CN103753049A - Cu@Sn core-shell-structured high-temperature solder and preparation method thereof - Google Patents
Cu@Sn core-shell-structured high-temperature solder and preparation method thereof Download PDFInfo
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- CN103753049A CN103753049A CN201310739337.XA CN201310739337A CN103753049A CN 103753049 A CN103753049 A CN 103753049A CN 201310739337 A CN201310739337 A CN 201310739337A CN 103753049 A CN103753049 A CN 103753049A
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 46
- 238000002360 preparation method Methods 0.000 title claims abstract description 17
- 239000010949 copper Substances 0.000 claims abstract description 85
- 239000000843 powder Substances 0.000 claims abstract description 54
- 239000002184 metal Substances 0.000 claims abstract description 41
- 229910052751 metal Inorganic materials 0.000 claims abstract description 41
- 238000000034 method Methods 0.000 claims abstract description 32
- 239000000758 substrate Substances 0.000 claims abstract description 31
- 238000003466 welding Methods 0.000 claims abstract description 19
- 230000004907 flux Effects 0.000 claims abstract description 11
- 229910052802 copper Inorganic materials 0.000 claims abstract description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910052718 tin Inorganic materials 0.000 claims abstract description 5
- 239000011135 tin Substances 0.000 claims description 37
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 36
- 239000008367 deionised water Substances 0.000 claims description 31
- 229910021641 deionized water Inorganic materials 0.000 claims description 31
- 238000003756 stirring Methods 0.000 claims description 17
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical group NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 claims description 12
- 238000006243 chemical reaction Methods 0.000 claims description 11
- 238000005219 brazing Methods 0.000 claims description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 9
- 239000006071 cream Substances 0.000 claims description 9
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 7
- 239000002270 dispersing agent Substances 0.000 claims description 7
- 238000009413 insulation Methods 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 239000002245 particle Substances 0.000 abstract description 23
- 229910000765 intermetallic Inorganic materials 0.000 abstract description 21
- 239000011258 core-shell material Substances 0.000 abstract description 7
- 238000010992 reflux Methods 0.000 abstract description 4
- 229910018471 Cu6Sn5 Inorganic materials 0.000 abstract 2
- 238000002844 melting Methods 0.000 abstract 2
- 230000008018 melting Effects 0.000 abstract 2
- 238000005476 soldering Methods 0.000 abstract 1
- 239000000243 solution Substances 0.000 description 12
- 239000007864 aqueous solution Substances 0.000 description 6
- 239000000047 product Substances 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 4
- 230000032683 aging Effects 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 3
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 3
- 230000008520 organization Effects 0.000 description 3
- 230000035882 stress Effects 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 230000035484 reaction time Effects 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000012459 cleaning agent Substances 0.000 description 1
- 238000007405 data analysis Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 235000019441 ethanol Nutrition 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000003209 petroleum derivative Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000010183 spectrum analysis Methods 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/17—Metallic particles coated with metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2301/00—Metallic composition of the powder or its coating
- B22F2301/10—Copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2301/00—Metallic composition of the powder or its coating
- B22F2301/30—Low melting point metals, i.e. Zn, Pb, Sn, Cd, In, Ga
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Powder Metallurgy (AREA)
Abstract
The invention provides a Cu@Sn core-shell-structured high-temperature solder and a preparation method thereof. According to the Cu@Sn core-shell-structured high-temperature solder, a core-shell-structured metal powder only contains Sn and Cu and is of a core-shell structure with Cu particles coated by Sn, and the size of the Cu particles is between 1 mu m and 20 mu m; the metal powder is mixed with commercial soldering flux to obtain the Cu@Sn core-shell-structured high-temperature solder. The Cu@Sn core-shell-structured high-temperature solder can be applied to welding various substrates; during a reflux process, and the Sn outside the particles can react with the core Cu to form Cu6Sn5 and accordingly to form a welding joint structure with the copper particles dispersed inside intermetallic compounds, which can be formed at a temperature higher than the melting point Sn and is on service at a temperature lower than the melting point of Cu6Sn5 to achieve the aim of low-temperature connection and high-temperature services. The preparation method of the Cu@Sn core-shell-structured high-temperature solder is simple in process, low in cost and highly practical and solves the problems such as high chip adhesion cost, high processing temperature and long processing time of existing power devices.
Description
Technical field
The invention belongs to material technology field, particularly a kind of Cu@Sn core-shell structured high temperature solder and preparation method thereof.
Background technology
High temperature power device has extensive use in fields such as automobile, downhole petroleum Gas Industry, aircraft, space exploration, nuclear reaction environment and radars.Mainly by chip attach technique, power device to be fixed on substrate at present.But because its caloric value is large, operating temperature is high, sometimes can reach 350 ℃, chip attach solder used has been proposed to new challenge.Its fusing point of common tin copper solder is generally lower than 250 ℃, add other component and its fusing point of high-temp solder of forming also generally not higher than 300 ℃, all cannot practical requirement.And use the higher solder of fusing point likely to destroy electronic device, to substrate, also can cause damage, the solder of therefore making low-temperature welding high-temperature service has become the common target of pursuing of academia.
Several chip attach means of having used at present all have weak point: although Nano Silver sintering process technique is simple and high temperature resistant, electrical conductivity, thermal conductivity are all higher, very high as the obvious cost of large area connecting material using silver, are unfavorable for large-scale mass production; Although Transient liquid phase sintering process is only used copper tin solder, due to counterdiffusion not exclusively, residual tin can at high temperature melt the problem that produces reliability, and the process time is long; And film connection exists because weld seam is very thin, impact resistance is strong, the problem of poor reliability.
Summary of the invention
The deficiency existing in order to solve above-mentioned prior art, the invention provides and a kind ofly have can forming at low temperatures of new structure and connect tin-copper (containing a certain amount of Cu@Sn nucleocapsid structure metal powder) solder of being on active service under high temperature.
Described Cu@Sn nucleocapsid structure metal powder refers to that used metal powder has the nucleocapsid structure of tin coated copper particle.
Wherein, described Cu@Sn nucleocapsid structure metal powder prepares by chemical method, states chemical method and comprises the following steps:
The first step, takes Cu powder, and it is scattered in deionized water completely, and making Cu powder concentration is 0.067g/ml, forms deionized water solution;
Second step, takes Sn and is dissolved in deionized water, and Sn and Cu mass ratio are in 1:8 to 1:2, stirs, and forms deionized water solution;
The 3rd step adds the deionized water solution of second step in the deionized water solution of the first step, and at room temperature stirs 10 to 40 minutes to guarantee complete reaction in the situation that constantly stirring;
The 4th step, makes water or absolute ethyl alcohol that product is repeatedly cleaned to solution and clarified and dry in the shade.
In above-mentioned preparation method, preferably, in the described first step, take a certain amount of dispersant PVP, after evenly mixing with the mass ratio 1:1 of Cu powder and dispersant, be scattered in deionized water completely; In preferred described second step, take a certain amount of complexant and add, complexant is thiocarbamide, and making the concentration of complexant in deionized water solution is 0.5mol/L to 1mol/L.
The shape appearance figure of gained Cu@Sn nucleocapsid structure metal powder, as shown in Figure 1.
By technique described in the present invention, can obtain having the subsphaeroidal core-shell structure particles of better pattern, Sn's is coated comparatively even, so that the follow-up connection that can form between particle.
The preferred dispersant of the present invention and complexant are most important for the formation of described nucleocapsid structure, and wherein, dispersant can form sterically hindered in solution, stop between particle and reunite, thereby obtain uniform particle diameter, coated uniform core-shell structure particles.Complexant can form stable complex with Cu, makes Cu
2+the electrode potential of/Cu moves to negative value, until lower than the electrode potential of Sn, thereby inactive Cu can be cemented out active Sn.
We are by great many of experiments and data analysis, the thickness of determining Cu powder footpath and outer Sn plays decisive role to final welding quality, select Cu powder coated certain Sn amount of appropriate particle size, the amount of coated Sn can be controlled by reactant concentration and reaction time, thereby was met the metal powder of application demand.
Wherein, in the described first step, weigh Cu powder as the raw material of preparing metal powder, 1 μ m to 20 μ m can not chosen not etc. as required in Cu powder footpath, and Cu powder is subsphaeroidal pattern.
In described second step, Sn is dissolved in 60ml deionized water, tackles its hydrolysis in water and takes certain precautionary measures.
In described the 3rd step, this reaction time can be adjusted according to required bag Sn thickness.In course of reaction, can there is strong effect with Cu in this complexant, and making Cu lose electronics becomes ion, thereby more active Sn is restored, and is coated on Cu surface.
The 4th step, repeatedly cleans product and dries in the shade, and cleans the residual volume that whether totally can directly affect dispersant, should clean to the cleaning agent after cleaning still for settled solution and solution viscosity remain unchanged.
Aforementioned Cu@Sn nucleocapsid structure metal powder is evenly mixed with commercially available organic brazing flux with certain proportion, makes solder, mixed proportion be metal powder quality account for solder gross mass 70% to 90%.Described solder only has Sn, two kinds of alloying elements of Cu, and described solder can form and connects and can under the environment of 350 ℃, be on active service below the technological temperature of 250 ℃, is called " high-temp solder " of the present invention.This preparation technology is simple, with low cost.
The present invention uses commercially available brazing flux and above-mentioned metal dust to be mixed to form solder, metal powder composition is between 70% to 90%, when metal powder content is high, can form the less weld seam of pore, brazing flux content Gao Shike increases the viscosity of finished product, wetability, facilitates and in industrial production, directly carries out serigraphy.
Described commercially available organic brazing flux comprises: the abietyl weld-aiding cream of the leaded abietyl weld-aiding cream of middle high temperature and the non-leaded type of middle high temperature.Use the weld-aiding cream expectation of non-leaded type abietyl can avoid rosin foaming, thereby obtain the weld seam of better quality.
The inventor thinks through theory analysis and after experimental results show that: use the high-temp solder that contains Cu@Sn nucleocapsid structure metal powder to weld, thereby the Cu in reflow process in the outer Sn of core-shell structure particles and Cu and the core of substrate reacts and generates intermetallic compound and reach the object of metallurgical, bond, and the outer field intermetallic compound of these particles can spread mutually the weld seam that is cross-linked to form homogeneous, inner Cu core remains, thereby has formed one deck Cu
6sn
5weld seam in be mingled with the structure of small elemental copper particle.
Wherein, the welding method of applying described high-temp solder is preferably:
Solder and substrate weld under the technological parameter of 120 ℃ of preheating 40s, 180 ℃ of insulations 80s, 250 ℃ of backflow 120s.
Substrate is preferably the substrate of Cu.The inventor carries out XRD analysis to the powder before welding and the solder side after welding, before welding, in powder, has had Cu
6sn
5, but also have the peak of Sn simultaneously.Through after remelting, the peak of Sn is very not obvious, has occurred Cu simultaneously
3the peak of Sn, illustrates and has reached the metallurgical, bond object of estimating.
The present invention also can be applicable to the substrate (as silver-plated, zinc-plated, nickel plating, gold-plated etc.) of other coats of metal, just can form metallurgical, bond (as shown in Figure 6) when the coat of metal of substrate can form intermetallic compound with the outer field Sn of metal powder.
The present invention uses welding method technique, refluxes and can connect covering on Cu substrate to form for 2-4 minute at 250 ℃, in like manner, covers Au etc. and can generate on the substrate of intermetallic compound and also can form and be connected with Sn covering Ag.In reflux course, the outer field Sn of metal powder melts and generation between particle and particle is cross-linked, and Sn reacts with the Cu in kernel and generates Cu simultaneously
6sn
5, because outer field Sn is very thin, the structure of disperse distribution Cu in reflow process ectomesoderm Sn can consume completely and be formed on intermetallic compound.This structure has very high fusing point, therefore can at high temperature be on active service, and the effectively Anticrack of existence of Cu simultaneously, has alleviated stress and concentrated, and impact resistance is increased.
After welding, through being incubated 1 to 3 hour at 200 ℃, can make intermetallic compound continued growth, organic principle fully volatilizees, and forms under high temperature and connects more reliably.In the ageing process of use procedure, along with the growth of intermetallic compound, its bonding strength also can increase.
Compared to existing technology, the invention has the advantages that:
1, first the present invention uses chemical reaction, at the coated one deck Sn layer in the Cu of different-grain diameter powder surface.By different reaction conditions, control Sn layer thickness to adapt to the welding under different condition, not only solved the current Cu powder shortcoming that easy-oxidizing hard is preserved in air, also make the present invention there is stronger compatibility, controllability, adaptability simultaneously.
2, the present invention is take copper powder as raw material, uses a step chemical reaction, and at the coated Sn in Cu surface, technique is simple and controlled, and the metal powder that can choose the different covering amounts of different-grain diameter according to practical service environment is made solder, and therefore strong adaptability of the present invention is simultaneously with low cost;
3, the weld seam inside that the present invention forms is distributed in the structure in intermetallic compound for simple substance Cu particle dispersion, Cu particle can absorb extraneous stress, alleviate concentrating of local stress, therefore this structure IMC layer more completely, the weld seam that technique such as film connection method forms has higher impact resistance;
4, the present invention is applicable to generate with Sn being connected of substrate of the various coats of metal of intermetallic compound, the outer field Sn of metal powder not only makes to occur between metal powder crosslinked in reflow process, also can with the metal of the substrate surface formation intermetallic compound that reacts, thereby reach metallurgical, bond, therefore the scope of application of the present invention is very wide;
5, the solder that the present invention makes can form connection in reflux course, and technique is simple, and the large-area chips stickup time is greatly reduced; The solder versatility that in the present invention, metal powder is made is wide, portable strong.
Accompanying drawing explanation
Fig. 1 is the shape appearance figure of Cu@Sn nucleocapsid structure metal powder of the present invention.
Fig. 2 is the connection top view that the present invention forms Cu@Sn nucleocapsid structure.
Fig. 3, Fig. 4 are seam organization and the energy spectrum analysis that the present invention forms Cu@Sn nucleocapsid structure.
Fig. 5 is the design sketch of seam organization under light microscopic that the present invention forms Cu@Sn nucleocapsid structure, in figure: the 0501 Cu core distributing for Mass in the present invention; 0502 is the outer Sn of metal-powder and Cu nuclear reaction the Cu that is cross-linked to form
6sn
5intermetallic compound.
The organization chart of interface when Fig. 6 is solder welding Ni pad of the present invention, in figure: the 0601 Cu core for disperse distribution in the present invention; 0602 is the intermetallic compound being cross-linked to form, and has formed metallurgical connection with plating Ni substrate; 0603 for being coated with the substrate of Ni layer.
Fig. 7, Fig. 8 are respectively the present invention and weld forward and backward XRD constituent analysis spectrum.
The specific embodiment
Below in conjunction with embodiment and accompanying drawing, the invention will be further described:
The preparation of the metal powder of embodiment 1Cu@Sn nucleocapsid structure
The first step, weighs 2g Cu powder and 2gPVP evenly mixes and it is scattered in 30ml deionized water completely;
Second step, takes 0.48g Sn and is dissolved in 60ml deionized water, takes 4.57g thiocarbamide and adds, and stirs;
The 3rd step adds the deionized water aqueous solution of second step in the deionized water aqueous solution of the first step, and at room temperature stirs 10 minutes to guarantee complete reaction in the situation that constantly stirring;
The 4th step, is used deionized water or ethanol that product is repeatedly cleaned to solution and clarified and dry in the shade.
The preparation of the metal powder of embodiment 2Cu@Sn nucleocapsid structure
The first step, weighs 2g Cu powder and 2gPVP evenly mixes and it is scattered in 30ml deionized water completely;
Second step, takes 0.96g Sn and is dissolved in 60ml deionized water, takes 4.57g thiocarbamide and adds, and stirs;
The 3rd step adds the deionized water aqueous solution of second step in the deionized water aqueous solution of the first step, and at room temperature stirs 20 minutes to guarantee complete reaction in the situation that constantly stirring;
The 4th step, makes water or absolute ethyl alcohol that product is repeatedly cleaned to solution and clarified and dry in the shade.
The preparation of the metal powder of embodiment 3Cu@Sn nucleocapsid structure
The first step, weighs 2g Cu powder and 2gPVP evenly mixes and it is scattered in 30ml deionized water completely;
Second step, takes 1.92g Sn and is dissolved in 60ml deionized water, takes 9.14g thiocarbamide and adds, and stirs;
The 3rd step adds the deionized water aqueous solution of second step in the deionized water aqueous solution of the first step, and at room temperature stirs 40 minutes to guarantee complete reaction in the situation that constantly stirring;
The 4th step, makes water or absolute ethyl alcohol that product is repeatedly cleaned to solution and clarified and dry in the shade.
The preparation of embodiment 4 solders
The metal powder of the Cu@Sn nucleocapsid structure that previous embodiment 1 is prepared than evenly mixes with certain mass with the leaded abietyl weld-aiding cream of high temperature in commercially available organic brazing flux, in mixed process, brazing flux is softened under 60 degrees Celsius, and stir while by amount add metal powder until become cream, mixed proportion be metal powder quality account for solder gross mass 70%, there is the Cu@Sn solder of nucleocapsid structure.
The preparation of embodiment 5 solders
The abietyl weld-aiding cream of the non-leaded type of high temperature in the metal powder of the Cu@Sn nucleocapsid structure that previous embodiment 2 is prepared and commercially available organic brazing flux.With certain mass, than even, mix, in mixed process, brazing flux is softened under 60 degrees Celsius, and stir while add metal powder until become cream by amount, mixed proportion be metal powder quality account for solder gross mass 70%, there is the Cu@Sn solder of nucleocapsid structure.
The welding application (Cu substrate) of embodiment 6 solders
Through test of many times checking, use solder and the Cu substrate that embodiment 5 obtains to weld under the technological parameter of 120 ℃ of preheating 40s, 180 ℃ of insulations 80s, 250 ℃ of backflow 120s, get final product so that this solder forms and is connected with multiple substrate.
Wherein, thereby be welded on the Cu in the outer Sn of core-shell structure particles and Cu and the core of substrate in reflow process and react the object that generates intermetallic compound and reach metallurgical, bond, and the outer field intermetallic compound of these particles can spread mutually the weld seam (as shown in Figure 2) that is connected to form homogeneous, inner Cu core remains, thereby has formed one deck Cu
6sn
5weld seam in be mingled with the structure (as Fig. 3, shown in 4,5) of small elemental copper particle.Wherein, Cu substrate welds forward and backward XRD constituent analysis and composes as Fig. 7, shown in 8.
Through being incubated 1 to 3 hour at 200 ℃, can make intermetallic compound continued growth, organic principle fully volatilizees, and forms under high temperature and connects more reliably.In the ageing process of use procedure, along with the growth of intermetallic compound, its bonding strength also can increase.
The welding application (other substrates) of embodiment 7 solders
Through test of many times checking, use solder and the Cu substrate that embodiment 5 obtains to weld under the technological parameter of 120 ℃ of preheating 40s, 180 ℃ of insulations 80s, 250 ℃ of backflow 120s, can be so that this solder and Ni, the multiple substrate such as Au forms and connects.
In reflow process, outer field Sn melts and react generation intermetallic compound with the Cu of kernel, thereby makes to be connected to form between particle weld seam.Between particle and substrate, the Ni of outer field Sn and substrate, the metals such as Au form intermetallic compound, thereby reach the object of metallurgical, bond.After welding, the tissue topography of near interface as shown in Figure 6.
Through being incubated 1 to 3 hour at 200 ℃, can make intermetallic compound continued growth, organic principle fully volatilizees, and forms under high temperature and connects more reliably.In the ageing process of use procedure, along with the growth of intermetallic compound, its bonding strength also can increase.
Above content is in conjunction with concrete preferred embodiment further description made for the present invention, can not assert that specific embodiment of the invention is confined to these explanations.For general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, can also make some simple deduction or replace, all should be considered as belonging to protection scope of the present invention.
Claims (10)
1. a Cu Sn nucleocapsid structure metal powder, is characterized in that, the shape appearance figure of described metal powder as shown in Figure 1.
2. a preparation method for Cu Sn nucleocapsid structure metal powder, is characterized in that, comprises the following steps:
The first step, takes Cu powder, and it is scattered in deionized water completely, and making Cu powder concentration is 0.067g/ml, forms deionized water solution;
Second step, takes Sn and is dissolved in deionized water, and Sn and Cu mass ratio are in 1:8 to 1:2, stirs, and forms deionized water solution;
The 3rd step adds the deionized water solution of second step in the deionized water solution of the first step, and at room temperature stirs 10 to 40 minutes to guarantee complete reaction in the situation that constantly stirring;
The 4th step, makes water or absolute ethyl alcohol that product is repeatedly cleaned to solution and clarified and dry in the shade.
3. preparation method according to claim 2, is characterized in that, in the described first step, takes dispersant PVP, after evenly mixing, is scattered in deionized water completely with the mass ratio 1:1 of Cu powder and dispersant.
4. preparation method according to claim 2, is characterized in that, in described second step, takes complexant and adds, and complexant is thiocarbamide, and making the concentration of complexant in deionized water solution is 0.5mol/L to 1mol/L.
5. preparation method according to claim 3, is characterized in that, in described second step, takes complexant and adds, and complexant is thiocarbamide, and making the concentration of complexant in deionized water solution is 0.5mol/L to 1mol/L.
6. a high-temp solder, it is characterized in that, prepare by the following method, claim 2 preparation method is prepared to Cu@Sn nucleocapsid structure metal powder and with certain proportion, evenly mix with organic brazing flux, make solder, mixed proportion be metal powder quality account for solder gross mass 70% to 90%.
7. a kind of high-temp solder according to claim 6, is characterized in that, described a kind of organic brazing flux is the abietyl weld-aiding cream of the leaded abietyl weld-aiding cream of middle high temperature or the non-leaded type of middle high temperature.
8. the substrate preparing through welding, is characterized in that: prepare by the following method, solder claimed in claim 6 and substrate are welded under the technological parameter of 120 ℃ of preheating 40s, 180 ℃ of insulations 80s, 250 ℃ of backflow 120s.
9. a kind of substrate preparing through welding according to claim 8, is characterized in that, after welding, at 200 ℃, is incubated 1 to 3 hour.
10. according to claim 8 a kind ofly it is characterized in that through the substrate for preparing of welding, described substrate comprises copper base, and silver-plated, zinc-plated, nickel plating, gold-plated substrate.
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