CN103715334A - light emitting device - Google Patents
light emitting device Download PDFInfo
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- CN103715334A CN103715334A CN201310070418.5A CN201310070418A CN103715334A CN 103715334 A CN103715334 A CN 103715334A CN 201310070418 A CN201310070418 A CN 201310070418A CN 103715334 A CN103715334 A CN 103715334A
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- 230000003287 optical effect Effects 0.000 claims abstract description 56
- 239000007787 solid Substances 0.000 claims abstract description 46
- 239000000758 substrate Substances 0.000 claims abstract description 27
- 239000013078 crystal Substances 0.000 claims abstract description 22
- 239000000126 substance Substances 0.000 claims description 33
- 238000006243 chemical reaction Methods 0.000 claims description 23
- 241000255925 Diptera Species 0.000 claims description 3
- 239000000463 material Substances 0.000 description 6
- 239000000049 pigment Substances 0.000 description 6
- 238000004020 luminiscence type Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000002650 habitual effect Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a light-emitting device, which comprises a substrate, at least one light-emitting element, an annular dam body and an optical lens. The substrate has a die bonding region. The light-emitting element is arranged in the die bonding area. The annular dam surrounds the die bonding region. The annular dam has an inner wall and an outer wall. The inner wall faces the die bonding area, and the outer wall is opposite to the inner wall and is provided with a first locking structure. The optical lens is provided with a second locking structure, and the second locking structure and the first locking structure are locked with each other, so that the optical lens is configured on the solid crystal area, and a cavity is formed on the solid crystal area.
Description
Technical field
The invention relates to a kind of light-emitting device, and particularly relevant for a kind of light-emitting device with optical lens.
Background technology
The lighting angle of general light-emitting diode is (for example: be approximately 120 degree left and right) of fixing; in order to meet various different products for the demand of optical characteristics; manufacturer can cover a secondary optical lens (Secondary Optical Lens), the light shape (Illumination Distribution) of radiating in order to adjust light-emitting diode conventionally above light-emitting diode.
Secondary optical lens normally utilizes adhesion glue to be adhered on circuit substrate, therefore when this secondary optical lens is adhered on circuit substrate, be just difficult to take off replacing again.In other words, after secondary optical lens has been adhered, the light shape of light-emitting diode will be fixed and be difficult to change, if want thereafter, be applicable in other purposes, must pull down the secondary optical lens of having adhered, not only can damage circuit substrate, also very inconvenient for user or manufacturer.
Although intermediate manufacturer is offered perforate in order to solve such problem on the surface of circuit substrate, and additionally increase by a lens load bearing seat with pin (pin pin), to utilize pin to be fixed in the perforate of circuit substrate and to carry lens.Yet such design but makes the assembling flow path of light-emitting device integral body more complicated, and also easily because of the contraposition of pin and perforate difficulty, cause secondary optical lens to be difficult to be assembled on circuit substrate.
Summary of the invention
In view of this, a technical scheme of the present invention is that a kind of light-emitting device is being provided, and its main purpose is to utilize a kind of sealed mechanism so that optical lens can be assembled on substrate more simply.
In order to achieve the above object, according to one embodiment of the present invention, a kind of light-emitting device comprises a substrate, at least one light-emitting component, ring-type dam body (dam) and an optical lens.Substrate has a crystal bonding area.Light-emitting component is to be disposed at crystal bonding area.Ring-type dam body is around crystal bonding area.Ring-type dam body has an inwall and an outer wall.Internal face is to crystal bonding area, and outer wall is with respect to inwall and has one first lock solid structure.Optical lens has one second lock solid structure, and sealed mutually by the second lock solid structure and the first lock solid structure, optical lens is configured on crystal bonding area, and on crystal bonding area, forms a cavity.
In one or more execution mode of the present invention, the rounded or rectangle of ring-type dam body.
In one or more execution mode of the present invention, the first lock solid structure is one to be surrounded on the first spiral shell mosquito on the outer wall of ring-type dam body.
In one or more execution mode of the present invention, the second lock solid structure is one around optical lens inner bottom and lines and intermeshing the second screw thread of the first screw thread, relative motion by between the second screw thread and the first screw thread, is rotated optical lens and is fixed on ring-type dam body.
In one or more execution mode of the present invention, the first lock solid structure is a trip, is convexly set on the outer wall of ring-type dam body.
In one or more execution mode of the present invention, the second lock solid structure be one with the Ka Gou of trip complementation, the sealed optical lens that makes by trip and Ka Gou is fixed on ring-type dam body.
In one or more execution mode of the present invention, light-emitting component is light-emitting diode.
In one or more execution mode of the present invention, light-emitting device optionally comprises a wire, and it is to be electrically connected light-emitting component.
In one or more execution mode of the present invention, in cavity, optionally comprise one first Wavelength conversion substance.
In one or more execution mode of the present invention, optical lens optionally includes a second wave length transformational substance.
The light-emitting device of the above-mentioned execution mode of the present invention can directly be locked on optical lens on the ring-type dam body of substrate, and need not additionally increase any lens load bearing seat, more need not utilize the contraposition of pin and perforate to fix optical lens.Therefore, the light-emitting device of the above-mentioned execution mode of the present invention has not only significantly been simplified assembling flow path, also can avoid the pin that suffers from prior art and the problem of perforate contraposition difficulty.
The above is only effect of the problem of setting forth institute of the present invention wish solution, the technological means of dealing with problems and generation thereof etc., and detail of the present invention will be introduced in the execution mode below and relevant drawings in detail.
Accompanying drawing explanation
For above and other object of the present invention, feature, advantage and embodiment can be become apparent, appended the description of the drawings is as follows:
Fig. 1 illustrates according to the lens of the light-emitting device of an embodiment of the present invention and the exploded view of substrate;
Fig. 2 illustrates the profile of the light-emitting device of Fig. 1;
Fig. 3 illustrates the profile according to the light-emitting device of another execution mode of the present invention;
Fig. 4 illustrates the profile according to the light-emitting device of the another execution mode of the present invention;
Fig. 5 illustrates the profile of the light-emitting device of an execution mode again according to the present invention;
Fig. 6 illustrates the profile of the light-emitting device of an execution mode again according to the present invention;
Fig. 7 illustrates the profile of the light-emitting device of an execution mode again according to the present invention;
Fig. 8 illustrates the lens of the light-emitting device of an execution mode and the exploded view of substrate again according to the present invention;
Fig. 9 illustrates the profile of the light-emitting device of Fig. 8.
[main element symbol description]
100: substrate
110: crystal bonding area
200: light-emitting component
300,700: ring-type dam body
310,710: inwall
320,720: outer wall
The 322,722: first lock solid structure
400,800,900: optical lens
410,810: ring-shaped base
The 412,812: second lock solid structure
420,920: cavity
510: the first Wavelength conversion substances
520: second wave length transformational substance
600: wire
Embodiment
Below will disclose a plurality of execution mode of the present invention with accompanying drawing, as clearly stated, the details in many practices will be explained in the following description.Yet those of ordinary skill in the art should recognize, in part execution mode of the present invention, the details in these practices is also non-essential, therefore does not apply to limit the present invention.In addition,, for the purpose of simplifying accompanying drawing, some known habitual structures and element illustrate the mode simply to illustrate in the accompanying drawings.
Fig. 1 illustrates according to the lens of the light-emitting device of an embodiment of the present invention and the exploded view of substrate, and Fig. 2 illustrates the profile of the light-emitting device of Fig. 1.As shown in Figures 1 and 2, the light-emitting device of present embodiment comprises a substrate 100, at least one light-emitting component 200, a ring-type dam body 300 and an optical lens 400.Substrate 100 has a crystal bonding area 110.Light-emitting component 200 is to be disposed on crystal bonding area 110.Ring-type dam body (dam) 300 is around crystal bonding area 110.Ring-type dam body 300 has an inwall 310 and an outer wall 320.Inwall 310 is in the face of crystal bonding area 110, and outer wall 320 is with respect to inwall 310 and has one first lock solid structure 322.Optical lens 400 has one second lock solid structure 412, and sealed mutually by the second lock solid structure 412 and the first lock solid structure 322, optical lens 400 is configured on crystal bonding area 110, and on crystal bonding area 110, forms a cavity 420.
Because the second lock solid structure 412 of optical lens 400 can directly be locked on the first lock solid structure 322 on the outer wall 320 of ring-type dam body 300, thus can need not any lens load bearing seat and the structure such as pin and perforate under, realize the function of fixed optics lens 400.Therefore, the light-emitting device of above-mentioned execution mode has not only significantly been simplified assembling flow path, more can avoid the pin that suffers from prior art and the problem of perforate contraposition difficulty.
In present embodiment, ring-type dam body 300 can be rounded, and the first lock solid structure 322 is one to be surrounded on the first spiral shell mosquito on the outer wall 320 of ring-type dam body 300.In addition, the second lock solid structure 412 is second screw threads around the inner bottom of optical lens 400, and the lines of the second screw thread and the first screw thread intermesh.Specifically, the first lock solid structure 322 (being the first screw thread in present embodiment) can be worked in coordination with pitch (Pitch) and the pitch diameter (Pitch Diameter) of the second lock solid structure 412 (being the second screw thread in present embodiment), in order to both, can closely mesh.
In part execution mode, optical lens 400 can comprise a ring-shaped base 410, and it is the bottom that is surrounded on optical lens 400.The second lock solid structure 412 (being the second screw thread in present embodiment) is the inner surface that is formed at ring-shaped base 410.By rotary optical lens 400, the second lock solid structures 412 counterclockwise or deasil, can rotate relative to the first lock solid structure 322, ring-shaped base 410 is locked on ring-type dam body 300.In other words, by the relative motion between the second screw thread and the first screw thread, optical lens 400 can be rotated and be fixed on ring-type dam body 300.In part execution mode, the closed intensity between the second screw thread and the first screw thread can reach waterproof or airtight degree.
In part execution mode, in cavity 420, optionally comprise one first Wavelength conversion substance 510.As shown in Figure 2, the first Wavelength conversion substance 510 can be arranged in cavity 420.Furthermore, the first Wavelength conversion substance 510 can be positioned on crystal bonding area 110 and be covered with light-emitting component 200.In part execution mode, the first Wavelength conversion substance 510 can comprise fluorescent material, pigment, pigment or its composition, and it can be in order to the radiation light wavelength of conversion luminescence element 200.For instance, the first Wavelength conversion substance 510 can comprise the fluorescent material of redness, green, yellow or the color such as blue, but its color is not as limit.In part execution mode, the first Wavelength conversion substance 510 is only filled out in the cavity 420 that is distributed in part.As shown in Figure 2, the stacking height of the first Wavelength conversion substance 510 only a little more than or equal the height of ring-type dam body 300, and the first Wavelength conversion substance 510 is without filling up whole cavity 420.
In part execution mode, light-emitting component 200 can be light-emitting diode (Light Emitting Diode, LED).Specifically, light-emitting component 200 can be not the light-emitting diode chip for backlight unit of encapsulation, and it is that mode with chip direct package (Chip on Board, COB) is directly arranged on substrate 100.In part execution mode, light-emitting diode chip for backlight unit can be red light-emitting diode chip, green light LED chip, blue LED chip or ultraviolet light-emitting diodes chip, but not as limit.In part execution mode, light-emitting device can further comprise a wire 600, and it is to be electrically connected light-emitting component 200.Wire 600 not only can be used to be electrically connected two adjacent light-emitting components 200 and reaches the in parallel of light-emitting component or connect, also can be used to be electrically connected the circuit layer (not being shown in figure) on light-emitting component 200 and substrate 100, to provide light-emitting component 200 electric power.In part execution mode, wire 600 can be gold thread, but not as limit.
Fig. 3 illustrates the profile according to the light-emitting device of another execution mode of the present invention.Present embodiment is similar to the execution mode of Fig. 2, and both Main Differences are: the first Wavelength conversion substance 510 of present embodiment is to fill up whole cavity 420.In other words, in Fig. 3, the first Wavelength conversion substance 510 is to contact and be closely sealed with the inner surface of optical lens 400, the inwall 310 of ring-type dam body 300 and substrate 100.
Fig. 4 illustrates the profile according to the light-emitting device of the another execution mode of the present invention.The Main Differences of the execution mode of present embodiment and Fig. 2 is: the optical lens 400 of present embodiment can include a second wave length transformational substance 520, can insert the first Wavelength conversion substance 510 (can consult Fig. 2) in its cavity 420.Specifically, second wave length transformational substance 520 can be doped in optical lens 400, also can coat on the inner surface or outer surface of optical lens 400.In part execution mode, second wave length transformational substance 520 can comprise fluorescent material, pigment, pigment or its composition, and it is the radiation light wavelength in order to conversion luminescence element 200.For instance, second wave length transformational substance 520 can comprise the fluorescent material of redness, green, yellow or the color such as blue, but its color is not as limit.Separately because second wave length transformational substance 520 there is no direct touch luminous element 200, therefore can help to reduce the problem because the heat that the impact of the heat energy of light-emitting component 200 occurs declines.
Fig. 5 illustrates the profile of the light-emitting device of an execution mode again according to the present invention.The Main Differences of the execution mode of present embodiment and Fig. 2 is: the optical lens 900 of present embodiment is concavees lens, and the optical lens 400 of Fig. 2 is convex lens.Because optical lens 900 is concavees lens, therefore the cavity 920 between optical lens 900 and substrate 100 can be concavity and raised shape around.In present embodiment, the first Wavelength conversion substance 510 is to fill out in the cavity 920 that is distributed in part.As shown in Figure 5, the stacking height of the first Wavelength conversion substance 510 be a little more than or equal the height of ring-type dam body 300, and the first Wavelength conversion substance 510 is without filling up whole cavity 920.
Fig. 6 illustrates the profile of the light-emitting device of an execution mode again according to the present invention.Present embodiment is similar to the execution mode of Fig. 5, and both Main Differences are: the first Wavelength conversion substance 510 of present embodiment is to fill up whole cavity 920.In other words, in Fig. 6, the first Wavelength conversion substance 510 is to contact and be closely sealed with the inner surface of optical lens 900, the inwall 310 of ring-type dam body 300 and substrate 100.
Fig. 7 illustrates the profile of the light-emitting device of an execution mode again according to the present invention.The Main Differences of the execution mode of present embodiment and Fig. 5 is: the optical lens 900 of present embodiment can include second wave length transformational substance 520, and the cavity 920 between optical lens 900 and substrate 100 can be inserted the first Wavelength conversion substance 510 (can consult Fig. 5).Specifically, second wave length transformational substance 520 can be doped in optical lens 900, also can coat on the inner surface or outer surface of optical lens 900.In part execution mode, second wave length transformational substance 520 can comprise fluorescent material, pigment, pigment or its composition, and it is the radiation light wavelength in order to conversion luminescence element 200.For instance, second wave length transformational substance 520 can comprise the fluorescent material of redness, green, yellow or the color such as blue, but its color is not as limit.Separately because second wave length transformational substance 520 there is no direct touch luminous element 200, therefore can help to reduce the problem because the heat that the impact of the heat energy of light-emitting component 200 occurs declines.
Fig. 8 illustrates the lens of the light-emitting device of an execution mode and the exploded view of substrate again according to the present invention, and Fig. 9 illustrates the profile of the light-emitting device of Fig. 8.Present embodiment and the 1st and the Main Differences of the execution mode of 2 figure be: the ring-type dam body 700 of present embodiment is rectangular, and the ring-shaped base 810 of optical lens 800 is also rectangular.
In present embodiment, ring-type dam body 700 has an inwall 710 and an outer wall 720, the first lock solid structure 722 is a trip, it is to be convexly set on the outer wall 720 of ring-type dam body 700, and the second lock solid structure 812 is a Ka Gou, it is complementary mutually with the first lock solid structure 722 (being trip in present embodiment).For instance, the first lock solid structure 722 can be rectangle trip, and the second lock solid structure 812 can be rectangle draw-in groove, and both shapes and size are all identical, tightly fits in rectangular card ditch, thereby realize the function of fixed optics lens 800 in order to rectangle trip.The shape of above-mentioned the first lock solid structure 722 and the second lock solid structure 812 is only example, but not in order to limit the present invention.In fact, the first lock solid structure 722 also can be the trip of wedge shape, taper or the shape such as spherical, and the second lock solid structure 812 can be the draw-in groove of corresponding wedge shape, taper or the shape such as spherical.
In part execution mode, relative both sides on the outer wall 720 of ring-type dam body 700 (for example: upper and lower both sides and/or left and right both sides) all can comprise at least one first lock solid structure 722, and correspondence position in the ring-shaped base 810 of optical lens 800 also comprises the second lock solid structure 812.Therefore the relative both sides of the ring-shaped base 810 of optical lens 800 can be locked on respectively on the relative both sides of outer wall 720 of ring-type dam body 700, with fixed optics lens 800 more firmly.
When assembling, manufacturer or user can move (for example: along the arrow B in figure) towards substrate 100 by optical lens 800, and ring-shaped base 810 a little outwards can be pulled open, when optical lens 800 contact ring-type dam body 700, toward in, turn back again, the first lock solid structure 722 is inserted in the second lock solid structure 812, thereby realizes the function of fixed optics lens 800.
Although the present invention discloses as above with execution mode; so it is not in order to limit the present invention; anyly be familiar with this skill person; without departing from the spirit and scope of the present invention; when being used for a variety of modifications and variations, so the scope that protection scope of the present invention ought define depending on appending claims is as the criterion.
Claims (10)
1. a light-emitting device, is characterized in that, comprises:
One substrate, has a crystal bonding area;
At least one light-emitting component, is disposed at this crystal bonding area;
One ring-type dam body, around this crystal bonding area, this ring-type dam body has an inwall and an outer wall, and this internal face is to this crystal bonding area, and this outer wall is with respect to this inwall and has one first lock solid structure; And
One optical lens, has one second lock solid structure, and sealed mutually by this second lock solid structure and this first lock solid structure, this optical lens is configured on this crystal bonding area, and forms a cavity on this crystal bonding area.
2. light-emitting device according to claim 1, is characterized in that, the rounded or rectangle of this ring-type dam body.
3. light-emitting device according to claim 2, is characterized in that, this first lock solid structure is one to be surrounded on the first spiral shell mosquito on this outer wall of this ring-type dam body.
4. light-emitting device according to claim 3, it is characterized in that, this second lock solid structure is one around this optical lens inner bottom and lines and intermeshing the second screw thread of this first screw thread, relative motion by between this second screw thread and this first screw thread, is rotated this optical lens and is fixed on this ring-type dam body.
5. light-emitting device according to claim 2, is characterized in that, this first lock solid structure is a trip, is convexly set on this outer wall of this ring-type dam body.
6. light-emitting device according to claim 5, is characterized in that, this second lock solid structure be one with the Ka Gou of this trip complementation, sealed this optical lens that makes by this trip and this Ka Gou is fixed on this ring-type dam body.
7. according to the light-emitting device described in any one claim in claim 1 to 6, it is characterized in that, this light-emitting component is light-emitting diode.
8. light-emitting device according to claim 7, is characterized in that, also comprises a wire, is electrically connected this light-emitting component.
9. light-emitting device according to claim 8, is characterized in that, also comprises one first Wavelength conversion substance in this cavity.
10. light-emitting device according to claim 9, is characterized in that, this optical lens also includes a second wave length transformational substance.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101136558 | 2012-10-03 | ||
| TW101136558A TW201415673A (en) | 2012-10-03 | 2012-10-03 | Illumination apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103715334A true CN103715334A (en) | 2014-04-09 |
Family
ID=50408134
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310070418.5A Pending CN103715334A (en) | 2012-10-03 | 2013-03-06 | light emitting device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103715334A (en) |
| TW (1) | TW201415673A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113130719A (en) * | 2021-04-02 | 2021-07-16 | 深圳市嘉兴南电科技有限公司 | Light-emitting diode for electric automobile steering signal lamp |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2874776Y (en) * | 2005-11-25 | 2007-02-28 | 深圳市瑞丰光电子有限公司 | High power LED package structure |
| CN1992361A (en) * | 2005-12-26 | 2007-07-04 | 株式会社东芝 | Lens-equipped light-emitting diode device and method of manufacturing the same |
| CN101097973A (en) * | 2006-06-26 | 2008-01-02 | 南京汉德森科技股份有限公司 | High power LED two-dimension light source |
| CN201084749Y (en) * | 2007-09-06 | 2008-07-09 | 深圳市龙岗区横岗光台电子厂 | A LED encapsulation structure with a lens setting device |
-
2012
- 2012-10-03 TW TW101136558A patent/TW201415673A/en unknown
-
2013
- 2013-03-06 CN CN201310070418.5A patent/CN103715334A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2874776Y (en) * | 2005-11-25 | 2007-02-28 | 深圳市瑞丰光电子有限公司 | High power LED package structure |
| CN1992361A (en) * | 2005-12-26 | 2007-07-04 | 株式会社东芝 | Lens-equipped light-emitting diode device and method of manufacturing the same |
| CN101097973A (en) * | 2006-06-26 | 2008-01-02 | 南京汉德森科技股份有限公司 | High power LED two-dimension light source |
| CN201084749Y (en) * | 2007-09-06 | 2008-07-09 | 深圳市龙岗区横岗光台电子厂 | A LED encapsulation structure with a lens setting device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113130719A (en) * | 2021-04-02 | 2021-07-16 | 深圳市嘉兴南电科技有限公司 | Light-emitting diode for electric automobile steering signal lamp |
| CN113130719B (en) * | 2021-04-02 | 2022-05-17 | 深圳市嘉兴南电科技有限公司 | Light-emitting diode for electric automobile steering signal lamp |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201415673A (en) | 2014-04-16 |
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Application publication date: 20140409 |