CN103706545A - UVLED curing assembly for backlight - Google Patents
UVLED curing assembly for backlight Download PDFInfo
- Publication number
- CN103706545A CN103706545A CN201310715588.4A CN201310715588A CN103706545A CN 103706545 A CN103706545 A CN 103706545A CN 201310715588 A CN201310715588 A CN 201310715588A CN 103706545 A CN103706545 A CN 103706545A
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- China
- Prior art keywords
- uvled
- light
- heat
- radiating substrate
- curing assembly
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- Pending
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- 238000004020 luminiscence type Methods 0.000 claims abstract description 27
- 239000000758 substrate Substances 0.000 claims abstract description 25
- 238000001816 cooling Methods 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- 229910000838 Al alloy Inorganic materials 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 238000004891 communication Methods 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 239000011159 matrix material Substances 0.000 claims description 2
- 238000001723 curing Methods 0.000 abstract description 16
- 238000003848 UV Light-Curing Methods 0.000 abstract description 5
- 230000017525 heat dissipation Effects 0.000 abstract 2
- 230000002093 peripheral effect Effects 0.000 abstract 2
- 230000008023 solidification Effects 0.000 abstract 1
- 238000007711 solidification Methods 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000009826 distribution Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000005457 optimization Methods 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000000622 irritating effect Effects 0.000 description 1
- 230000035800 maturation Effects 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000003911 water pollution Methods 0.000 description 1
Images
Landscapes
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The invention relates to the technical field of UV curing, in particular to a UVLED curing assembly for backlight. A UVLED solidification subassembly for being shaded, it includes a plurality of UVLED luminescence units, characterized by: it still includes: the UVLED light-emitting units are arranged on the front surface of the radiating substrate; the heat dissipation system is arranged on the back surface of the heat dissipation substrate; the reflecting cover forms a reflecting peripheral wall used for reflecting light of the UVLED light-emitting unit on the front face of the radiating substrate, a light-transmitting plate used for allowing the light of the UVLED light-emitting unit to penetrate is formed on the top of the reflecting peripheral wall, and a reflecting cup used for gathering the light emitted by the UVLED light-emitting unit is arranged at the corresponding position of each UVLED light-emitting unit of the light-transmitting plate. The device has simple structure and high curing efficiency.
Description
Technical field:
The present invention relates to UV curing technology field, relate in particular to a kind of UVLED of using curing assembly backlight.
Background technology:
Along with the generally application of LED and the day by day maturation of corresponding science and technology, UVLED, is different from the LED light source of traditional lighting and is widely applied in product processing, air cleaning, water pollution processing and the medical treatment of all trades and professions with its distinctive photochemistry and physical characteristic as a kind of new type light source.
Transformation due to conventional television industry backlight production model, the production cycle of product seems more and more important, and the production efficiency of the mode of production of employing UV cured lens and economic interests are apparently higher than traditional silicon resin, make to be accepted by increasing manufacturer by the mode of production of UV cured lens.
At present many using high-pressure sodium lamp or metal halide lamp as UV light source for the curing equipment of UV, but it has the shortcomings such as power excessive (KW rank), life-span shorter (800-1000 hour), radiation flux are not concentrated, internal heat is larger, and in spectrum, there is infrared composition to make product surface temperature rise larger, to having relatively high expectations of curing apparatus.
And traditional UV curing apparatus can not meet the integration demand to UVLED light source module, provide novel UV curing assembly to meet the demand of equipment and product, seem particularly important.
Summary of the invention:
The object of the present invention is to provide a kind of UVLED of using curing assembly backlight, it is simple in structure, curing efficiency is high.
A kind of technical scheme with UVLED curing assembly backlight of the present invention is achieved in that
The UVLED curing assembly of using backlight, it comprises some UVLED luminescence units, it is characterized in that: it also comprises:
One heat-radiating substrate, described some UVLED luminescence units are located at heat-radiating substrate front;
One cooling system, is located at the heat-radiating substrate back side;
One reflector, reflection covers in the positive formation one of heat-radiating substrate for reflecting the reflective perisporium of UVLED luminescence unit light, reflection covers in reflective perisporium top and forms a light-passing board seeing through for UVLED luminescence unit light, and described light-passing board is provided with one for converging the irradiant reflector of UVLED luminescence unit in each UVLED luminescence unit relevant position.
All UVLED luminescence units described above are matrix and arrange.
UVLED luminescence unit described above is comprised of a UVLED light source or a plurality of UVLED light source.
UVLED light source described above is spot light, line source, area source, and described UVLED luminescence unit comprises a spot light or line source or an area source or its combination.
Cooling system described above comprises the ventilating system of being located at the heat-radiating substrate back side, and described ventilating system comprises at least one air inlet and at least one air outlet, forms an air communication channel that runs through the heat-radiating substrate back side between each air inlet and its corresponding air outlet.
Cooling system described above also comprises the water cooling plant that corresponding ventilating system arranges, and water cooling plant is for dispelling the heat to the air of ventilating system and/or heat-radiating substrate.
The material of the reflective perisporium of reflection shield described above is aluminum or aluminum alloy.
The material of light-passing board described above is quartz glass.
Of the present invention a kind of backlight with UVLED curing assembly compared with prior art tool have the following advantages:
1. the present invention adopts UVLED light source to coordinate the focus type lampshade with reflector to substitute traditional UV curing assembly, can effectively reduce the rising angle of light source, solve UV fluorescent tube emittance and do not concentrate, the excessive curing inequality causing to product of heat and the too high problem of product surface temperature rise;
2. bronze drum reduces the rising angle of light source, has effectively promoted to print to hold the emittance in thing unit are, makes products solidifying speed sooner, more completely, reliably;
3. reflector can adjust locus according to the size of UVLED luminescence unit and arrangement mode, uses flexibly, applied widely;
4. air communication channel can be taken away the irritative gas producing in curing assembly in time, prevents operator ' s health to cause damage, safe;
5. cooling by adopting water-cooled and the air-cooled mode combining to carry out heat-radiating substrate, improved cooling effectiveness, meanwhile, guarantee that UVLED light source works under the environment temperature adapting to, extended the service life of light source.
Accompanying drawing explanation:
Below in conjunction with accompanying drawing, the present invention is described in detail:
Fig. 1 is a kind of structural representation with UVLED curing assembly backlight of the present invention;
Fig. 2 is a kind of UVLED distribution of light sources schematic diagram with UVLED curing assembly backlight of the present invention.
The specific embodiment:
As shown in Figure 1, a kind of UVLED curing assembly of using backlight, it comprises some UVLED luminescence units, it also comprises:
One heat-radiating substrate 1, described some UVLED luminescence units are located at heat-radiating substrate 1 front;
One cooling system 2, is located at heat-radiating substrate 1 back side;
One reflector 3, reflector 3 forms one for reflecting the reflective perisporium 31 of UVLED luminescence unit light in heat-radiating substrate 1 is positive, reflection covers in reflective perisporium 31 tops and forms a light-passing board 32 seeing through for UVLED luminescence unit light, and described light-passing board 32 is provided with one for converging the irradiant reflector 33 of UVLED luminescence unit in each UVLED luminescence unit relevant position.
As shown in Figure 2, described UVLED luminescence unit is comprised of and rectangular array arrangement a UVLED light source 4.Described UVLED light source 4 is spot light or area source.
Described cooling system 2 comprises the ventilating system 21 of being located at heat-radiating substrate 1 back side, and described ventilating system 21 comprises an air inlet 211 and an air outlet 212, forms an air communication channel 213 that runs through heat-radiating substrate 1 back side between air inlet 211 and air outlet 212.
Described cooling system 2 also comprises the water cooling plant 22 that corresponding ventilating system arranges, and water cooling plant is for dispelling the heat to the air of ventilating system 21 and heat-radiating substrate 1.
The material of the reflective perisporium 31 of described reflection shield 3 is aluminum or aluminum alloy.
The material of described light-passing board 32 is quartz glass.
Above content is in conjunction with specific embodiments to further description of the present invention, can not regard as specific embodiment and be confined to these explanations.As: as described in reflective perisporium be not limited only to be made by aluminum or aluminum alloy, described light-passing board is not limited only to quartz glass, described UVLED distribution of light sources is not limited only to the disclosed distribution mode of the present embodiment, also can comprise circular array, rhombus array etc.For those skilled in the art; without departing from the inventive concept of the premise; the specific embodiment of the present invention is not limited to above-mentioned example; in specific embodiment of the invention process; the specific embodiment can also be made some deductions or optimization, and these deductions or optimization all should be considered as belonging to protection scope of the present invention.
Claims (8)
1. the UVLED curing assembly of using backlight, it comprises some UVLED luminescence units, it is characterized in that: it also comprises:
One heat-radiating substrate, described some UVLED luminescence units are located at heat-radiating substrate front;
One cooling system, is located at the heat-radiating substrate back side;
One reflector, reflection covers in the positive formation one of heat-radiating substrate for reflecting the reflective perisporium of UVLED luminescence unit light, reflection covers in reflective perisporium top and forms a light-passing board seeing through for UVLED luminescence unit light, and described light-passing board is provided with one for converging the irradiant reflector of UVLED luminescence unit in each UVLED luminescence unit relevant position.
2. a kind of UVLED curing assembly of using backlight according to claim 1, is characterized in that: described all UVLED luminescence units are matrix and arrange.
3. a kind of UVLED curing assembly of using backlight according to claim 2, is characterized in that: described UVLED luminescence unit is comprised of a UVLED light source or a plurality of UVLED light source.
4. a kind of UVLED curing assembly of using backlight according to claim 3, it is characterized in that: described UVLED light source is spot light, line source, area source, described UVLED luminescence unit comprises a spot light or line source or an area source or its combination.
5. according to the UVLED curing assembly of using a kind of backlight one of claims 1 to 3 Suo Shu, it is characterized in that: described cooling system comprises the ventilating system of being located at the heat-radiating substrate back side, described ventilating system comprises at least one air inlet and at least one air outlet, forms an air communication channel that runs through the heat-radiating substrate back side between each air inlet and its corresponding air outlet.
6. a kind of UVLED curing assembly of using backlight according to claim 5, is characterized in that: described cooling system also comprises the water cooling plant that corresponding ventilating system arranges, and water cooling plant is for dispelling the heat to the air of ventilating system and/or heat-radiating substrate.
7. a kind of UVLED curing assembly of using backlight according to claim 6, is characterized in that: the material of the reflective perisporium of described reflection shield is aluminum or aluminum alloy.
8. a kind of UVLED curing assembly of using backlight according to claim 6, is characterized in that: the material of described light-passing board is quartz glass.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310715588.4A CN103706545A (en) | 2013-12-23 | 2013-12-23 | UVLED curing assembly for backlight |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310715588.4A CN103706545A (en) | 2013-12-23 | 2013-12-23 | UVLED curing assembly for backlight |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103706545A true CN103706545A (en) | 2014-04-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310715588.4A Pending CN103706545A (en) | 2013-12-23 | 2013-12-23 | UVLED curing assembly for backlight |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103706545A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103994357A (en) * | 2014-06-06 | 2014-08-20 | 兰卫国 | Ultra-violet LED face light source for PCB exposure machine |
| CN105398203A (en) * | 2015-12-15 | 2016-03-16 | 保定市特种光源电器厂 | LED curing lamp box for UV printing |
| WO2021233140A1 (en) * | 2020-05-21 | 2021-11-25 | 长鑫存储技术有限公司 | Film layer curing device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101021304A (en) * | 2006-02-16 | 2007-08-22 | 江昆渊 | High-power light-emitting diode lamp |
| CN202501224U (en) * | 2011-12-30 | 2012-10-24 | 深圳市润天智数字设备股份有限公司 | Ultraviolet light emitting diode (UV LED) light source |
-
2013
- 2013-12-23 CN CN201310715588.4A patent/CN103706545A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101021304A (en) * | 2006-02-16 | 2007-08-22 | 江昆渊 | High-power light-emitting diode lamp |
| CN202501224U (en) * | 2011-12-30 | 2012-10-24 | 深圳市润天智数字设备股份有限公司 | Ultraviolet light emitting diode (UV LED) light source |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103994357A (en) * | 2014-06-06 | 2014-08-20 | 兰卫国 | Ultra-violet LED face light source for PCB exposure machine |
| CN103994357B (en) * | 2014-06-06 | 2016-06-08 | 兰卫国 | PCB exposure machine ultraviolet LED area light source |
| CN105398203A (en) * | 2015-12-15 | 2016-03-16 | 保定市特种光源电器厂 | LED curing lamp box for UV printing |
| WO2021233140A1 (en) * | 2020-05-21 | 2021-11-25 | 长鑫存储技术有限公司 | Film layer curing device |
| CN113695204A (en) * | 2020-05-21 | 2021-11-26 | 长鑫存储技术有限公司 | Film layer curing device |
| CN113695204B (en) * | 2020-05-21 | 2022-10-18 | 长鑫存储技术有限公司 | Film layer curing device |
| US12006573B2 (en) | 2020-05-21 | 2024-06-11 | Changxin Memory Technologies, Inc. | Film layer curing apparatus |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140409 |