CN103776538A - Connection plate type infrared ray sensor group architecture, and manufacturing method of infrared ray sensor - Google Patents
Connection plate type infrared ray sensor group architecture, and manufacturing method of infrared ray sensor Download PDFInfo
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- CN103776538A CN103776538A CN201210397895.8A CN201210397895A CN103776538A CN 103776538 A CN103776538 A CN 103776538A CN 201210397895 A CN201210397895 A CN 201210397895A CN 103776538 A CN103776538 A CN 103776538A
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Abstract
The invention discloses a connection plate type infrared ray sensor group architecture, and a manufacturing method of an infrared ray sensor. The connection plate type infrared ray sensor group architecture comprises a support plate, multiple circuit units and multiple infrared ray sensing modules. The support plate is divided into multiple sensing blocks; each sensing block sequentially defines a base portion, a connection portion and a test portion; each circuit unit forms a base circuit, a connection circuit and a test circuit which are electrically connected and are respectively disposed at the base portion, the connection portion and the test portion of each sensing block; the infrared ray sensing modules are respectively arranged on the base portions and are electrically connected with the base circuits; and each infrared ray sensing module, the corresponding base portion where the infrared ray sensing module is disposed, and the corresponding base circuit where the infrared ray sensing module is electrically connected are defined together as one infrared ray sensor, such that the infrared ray sensors can be simultaneously tested through the test circuits. Besides, the invention further provides a manufacturing method of an infrared ray sensor.
Description
Technical field
The present invention relates to a kind of sensor and manufacture method thereof, and particularly relate to the manufacture method of a kind of linking-board type infrared ray sensor group's framework and infrared ray sensor.
Background technology
The shaping of known infrared line sensor is mainly first to prepare a wafer (figure slightly); Again wafer is cut, use and form multiple chips; Get one of them chip, with stick brilliant machine (figure slightly) by chip gluing in having on the pedestal of pin; Thermistor is arranged on pedestal, with wire bonder (figure slightly), chip and thermistor is connected on pin thereafter; Finally, the lid that is equiped with optical filter is sealed on pedestal.By this, complete an infrared ray sensor.
But, as mentioned above, mostly produced take single infrared ray sensor as a unit, and after manufacturing in the past, then by whether defectiveness of a testing infrared ray sensor.This kind of flow process will make the integral production high cost of infrared ray sensor.
So the improving of the above-mentioned defect of inventor's thoughts, is that spy concentrates on studies and coordinates the utilization of scientific principle, finally propose a kind of reasonable in design and effectively improve the present invention of above-mentioned defect.
Summary of the invention
The embodiment of the present invention is to provide the manufacture method of a kind of linking-board type infrared ray sensor group's framework and infrared ray sensor, and it contributes to can test by test circuit multiple infrared ray sensors simultaneously.
The embodiment of the present invention provides a kind of linking-board type infrared ray sensor group framework, comprising: a support plate, and it divides into multiple sensing blocks, and each sensing block sequentially defines a base portion, a junction and a test department; Multiple circuit units, it is located at respectively these sensing blocks, and each circuit unit is sequentially formed with a base portion circuit, a connecting circuit and a test circuit of electrical communication, and base portion circuit, connecting circuit and the test circuit of each circuit unit lay respectively at base portion, connecting portion and the test department of each sensing block; And multiple infrared sensing modules, it is arranged at respectively on the base portion of these sensing blocks, and these infrared sensing modules are electrically connected at respectively the base portion circuit of these circuit units; Wherein, each infrared sensing module, its this set sensing block base portion and this circuit unit base portion circuit being electrically connected thereof are defined as an infrared ray sensor jointly, and this linking-board type infrared ray sensor group framework is suitable for testing by the test circuit of these circuit units these infrared ray sensors simultaneously.
Preferably, this support plate defines one first cut-off rule and many second cut-off rules, these sensors are positioned at a side of this first cut-off rule, the connecting circuit of the connecting portion of this support plate and test department and these circuit units and test circuit are positioned at the opposite side of this first cut-off rule, these second cut-off rules lay respectively between the base portion of any two these adjacent sensing blocks, or, between any two the second adjacent cut-off rules, be at least two in these sensing block base portions.
The embodiment of the present invention separately provides a kind of manufacture method of infrared ray sensor, its step comprises: a support plate is provided, and this support plate is divided into multiple sensing blocks along a first direction, then each sensing block is sequentially defined to a base portion, a junction and a test department along a second direction; Wherein, this first direction is approximately perpendicular to this second direction; A base portion circuit, a connecting circuit and a test circuit of the corresponding circuit unit that is shaped of difference on base portion, connecting portion and the test department of each sensing block, and base portion circuit, connecting circuit and the test circuit of each circuit unit electrically conduct each other; And multiple infrared sensing modules are installed on respectively on the base portion of these sensing blocks, and these infrared sensing modules are electrically connected at respectively to the base portion circuit of these circuit units, to form a linking-board type infrared ray sensor group framework; Wherein, each infrared sensing module, its this set sensing block base portion and this circuit unit base portion circuit of being electrically connected thereof are defined as an infrared ray sensor jointly.
Preferably, in the time being shaped these circuit units, the test circuit of these circuit units is revealed in respectively to the plate face of this support plate, and forming after this linking-board type infrared ray sensor group framework, test circuit by these circuit units is to test these infrared ray sensors simultaneously, and after testing these infrared ray sensors, connecting circuit and the test circuit of these circuit units that remove the connecting portion of this support plate and test department and be located thereon, to obtain these infrared ray sensors that are connected along this first direction.
In sum, linking-board type infrared ray sensor group's framework that the embodiment of the present invention provides and the manufacture method of infrared ray sensor, it is suitable for producing in a large number infrared ray sensor, and effectively significantly shortens and detect the required time of expending, and then reaches the effect reducing production costs.
For enabling further to understand feature of the present invention and technology contents, refer to following about detailed description of the present invention and accompanying drawing, but these explanations with appended graphic be only for the present invention is described, but not claim scope of the present invention is done to any restriction.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of linking-board type infrared ray sensor of the present invention group framework.
Fig. 2 is the schematic diagram that linking-board type infrared ray sensor of the present invention group framework is cut into modular infrared ray sensor.
Fig. 3 is the schematic diagram that linking-board type infrared ray sensor of the present invention group framework is cut into multi-element type infrared ray sensor.
Fig. 4 is the wherein schematic diagram of an infrared ray sensor of linking-board type infrared ray sensor of the present invention group framework.
Fig. 5 is the infrared ray sensor of linking-board type infrared ray sensor of the present invention group framework, and its thermometric chip and temperature-compensated chip are the schematic diagram of the form that is connected as a body.
Fig. 6 is the infrared ray sensor of linking-board type infrared ray sensor of the present invention group framework, the schematic diagram that its thermometric chip and temperature-compensated chip are unpack format.
Fig. 7 is the schematic diagram that the filter unit of linking-board type infrared ray sensor of the present invention group framework is embedded at cover unit through hole.
Fig. 8 is a wherein infrared ray sensor of linking-board type infrared ray sensor of the present invention group framework, and it is equiped with the schematic diagram of auxiliary element unit.
Fig. 9 is the infrared ray sensor of linking-board type infrared ray sensor of the present invention group framework, and its infrared sensing unit only has the schematic diagram of thermometric chip.
Figure 10 is the steps flow chart schematic diagram of the manufacture method of infrared ray sensor of the present invention.
[main element symbol description]
100 linking-board type infrared ray sensor group frameworks
1 support plate
11 first plate faces
12 second plate faces
13 sensing blocks
131 base portions
132 connecting portions
133 test departments
2 circuit units
21 base portion circuit
22 connecting circuit
23 test circuits
3 infrared sensing modules
31 infrared sensing unit
311 thermometric chips
312 temperature-compensated chips
32 cover unit
321 through holes
33 filter units
34 thermistors
35 auxiliary element unit
10 infrared ray sensors
D1 first direction
D2 second direction
L1 the first cut-off rule
L2 the second cut-off rule
Embodiment
Refer to Fig. 1, it is the preferred embodiments of the present invention, and the present embodiment is the manufacture method of a kind of linking-board type infrared ray sensor group's framework and infrared ray sensor.Following elder generation is described with regard to linking-board type infrared ray sensor group framework, then introduces the manufacture method of infrared ray sensor again.
Described linking-board type infrared ray sensor group framework 100, comprises a support plate 1, multiple circuit unit 2 and multiple infrared sensing module 3.Wherein, above-mentioned support plate 1 can be printed circuit board (PCB), IC support plate or ceramic substrate etc., is not limited at this.
Described support plate 1 be roughly elongated and there is one first relative plate face 11 and one second plate face 12(as Fig. 4), and support plate 1 is divided into multiple sensing blocks 13 along a first direction D1, in other words, the external form of above-mentioned sensing block 13 is roughly the same and along sequentially spread configuration of first direction D1.
And each sensing block 13 sequentially defines a base portion 131, a junction 132 and a test department 133 along a second direction D2, also, the base portion 131 of each sensing block 13, connecting portion 132 and test department 133 external forms are roughly the same and along sequentially spread configuration of second direction D2.
Wherein, above-mentioned second direction D2 is that to be approximately perpendicular to first direction D1 be example in the present embodiment, but is not limited to this.And the base portion 131 of each sensing block 13 is roughly square (as: square).
Described circuit unit 2 is located at respectively the sensing block 13 of above-mentioned support plate 1, and each circuit unit 2 is sequentially formed with a base portion circuit 21, a connecting circuit 22 and a test circuit 23 of electrical communication.In other words, each circuit unit 2 base portion circuit 21 can electrically conduct to test circuit 23 via its connected connecting circuit 22.
And the base portion circuit 21 of each circuit unit 2, connecting circuit 22 and test circuit 23 lay respectively on base portion 131, connecting portion 132 and the test department 133 of each sensing block 13.For instance, the circuit on each sensing block 13 base portion 131 is all base portion circuit 21, only indicates part base portion circuit 21 so that the use illustrating in Fig. 1 ~ 3; Similarly, in Fig. 1 ~ 3, also only indicate part connecting circuit 22 and partial test circuit 23 use as an example.
Wherein, the base portion circuit 21 of described circuit unit 2, connecting circuit 22 and test circuit 23 are revealed in respectively the first plate face 11 and the second plate face 12 of support plate 1.
Say further, above-mentioned test circuit 23 is roughly the strip external form that is parallel to second direction D2, and test circuit 23 on support plate 1 is along second direction D2 compartment of terrain spread configuration.In other words, the test circuit 23 of the test department 133 of the sensing block 13 of described support plate 1 and these circuit units 2 that are located thereon is equivalent to a golden finger structure (golden finger structure), but in the time of practical application, also can be adjusted according to deviser's demand, be not limited to golden finger structure.For instance, described test circuit 23 also can be general electrode structure, in other words, as long as described test circuit 23 can provide external probe or any form (as: reed) engaged test.
Described infrared sensing module 3 arranges respectively the second plate face 12(of support plate 1 as Fig. 4) and be positioned on the base portion 131 of these sensing blocks 13, and the described infrared sensing module 3 base portion circuit 21 that is electrically connected at respectively these circuit units 2 is revealed in the position (figure is slightly) of the second plate face 12.Wherein, each infrared sensing module 3, its set sensing block 13 base portions 131 and the circuit unit 2 base portion circuit 21 that are electrically connected thereof are defined as an infrared ray sensor 10 jointly.
Moreover the size of described support plate 1 each base portion 131 is only suitable for installing an infrared sensing module 3, in other words, the size of each infrared ray sensor 10 is equivalent to an infrared sensing module 3, uses the effect that reaches microminiaturized infrared ray sensor 10.
Therefore, described linking-board type infrared ray sensor group framework 100 is suitable for testing by the test circuit 23 of these circuit units 2 all infrared ray sensors 10 simultaneously, that is to say, being connected to a proving installation (figure slightly) by above-mentioned golden finger structure can detect all infrared ray sensors 10, uses and reaches the effect of dwindling detection time and then reducing production costs.
Moreover, described support plate 1 defines one first cut-off rule L1, above-mentioned the first cut-off rule L1 is roughly parallel to above-mentioned first direction D1, and the first cut-off rule L1 (also can say so, between the base portion 131 and connecting portion 132 of these sensing blocks 13) between these infrared ray sensors 10 and the connecting portion 132 of these sensing blocks 13.
That is to say, these infrared ray sensors 10 are positioned at a side of this first cut-off rule L1, and the connecting portion 132 of described support plate 1 and the connecting circuit 22 of test department 133 and these circuit units 2 and test circuit 23 are positioned at the opposite side of above-mentioned the first cut-off rule L1.
Separately, described support plate 1 also defines many second cut-off rule L2, and above-mentioned the second cut-off rule L2 is roughly parallel to described second direction D2, and the quantity of the second cut-off rule L2 can be changed according to deviser's demand.
For instance, shown in Fig. 2, if form the modular infrared ray sensor of infrared ray sensor 10(of single type formula), between any two adjacent sensing block 13 base portions 131, form a second cut-off rule L2, that is to say, these second cut-off rules L2 lays respectively between the base portion 131 of any two adjacent sensing blocks 13.
Shown in Fig. 3, if form the infrared ray sensor 10(multi-element type infrared ray sensor of many connected patterns), form a second cut-off rule L2 between multiple connected sensing block 13 base portions 131 and the in addition adjacent multiple sensing block being connected 13 base portions 131, also be, between any two the second adjacent cut-off rule L2, be at least two in these sensing block 13 base portions 131 (are equivalent in Fig. 1, do not form from even number bar the second cut-off rule L2 left and that right number comes).
Therefore, testing after all infrared ray sensors 10, can be along the first cut-off rule L1 cutting, use the connecting portion 132 that removes described support plate 1 and test department 133 and the connecting circuit 22 and test circuit 23 of these circuit units 2 of being located thereon.And after the second cut-off rule L2 cutting, can form the required type of deviser (as: modular infrared ray sensor or multi-element type infrared ray sensor).
Followingly will illustrate that further the infrared ray sensor 10 about in above-mentioned linking-board type infrared ray sensor group framework 100 constructs, and for ease of explanation, Fig. 4 to Fig. 6 will be with an infrared ray sensor 10 use as an example.
Specifically, in each infrared ray sensor 10, infrared sensing module 3 includes an infrared sensing unit 31, a cover unit 32, a filter unit 33 and a thermistor 34.
Described infrared sensing unit 31 is arranged on the base portion 131 of support plate 1, and is electrically connected at the base portion circuit 21 of circuit unit 2.Wherein, each infrared sensing unit 31 has a thermometric chip 311 and a temperature-compensated chip 312, and thermometric chip 311 and temperature-compensated chip 312 are identical roughly square structure (as: square).
Above-mentioned thermometric chip 311 is in order to receive an infrared signal, and thermometric chip 311 and temperature-compensated chip 312 are in order to receive and to have a noise, the noise that the noise that temperature-compensated chip 312 receives receives in order to offset thermometric chip 311 respectively simultaneously.
In more detail, as Fig. 5, in described infrared ray sensor 10, thermometric chip 311 and the temperature-compensated chip 312 of infrared sensing unit 31 can be designed to be connected to the microscler structure of single type.In other words, above-mentioned thermometric chip 311 and temperature-compensated chip 312, in the time manufacturing, can cut into both a connected structure, use and save the required time of expending of manufacture process.
Wherein, the long axis direction of infrared sensing unit 31 is roughly parallel to the diagonal line of described support plate 1 base portion 131, and thermometric chip 311 is roughly arranged on the diagonal line of support plate 1 base portion 131 with temperature-compensated chip 312.
In the present embodiment, described thermometric chip 311 is roughly positioned at the central part of support plate 1 base portion 131, and the diagonal line of thermometric chip 311 roughly accompanies an angle (being approximately 45 degree) mutually with the diagonal line of support plate 1 base portion 131, but in the time of practical application, is not limited to this.
Moreover, the catercorner length of shared support plate 1 base portion 131 in described infrared sensing unit 31 be roughly both length of sides of thermometric chip 311 and temperature-compensated chip 312 and.Therefore, described thermometric chip 311 and temperature-compensated chip 312 are connected to the microscler structure of single type, and its single structure compared to single separation (will explain in following), contributes to support plate 1 base portion 131 to dwindle further its size especially.
Or as Fig. 6, in described infrared ray sensor 10, thermometric chip 311 and the temperature-compensated chip 312 of infrared sensing unit 31 can be designed to single structure separated from one another.
Wherein, the diagonal line of described thermometric chip 311 and temperature-compensated chip 312 is roughly parallel to the diagonal line of support plate 1 base portion 131, and thermometric chip 311 is roughly arranged on the diagonal line of support plate 1 base portion 131 with temperature-compensated chip 312.
In the present embodiment, described thermometric chip 311 is roughly positioned at the central part of support plate 1 base portion 131, and the catercorner length of shared support plate 1 base portion 131 in described infrared sensing unit 31 is roughly both diagonal line sum totals of thermometric chip 311 and temperature-compensated chip 312, but in the time of practical application, be not limited to this.
As Fig. 4, described cover unit 32 is take a crown cap as example in the present embodiment.And the nearly central part of above-mentioned cover unit 32 is formed with a through hole 321, and cover unit 32 is fixed on support plate 1 base portion 131 and cover at 31 outsides, infrared sensing unit.
Wherein, the through hole 321 of above-mentioned cover unit 32, corresponding to thermometric chip 311, is used and is made above-mentioned thermometric chip 311 can receive above-mentioned infrared signal through this through hole 321.
Moreover described cover unit 32 inner edges can plate establishes an emissivity lower than the coat of metal of cover unit 32 (figure slightly, as: gold-plated or nickel plating).By this, cover unit 32 can effectively block external noise and disturb infrared sensing unit 31.And in the time that cover unit 32 is heated, the coat of metal of cover unit 32 inner edges can give out the radiant quantity low compared with cover unit 32, to reduce the interference to infrared sensing unit 31.
Described filter unit 33 in the present embodiment take an optical filter as example.Filter unit 33 is arranged at the through hole 321 of cover unit 32 outer rims and covering lid body unit 32.Filter unit 33 in the present embodiment is fixed on cover unit 32 outer rims with an adhesive agent (not indicating).
Wherein, because the emissivity of adhesive agent is higher, therefore the present embodiment intercepts adhesive agent outside cover unit 32, use the radiation producing while utilizing the isolated adhesive agent of cover unit 32 to be heated, and then avoid interference infrared sensing unit 31.
In addition, the filter unit 33 in the present embodiment to be to be attached to cover unit 32 tops as example, but in the time of practical application not as limit.For example: consult shown in Fig. 7, described filter unit 33 also can be embedded in the through hole 321 of cover unit 32.
By this, described infrared signal can, outside infrared ray sensor 10, after the filtration of filter unit 33, be worn the thermometric chip 311 that is incident upon infrared sensing unit 31, for its reception.Moreover the filter unit 33 of described infrared ray sensor 10 also can use respectively different optical filters, in order to the signal of filtering different-waveband in multi-element type infrared ray sensor.
Described thermistor 34 is electrically connected at the base portion circuit 21 of circuit unit 2, and thermistor 34 there is pattern, can be on single element the base portion 131 that is installed in described support plate 1; Or, be built in can being also (figure is slightly) in thermometric chip 311.
Should be noted that, in the time being built in thermometric chip 311 in thermistor 34, because the structure of the temperature-compensated chip 312 in the present embodiment is equal to thermometric chip 311, in other words, thermometric chip 311 and temperature-compensated chip 312 have thermistor 34 in all.But in the time of practical application, also can only there is the built-in thermistor 34(figure of above-mentioned thermometric chip 311 slightly).
Moreover, as Fig. 8, each infrared ray sensor 10 is except said elements, described infrared sensing unit 31 also can further have an auxiliary element unit 35, for example: operational amplifier (operational amplifier, OP) or electronic type can clear program ROM (read-only memory) (electrically erasable programmable read-only memory, EEPROM).
And above-mentioned auxiliary element unit 35 is positioned at cover unit 32 and be arranged on the base portion 131 of support plate 1, and be electrically connected at the base portion circuit 21 of circuit unit 2.
In addition, the mode that above-mentioned infrared sensing unit 31, thermistor 34 and auxiliary element unit 35 are electrically connected at base portion circuit 21 can optionally be used and cover crystal type (flip chip), surface mount mode (surface mount technology according to deviser's consideration, SMT), the mode such as chip direct package (chip-on-board, COB) and routing (wire bonding) at least one of them.
For instance, as shown in Figure 8, infrared sensing unit 31 is electrically connected at base portion circuit 21 by covering crystal type, and thermistor 34 is electrically connected at base portion circuit 21 by surface mount mode, and auxiliary element unit 35 is electrically connected at base portion circuit 21 by routing.
Subsidiary one carries, as Fig. 9, described linking-board type infrared ray sensor group framework 100 also can dwindle the size of support plate 1 base portion 131 and cover unit 32, in order to be only suitable for an accommodating thermometric chip 311, use in meeting the lower demand of degree of accuracy requirement the size of dwindling further described infrared ray sensor 10.
In sum, the preferred enforcement aspect of the present embodiment linking-board type infrared ray sensor group framework 100 is described, has then then been described for the manufacture method of infrared ray sensor 10.
Specifically, refer to Figure 10 while referring to figs. 1 through Fig. 4, the manufacture method of described infrared ray sensor 10 comprises that step S110 is to step S150, and the explanation of each step is roughly as follows.
Step S110 a: support plate 1 is provided, and above-mentioned support plate 1 is divided into multiple sensing blocks 13 along a first direction D1, then each sensing block 13 is sequentially defined to a base portion 131, a junction 132 and a test department 133 along a second direction D2.Wherein, described first direction D1 is approximately perpendicular to second direction D2, but in the time of practical application, is not limited to this.
Step S120: a base portion circuit 21, a connecting circuit 22 and a test circuit 23 of the corresponding circuit unit 2 that is shaped of difference on base portion 131, connecting portion 132 and the test department 133 of each sensing block 13.And base portion circuit 21, connecting circuit 22 and the test circuit 23 of each circuit unit 2 electrically conduct each other.
Wherein, in the time of shaping foregoing circuit unit 2, the test circuit of these circuit units 2 23 is revealed in respectively to the plate face of support plate 1.
Step S130: multiple infrared sensing modules 3 are installed on respectively on the base portion 131 of these sensing blocks 13, and these infrared sensing modules 3 are electrically connected at respectively to the base portion circuit 21 of these circuit units 2, to form a linking-board type infrared ray sensor group framework 100.
Wherein, each infrared sensing module 3, its set sensing block 13 base portions 131 and the circuit unit 2 base portion circuit 21 that are electrically connected thereof are defined as an infrared ray sensor 10 jointly.
Step S140: forming after linking-board type infrared ray sensor group framework 100, the test circuit 23 by these circuit units 2 is to test all infrared ray sensors 10 simultaneously.
Step S150: and after testing infrared ray sensor 10, the first cut-off rule L1 along support plate 1 cuts, with the connecting circuit 22 and test circuit 23 of the connecting portion 132 that removes described support plate 1 and test department 133 and these circuit units 2 of being located thereon, use and obtain these infrared ray sensors 10 that are connected along above-mentioned first direction D1.
Step S160: obtaining after these connected infrared ray sensors 10, cutting these connected infrared ray sensors 10 along the second cut-off rule L2 of support plate 1.Say further, can cut according to deviser's demand the modular infrared ray sensor of infrared ray sensor 10(that forms multiple single type formulas); Or cutting forms the infrared ray sensor 10(multi-element type infrared ray sensor of multiple many connected patterns).
(effect of embodiment)
According to the embodiment of the present invention, above-mentioned linking-board type infrared ray sensor group's framework and the manufacture method of infrared ray sensor, it is suitable for producing infrared ray sensor in mode in batches, and effectively significantly to shorten and to detect the required time of expending, and then reach the effect reducing production costs by linking-board type infrared ray sensor group framework.
Moreover the size of each base portion of described support plate is only suitable for installing an infrared sensing module.In other words, the size of each infrared ray sensor is equivalent to an infrared sensing module, uses the effect that reaches microminiaturized.
The foregoing is only embodiments of the invention, it is not in order to limit to the scope of the claims of the present invention.
Claims (19)
1. a linking-board type infrared ray sensor group framework, is characterized in that, comprising:
One support plate, it divides into multiple sensing blocks, and described in each, sensing block sequentially defines a base portion, a junction and a test department;
Multiple circuit units, it is located at respectively described sensing block, and circuit unit is sequentially formed with a base portion circuit, a connecting circuit and a test circuit of electrical communication described in each, and described in each, base portion circuit, connecting circuit and the test circuit of circuit unit lays respectively at base portion, connecting portion and the test department of sensing block described in each; And
Multiple infrared sensing modules, it is arranged at respectively on the base portion of described sensing block, and described infrared sensing module is electrically connected at respectively the base portion circuit of described circuit unit;
Wherein, described in each, infrared sensing module, the set base portion of described sensing block and the base portion circuit of the described circuit unit that described infrared sensing module is electrically connected of described infrared sensing module are defined as an infrared ray sensor jointly, and described linking-board type infrared ray sensor group framework is suitable for testing described infrared ray sensor by the described test circuit of described circuit unit simultaneously.
2. linking-board type infrared ray sensor according to claim 1 group framework, is characterized in that, the test circuit of described circuit unit is revealed in respectively the plate face of described support plate.
3. linking-board type infrared ray sensor according to claim 2 group framework, is characterized in that, the test department of the described sensing block of described support plate and the test circuit that is positioned at the described circuit unit on described test department are a golden finger structure.
4. linking-board type infrared ray sensor according to claim 1 group framework, is characterized in that, in infrared ray sensor described in each, described infrared sensing module includes:
One infrared sensing unit, it is arranged on the base portion of described support plate, and is electrically connected at the base portion circuit of described circuit unit;
One cover unit, it is formed with a through hole, and described cover unit covers at the outside of described infrared sensing unit and is fixed on the base portion of described support plate; And
One filter unit, it covers the through hole of described cover unit, so that described infrared sensing unit can receive an infrared signal through described filter unit.
5. linking-board type infrared ray sensor according to claim 4 group framework, it is characterized in that, in infrared ray sensor described in each, described infrared sensing unit has a thermometric chip and a temperature-compensated chip, described thermometric chip is corresponding to the through hole of described cover unit, and described thermometric chip is in order to receive described infrared signal, described thermometric chip and described temperature-compensated chip are in order to receive respectively a noise simultaneously, and the noise that the noise that described temperature-compensated chip receives receives in order to offset described thermometric chip.
6. linking-board type infrared ray sensor according to claim 5 group framework, it is characterized in that, in infrared ray sensor described in each, the described thermometric chip of described infrared sensing unit and described temperature-compensated chip are the microscler structure that is connected to single type, and the base portion of described support plate is square, the long axis direction of described infrared sensing unit is parallel to the diagonal line of the base portion of described support plate, and described thermometric chip and described temperature-compensated chip are arranged on the diagonal line of base portion of described support plate.
7. linking-board type infrared ray sensor according to claim 5 group framework, it is characterized in that, in infrared ray sensor described in each, the described thermometric chip of described infrared sensing unit and described temperature-compensated chip are structure separated from one another, and the base portion of described support plate is square, described thermometric chip and described temperature-compensated chip are arranged on the diagonal line of base portion of described support plate.
8. linking-board type infrared ray sensor according to claim 7 group framework, it is characterized in that, described thermometric chip and described temperature-compensated chip are all square, and the diagonal line of described thermometric chip and described temperature-compensated chip is parallel to the diagonal line of the base portion of described support plate.
9. linking-board type infrared ray sensor according to claim 4 group framework, it is characterized in that, in infrared ray sensor described in each, described infrared sensing module further has a thermistor, and described thermistor is electrically connected at the base portion circuit of described circuit unit.
10. linking-board type infrared ray sensor according to claim 4 group framework, is characterized in that, the filter unit of described infrared ray sensor is respectively in order to the light of filtering different-waveband.
11. linking-board type infrared ray sensor according to claim 4 group frameworks, it is characterized in that, in infrared ray sensor described in each, described infrared sensing unit further has an auxiliary element unit, described auxiliary element unit is positioned at described cover unit and is arranged on the base portion of described support plate, and is electrically connected at the base portion circuit of described circuit unit.
12. according to the linking-board type infrared ray sensor group framework described in any one in claim 1 to 11, it is characterized in that, described support plate defines one first cut-off rule and many second cut-off rules, described infrared ray sensor is positioned at a side of described the first cut-off rule, the connecting circuit of the connecting portion of described support plate and test department and described circuit unit and test circuit are positioned at the opposite side of described the first cut-off rule, and described the second cut-off rule lays respectively between the base portion of any two adjacent described sensing blocks.
13. according to the linking-board type infrared ray sensor group framework described in any one in claim 1 to 11, it is characterized in that, described support plate defines one first cut-off rule and many second cut-off rules, described infrared ray sensor is positioned at a side of described the first cut-off rule, the connecting circuit of the connecting portion of described support plate and test department and described circuit unit and test circuit are positioned at the opposite side of described the first cut-off rule, are at least two in the base portion of described sensing block between any two the second adjacent cut-off rules.
14. according to the linking-board type infrared ray sensor group framework described in any one in claim 1 to 11, it is characterized in that, described sensing block is along sequentially spread configuration of a first direction, and the base portion of sensing block, connecting portion and test department are along sequentially spread configuration of a second direction described in each, and described second direction is perpendicular to described first direction.
The manufacture method of 15. 1 kinds of infrared ray sensors, is characterized in that, step comprises:
One support plate is provided, and described support plate is divided into multiple sensing blocks along a first direction, then sensing block described in each is sequentially defined to a base portion, a junction and a test department along a second direction;
Wherein, described first direction is perpendicular to described second direction;
A base portion circuit, a connecting circuit and a test circuit of the corresponding circuit unit that is shaped of difference on base portion, connecting portion and the test department of sensing block described in each, and described in each, base portion circuit, connecting circuit and the test circuit of circuit unit electrically conducts each other; And
Multiple infrared sensing modules are installed on respectively on the base portion of described sensing block, and described infrared sensing module are electrically connected at respectively to the base portion circuit of described circuit unit, to form a linking-board type infrared ray sensor group framework;
Wherein, described in each, infrared sensing module, the set base portion of described sensing block and the base portion circuit of the described circuit unit that described infrared sensing module is electrically connected of described infrared sensing module are defined as an infrared ray sensor jointly.
The manufacture method of 16. infrared ray sensors according to claim 15, is characterized in that, in the time being shaped described circuit unit, the test circuit of described circuit unit is revealed in respectively to the plate face of described support plate.
The manufacture method of 17. infrared ray sensors according to claim 16, it is characterized in that, after the described linking-board type infrared ray sensor of formation group framework, test circuit by described circuit unit is to test described infrared ray sensor simultaneously, and testing after described infrared ray sensor, remove connecting portion and the test department of described support plate and be positioned at described connecting portion and described test department on connecting circuit and the test circuit of described circuit unit, to obtain the described infrared ray sensor being connected along described first direction.
The manufacture method of 18. infrared ray sensors according to claim 17, is characterized in that, is obtaining after connected infrared ray sensor, cuts described connected infrared ray sensor, to form the infrared ray sensor of multiple single type formulas.
The manufacture method of 19. infrared ray sensors according to claim 17, is characterized in that, is obtaining after connected infrared ray sensor, cuts described connected infrared ray sensor, to form the infrared ray sensor of multiple many connected patterns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210397895.8A CN103776538A (en) | 2012-10-18 | 2012-10-18 | Connection plate type infrared ray sensor group architecture, and manufacturing method of infrared ray sensor |
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| US5157255A (en) * | 1990-04-05 | 1992-10-20 | General Electric Company | Compact, thermally efficient focal plane array and testing and repair thereof |
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| WO2002084741A2 (en) * | 2001-04-12 | 2002-10-24 | Epir Ltd. | Monolithic infrared focal plane array detectors |
| CN1545752A (en) * | 2002-06-25 | 2004-11-10 | ���µ繤��ʽ���� | Infrared sensor package |
| US20050258352A1 (en) * | 2004-05-21 | 2005-11-24 | Duncan Jeffrey T | Optical sensor system with built-in optical test capability |
| TWM423831U (en) * | 2011-08-26 | 2012-03-01 | Unimems Mfg Co Ltd | Stacked thermometer module |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5157255A (en) * | 1990-04-05 | 1992-10-20 | General Electric Company | Compact, thermally efficient focal plane array and testing and repair thereof |
| US5391875A (en) * | 1990-07-18 | 1995-02-21 | Raytheon Company | Infrared sensor package |
| WO2002084741A2 (en) * | 2001-04-12 | 2002-10-24 | Epir Ltd. | Monolithic infrared focal plane array detectors |
| CN1545752A (en) * | 2002-06-25 | 2004-11-10 | ���µ繤��ʽ���� | Infrared sensor package |
| US20050258352A1 (en) * | 2004-05-21 | 2005-11-24 | Duncan Jeffrey T | Optical sensor system with built-in optical test capability |
| TWM423831U (en) * | 2011-08-26 | 2012-03-01 | Unimems Mfg Co Ltd | Stacked thermometer module |
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Application publication date: 20140507 |