CN103725238B - Reparable conducting resin and preparation method thereof - Google Patents
Reparable conducting resin and preparation method thereof Download PDFInfo
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Abstract
The invention relates to a reparable conducting resin. The conducting resin comprises the following components in parts by weight: 100 parts of epoxy resin I, 250-900 parts of sheet aluminium powder, 10-50 parts of a curing agent I, 10-40 parts of an epoxy diluent I, 3-20 parts of a coupling agent and 8-30 parts of composite mesoporous granules, wherein the curing temperature of an epoxy resin composition I consisting of the curing agent I, the epoxy resin I and the epoxy diluent I is 60-80 DEG C; the composite mesoporous granules are mesoporous silica granules containing capsule wall material layers on the outer surfaces and inner epoxy resin compositions II, and the curing temperature of the epoxy resin compositions II is equal to or higher than 150 DEG C; an epoxy diluent II contained in the composition of the epoxy resin II is insoluble or difficult to dissolve in water, and the boiling point of the epoxy diluent II is equal to or higher than 150 DEG C. The invention further relates to a preparation method for the reparable conducting resin. The reparable conducting resin has high repair efficiency, and stress concentration generated at cracks appeared after repair is avoided.
Description
Technical field
The present invention relates to conductive resin, being specifically related to one can repairing type conductive resin and preparation method thereof.
Background technology
The development trend of conductive resin as conductive resin can be repaired, due to the Application Areas that it can improve the reliability of conduction and work-ing life, expansion conductive resin, be significant.
Conductive resin can be repaired at present mainly by adding microscapsule powder in conductive resin, the repair mechanisms of this conductive silver glue are: conductive resin is when cured subject to External Force Acting or produces after tiny crack in inside due to fatigue, fill up to solidify bonding crackle in crackle containing releases such as nanometer silver, latent curing agent, epoxy resin in microscapsule powder, reach the dual reparation of crackle and conductive network.Its main drawback is that repair rate is low.It is that liquid in microcapsule produces volumetric shrinkage after hardening that its reason mainly contains two: one, therefore there is stress concentration after crack forming mechanism; Two is microcapsule preparation difficulties, and epoxy resin encapsulation ratio is low.In addition, microcapsule poorly conductive, is unfavorable for the electrical property of conductive resin.
Summary of the invention
The technical issues that need to address of the present invention are to provide one can repairing type conductive resin, and its remediation efficiency can up to 73 ~ 84%.
The technical issues that need to address of the present invention be also to provide above-mentioned can the preparation method of repairing type conductive resin.
The present invention needs first technical problem solved to be achieved through the following technical solutions: one can repairing type conductive resin, and it calculates by its parts by weight, composed as follows:
Epoxy resin I 100 parts
Flake silver powder 250 ~ 900 parts
Solidifying agent I 10 ~ 50 parts
Epoxide diluent I 10 ~ 40 parts
Coupling agent 3 ~ 20 parts
Composite mesopore particle 8 ~ 30 parts;
Wherein, the solidification value of the composition epoxy resin I be made up of solidifying agent I, epoxy resin I and epoxide diluent I is 60 ~ 80 DEG C; Described composite mesopore particle is that outside surface has wall capsule material layer, the interior mesoporous silica particles containing composition epoxy resin II, and composite mesopore particle calculates by its parts by weight, comprises following composition:
Mesoporous silica particles 100 parts
Composition epoxy resin II 10 ~ 60 parts
Wall capsule material 5 ~ 30 parts;
Wherein, solidification value >=150 DEG C of described composition epoxy resin II, composition epoxy resin II calculates by its parts by weight, composed as follows:
Epoxy resin II 100 parts
Solidifying agent II 10 ~ 20 parts
Epoxide diluent II 35 ~ 80 parts;
And described epoxide diluent II is the epoxide diluent being insoluble to or being insoluble in water, and boiling point >=150 DEG C.
Here, described composite mesopore particle can be prepared by following steps:
S1. absorption is flooded: flooded in described composition epoxy resin II by mesoporous silica particles, centrifugal after dipping 0.5 ~ 24h, use deionized water wash mesoporous silica particles again, subsequently at 50 ~ 60 DEG C of more than vacuum-drying 3h, mesoporous silica particles containing composition epoxy resin II in obtaining, wherein the weight ratio of composition epoxy resin II and mesoporous silicon oxide is 10 ~ 60:100;
S2. composite mesopore particle is prepared: the mesoporous silica particles dispersion containing composition epoxy resin II in being obtained by step S1 in deionized water, add the pre-polymerization liquid of wall capsule material, or the monomer of wall capsule material, emulsifying agent, dispersion agent and initiator, heating also stirring reaction 1 ~ 24h in 50 ~ 80 DEG C of water-baths, stir subsequently and be cooled to room temperature, centrifugal, with deionized water wash, subsequently at 50 ~ 60 DEG C of more than vacuum-drying 3h, obtain outside surface and have wall capsule material layer, the interior mesoporous silica particles containing composition epoxy resin II, i.e. composite mesopore particle, the weight ratio of its mesospore capsule material and mesoporous silicon oxide is 5 ~ 30:100.
Here, described epoxide diluent II can be propylene oxide phenyl ether or epoxy propane butyl ether; Described solidifying agent II is 70# acid anhydrides, 647# acid anhydrides or trimellitic anhydride.The boiling point of propylene oxide phenyl ether is 245 DEG C, and the boiling point of epoxy propane butyl ether is 164 DEG C, and all water insoluble; Ensure that the drying phase under vacuum of composite mesopore particle when it is prepared is non-volatile, the washing stage is water insoluble and keep mobility in conductive resin LOTES process.Described epoxide diluent II is preferably propylene oxide phenyl ether, because propylene oxide phenyl ether boiling point is higher.70# acid anhydrides is synthesized by divinyl and MALEIC ANHYDRIDE, and 647# acid anhydrides is synthesized by dicyclopentadiene and MALEIC ANHYDRIDE.They and trimellitic anhydride are all commercially available, their solidification values respectively needed for cured epoxy resin are 150 ~ 160 DEG C, therefore in composite mesopore particulate production vacuum-drying and conductive resin solidification process in, mesoporous in composition epoxy resin II can not solidify, keep good mobility.
Described coupling agent can be organo silane coupling agent; Described solidifying agent I can be Dyhard RU 100 or modified amine curing agent; Described epoxide diluent I is epoxy propane butyl ether or polypropylene glycol diglycidyl ether.This solidifying agent I and epoxide diluent I with the use of, its solidification value is 60 ~ 80 DEG C, therefore the solidification of composition epoxy resin II in composite mesopore particle can not be caused, thus make mesoporous interior composition epoxy resin II keep good mobility, have an effect when repairing.
Described wall capsule material can be the one in urethane, polyester, polyureas, polymeric amide, polystyrene, poly(urea formaldehyde), polyacrylic ester or its modifier.Wall capsule material layer can continue polyreaction by performed polymer and obtain, and also can be obtained by monomer direct polymerization.Preferably, described wall capsule material is polymethylmethacrylate.Here, the polymethyl methacrylate layers of meso-porous titanium dioxide silicon face can be formed by the letex polymerization of methacrylic acid monomer.
In technique scheme, preferably, the particle diameter of described mesoporous silica particles is 25 ~ 200 nanometers.Adopt nanometer or nearly nano level mesoporous silica particles, be conducive to the dispersed mesoporous silica particles in conductive resin, and then the composition epoxy resin II etc. of its internal package is evenly distributed in conductive resin.
Preferably, the median size of described flake silver powder is 5 ~ 10 μm, tap density>=4.0g/cm
3, specific surface area>=0.5m
2/ g.
The present invention needs second technical problem solved to be achieved through the following technical solutions: a kind of can the preparation method of repairing type conductive resin, it comprises the following steps:
S1. absorption is flooded: flooded in composition epoxy resin II by mesoporous silica particles, composition epoxy resin II calculates by its parts by weight, comprise epoxy resin II100 part, solidifying agent II10 ~ 20 part, epoxide diluent II35 ~ 80 part, and described epoxide diluent II is the epoxide diluent being insoluble to or being insoluble in water, and boiling point >=150 DEG C; Centrifugal after dipping 0.5 ~ 24h, use deionized water wash mesoporous silica particles again, subsequently at 50 ~ 60 DEG C of more than vacuum-drying 3h, mesoporous silica particles containing composition epoxy resin II in obtaining, wherein the weight ratio of composition epoxy resin II and mesoporous silicon oxide is 10 ~ 60:100;
S2. composite mesopore particle is prepared: the mesoporous silica particles dispersion containing composition epoxy resin II in being obtained by step S1 in deionized water, add the pre-polymerization liquid of wall capsule material, or the monomer of wall capsule material, emulsifying agent, dispersion agent and initiator, heating also stirring reaction 1 ~ 24h in 50 ~ 80 DEG C of water-baths, stir subsequently and be cooled to room temperature, centrifugal, with deionized water wash, at 50 ~ 60 DEG C of more than vacuum-drying 3h, obtain outside surface and have wall capsule material layer, the interior mesoporous silica particles containing composition epoxy resin II, i.e. composite mesopore particle, the weight ratio of its mesospore capsule material and mesoporous silicon oxide is 5 ~ 30:100,
S3. conductive resin is modulated: weigh each component according to the parts by weight of epoxy resin I100 part, flake silver powder 250 ~ 900 parts, solidifying agent I10 ~ 50 part, epoxide diluent I10 ~ 40 part, coupling agent 3 ~ 20 parts, composite mesopore particle 8 ~ 30 parts, each component is at room temperature mixed, obtaining can repairing type conductive resin, and the solidification value of the composition epoxy resin I be wherein made up of solidifying agent I, epoxy resin I and epoxide diluent I is 60 ~ 80 DEG C.
In the above-mentioned methods, preferably, described epoxide diluent II is propylene oxide phenyl ether or epoxy propane butyl ether; Described solidifying agent II is 70# acid anhydrides, 647# acid anhydrides or trimellitic anhydride; Described coupling agent is organo silane coupling agent; Described solidifying agent I is Dyhard RU 100 or modified amine curing agent; Described epoxide diluent I is epoxy propane butyl ether or polypropylene glycol diglycidyl ether; Described wall capsule material is the one in urethane, polyester, polyureas, polymeric amide, polystyrene, poly(urea formaldehyde), polyacrylic ester or its modifier; The particle diameter of described mesoporous silica particles is 25 ~ 200 nanometers; The median size of described flake silver powder is 5 ~ 10 μm, tap density>=4.0g/cm
3, specific surface area>=0.5m
2/ g.
In the above-mentioned methods, preferably, in described step S2, the weight ratio of deionized water, emulsifying agent, dispersion agent, initiator and monomer is 600 ~ 1800:8 ~ 12:0.5 ~ 1.5:0.1 ~ 0.3:100, emulsifying agent is OP-10 and the Sodium dodecylbenzene sulfonate mixture by weight 1:1, dispersion agent is polyvinyl alcohol, and initiator is ammonium persulphate, and monomer is methyl methacrylate.The described wall capsule material obtained is polymethylmethacrylate.
Compared with prior art, advantage of the present invention and beneficial effect are:
Can be repaired after crackle appears in this conductive resin, long service life: after in use cracking, crackle is diffused into cyst material layer place, carries out local heating or heating and pressurizing to cracks, mesoporous interior composition epoxy resin II flowing can be made to discharge, repaired crackle;
Because this conductive resin is added with mesoporous silicon oxide, it is mesoporous has good adsorptivity, in the process of the coated cyst material layer of mesoporous silicon oxide, not easily discharged by the composition epoxy resin II of mesoporous absorption, ensure composition epoxy resin be stored in mesoporous in, thus repair time improve remediation efficiency;
Mesoporous silicon oxide has the volumetric shrinkage that hole can offset the generation of cracks liquid curing, avoids the cracks after being repaired and produces stress concentration, improve the mechanical strength after repairing;
Polymethylmethacrylate can be selected to be wall capsule material layer, in repair process, can to heat and make that wall capsule material is softening, melting, thus can make mesoporous in composition epoxy resin II discharge more fully;
Provide and a kind ofly prepare the new way can repairing conductive resin, this conductive resin technique is simple, parameter is easily controlled.
Embodiment
Below in conjunction with embodiment, the specific embodiment of the present invention is described further.Following examples only for technical scheme of the present invention is clearly described, and can not limit the scope of the invention with this.
Embodiment 1 ~ 6
The present invention is that one can repairing type conductive resin, and its composition comprises: epoxy resin I, flake silver powder, solidifying agent I, epoxide diluent I, coupling agent and composite mesopore particle, each parts by weight are as shown in table 1.Wherein, the solidification value of the composition epoxy resin I be made up of solidifying agent I, epoxy resin I and epoxide diluent I is 60 ~ 80 DEG C.Coupling agent can be organo silane coupling agent; Solidifying agent I can be Dyhard RU 100 or modified amine curing agent; Epoxide diluent I can be epoxy propane butyl ether or polypropylene glycol diglycidyl ether.Certainly, realize composition epoxy resin I can solidify 60 ~ 80 DEG C of temperature ranges as long as the selection of solidifying agent I, epoxide diluent I meets.
Table 1: can repairing type conductive resin each feed composition containing scale
Wherein, composite mesopore particle is that outside surface has wall capsule material layer, the interior mesoporous silica particles containing composition epoxy resin II, the particle diameter of mesoporous silica particles is 25 ~ 200 nanometers, in addition, the mesoporous silicon oxide of submicron order as 400 ran is applicable, just the mesoporous silica particles of employing 25 ~ 200 nanometer, is more conducive to dispersed; Described wall capsule material can be the one in urethane, polyester, polyureas, polymeric amide, polystyrene, poly(urea formaldehyde), polyacrylic ester or its modifier, as polymethylmethacrylate.In embodiment 1 ~ 6, the composition of composite mesopore particle is in table 2.
Table 2: composite mesopore grain fraction containing scale
Table 2 epoxy resin composition I I comprises by composition: epoxy resin II, solidifying agent II and epoxide diluent II, and the parts by weight of embodiment 1 ~ 6 epoxy resin composition I I are as shown in table 3.Here, solidification value >=150 DEG C of composition epoxy resin II.For this reason, solidifying agent II can select 70# acid anhydrides, 647# acid anhydrides or trimellitic anhydride, and their solidification values needed for cured epoxy resin II are 150 ~ 160 DEG C.In addition, here epoxide diluent II select be insoluble to or be insoluble in water and boiling point at the epoxide diluent of >=150 DEG C, such as propylene oxide phenyl ether or epoxy propane butyl ether.
Table 3: composition epoxy resin II component containing scale
Above-mentionedly can the preparation method of repairing type conductive resin to comprise the following steps:
S1. absorption is flooded: flood in the composition epoxy resin II be made up of epoxy resin II, solidifying agent II and epoxide diluent II of mesoporous silica particles described in table 3, centrifugal after dipping 0.5 ~ 24h, use deionized water wash mesoporous silica particles again, subsequently at 50 ~ 60 DEG C of more than vacuum-drying 3h, the mesoporous silica particles containing composition epoxy resin II in obtaining; Wherein, composition epoxy resin II relative to the addition of mesoporous silicon oxide in table 2.
S2. composite mesopore particle is prepared: the mesoporous silica particles dispersion containing composition epoxy resin II in being obtained by step S1 in deionized water, add the pre-polymerization liquid of wall capsule material, or the monomer of wall capsule material, emulsifying agent, dispersion agent and initiator, heating also stirring reaction 1 ~ 24h in 50 ~ 80 DEG C of water-baths, stir subsequently and be cooled to room temperature, centrifugal, with deionized water wash, subsequently at 50 ~ 60 DEG C of more than vacuum-drying 3h, obtain outside surface and have wall capsule material layer, the interior mesoporous silica particles containing composition epoxy resin II, i.e. composite mesopore particle; Wherein, wall capsule material relative to the addition of mesoporous silicon oxide in table 2.
S3. conductive resin is modulated: the composite mesopore particle, epoxy resin I, flake silver powder, solidifying agent I, epoxide diluent I and the coupling agent that obtain according to the parts by weight weighing step S2 described in table 1, it at room temperature mixed, obtaining can repairing type conductive resin.
In embodiment 1, what add in step S2 is by trimeric cyanamide, the formaldehyde of 37% and the pre-polymerization liquid of the trimeric cyanamide that obtains of deionized water 1:1.5:1.6 ratio and copolyoxymethylenes.In embodiment 2, what add in step S2 is the pre-polymerization liquid of poly(urea formaldehyde) resin that obtains of formaldehyde solution 1:1.5 ratio by urea and 37%.In embodiment 3 ~ 6, what add in step S2 is methacrylic acid monomer, polyvinyl alcohol dispersion agent, ammonium persulfate initiator, compound emulsifying agent (OP-10 and Sodium dodecylbenzene sulfonate are by weight the mixture of 1:1), and the weight ratio of deionized water, emulsifying agent, dispersion agent, initiator and monomer is 600 ~ 1800:8 ~ 12:0.5 ~ 1.5:0.1 ~ 0.3:100.Wherein, the selection of the concrete technology parameter in S1 ~ S2 step is in table 4.
Table 4: concrete technology parameter list
What embodiment 1 ~ 6 obtained can solidify 6 hours by repairing type conductive resin at 60 ~ 80 DEG C, obtains solidifying rear product.Tested respectively by four-point probe method and calculate conductive resin original volume resistivity, adopting ASTM D5045-99 standard testing initial breaking strength.By the batten alignment after test, at 150 DEG C, solidify 2h.Then continuation four-point probe method calculates the volume specific resistance after conductive resin reparation, and breaking tenacity after adopting ASTM D5045-99 standard test reparation.Volume specific resistance after reparation and the ratio of initial electrical resistivity, and after repairing, the ratio of breaking tenacity and initial breaking strength is all listed in table 5.
Table 5: performance table
| Component | Embodiment 1 | Embodiment 2 | Embodiment 3 | Embodiment 4 | Embodiment 5 | Embodiment 6 |
| Volume specific resistance after reparation and the ratio of initial electrical resistivity | 1.1 | 1.1 | 1.1 | 1.0 | 1.1 | 1.0 |
| The ratio (%) of breaking tenacity and initial breaking strength after repairing | 73 | 75 | 79 | 84 | 81 | 80 |
As can be seen from Table 5, the present invention breaking tenacity can reach 73 ~ 84% of initial breaking strength after the reparation of repairing type conductive resin, and volume specific resistance after repairing is also suitable with initial volume specific resistance.
Above-mentioned each embodiment is further illustrating of making foregoing of the present invention, but the scope that should not be construed as the above-mentioned theme of the present invention is only limitted to above-described embodiment.It should be pointed out that for those skilled in the art, under the prerequisite not departing from the technology of the present invention principle, can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.
Claims (10)
1. can a repairing type conductive resin, it is characterized in that, calculate by its parts by weight, composed as follows:
Epoxy resin I 100 parts
Flake silver powder 250 ~ 900 parts
Solidifying agent I 10 ~ 50 parts
Epoxide diluent I 10 ~ 40 parts
Coupling agent 3 ~ 20 parts
Composite mesopore particle 8 ~ 30 parts;
Wherein, the solidification value of the composition epoxy resin I be made up of solidifying agent I, epoxy resin I and epoxide diluent I is 60 ~ 80 DEG C; Described composite mesopore particle is that outside surface has wall capsule material layer, the interior mesoporous silica particles containing composition epoxy resin II, and composite mesopore particle calculates by its parts by weight, composed as follows:
Mesoporous silica particles 100 parts
Composition epoxy resin II 10 ~ 60 parts
Wall capsule material 5 ~ 30 parts;
Wherein, solidification value >=150 DEG C of described composition epoxy resin II, composition epoxy resin II calculates by its parts by weight, composed as follows:
Epoxy resin II 100 parts
Solidifying agent II 10 ~ 20 parts
Epoxide diluent II 35 ~ 80 parts;
And described epoxide diluent II is the epoxide diluent being insoluble to or being insoluble in water, and boiling point >=150 DEG C.
2. as claimed in claim 1 can repairing type conductive resin, it is characterized in that, described composite mesopore particle is prepared by following steps:
S1. absorption is flooded: flooded in described composition epoxy resin II by mesoporous silica particles, centrifugal after dipping 0.5 ~ 24h, use deionized water wash again, subsequently at 50 ~ 60 DEG C of more than vacuum-drying 3h, mesoporous silica particles containing composition epoxy resin II in obtaining, wherein the weight ratio of composition epoxy resin II and mesoporous silicon oxide is 10 ~ 60:100;
S2. composite mesopore particle is prepared: the mesoporous silica particles dispersion containing composition epoxy resin II in being obtained by step S1 in deionized water, add the pre-polymerization liquid of wall capsule material, or the monomer of wall capsule material, emulsifying agent, dispersion agent and initiator, heating also stirring reaction 1 ~ 24h in 50 ~ 80 DEG C of water-baths, stir subsequently and be cooled to room temperature, centrifugal, with deionized water wash, subsequently at 50 ~ 60 DEG C of more than vacuum-drying 3h, obtain outside surface and have wall capsule material layer, the interior mesoporous silica particles containing composition epoxy resin II, i.e. composite mesopore particle, the weight ratio of its mesospore capsule material and mesoporous silicon oxide is 5 ~ 30:100.
3. as claimed in claim 1 can repairing type conductive resin, it is characterized in that: described epoxide diluent II is propylene oxide phenyl ether or epoxy propane butyl ether; Described solidifying agent II is 70# acid anhydrides, 647# acid anhydrides or trimellitic anhydride.
4. as claimed in claim 1 can repairing type conductive resin, it is characterized in that: described coupling agent is organo silane coupling agent; Described solidifying agent I is Dyhard RU 100 or modified amine curing agent; Described epoxide diluent I is epoxy propane butyl ether or polypropylene glycol diglycidyl ether; Described wall capsule material is the one in urethane, polyester, polyureas, polymeric amide, polystyrene, poly(urea formaldehyde), polyacrylic ester or its modifier.
5. as claimed in claim 1 can repairing type conductive resin, it is characterized in that: described wall capsule material is polymethylmethacrylate.
6. as described in claim 1 to 5 any one can repairing type conductive resin, it is characterized in that: the particle diameter of described mesoporous silica particles is 25 ~ 200 nanometers.
7. as claimed in claim 6 can repairing type conductive resin, it is characterized in that: the median size of described flake silver powder is 5 ~ 10 μm, tap density>=4.0g/cm
3, specific surface area>=0.5m
2/ g.
8. can the preparation method of repairing type conductive resin, it is characterized in that, comprise the following steps:
S1. absorption is flooded: flooded in composition epoxy resin II by mesoporous silica particles, composition epoxy resin II calculates by its parts by weight, comprise epoxy resin II100 part, solidifying agent II10 ~ 20 part, epoxide diluent II35 ~ 80 part, and described epoxide diluent II is the epoxide diluent being insoluble to or being insoluble in water, and boiling point >=150 DEG C; Centrifugal after dipping 0.5 ~ 24h, use deionized water wash mesoporous silica particles again, subsequently at 50 ~ 60 DEG C of more than vacuum-drying 3h, mesoporous silica particles containing composition epoxy resin II in obtaining, wherein the weight ratio of composition epoxy resin II and mesoporous silicon oxide is 10 ~ 60:100;
S2. composite mesopore particle is prepared: the mesoporous silica particles dispersion containing composition epoxy resin II in being obtained by step S1 in deionized water, add the pre-polymerization liquid of wall capsule material, or the monomer of wall capsule material, emulsifying agent, dispersion agent and initiator, heating also stirring reaction 1 ~ 24h in 50 ~ 80 DEG C of water-baths, stir subsequently and be cooled to room temperature, centrifugal, with deionized water wash, at 50 ~ 60 DEG C of more than vacuum-drying 3h, obtain outside surface and have wall capsule material layer, the interior mesoporous silica particles containing composition epoxy resin II, i.e. composite mesopore particle, the weight ratio of its mesospore capsule material and mesoporous silicon oxide is 5 ~ 30:100,
S3. conductive resin is modulated: weigh each component according to the parts by weight of epoxy resin I100 part, flake silver powder 250 ~ 900 parts, solidifying agent I10 ~ 50 part, epoxide diluent I10 ~ 40 part, coupling agent 3 ~ 20 parts, composite mesopore particle 8 ~ 30 parts, each component is at room temperature mixed, obtaining can repairing type conductive resin, and the solidification value of the composition epoxy resin I be wherein made up of solidifying agent I, epoxy resin I and epoxide diluent I is 60 ~ 80 DEG C.
9. as claimed in claim 8 can the preparation method of repairing type conductive resin, it is characterized in that, described epoxide diluent II is propylene oxide phenyl ether or epoxy propane butyl ether; Described solidifying agent II is 70# acid anhydrides, 647# acid anhydrides or trimellitic anhydride; Described coupling agent is organo silane coupling agent; Described solidifying agent I is Dyhard RU 100 or modified amine curing agent; Described epoxide diluent I is epoxy propane butyl ether or polypropylene glycol diglycidyl ether; Described wall capsule material is the one in urethane, polyester, polyureas, polymeric amide, polystyrene, poly(urea formaldehyde), polyacrylic ester or its modifier; The particle diameter of described mesoporous silica particles is 25 ~ 200 nanometers; The median size of described flake silver powder is 5 ~ 10 μm, tap density>=4.0g/cm
3, specific surface area>=0.5m
2/ g.
10. as claimed in claim 8 can the preparation method of repairing type conductive resin, it is characterized in that: in described step S2, the weight ratio of deionized water, emulsifying agent, dispersion agent, initiator and monomer is 600 ~ 1800:8 ~ 12:0.5 ~ 1.5:0.1 ~ 0.3:100, emulsifying agent is OP-10 and the Sodium dodecylbenzene sulfonate mixture by weight 1:1, dispersion agent is polyvinyl alcohol, initiator is ammonium persulphate, and monomer is methyl methacrylate.
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| CN101508823B (en) * | 2009-03-12 | 2011-05-04 | 中山大学 | Quick self-repair type polymer composite material at room temperature |
| CN103194164B (en) * | 2013-04-26 | 2014-05-21 | 中国电子科技集团公司第三十八研究所 | High temperature self-repairing conductive silver adhesive and preparation method thereof |
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