CN103728747A - Chip on film (COF) structure and liquid crystal display thereof - Google Patents
Chip on film (COF) structure and liquid crystal display thereof Download PDFInfo
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- CN103728747A CN103728747A CN201410009141.XA CN201410009141A CN103728747A CN 103728747 A CN103728747 A CN 103728747A CN 201410009141 A CN201410009141 A CN 201410009141A CN 103728747 A CN103728747 A CN 103728747A
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Abstract
The invention provides a chip on film (COF) structure and a liquid crystal display thereof. The COF structure comprises a body area and a pair of protruding parts. The body area comprises a driver chip, and the driver chip is pressed and is electrically connected to a liquid crystal display panel. The protruding parts are placed on the two opposite sides of the body area. An isolation groove is formed between each protruding part and the body area and is used for isolating the body area and the corresponding protruding part. Fluid is led out by the COF structure through the protruding parts, and thus the fluid is prevented from flowing into the body area. Compared with the prior art, when a user clean the liquid crystal display panel, cleaning fluid can be led out by the liquid crystal display through the protruding parts of the COF structure, so that the cleaning fluid is prevented from flowing into the body area, and hence short circuit or circuit faults can be avoided. In addition, when the COF structure and the liquid crystal display are bonded, generated excessive glue can also be discharged through the protruding parts and can not permeate into the body area, and therefore the circuit reliability of products is improved.
Description
Technical field
The present invention relates to semiconductor technology and lcd technology, covering polycrystalline structure film and comprising the liquid crystal display that this covers polycrystalline structure film while relating in particular to a kind of assembling.
Background technology
Along with the progress of optics science and technology with semiconductor technology, liquid crystal indicator (Liquid Crystal Display; LCD) be widely used in electronic product display device.Liquid crystal indicator product, especially portable product now, more and more trend towards the project organization frivolous, short and small, weight is few, and therefore new material and package technique constantly weeded out the old and bring forth the new.Cover brilliant thin film technique (Chip On Film, COF) and be wherein considerable a kind of package technique.It is to use flexible circuit board as encapsulation, to drive the carrier of chip that term " covers brilliant film ", driving chip is directly installed on to flexible circuit board, the integrated level of this connected mode is higher, and perimeter component also can be installed on flexible circuit board together with driving chip.
In existing packaging technology, backlight module, liquid crystal panel and polaroid must be fitted together, one end of covering brilliant film is electrically connected to liquid crystal panel, then will covers the other end of brilliant film and the golden finger of a printed circuit board (PCB) presses together.On the other hand, lifting day by day along with display quality demand, derived different modular design, and printed-wiring board (PWB) puts towards ground side-sway the main flow that design becomes market gradually, yet, user is when plate cleans over there, and clean liquid is easy to flow into along panel related electronic components or the golden finger of below, causes short circuit or other fault.
In view of this, how to design covering polycrystalline structure film or the existing polycrystalline structure film that covers being improved of a kind of novelty, thereby improve or eliminate above-mentioned defect, the circuit reliability of improving product, is a person skilled problem urgently to be resolved hurrily in the industry.
Summary of the invention
For liquid crystal display of the prior art existing above-mentioned defect when polycrystalline structure film is covered in design, thus the invention provides a kind of novelty, can effectively prevent that liquid from flowing into the body region cover polycrystalline structure film and avoiding causing covering polycrystalline structure film and containing the liquid crystal display that this covers polycrystalline structure film of short circuit.
According to one aspect of the present invention, a kind of brilliant film (Chip On Film, COF) structure of covering is provided, be applicable to a liquid crystal panel, this covers polycrystalline structure film and comprises:
One body region, comprises a driving chip, and this driving chip is by pressing and be electrically connected to described liquid crystal panel; And
A pair of lug boss, is positioned at the relative both sides of described body region, has an isolation channel, in order to body region described in interval and described lug boss between each lug boss and described body region;
Wherein, described in cover polycrystalline structure film by this to lug boss tapping, thereby prevent that liquid from flowing into described body region.
In an embodiment therein, described in cover polycrystalline structure film body region adopt heat pressing process to be bonded to a printed-wiring board (PWB).
In an embodiment therein, described printed-wiring board (PWB) also comprises a golden finger (Gold Finger), covers polycrystalline structure film described in after bonding and sees through the corresponding terminal that this golden finger is electrically connected described printed-wiring board (PWB).
In an embodiment therein, described printed-wiring board (PWB) is arranged between a front frame and a backlight module.
In an embodiment therein, described in cover polycrystalline structure film and described driving chip be electrically connected to described liquid crystal panel by an anisotropic conductive film (Anisotropic Conductive Film, ACF) material.
According to another aspect of the present invention, a kind of liquid crystal display is provided, comprise a front frame, a liquid crystal panel and a backlight module, this liquid crystal display also comprises:
One covers polycrystalline structure film, has:
One body region, comprises a driving chip, and this driving chip is by pressing and be electrically connected to described liquid crystal panel; And
A pair of lug boss, is positioned at the relative both sides of described body region, between each lug boss and described body region, has an isolation channel, in order to body region described in interval and described lug boss, wherein, described in cover polycrystalline structure film by this to lug boss tapping, thereby prevent that liquid from flowing into described body region; And
One printed-wiring board (PWB), covers the described body region of polycrystalline structure film described in being bonded to.
In an embodiment therein, described printed-wiring board (PWB) is arranged between described front frame and described backlight module.
In an embodiment therein, described printed-wiring board (PWB) also comprises a golden finger (Gold Finger), covers polycrystalline structure film described in after bonding and sees through the corresponding terminal that this golden finger is electrically connected described printed-wiring board (PWB).
In an embodiment therein, described in cover polycrystalline structure film, by an anisotropic conductive film material, described driving chip be electrically connected to described liquid crystal panel.
In an embodiment therein, this liquid crystal display is Thin Film Transistor-LCD.
Adopt the polycrystalline structure film that covers of the present invention, its body region (or being called effective coverage) comprises a driving chip, this driving chip is by pressing and be electrically connected to liquid crystal panel, and the relative both sides that a pair of lug boss (or being called inactive area) is positioned at this body region are set, between each lug boss and body region, there is an isolation channel, by this isolation channel, separate body region and lug boss.Than prior art, when user's cleaning solution crystal panel, liquid crystal display can derive clean liquid to lug boss by this that covers polycrystalline structure film, to prevent that it from flowing into body region and causing short circuit or fault.In addition, when covering polycrystalline structure film and liquid crystal panel when bonding, the excessive glue producing also can see through this lug boss is discharged and can not infiltrated body region, thus the circuit reliability of improving product.
Accompanying drawing explanation
Reader, after having read the specific embodiment of the present invention with reference to accompanying drawing, will become apparent various aspects of the present invention.Wherein,
Figure 1A illustrates the decomposing schematic representation of front frame, liquid crystal panel and backlight module in a kind of liquid crystal display;
Figure 1B illustrates the schematic cross-section of the liquid crystal display of Figure 1A;
Fig. 2 illustrates the schematic diagram that covers polycrystalline structure film of liquid crystal display of the prior art; And
Fig. 3 illustrates the schematic diagram that covers polycrystalline structure film according to the liquid crystal display of one embodiment of the present invention.
Embodiment
For the technology contents that the application is disclosed is more detailed and complete, can be with reference to accompanying drawing and following various specific embodiments of the present invention, in accompanying drawing, identical mark represents same or analogous assembly.Yet those of ordinary skill in the art should be appreciated that the embodiment that hereinafter provided is not used for limiting the scope that the present invention is contained.In addition, accompanying drawing, only for being schematically illustrated, is not drawn according to its life size.
With reference to the accompanying drawings, the embodiment of various aspects of the present invention is described in further detail.
Figure 1A illustrates the decomposing schematic representation of front frame, liquid crystal panel and backlight module in a kind of liquid crystal display, and Figure 1B illustrates the schematic cross-section of the liquid crystal display of Figure 1A.
With reference to Figure 1A, this liquid crystal display comprises a front frame 100, a liquid crystal panel 102 and a backlight module (Backlight Unit, BLU) 104.In addition, one end of covering polycrystalline structure film 106 is electrically connected to liquid crystal panel 102, and the other end is electrically connected to printed-wiring board (PWB) (Printed Circuit Board Assembly, PCBA) 108.Printed circuit board (PCB) 108 also comprises a connector interface 110.
In Figure 1B, liquid crystal panel 102 is arranged at the top of backlight module 104, and liquid crystal panel 102 is bonded to front frame 100.For example, liquid crystal panel 102 comprises a colored filter glass substrate and the thin-film transistor array base-plate being oppositely arranged, and above colored filter glass substrate, also a polaroid can be set, in order to the light of backlight module outgoing is carried out to polarization.Printed circuit board (PCB) 108 is between front frame 100 and backlight module 104.One end of covering polycrystalline structure film 106 is electrically connected to the thin-film transistor array base-plate in liquid crystal panel 102, and for example, a part of terminal is electrically connected the grid of each thin film transistor (TFT), in order to provide thin film transistor (TFT) to open or turn-off required gate drive signal; Another part terminal is electrically connected the source electrode of each thin film transistor (TFT), in order to the data voltage of the corresponding pixel of thin film transistor (TFT) to be provided.
As mentioned before, lifting day by day along with display quality demand, printed-wiring board (PWB) puts towards ground side-sway the main flow that design becomes market gradually, yet, user is when cleaning liquid crystal panel, clean liquid is easy to flow into along panel related electronic components or the printed-wiring board (PWB) of below, causes short circuit or other fault, and then affects operation stability and the fiduciary level of product.
Fig. 2 illustrates the schematic diagram that covers polycrystalline structure film of liquid crystal display of the prior art.With reference to Fig. 2, cover polycrystalline structure film 106 and comprise a driving chip, this driving chip is pressure bonded to liquid crystal panel 102.And covering polycrystalline structure film 106 is anisotropic conductive film (Anisotropic Conductive Film, ACF) material 112 with the pressing region of liquid crystal panel 102, wherein, dotted portion represents the border of anisotropic conductive film 112.At this, ACF refers to that dispersion diameter is 3 microns~5 microns adhesive films that big or small electrically conductive particles forms in thermoset polymer matrix.
As can be seen from Figure 2, cover polycrystalline structure film and there is no the design of draining or water guide, when covering polycrystalline structure film 106 when bonding with liquid crystal panel 102, the excessive glue producing is easy to flow into or penetrate into pressing region, cause short circuit or other fault, affect circuit reliability of operation.
In order to eliminate above-mentioned defect of the prior art, Fig. 3 illustrates the schematic diagram that covers polycrystalline structure film according to the liquid crystal display of one embodiment of the present invention.
With reference to Fig. 3, the polycrystalline structure film that covers of the present invention comprises a body region (also can be described as " effective coverage ") 1061 and a pair of lug boss (also can be described as " inactive area ") 1063.This body region 1061 also comprises a driving chip, and this driving chip is by pressing and be electrically connected to liquid crystal panel 102.A pair of lug boss 1063 lays respectively at the relative both sides of body region 1061.Between each lug boss 1063 and body region 1061, there is an isolation channel 1062.This isolation channel 1062 is in order to separate body region 1061 and lug boss 1063.Because this covers polycrystalline structure film, adopted convex design, while there is overflowing glue when cleaning solution crystal panel 102 or in bonding processing procedure, the polycrystalline structure film that covers of the present invention can pass through this to lug boss 1063 tappings, thereby prevents that liquid from flowing into body region 1061.
In one embodiment, this body region 1061 of covering polycrystalline structure film adopts heat pressing process to be bonded to a printed-wiring board (PWB) (not shown).Further, this printed-wiring board (PWB) also comprises a golden finger (Gold Finger), and the polycrystalline structure film that covers after bonding sees through the corresponding terminal that this golden finger is electrically connected printed-wiring board (PWB).Be similar to Figure 1B, this printed-wiring board (PWB) can be arranged between a front frame and a backlight module.
In one embodiment, this covers polycrystalline structure film and driving chip is electrically connected to liquid crystal panel 102 by an anisotropic conductive film (Anisotropic Conductive Film, ACF) material 112.
It will be understood by those of skill in the art that Fig. 3 not only can describe the polycrystalline structure film that covers of the present invention, but also can illustrate and comprise the liquid crystal display that this covers polycrystalline structure film.For example, this liquid crystal display is a Thin Film Transistor-LCD.This liquid crystal display comprises that a front frame, a liquid crystal panel, a backlight module, cover polycrystalline structure film and a printed circuit board (PCB).Because front frame, liquid crystal panel, backlight module and printed circuit board (PCB) specifically describe in Figure 1A and Figure 1B, for simplicity, repeat no more herein.
Adopt the polycrystalline structure film that covers of the present invention, its body region (or being called effective coverage) comprises a driving chip, this driving chip is by pressing and be electrically connected to liquid crystal panel, and the relative both sides that a pair of lug boss (or being called inactive area) is positioned at this body region are set, between each lug boss and body region, there is an isolation channel, by this isolation channel, separate body region and lug boss.Than prior art, when user's cleaning solution crystal panel, liquid crystal display can derive clean liquid to lug boss by this that covers polycrystalline structure film, to prevent that it from flowing into body region and causing short circuit or fault.In addition, when covering polycrystalline structure film and liquid crystal panel when bonding, the excessive glue producing also can see through this lug boss is discharged and can not infiltrated body region, thus the circuit reliability of improving product.
Above, describe the specific embodiment of the present invention with reference to the accompanying drawings.But those skilled in the art can understand, without departing from the spirit and scope of the present invention in the situation that, can also do various changes and replacement to the specific embodiment of the present invention.These changes and replacement all drop in the claims in the present invention book limited range.
Claims (10)
1. cover a polycrystalline structure film, be applicable to a liquid crystal panel, it is characterized in that, described in cover polycrystalline structure film and comprise:
One body region, comprises a driving chip, and this driving chip is by pressing and be electrically connected to described liquid crystal panel; And
A pair of lug boss, is positioned at the relative both sides of described body region, has an isolation channel, in order to body region described in interval and described lug boss between each lug boss and described body region;
Wherein, described in cover polycrystalline structure film by this to lug boss tapping, thereby prevent that liquid from flowing into described body region.
2. the polycrystalline structure film that covers according to claim 1, is characterized in that, described in cover polycrystalline structure film body region adopt heat pressing process to be bonded to a printed-wiring board (PWB).
3. the polycrystalline structure film that covers according to claim 2, is characterized in that, described printed-wiring board (PWB) also comprises a golden finger, covers polycrystalline structure film described in after bonding and sees through the corresponding terminal that this golden finger is electrically connected described printed-wiring board (PWB).
4. the polycrystalline structure film that covers according to claim 2, is characterized in that, described printed-wiring board (PWB) is arranged between a front frame and a backlight module.
5. the polycrystalline structure film that covers according to claim 1, is characterized in that, described in cover polycrystalline structure film, by an anisotropic conductive film material, described driving chip be electrically connected to described liquid crystal panel.
6. a liquid crystal display, comprises a front frame, a liquid crystal panel and a backlight module, it is characterized in that, described liquid crystal display also comprises:
One covers polycrystalline structure film, has:
One body region, comprises a driving chip, and this driving chip is by pressing and be electrically connected to described liquid crystal panel; And
A pair of lug boss, is positioned at the relative both sides of described body region, between each lug boss and described body region, has an isolation channel, in order to body region described in interval and described lug boss, wherein, described in cover polycrystalline structure film by this to lug boss tapping, thereby prevent that liquid from flowing into described body region; And
One printed-wiring board (PWB), covers the described body region of polycrystalline structure film described in being bonded to.
7. liquid crystal display according to claim 6, is characterized in that, described printed-wiring board (PWB) is arranged between described front frame and described backlight module.
8. according to the liquid crystal display described in claim 6 or 7, it is characterized in that, described printed-wiring board (PWB) also comprises a golden finger, covers polycrystalline structure film described in after bonding and sees through the corresponding terminal that this golden finger is electrically connected described printed-wiring board (PWB).
9. liquid crystal display according to claim 6, is characterized in that, described in cover polycrystalline structure film, by an anisotropic conductive film material, described driving chip be electrically connected to described liquid crystal panel.
10. liquid crystal display according to claim 6, is characterized in that, described liquid crystal display is a Thin Film Transistor-LCD.
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CN201410009141.XA CN103728747A (en) | 2014-01-08 | 2014-01-08 | Chip on film (COF) structure and liquid crystal display thereof |
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CN201410009141.XA CN103728747A (en) | 2014-01-08 | 2014-01-08 | Chip on film (COF) structure and liquid crystal display thereof |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
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CN104049393A (en) * | 2014-06-12 | 2014-09-17 | 深圳市华星光电技术有限公司 | Chip on film (COF) substrate and manufacturing method thereof and display panel |
CN108701691A (en) * | 2016-02-18 | 2018-10-23 | 苹果公司 | Floor structure and method for microdrive and micro- LED |
WO2019192029A1 (en) * | 2018-04-03 | 2019-10-10 | 惠州市华星光电技术有限公司 | Display device and manufacturing method therefor |
CN110376806A (en) * | 2019-07-16 | 2019-10-25 | 惠州市华星光电技术有限公司 | Flip chip structure and display |
US10522610B2 (en) | 2018-04-03 | 2019-12-31 | Huizhou China Star Optoelectronics Technology Co., Ltd. | Display device with hemispherical particles on chip-on-film surface, and manufacturing method thereof |
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2014
- 2014-01-08 CN CN201410009141.XA patent/CN103728747A/en active Pending
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104049393A (en) * | 2014-06-12 | 2014-09-17 | 深圳市华星光电技术有限公司 | Chip on film (COF) substrate and manufacturing method thereof and display panel |
WO2015188408A1 (en) * | 2014-06-12 | 2015-12-17 | 深圳市华星光电技术有限公司 | Chip on film substrate, manufacturing method therefor, and display panel |
CN108701691A (en) * | 2016-02-18 | 2018-10-23 | 苹果公司 | Floor structure and method for microdrive and micro- LED |
CN108701691B (en) * | 2016-02-18 | 2022-05-27 | 苹果公司 | Backplane structure and method for micro-drivers and micro-LEDs |
WO2019192029A1 (en) * | 2018-04-03 | 2019-10-10 | 惠州市华星光电技术有限公司 | Display device and manufacturing method therefor |
US10522610B2 (en) | 2018-04-03 | 2019-12-31 | Huizhou China Star Optoelectronics Technology Co., Ltd. | Display device with hemispherical particles on chip-on-film surface, and manufacturing method thereof |
CN110376806A (en) * | 2019-07-16 | 2019-10-25 | 惠州市华星光电技术有限公司 | Flip chip structure and display |
WO2021007950A1 (en) * | 2019-07-16 | 2021-01-21 | 惠州市华星光电技术有限公司 | Chip on film structure and display |
US11309260B2 (en) | 2019-07-16 | 2022-04-19 | Huizhou China Star Optoelectronics Technology Co., Ltd. | Chip on film structure and display device |
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Application publication date: 20140416 |