CN103762428B - Carborundum wave absorbing assembly under high vacuum condition - Google Patents
Carborundum wave absorbing assembly under high vacuum condition Download PDFInfo
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- CN103762428B CN103762428B CN201310642611.1A CN201310642611A CN103762428B CN 103762428 B CN103762428 B CN 103762428B CN 201310642611 A CN201310642611 A CN 201310642611A CN 103762428 B CN103762428 B CN 103762428B
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- carborundum
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- wave absorbing
- absorbing assembly
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Abstract
The invention provides a kind of carborundum wave absorbing assembly under high vacuum condition, including structured substrate, described structured substrate is provided with suction ripple splitter.The present invention is Inorganic Non-metallic Materials, by mould molding, then through high temperature sintering, has the lowest volatility, it is possible to meets vacuum and uses requirement, has good heat conductivity simultaneously.By adjusting alumina particle and the ratio of graphite, optimize height and the angle of design side's cone so that the absorbing property of carborundum wave absorbing assembly reaches optimum in target frequency bands.By optimized Structure Design, adjust alumina particle and graphite ratio, there is again while there is good absorbing property excellent heat conductivility, accurate Orbital heat flux simulation can be carried out, can be used for the construction of vacuum-resistant controllable temperature microwave dark room.
Description
Technical field
The present invention relates to absorbing material technical field, be specifically related to a kind of carborundum under high vacuum condition
Wave absorbing assembly
Background technology
Antenna is as the load of spacecraft, and start power is relatively big, and the thermal design of spacecraft needs
Pay close attention to.Heat sink and vacuum vessel wall and tool lifting appliance etc. within space simulator are all
Metal material, metal material has good reflecting effect for microwave, and the microwave that antenna is launched necessarily has
The biggest ratio reflects back, if the microwave power reflected exceedes a certain amount of, it is possible to cause reception
The damage of antenna sensing element.Therefore, for avoiding microwave reflection to disturb it normally to work, it usually needs right
Antenna is reequiped, and is provided with linear load first to reequip antenna before absorbing microwave energy, i.e. vacuum thermal test
System, has connected linear load, and linear load will be had after off-test again to remove, and is restored to the original state by antenna.This
Plant test method to have the disadvantage in that
1) repacking work adds experiment work amount, and along with the complexity of new generation product is significantly increased,
Product is more and more tiny, and on the one hand repacking will become extremely difficult, even if on the other hand reequiping, by
In the tiny fragility of element, being faced with the biggest risk in retrofit process, the state before and after dismounting may nothing
Method the most even makes the reliability of product reduce, and the just complexity at the more new generation product of beforehand research improves
Several times, dismount the flow process that wired load brings and delay and security risks is by unacceptable, therefore, newly
Generation product is difficult to continue to use original test method；
2) repacking spacecraft changes the time of day of antenna system, affects the effectiveness of test,
The thermal design of new generation product is the most complicated, if still carrying out vacuum thermal test with wired load model,
Will be unable to the heat effect the investigating microwave impact for product thermal design, it is therefore necessary to carry out realistic model
Verification experimental verification works, and completes test, to examine microwave by directly carrying out real Microwave emission state
Launch the influence degree for thermal design.
Summary of the invention
The present invention is directed to above-mentioned deficiency present in prior art, it is provided that a kind of under high vacuum condition
Carborundum wave absorbing assembly, this wave absorbing assembly has good wave absorbtion and heat conductivity, can be used for vacuum-resistant controlled
The construction in temperature microwave darkroom.
To achieve the above object, the present invention is achieved by the following technical solutions.
A kind of carborundum wave absorbing assembly under high vacuum condition, including structured substrate and suction ripple splitter,
Described suction ripple splitter is integrally formed with structured substrate by secondary die casting sintering.
Preferably, described structured substrate is the array structure that multiple side cone combination is formed.
Preferably, the plurality of side cone includes thermoelectricity prescription with ingredients even in number cone and common side cone, and described common side cone is solid knot
Structure, described thermoelectricity prescription with ingredients even in number cone is internal is provided with thermocouple mounting hole.
Preferably, described side cone is 16, uses 4 × 4 array elements, wherein, the center of each unit
It is equipped with an installing hole.
Preferably, for meeting X-band wave-absorbing effect, described side's cone height is 40mm.
Preferably, described carborundum wave absorbing assembly under high vacuum condition, the material of employing is: pass through
In carborundum, mix aluminium oxide and graphite granule, prepare through high temperature sintering.
Compared with prior art, the present invention has a following beneficial effect:
(1) a kind of carborundum wave absorbing assembly under high vacuum condition of the present invention, for Inorganic Non-metallic Materials,
By mould molding, then through high temperature sintering, there is the lowest volatility, it is possible to meet vacuum and use requirement,
There is good heat conductivity simultaneously.
(2) a kind of spary coating type wave absorbing assembly under high vacuum condition of the present invention, by adjusting aluminium oxide granule
Grain and the ratio of graphite, optimize height and the angle of design side's cone so that the absorbing property of carborundum wave absorbing assembly
In target frequency bands, reach optimum.
(3) a kind of carborundum wave absorbing assembly under high vacuum condition of the present invention, by optimized Structure Design,
Adjust alumina particle and graphite ratio, there is again while there is good absorbing property excellent heat conductivity
Can, accurate Orbital heat flux simulation can be carried out, can be used for the construction of vacuum-resistant controllable temperature microwave dark room.
Accompanying drawing explanation
By the detailed description non-limiting example made with reference to the following drawings of reading, its of the present invention
Its feature, purpose and advantage will become more apparent upon:
Fig. 1 is the front view of a kind of carborundum wave absorbing assembly under high vacuum condition.
Fig. 2 is the top view of a kind of carborundum wave absorbing assembly under high vacuum condition.
Fig. 3 is the profile of a kind of carborundum wave absorbing assembly under high vacuum condition.
In figure: 11 is structured substrate, 12 for inhaling ripple splitter, and 13 is threaded mounting hole, and 14 pacify for thermocouple
Dress hole.
Detailed description of the invention
Below embodiments of the invention are elaborated: the present embodiment is under premised on technical solution of the present invention
Implement, give detailed embodiment and concrete operating process.It should be pointed out that, to this area
Those of ordinary skill for, without departing from the inventive concept of the premise, it is also possible to make some deformation and change
Entering, these broadly fall into protection scope of the present invention.
Below with reference to Fig. 1 to Fig. 3, the present embodiment is described in further detail.
Present embodiments provide a kind of carborundum wave absorbing assembly under high vacuum condition, including structuring base
The end and suction ripple splitter, described suction ripple splitter is integrally formed with structured substrate by secondary die casting sintering.
Further, described structured substrate is the array structure that multiple side cone combination is formed.
Further, the plurality of side cone includes thermoelectricity prescription with ingredients even in number cone and common side cone, and described common side cone is for solid
Structure, described thermoelectricity prescription with ingredients even in number cone is internal is provided with thermocouple mounting hole.
Further, described side cone is 16, uses 4 × 4 array elements, wherein, the center of each unit
Place is equipped with an installing hole.
Further, for meeting X-band wave-absorbing effect, described side's cone height is 40mm.
Further, described carborundum wave absorbing assembly under high vacuum condition, the material of employing is: logical
Cross in carborundum, mix aluminium oxide and graphite granule, prepare through high temperature sintering.
The present embodiment particularly as follows:
As it is shown in figure 1,11 is structured substrate, good for the concordance and wave absorbing assembly ensureing material entirety
Heat conductivity；12, for inhaling ripple splitter, can incide the microwave energy absorption of wave absorbing assembly, it is to avoid reflection
Signal is excessive, antenna is received unit and causes damage；13 is the threaded mounting hole of carborundum wave absorbing assembly, uses
Installation in wave absorbing assembly is fixed.
As in figure 2 it is shown, the carborundum wave absorbing assembly under high vacuum condition uses Structured Design, each
Arranging 4 in the wave absorbing assembly of structuring unit and be provided with the structured substrate inhaling ripple splitter, every 4 are provided with suction ripple
The structured substrate of splitter arranges an installing hole.
The carborundum wave absorbing assembly under high vacuum condition that the present embodiment provides, it is possible at high vacuum environment
The wave absorbing assembly of lower use, has good heat conductivity simultaneously.
In the present embodiment:
Structured substrate, described structured substrate is provided with suction ripple splitter.
Structured substrate and suction ripple splitter, respectively by die cast, are integrally formed through secondary die casting the most again,
Form through high temperature sintering, there is good heat conductivity, and at X-band, there is good absorbing property,
Can use under high vacuum environment, can be used for the construction of vacuum-resistant controllable temperature microwave dark room.
Described structured substrate is the array structure that multiple side's taper becomes.
Boring for installing the side of thermocouple, leave thermocouple mounting hole inside it, its other party cone is entity structure.
Structured substrate uses 4 × 4 array elements, and each unit center has an installing hole, is used for installing admittedly
Fixed.
The material that carborundum wave absorbing assembly uses is Inorganic Non-metallic Materials, by mould molding, in carborundum
Mix aluminium oxide and graphite granule, prepared by high temperature sintering, there is low material outgassing, be suitable for vacuum ring
Border uses.
Side's cone height is set to 40mm, it is ensured that side's cone has good wave-absorbing effect at X-band.
Above the specific embodiment of the present invention is described.It is to be appreciated that the present invention not office
Being limited to above-mentioned particular implementation, those skilled in the art can make various within the scope of the claims
Deformation or amendment, this has no effect on the flesh and blood of the present invention.
Claims (3)
1. the carborundum wave absorbing assembly under high vacuum condition, it is characterised in that include structuring
Substrate and suction ripple splitter, described suction ripple splitter is integrally formed with structured substrate by secondary die casting sintering；
Described structured substrate is the array structure that multiple side cone combination is formed；
The plurality of side cone includes thermoelectricity prescription with ingredients even in number cone and common side cone, and described common side cone is solid construction, described
Thermoelectricity prescription with ingredients even in number cone is internal is provided with thermocouple mounting hole；
Described secondary die casting, specifically refers to: structured substrate and suction ripple splitter are respectively by die cast, so
After be integrally formed through secondary die casting again, form through high temperature sintering；The material used is: by carborundum
Middle incorporation aluminium oxide and graphite granule, prepare through high temperature sintering.
Carborundum wave absorbing assembly under high vacuum condition the most according to claim 1, its feature
Being, described side cone is 16, uses 4 × 4 array elements, wherein, the center of each array element
It is equipped with an installing hole.
Carborundum wave absorbing assembly under high vacuum condition the most according to claim 1, its feature
Being, for meeting X-band wave-absorbing effect, described side's cone height is 40mm.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310642611.1A CN103762428B (en) | 2013-12-03 | 2013-12-03 | Carborundum wave absorbing assembly under high vacuum condition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310642611.1A CN103762428B (en) | 2013-12-03 | 2013-12-03 | Carborundum wave absorbing assembly under high vacuum condition |
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| Publication Number | Publication Date |
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| CN103762428A CN103762428A (en) | 2014-04-30 |
| CN103762428B true CN103762428B (en) | 2016-08-17 |
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| CN201310642611.1A Active CN103762428B (en) | 2013-12-03 | 2013-12-03 | Carborundum wave absorbing assembly under high vacuum condition |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104698011A (en) * | 2015-02-12 | 2015-06-10 | 上海卫星装备研究所 | Test device for high-frequency absorbing property of wave-absorbing material and test method |
| CN106597124A (en) * | 2016-08-22 | 2017-04-26 | 北京卫星环境工程研究所 | PIM testing wave-absorbing module for vacuum low-temperature environment |
| CN108621360B (en) * | 2018-07-04 | 2024-02-09 | 中国人民解放军61489部队 | Mould for preparing polyurethane foam wedge wave-absorbing material |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3631492A (en) * | 1968-10-09 | 1971-12-28 | Kunihiro Suetake | Multilayer wave absorbing wall |
| US5331567A (en) * | 1991-08-22 | 1994-07-19 | The University Of Colorado Foundation, Inc. | Pyramidal absorber having multiple backing layers providing improved low frequency response |
| US5688348A (en) * | 1995-01-04 | 1997-11-18 | Northrop Grumman Corporation | Anechoic chamber absorber and method |
| CN103366914A (en) * | 2012-03-30 | 2013-10-23 | 株式会社东芝 | Radiowave absorber |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007149121A2 (en) * | 2005-12-12 | 2007-12-27 | Irina Puscasu | Selective reflective and absorptive surfaces and method for resonantly coupling incident radiation |
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2013
- 2013-12-03 CN CN201310642611.1A patent/CN103762428B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3631492A (en) * | 1968-10-09 | 1971-12-28 | Kunihiro Suetake | Multilayer wave absorbing wall |
| US5331567A (en) * | 1991-08-22 | 1994-07-19 | The University Of Colorado Foundation, Inc. | Pyramidal absorber having multiple backing layers providing improved low frequency response |
| US5688348A (en) * | 1995-01-04 | 1997-11-18 | Northrop Grumman Corporation | Anechoic chamber absorber and method |
| CN103366914A (en) * | 2012-03-30 | 2013-10-23 | 株式会社东芝 | Radiowave absorber |
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| CN103762428A (en) | 2014-04-30 |
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