of thermal expansion coefficient between ceramic glue 106 and the optical fiber 105 of the present invention's use is 0.5 × 10
-7/ K, even less, make to have suppressed to greatest extent the caused impact of difference due to thermal expansivity, so can effectively prevent that the polarization characteristic of optical fiber from reducing (therefore being particularly useful for the air-tight packaging of polarization maintaining optical fibre), guarantees the extinction ratio of optical fiber better.
Carry out comparative illustration with a specific embodiment: in prior art, directly weld mutually with low temperature glass solder and optical fiber, the contact length of supposing optical fiber and scolder is 0.5mm, if under the welding temperature difference of 175 °, the expansion difference of bi-material is 0.48um, and these two differences will cause larger compressive stress; And if with expansion coefficient be 4.5 × 10
-7the ceramic glue of/K wraps optical fiber, and so, difference of thermal expansion coefficient is between the two only 0.0043um, and the difference of this magnitude can produce obvious compressive stress hardly.In specific embodiment preferably, can preferentially select and the identical ceramic glue of optical fiber thermal expansivity, in this case, both difference of thermal expansion coefficient are 0/K, the polarization property of optical fiber also can be protected best.
Refer to Figure 15 and Figure 16, in specific embodiment, one end of modular cartridge 201 is provided with the first counterbore 205 for filling scolder 202, and the other end is provided with the second counterbore 204 for filling epoxy glue 203; The first counterbore 205 and the second counterbore 204 are coaxial, and be coaxially arranged with location shoulder hole between the two, in the shoulder hole of location near one end diameter of the second counterbore 204 less and with the diameter adaptation of optical fiber, in the shoulder hole of location near one end diameter of the first counterbore 205 large and with solidify after the diameter adaptation of cylindrical ceramic glue 106.In the time that optical fiber is sealed, the optical fiber 195 of the good ceramic glue 105 of fixed bonding is penetrated in modular cartridge 201, and be pushed into the draw-in groove position of location shoulder hole, play positioning action placed in the middle.And in the time that optical fiber is further sealed, the epoxy glue 203 of one end of modular cartridge 201 is covered in the outside of the first counterbore 205, the epoxy glue 203 of the other end is filled in the second counterbore 204, as shown in figure 20.
Refer to Fig. 9 to Figure 12, in specific embodiment, by mould by ceramic glue 106 curing moldings on naked fine window 101, wherein, being preferably mould is silica gel mould, specifically comprise sole piece 102 and upper cover 103, be respectively arranged with the first step trough and the second step trough on sole piece 102 and upper cover 103, the first step trough and the second step trough are configured for arranging the moulding shoulder hole of ceramic glue 106.Therefore,, in above-mentioned airtight packaging method, step C comprises:
Step C1: optical fiber 105 is positioned in the moulding shoulder hole in mould to one end that in moulding shoulder hole, diameter is less and optical fiber 105 adaptations, one end and the shape adaptation (as shown in Figures 3 to 5) that needs the ceramic glue 106 of shaping that diameter is larger;
Step C2: pour into ceramic glue 106(as shown in Figure 6);
Step C3: ceramic glue 106 curing moldings.
Finally take mould (as shown in Figure 7) apart, the demoulding obtains the optical fiber 105 with ceramic glue 106 as shown in Figure 8, and wherein, the ceramic glue 106 of curing molding is cylindrical colloid as shown in Figure 13 and Figure 14.
In a preferred embodiment, between the sole piece 102 of mould and upper cover 103, position by guidepost 107 and pilot hole 104, be sole piece 102(or upper cover 1) on be provided with guidepost 107, upper cover 1(or sole piece 102) on be provided with the pilot hole 104 corresponding with guidepost 107 adaptations and position.
In a preferred embodiment, modular cartridge 201 is generally Can, and it is the alloy material of 6～7ppm/ ℃ that Can should be selected thermal expansivity, the preferably kovar alloy material of thermal expansivity in aforementioned range, i.e. and kovar alloy, also claims fernico.In addition, the epoxy glue 203 of filling should selection work temperature exceed the epoxy glue of 200 ℃.
To sum up, the technological process of most preferred specific embodiment provided by the invention is: output bare wire window → clean → pack into mould → pour into ceramic glue → ceramic glue curing molding → take off optical fiber → penetrate Can → heating → cooling on optical fiber after, pull down optical fiber → filling epoxy glue → high low-temperature circulating.Specifically please refer to Figure 21.
To the above-mentioned explanation of the disclosed embodiments, make professional and technical personnel in the field can realize or use the present invention.To be apparent for those skilled in the art to the multiple modification of these embodiment, General Principle as defined herein can, in the situation that not departing from the spirit or scope of the present invention, realize in other embodiments.Therefore, the present invention will can not be restricted to these embodiment shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (10)
1. for an airtight packaging method for optical fiber, it is characterized in that, comprising:
Steps A: the optical fiber (105) for the treatment of level Hermetic Package is outputed to naked fine window (101);
Step B: clean described optical fiber (105);
Step C: at the upper ceramic glue (106) that covers of described naked fine window (101);
Step D: described ceramic glue (106) is arranged in described optical fiber (105) in the through hole of modular cartridge (201) after solidifying;
Step e: add scolder (202);
Step F: heat described modular cartridge (201) described scolder (202) is melted;
Step G: cooling.
2. airtight packaging method according to claim 1, is characterized in that, after step G, also comprises:
Step H: on the described optical fiber (105) that is positioned at described modular cartridge (201) end position, epoxy glue (203) is set;
Step I: put into high low temperature circulating box and circulate.
3. airtight packaging method according to claim 2, it is characterized in that, one end of described modular cartridge (201) is provided with the first counterbore (205) for filling described scolder (202), the other end is provided with the second counterbore (204) for filling described epoxy glue (203), the described epoxy glue (203) of described modular cartridge (201) one end is covered in the outside of described the first counterbore (205), and the described epoxy glue (203) of the other end is filled in described the second counterbore (204).
4. airtight packaging method according to claim 3, it is characterized in that, described the first counterbore (205) and described the second counterbore (204) are coaxial, and be coaxially arranged with location shoulder hole between the two, in the shoulder hole of described location near one end diameter of described the second counterbore (204) less and with the diameter adaptation of described optical fiber, in the shoulder hole of described location near one end diameter of described the first counterbore (205) large and with solidify after the diameter adaptation of described ceramic glue (106).
5. airtight packaging method according to claim 1, is characterized in that, step B is specially: with optical fiber (105) described in the sticky alcohol wipe of dust-free paper, then shake and wash with alcohol, finally dry up with nitrogen.
6. airtight packaging method according to claim 1, is characterized in that, step C is specially:
Step C1: described optical fiber (105) is positioned in the moulding shoulder hole in mould, one end that in described moulding shoulder hole, diameter is less and described optical fiber (105) adaptation, one end and the shape adaptation that needs the described ceramic glue (106) of shaping that diameter is larger;
Step C2: pour into described ceramic glue (106);
Step C3: described ceramic glue (106) curing molding.
7. airtight packaging method according to claim 6, it is characterized in that, described mould comprises sole piece (102) and upper cover (103), on described sole piece (102) and described upper cover (103), be respectively arranged with the first step trough and the second step trough, described the first step trough and described the second step trough form described moulding shoulder hole.
8. airtight packaging method according to claim 7, it is characterized in that, in described sole piece (102) and described upper cover (103), one is provided with guidepost (107), and another is provided with the pilot hole (104) corresponding with described guidepost (107) adaptation and position.
9. airtight packaging method according to claim 6, is characterized in that, described mould is silica gel mould.
10. airtight packaging method according to claim 1, is characterized in that, step I is specially: put into high low temperature circulating box and circulate 23 to 25 hours.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410052456.2A CN103777298B (en) | 2014-02-17 | 2014-02-17 | A kind of airtight packaging method for optical fiber |
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|---|---|---|---|
| CN201410052456.2A CN103777298B (en) | 2014-02-17 | 2014-02-17 | A kind of airtight packaging method for optical fiber |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110291688A (en) * | 2017-02-14 | 2019-09-27 | 古河电气工业株式会社 | Optical element packaging part and optical element module |
| CN110824634A (en) * | 2019-10-31 | 2020-02-21 | 苏州长光华芯光电技术有限公司 | Optical fiber packaging structure |
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| CN1556427A (en) * | 2003-12-31 | 2004-12-22 | 王其彪 | Photoelectron device coupling packaged by optical fiber terminal |
| US6837075B1 (en) * | 2000-10-27 | 2005-01-04 | Bookham Technology, Plc. | Glass fiber fixative and fixing process |
| CN101063730A (en) * | 2006-03-29 | 2007-10-31 | 索尼株式会社 | Hermetic seal device for polarization-maintaining optical fiber and hermetic seal partition |
| US20110158594A1 (en) * | 2009-12-29 | 2011-06-30 | Prasad Yalamanchili | Optical module with fiber feedthrough |
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| JPS5685715A (en) * | 1979-12-14 | 1981-07-13 | Nippon Telegr & Teleph Corp <Ntt> | Optical fiber lead-in part |
| CN1055428A (en) * | 1990-03-28 | 1991-10-16 | 日本碍子株式会社 | Optical fiber built-in type composite insulator |
| US6837075B1 (en) * | 2000-10-27 | 2005-01-04 | Bookham Technology, Plc. | Glass fiber fixative and fixing process |
| CN1556427A (en) * | 2003-12-31 | 2004-12-22 | 王其彪 | Photoelectron device coupling packaged by optical fiber terminal |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110291688A (en) * | 2017-02-14 | 2019-09-27 | 古河电气工业株式会社 | Optical element packaging part and optical element module |
| CN110824634A (en) * | 2019-10-31 | 2020-02-21 | 苏州长光华芯光电技术有限公司 | Optical fiber packaging structure |
| CN110824634B (en) * | 2019-10-31 | 2021-01-29 | 苏州长光华芯光电技术有限公司 | Optical fiber packaging structure |
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|---|---|
| CN103777298B (en) | 2016-02-17 |
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