CN103712098A

CN103712098A - LED lighting device

Info

Publication number: CN103712098A
Application number: CN201310349945.XA
Authority: CN
Inventors: 王儒光
Original assignee: Individual
Current assignee: Individual
Priority date: 2012-10-09
Filing date: 2013-08-12
Publication date: 2014-04-09
Anticipated expiration: 2033-08-12
Also published as: CN203517370U; CN102900983A; CN103712098B

Abstract

The invention provides an LED lighting device. According to the LED lighting device, service life can be prolonged, 360-degree lighting can be realized through irradiation angle amplification, light uniformity can be achieved, procedures and cost can be reduced. The LED lighting device comprises an LED lamp body, an allochroic light guide body and a light diffusing tube. The LED body comprises a light-transmitting support base, LED wafers and a circuit. The LED wafers and the circuit are arranged on the light-transmitting support base and are electrically insulated from the light-transmitting support base. The allochroic light guide body is sleeved on the periphery of the LED lamp body. Allochroic powder is contained in the allochroic light guide body. Light emitted by the LED wafers is evenly diffused by the light diffusing tube and then turned into light for lighting.

Description

A kind of LED lighting device

Technical field

The present invention relates to use the lighting device of light emitting diode (LED:light-emitting diode).

Background technology

In recent years, light emitting diode (hereinafter referred to as LED luminescence unit) receives publicity as the light source for various lighting apparatus, compares with the conventional illuminating lamp such as incandescent lamp, and LED luminescence unit has and working life longer advantageous effects lower such as caloric value.LED luminescence unit is used in various fields in recent years, not only as the light source of display, also as the illuminating lamp of general illumination equipment or as the headlight of installing on vehicle etc.Because each LED luminescence unit has lower luminous intensity, therefore, in order to realize high luminous intensity, a large amount of LED luminescence units is assembled in a lamp body.

As this lighting device, provided the LED illuminating lamp of the bullet cut LED luminescence unit shown in Fig. 1 in the past.Wherein, have use single light emitting diode light supply apparatus and by a plurality of dot matrix LEDs shapes be configured in the light supply apparatus using on insulation board.Luminescence unit 1 structure is as follows: LED wafer 2 soldering pastes such as wafer such as use silver slurries grade 7 are welded on the support that insulation board 4 forms, then with circuit board 8, the electrode of LED wafer 29 are connected into electric loop.In order to obtain white light, the sealing resin 10 that has mixed fluorescent material 11 is covered on LED wafer 2 and partial circuit.

The LED lighting device of this kind of structure has following shortcoming:

First, due to outer sealing resin and the fluorescent material of being covered with of LED wafer 2, because the thermal conductivity factor of sealing resin is low, therefore, the heat dissipation path of general LED wafer 2 only has one, by bearing, heat is passed, this also causes the coefficient of heat transfer of LED wafer low, thereby can shorten the service life of LED wafer.

Secondly, the fluorescent material of prior art is the outer type that covers, it is by fluorescent material and mixed with resin, manually be coated in again one by one on LED lamp pearl, operation is loaded down with trivial details, and manually coating can cause coating became uneven, thereby LED bright dipping color and luster is uneven, need again the LED wafer that is coated with fluorescent material of different colours, again by outstanding go-no-go, thereby cause cost, significantly to increase.

Moreover bearing is generally opaque, also affected going out light utilization efficiency and affecting the final irradiating angle of lamp body of LED.

Finally, because the amount of light of six faces of LED crystal is also inconsistent, the amount of light of one of them face accounts for 60%, and the amount of light of all the other five faces only accounts for 40%, can cause like this LED lighting device to have large stretch of dark side.

Summary of the invention

In view of the above problems, the object of this invention is to provide a kind of LED lighting device, can improve its service life, increase that irradiating angle is realized 360 degree illuminations, to realize light even, can reduce again operation and reduce costs simultaneously.

To achieve these goals, according to the lighting device shooting out from LED wafer of the present invention, comprise a LED lamp body and allochroic light-conducting body, described LED lamp body comprises printing opacity bearing, LED wafer and circuit, described LED wafer and circuit be arranged on printing opacity bearing and with its electric insulation, described LED wafer and circuit connect into circuit;

Described allochroic light-conducting body is set in described LED lamp body periphery, and described allochroic light-conducting body contains and becomes light powder.

Further, in described allochroic light-conducting body, also contain light spread powder, the described light shooting out from LED wafer first becomes illumination light through becoming light powder again after the diffusion of light spread powder.

Or, between allochroic light-conducting body and filament, there is light anemostat, described smooth anemostat is set in LED lamp body periphery.

Preferably, described smooth anemostat is comprised of the PC pipe that has mixed titanium dioxide.

The present invention is luminous for realizing 360 degree, proportional according to the quadratic power of the semi-conductive caloric value of Joule's law LED and its rated current, is also Q=I with its working time and the proportional formula of resistance ²rT, wherein Q is that heat, I are that rated current, R are that resistance, T are the time.Because of luminous being fully used of LED wafer of the present invention, so can apply less real work electric current on LED wafer of the present invention, thereby the heat producing while making LED wafer luminous is with the reduction of quadratic power multiple, the final negligible luminous and heat that produces, the heat that reduces LED wafer is deteriorated, improves the life-span of LED wafer.In addition, while working due to LED wafer, caloric value seldom causes whole LED lamp body operating temperature decline, thereby the present invention can not need radiator; On the other hand, while working because of LED wafer, caloric value is low, and the fluorescent material also causing in light conductor causes the deteriorated minimizing of fluorescent material heat because its operating ambient temperature declines, can effectively improve the working life of fluorescent material.

Support plate of the present invention is light-passing board, and the light that can all utilize LED wafer to send improves the luminous utilization rate of LED wafer, realizes 360 degree optical illumination.

The present invention utilizes light spread powder by variable color again after each face institute luminous abundant diffusion evenly of LED wafer, can make LED lighting device all angles of the present invention bright dipping even.

The present invention is owing to being obtained by mixing allochroic light-conducting body with fluorescent material and optical material, and the production technology of this structure is simple, can reduce costs.

Accompanying drawing explanation

In order to be illustrated more clearly in the present invention or technical scheme of the prior art, will the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described below.Apparently, the accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skills, is not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing.

Fig. 1 is the structural representation of existing bullet cut LED luminescence unit;

Fig. 2 is LED luminescence unit structural representation of the present invention;

Fig. 3 is embodiment of the present invention structural representation;

Fig. 4 is light conductor half sectional view in Fig. 3;

Fig. 5 is another embodiment schematic diagram of the present invention.

The specific embodiment

Below, with reference to accompanying drawing, embodiments of the invention are described.

Below with reference to Fig. 2 and Fig. 3, embodiments of the invention are described.

First make LED luminescence unit 1, as shown in Figure 2.Use transparent glue 7 that LED wafer 2 is bonded in respectively on insulation board 4.Other position at insulation board 4 forms circuit board 8 by printed wiring technology, forms drive circuit (not shown) on circuit board 8, will between the electrode of LED wafer 2 and drive circuit, with the sealing wire 9 that metal wire forms, be electrically connected to.

As LED wafer 2, two electrodes of wafer shown in Fig. 2, in upper wafer surface, also can be established an electrode by wafer lower surface, and upper surface is established another electrode.

Insulation board 4 herein can be support plate again, as shown in Figure 3, for improving the irradiating angle that light utilization efficiency and increase LED illuminating lamp of LED wafer, support plate 5 can be transparent panel, as glass etc., LED wafer 2 is arranged on support plate 5, then connects into circuit with circuit 6, lamp body 13 as shown in Figure 3.On circuit 6, connect in addition the electrode of external power.

For making lighting device realize 360 degree illuminations, support plate of the present invention, insulation board will be all transparent material.Because the present invention can all utilize the luminous of LED wafer, therefore can need to apply less operating current to reduce the heating of LED wafer according to actual illumination intensity during the work of this lighting device, in the situation that the heating of LED wafer is lower, this device can not add radiator and can reach compared with long service live equally.

Allochroic light-conducting body 18 can obtain by following several modes.A: change light powder 11 is applied on optical material or is directly formed to allochroic light-conducting body as fluorescent material etc. mixes with silica type glue; B: in airtight transparent utensil, be filled with that inert gas and fluorescent material 11 synthesize primary mixture and transparent utensil becomes light conductor 18; C: after fluorescent material 11 is mixed with the colored varnish, direct spraying becomes the allochroic light-conducting body 18 that the modes such as light conductor 18 are processed into required form on optical material.Light conductor 18 is fixed on to LED lamp body 13 peripheries, as is fixed on the tail end of LED lamp body, or be fixed on other support of lighting device.

Because the luminous quantity of LED wafer 2 each faces is inconsistent, the one side of luminous quantity maximum accounts for 60% of total light yield, for making LED lighting device even in all angles bright dipping, need evenly and all apply light spread powder 16 at the nexine of light conductor, as shown in Figure 4, make the various colored lights that LED wafer 2 sends first after 16 diffusions evenly of light spread powder, become illuminator lamp light again through 11 variable colors of tenebrescent powder, meanwhile, LED wafer 2 spot lights have also become area source after light diffusion one by one.

Fig. 5 is another kind of embodiment, at the sheathed smooth anemostat 15 of LED lamp body 13 peripheries, as being Merlon at PC(polycarbonate) apply or inject light spread powder 16 as titanium dioxide etc. in pipe, certain light anemostat 15 also can be with reference to the acquisition pattern of listed above allochroic light-conducting body.Again allochroic light-conducting body 18 is set in to light anemostat 15 peripheries, equally also can reaches the object that light is first spread to variable color again.

Embodiments of the invention are not limited to above statement, and all have the embodiment of similar functions all within protection scope of the present invention with above-described embodiment.

Claims

1. a LED lighting device, shoots out the light from LED wafer, comprises a LED lamp body (13) and allochroic light-conducting body (18), it is characterized in that:

Described LED lamp body (13) comprises printing opacity bearing (5), LED wafer (2) and circuit (6), described LED wafer (2) and circuit (6) be arranged on printing opacity bearing (5) upper and with its electric insulation, described LED wafer (2) connects into circuit with circuit (6);

Described allochroic light-conducting body (18) is set in described LED lamp body (13) periphery, and described allochroic light-conducting body (18) contains and becomes light powder (11).

2. LED lighting device as claimed in claim 1, it is characterized in that, in described allochroic light-conducting body (18), also contain light spread powder (16), the described light shooting out from LED wafer (2) first becomes illumination light through becoming light powder (11) again after light spread powder (16) diffusion.

3. LED lighting device as claimed in claim 1, is characterized in that, between allochroic light-conducting body (18) and lamp body (13), has light anemostat (15), and described smooth anemostat (15) is set in LED lamp body (13) periphery.

4. LED lighting device as claimed in claim 3, is characterized in that, described smooth anemostat (15) is comprised of the PC pipe that has mixed titanium dioxide (16).