CN103753740A - Release agent composition for epoxy resin product - Google Patents
Release agent composition for epoxy resin product Download PDFInfo
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- CN103753740A CN103753740A CN201310536251.7A CN201310536251A CN103753740A CN 103753740 A CN103753740 A CN 103753740A CN 201310536251 A CN201310536251 A CN 201310536251A CN 103753740 A CN103753740 A CN 103753740A
- Authority
- CN
- China
- Prior art keywords
- epoxy resin
- silicone oil
- mold release
- release compositions
- resin goods
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 26
- 239000000203 mixture Substances 0.000 title claims abstract description 26
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 26
- 239000003795 chemical substances by application Substances 0.000 title abstract description 18
- 229920002545 silicone oil Polymers 0.000 claims abstract description 23
- 239000002904 solvent Substances 0.000 claims abstract description 15
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims abstract description 12
- 229910021529 ammonia Inorganic materials 0.000 claims description 28
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 28
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 claims description 10
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 claims description 10
- 229940043265 methyl isobutyl ketone Drugs 0.000 claims description 10
- 229920001296 polysiloxane Polymers 0.000 claims description 8
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims description 8
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims description 4
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 claims description 4
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 claims description 4
- 239000003921 oil Substances 0.000 claims description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 abstract description 8
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 229920002379 silicone rubber Polymers 0.000 abstract description 4
- 229920002050 silicone resin Polymers 0.000 abstract 1
- 239000004945 silicone rubber Substances 0.000 abstract 1
- -1 fatty acid salt Chemical class 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 6
- 125000000217 alkyl group Chemical group 0.000 description 6
- 229910052799 carbon Inorganic materials 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 238000000465 moulding Methods 0.000 description 6
- 125000003545 alkoxy group Chemical group 0.000 description 4
- 230000007613 environmental effect Effects 0.000 description 4
- 125000003700 epoxy group Chemical group 0.000 description 4
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical class CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 229920002430 Fibre-reinforced plastic Polymers 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000006555 catalytic reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000004043 dyeing Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 150000008282 halocarbons Chemical class 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- XQSFXFQDJCDXDT-UHFFFAOYSA-N hydroxysilicon Chemical compound [Si]O XQSFXFQDJCDXDT-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000011344 liquid material Substances 0.000 description 1
- 239000008204 material by function Substances 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 230000002688 persistence Effects 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Landscapes
- Epoxy Resins (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The invention discloses a release agent composition for epoxy resin products. The composition consists of the following components by weight: 15-45 parts of reactive aminohydrocarbyl silicone oil, 48-80 parts of hydroxyl silicone rubber, 5-35 parts of methyl MQ silicone resin and 300-20000 parts of a solvent. The invention has the advantages of good demoulding effect, environment-friendliness, repeatability for demoulding and high production efficiency.
Description
Technical field
The present invention relates to polymer material molding processing technique field, be specifically related to a kind of epoxy resin goods mold release compositions.
Background technology
Epoxy resin is the organic high molecular compound that contains two or more epoxide groups in general reference molecule, and except indivedual, their relative molecular mass is not high.The molecular structure of epoxy resin is to contain active epoxide group in strand as its feature, and epoxide group can be positioned at the end, centre of strand or structure circlewise.Owing to containing active epoxide group in molecular structure, make them can form with polytype curing agent generation cross-linking reaction insoluble, the molten cancellated high polymer of three-dimensional that has, therefore in every profession and trade, be widely used.Macromolecular material, as the processing and forming of epoxy resin goods, often adopts molded method, and melt or molten liquid material are injected to mould, after curing molding, then from mould, takes out moulded products.Epoxy resin releasing agent is a kind of functional materials between mould and finished product, can prevent that shaping mould goods are bonded to die surface.In order to guarantee the smoothly demoulding of goods, conventionally to apply in advance releasing agent at die surface, do not bond with mould after making goods cooling.
Conventional epoxy resin releasing agent is take sacrifice type releasing agent as main, the releasing agent that so-called sacrifice type releasing agent consumed completely through demoulding process once.Sacrifice type releasing agent must recoat and be layed onto on die surface before manufacturing each goods, was easily accumulated into dirt, thereby caused a series of adverse consequences, as affect products appearance integrality; Need often to clean and affected production efficiency; Reuse, cost is high, increases that in releasing agent, volatile materials is as the discharge capacity of solvent simultaneously, and environmental protection pressure is large etc.
As China Patent Publication No. CN1554524A discloses a kind of preparation method of demolding agent for roducing epoxy glass fibre reinforced plastic composite material, by the proportioning of the paraffin of the silicone grease of 5～20 parts of weight, the silicon rubber of 10～60 parts of weight, the higher fatty acid salt of 20～120 parts of weight, 30～90 parts of weight taken amount respectively, adopt gasoline as solvent, each component being added respectively in reaction vessel and make the weight percentage of solid is 10%-80%, 50 ℃～120 ℃ heating, under reflux state, stir and make each component be dissolved as homogeneous phase, make release agent solution.Weak point is to repeat the demoulding, and production efficiency is low, and solvent discharge amount is large.
Summary of the invention
Technical problem to be solved by this invention is the defect that overcomes prior art, provides that a kind of stripping result is good, environmental friendliness, can repeat the epoxy resin goods releasing agent of the demoulding.
In order to solve above technical problem, the present invention has adopted following technical scheme: a kind of epoxy resin goods mold release compositions, composed of the following components by weight:
Described reactive ammonia alkyl silicone oil is preferably two hydroxy-end capped ammonia alkyl silicone oil or bi-methoxy end-blocking ammonia alkyl silicone oil.
Described reactive ammonia silicon alkyl oil viscosity is preferably 500～150000cps.
The amino content of described reactive ammonia alkyl silicone oil is preferably 0.15～5.6%.
The MQ value of described methyl MQ silicones is preferably 0.6～0.9.
Described solvent is preferably the one in benzinum, methyl iso-butyl ketone (MIBK) (MIBK), butyl acetate.
Epoxy resin goods of the present invention are coated in after die surface with mold release compositions, along with the volatilization of solvent, between each composition, can form cross-linked network structure, and methyl MQ silicones has been given composition and the stronger cementation power of die surface, can effectively prevent the transfer of releasing agent to goods, keep the persistence of stripping result.
The reactive ammonia alkyl silicone oil that the following general formula of the optional use of reactive ammonia alkyl silicone oil of the present invention represents:
R in formula
1, R
2, R
3, R
4and R
5identical or different separately, represent the alkyl that carbon number is 1～4; P
1, P
2and P
3identical or different separately, be selected from respectively hydroxyl, alkoxyl and carbon number and be 1～4 alkyl, but the number that must guarantee hydroxyl and/or alkoxyl 2 and more than; R
1and R
2identical or different separately, be selected from respectively ammonia alkyl (as-CH
2cH
2cH
2nH
2deng) and the carbon number alkyl that is 1～4, but have one at least for ammonia alkyl; L, m are 0 or positive integer, and n is positive integer, l+m ﹥ 0, and the number of ammonia alkyl is greater than 0.Reactive ammonia alkyl silicone oil is preferably two hydroxy-end capped ammonia alkyl silicone oil or bi-methoxy end-blocking ammonia alkyl silicone oil.Described reactive ammonia silicon alkyl oil viscosity is preferably 500～150000cps, and amino content is preferably 0.15～5.6%.
Methyl MQ silicones refers to by four degree of functionality siloxanes polycondensation chain link (SiO
2be Q) and single functionality siloxane unit (R
3siO
1/2be M) composition the more special polysiloxane of structure.MQ value refers to the ratio of M and Q.
The principle that solvent of the present invention is selected is to make the solvent of reactive ammonia alkyl silicone oil, silicon rubber and methyl MQ silicones uniform dissolution and effumability all can.As varsol hexane, benzinum etc., ketones solvent acetone, methyl iso-butyl ketone (MIBK) etc., esters solvent ethyl acetate, butyl acetate etc., halogenated hydrocarbon solvent trichloroethanes, trichorotrifluoroethane etc.Described solvent is preferably the one in benzinum, methyl iso-butyl ketone (MIBK) (MIBK), butyl acetate.
Epoxy goods of the present invention are as follows by the preparation method of mold release compositions: each described mold release compositions composition is at room temperature uniformly mixed into uniform solution.
Compared with prior art, the present invention has the following advantages:
1, stripping result is good, and the easy film-forming of releasing agent and strong with the cohesive force of die surface for epoxy resin goods of the present invention, so shift lessly to goods, does not affect the secondary operations of goods, makes moulded products surface smoothness good;
2, can repeat the demoulding, production efficiency is high, applies and once can realize continuous several times demoulding, has simplified production process, has improved production efficiency;
3, environmental friendliness, has reduced solvent discharge, safety and environmental protection.
The specific embodiment
Below in conjunction with specific embodiment, further illustrate the present invention, but these embodiment are only for explaining the present invention, rather than for limiting the scope of the invention.
The reactive ammonia alkyl silicone oil that the following general formula of the optional use of reactive ammonia alkyl silicone oil using in embodiment represents:
R in formula
1, R
2, R
3, R
4and R
5identical or different separately, represent the alkyl that carbon number is 1～4; P
1, P
2and P
3identical or different separately, be selected from respectively hydroxyl, alkoxyl and carbon number and be 1～4 alkyl, but the number that must guarantee hydroxyl and/or alkoxyl 2 and more than; R
1and R
2identical or different separately, be selected from respectively ammonia alkyl (as-CH
2cH
2cH
2nH
2deng) and the carbon number alkyl that is 1～4, but have one at least for ammonia alkyl; L, m are 0 or positive integer, and n is positive integer, l+m ﹥ 0, and the number of ammonia alkyl is greater than 0.
Wherein:
AY1, commercial (Fu Chun chemicals Co., Ltd) two hydroxy-end capped ammonia alkyl silicone oil, viscosity 4000cps, amino content 2.5%.Wherein, R
1for CH
2cH
2cH
2nH
2, P
1, P
2be respectively hydroxyl (OH), P
3, R
1, R
2, R
2, R
3, R
4and R
5be respectively methyl (CH
3);
AY2, commercial (Fu Chun chemicals Co., Ltd) two hydroxy-end capped ammonia alkyl silicone oil, viscosity 500cps, amino content 4%.Wherein, R
1for CH
2cH
2cH
2nH
2, P
1, P
2be respectively hydroxyl (OH), P
3, R
1, R
2, R
2, R
3, R
4and R
5be respectively methyl (CH
3);
AY3, commercial (three Tai Youjiguicailiaochang) bi-methoxy end-blocking ammonia alkyl silicone oil, viscosity 80,000 cps, amino content 0.43%.Wherein, R
1for CH
2cH
2cH
2nH
2, P
1, P
2be respectively methoxyl group (OCH
3), P
3, R
1, R
2, R
2, R
3, R
4and R
5be respectively methyl (CH
3);
AY4, commercial (three Tai Youjiguicailiaochang) bi-methoxy end-blocking ammonia alkyl silicone oil, viscosity 150,000 cps, amino content 0.15%.Wherein, R
1for CH
2cH
2cH
2nH
2, P
1, P
2be respectively methoxyl group (OCH
3), P
3, R
1, R
2, R
2, R
3, R
4and R
5be respectively methyl (CH
3);
AY5, synthetic reaction ammonia alkyl silicone oil, press the open method (Zhou Jianhua etc. of document, printing and dyeing assistant, 2004,21 (5): 11～14), by α, ε-dihydroxy dimethyl siloxane reacts and obtains under amines catalysis with N-β-aminoethyl-γ-aminopropyltrimethoxysilane, viscosity 2200cps, amino content 5.6%.Wherein, P
1and P
2for hydroxyl (OH), P
3for methoxyl group (OCH
3), R
1for CH
2cH
2cH
2nHCH
2cH
2nH
2, R
1, R
2, R
2, R
3, R
4and R
5be respectively methyl (CH
3).
Embodiment 1
Preparation epoxy resin goods mold release compositions: the reactive ammonia alkyl silicone oil AY1 of 20 grams, the hydroxyl silicon rubber of 75 grams, methyl MQ silicones (MQ value is 0.71) and 400 grams of solvent benzinums of 5 grams are at room temperature stirred, be configured to releasing agent of the present invention.
Embodiment 2～10
Epoxy resin goods are by mold release compositions compound method with embodiment 1, and composition is in Table 1.
The epoxy resin goods of embodiment 1～15 are carried out to performance evaluation with mold release compositions:
(1) demoulding test
Aluminium-making mould is heated to 90 ℃, is coated with and is covered with the mold release compositions of the embodiment of the present invention 1～15 respectively, solidify after 5～15min, casting epoxy resin and at 90 ℃ curing molding 4 hours, measure knockout press with tensile testing machine.
No longer repetitive coatings releasing agent, proceeds demoulding test, until demoulding ability declines, (is that knockout press is greater than 3N/cm
2), determining release times (is that knockout press is less than 3N/cm
2release times), the results detailed in Table 1.
(2) coated test
The molding for epoxy resin thing forming surface brushing esters of acrylic acid coating obtaining in release times in testing to the demoulding, carries out cross cut test by GB/T9286-1998 method after drying and forming-film, according to pull-away situation, carries out classification.Be divided into 0～5 six grade, wherein 0 grade best, represent that paint film is completely without coming off.The suitability for secondary processing of the lower surface forming goods of progression is better, the results detailed in Table 1.
(4) moulding situation test
Observe the molding for epoxy resin thing forming surface obtaining in release times in release property test, if any surface finish, zero defect, surface forming is good, otherwise surface forming is poor, the results detailed in Table 1.
Mold release compositions composition and performance evaluation for table 1 embodiment 1～15 epoxy resin goods
Claims (6)
1. an epoxy resin goods mold release compositions, composed of the following components by weight:
2. epoxy resin goods mold release compositions according to claim 1, is characterized in that described reactive ammonia alkyl silicone oil is for two hydroxy-end capped ammonia alkyl silicone oil or bi-methoxy end-blocking ammonia alkyl silicone oil.
3. epoxy resin goods mold release compositions according to claim 1, is characterized in that described reactive ammonia silicon alkyl oil viscosity is 500～150000cps.
4. epoxy resin goods mold release compositions according to claim 1, the amino content that it is characterized in that described reactive ammonia alkyl silicone oil is 0.15～5.6%.
5. epoxy resin goods mold release compositions according to claim 1, the MQ value that it is characterized in that described methyl MQ silicones is 0.6～0.9.
6. epoxy resin goods mold release compositions according to claim 1, is characterized in that described solvent is the one in benzinum, methyl iso-butyl ketone (MIBK), butyl acetate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310536251.7A CN103753740B (en) | 2013-11-01 | 2013-11-01 | A kind of release agent composition for epoxy resin product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310536251.7A CN103753740B (en) | 2013-11-01 | 2013-11-01 | A kind of release agent composition for epoxy resin product |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103753740A true CN103753740A (en) | 2014-04-30 |
| CN103753740B CN103753740B (en) | 2015-12-30 |
Family
ID=50521135
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310536251.7A Expired - Fee Related CN103753740B (en) | 2013-11-01 | 2013-11-01 | A kind of release agent composition for epoxy resin product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103753740B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106079183A (en) * | 2016-07-05 | 2016-11-09 | 安徽三彩工贸有限责任公司 | A kind of polyurethane release agent of dual density |
| CN106608008A (en) * | 2016-11-28 | 2017-05-03 | 西安空间无线电技术研究所 | Releasing agent and preparation method and application thereof to filling epoxy resin |
| CN114654626A (en) * | 2022-03-18 | 2022-06-24 | 惠州市金亮丽塑胶制品有限公司 | Composite plastic processing release agent and preparation method thereof |
| CN114891398A (en) * | 2022-07-07 | 2022-08-12 | 厦门欧化实业有限公司 | Water-based plastic surface printing ink and production method and equipment thereof |
| CN115042353A (en) * | 2022-08-15 | 2022-09-13 | 广东纳德新材料有限公司 | Resin grinding block release agent and preparation method thereof |
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| DE3535360C1 (en) * | 1985-10-03 | 1986-04-24 | Th. Goldschmidt Ag, 4300 Essen | Process for the formation of a strongly adherent, elastic coating on the surface of a heatable rubber bellows |
| CN87104240A (en) * | 1987-06-17 | 1988-12-28 | 中国原子能科学研究院 | Rubber release agent |
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-
2013
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Patent Citations (4)
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106079183A (en) * | 2016-07-05 | 2016-11-09 | 安徽三彩工贸有限责任公司 | A kind of polyurethane release agent of dual density |
| CN106608008A (en) * | 2016-11-28 | 2017-05-03 | 西安空间无线电技术研究所 | Releasing agent and preparation method and application thereof to filling epoxy resin |
| CN106608008B (en) * | 2016-11-28 | 2018-11-23 | 西安空间无线电技术研究所 | A kind of release agent and preparation method thereof and the application in epoxy resin encapsulated |
| CN114654626A (en) * | 2022-03-18 | 2022-06-24 | 惠州市金亮丽塑胶制品有限公司 | Composite plastic processing release agent and preparation method thereof |
| CN114891398A (en) * | 2022-07-07 | 2022-08-12 | 厦门欧化实业有限公司 | Water-based plastic surface printing ink and production method and equipment thereof |
| CN115042353A (en) * | 2022-08-15 | 2022-09-13 | 广东纳德新材料有限公司 | Resin grinding block release agent and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103753740B (en) | 2015-12-30 |
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