A kind of stir-in resin Preblend
Technical field
The present invention relates to a kind of resin premixed material.
Background technology
Recent years, along with the expansion of needs, when the surface encapsulation material that LED package is used is manufactured, it has encapsulated with material selection the good resin of thermotolerance and has coordinated the resin combination forming with inorganic fill material and illuminating colour.Conventional as epoxy resin or organosilicon resin composition, its heat-resisting photostabilization is relatively better, but the molding that LED package is used itself needs very thin, so need resin combination to there is good mobility in moulding process, and while adopting epoxy resin and silicone resin, its mobility relative deficiency, cannot evenly extend, easily produce filling inhomogeneous even in generation crack, middle part, be unfavorable for fixing, and the corresponding blocked up part of buildup of resin that also can produce, it is unfavorable for printing opacity, even hinders energising.
Summary of the invention
The object of the present invention is to provide a kind of Preblend of solidifying the front good resin material of mobility and making use thereof.
The present invention is achieved by the following technical solutions:
Described stir-in resin Preblend, comprise following component: derivative and the silicon hydrogen addition catalyst of resin, filling material, silane, the derivative molecular amount of silane is below 200, and the shared part by weight of described resin is 60%~80%, and the derivative ratio of silane is 5%~10%.
Further, described resin is epoxy resin or silicone resin.
Further, described silicon hydrogen addition catalyst is Platinic chloride.
Further, described inorganic fill material is magnesiumcarbonate or calcium carbonate.
Further, the described compound with SiH group is methyl-monosilane, ethylsilane, methoxy silane, tripropyl silane or phenyl silane.
Beneficial effect of the present invention illustrates with relevant experimental data part in the lump in embodiment.
Embodiment
Below in conjunction with embodiment, the present invention is further elaborated:
Derivative and the silicon hydrogen addition catalyst of resin, filling material, silane are mixed into Preblend, the derivative molecular amount of silane is below 200, in described Preblend, the shared part by weight of resin is 60%~80%, the derivative ratio of silane is 5%~10%, described Preblend mixing early stage temperature remain on 20~30 ℃, continue more than 24 hours, the pressure of mixing later stage more than 10Mpa, carries out helicoidal flow more than 2 minutes at 120 ℃ of above temperature.
The stirring velocity of described helicoidal flow is more than 5rpm.Stir and be unfavorable for too slowly resin Uniform Flow.
Described resin is epoxy resin or silicone resin.
Described silicon hydrogen addition catalyst is Platinic chloride.The kind of catalyzer also has a lot, general silicon hydrogen addition catalyst all can, its role is to make the unsaturated link(age) in silicon and resin to carry out addition reaction.
Described inorganic fill material is magnesiumcarbonate or calcium carbonate.Or other conventional chemical industry resin filling materials also can.
The described compound with SiH group is methyl-monosilane, ethylsilane, methoxy silane, tripropyl silane or phenyl silane.
Of the present inventionly be mainly used in encapsulating diode.
Photodiode of the present invention can be manufactured corresponding LED luminaire after adding power supply and lampshade.
Below by experimental data comparative illustration beneficial effect of the present invention:
After having added the additive of silane compound in resin, and be aided with helical stir, contribute to improve its unit elongation, make encapsulation more even.
The detailed description of this patent being made according to above specification sheets; its object is to be convenient to those skilled in the art better understands application mode and the scope of this patent; can not be interpreted as limitation of the present invention; in conjunction with the general knowledge of above content and this area; under the prerequisite of aim that does not depart from this patent, the alternative that is equal to that those skilled in the art make the technical scheme of recording in this patent document still falls into protection scope of the present invention.