CN103687304A - Manufacturing method of optical printing circuit board with MT inserting core - Google Patents
Manufacturing method of optical printing circuit board with MT inserting core Download PDFInfo
- Publication number
- CN103687304A CN103687304A CN201310708758.6A CN201310708758A CN103687304A CN 103687304 A CN103687304 A CN 103687304A CN 201310708758 A CN201310708758 A CN 201310708758A CN 103687304 A CN103687304 A CN 103687304A
- Authority
- CN
- China
- Prior art keywords
- lock pin
- circuit board
- sheet material
- printed circuit
- manufacture method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Optical Couplings Of Light Guides (AREA)
- Optical Integrated Circuits (AREA)
Abstract
The invention discloses a manufacturing method of an optical printing circuit board with an MT inserting core. The manufacturing method of the optical printing circuit board with the MT inserting core comprises the following steps of hole drilling, filling of smooth materials, groove forming, plate pressing and cover opening. The standard MT inserting core is integrated on the optical printing circuit board, the conversion efficiency between light and electricity on the optical printing circuit board is improved, the work procedures for producing externally added optical coupling assemblies are reduced, and large-scale production is facilitated.
Description
Technical field
The present invention relates to circuit board fabrication field, relate in particular to a kind of manufacture method of optical printed circuit board of the MT of being equipped with lock pin.
Background technology
Along with following calculator system more and more needs higher transmission requirement, optical printed circuit board can provide data rate more than 10Gb/s, but it is not enough only having optical printed circuit board, periphery supporting as laser, optical sensor and optical coupling assembly etc. all needs to integrate with its advantage that competence exertion goes out optical printed circuit board.
Summary of the invention
The manufacture method that the object of this invention is to provide a kind of optical printed circuit board of the MT of being equipped with lock pin, need not additional optical coupling assembly, only the MT lock pin of standard need to be incorporated on optical printed circuit board, just improved the conversion efficiency between optical printed circuit board glazing and electricity, reduce the operation of producing additional optical coupling assembly simultaneously, be convenient to large-scale production.
To this, the invention provides a kind of manufacture method of optical printed circuit board of the MT of being equipped with lock pin, comprise the steps:
S1, perforate: on the first sheet material and the second sheet material, output respectively two the first holes, these two first holes horizontally set on the first sheet material and the second sheet material;
S2, insert smooth material: in the first hole, insert smooth material, then in this smooth material, output the second hole;
S3, fluting: in described the first sheet material lower surface, open a link slot that is connected described two the first holes with the second sheet material upper face, then the fibre ribbon that connects MT lock pin is put into link slot, the degree of depth of described link slot is 0.175mm;
S4, pressing plate: place in order from top to bottom copper clad laminate, prepreg, the first sheet material, prepreg, the second sheet material, prepreg and copper clad laminate, by HTHP pressing; And,
S5, uncap: the bottom surface copper clad laminate of the first sheet material and the corresponding MT lock pin of the second sheet material is cut away, the smooth material of the inside is taken away.
After pressing plate, the fusing of prepreg between the first sheet material bottom and the second sheet material top, solidify, and fibre ribbon is bonded together, fibre ribbon fixed, thereby formed photosphere.The copper clad laminate protection MT lock pin of the first sheet material top and the second sheet material bottom exempts from subsequent handling as the damage of boring, circuit etching.
After uncapping and the smooth material of the inside being taken away, because MT lock pin directly exposes, can directly externally connect like this, thereby increase light source coupling and receiving efficiency between optical printed circuit board and laser and optical sensor, reduce the operation of producing additional optical coupling assembly simultaneously, be convenient to large-scale production.In addition, the technical program can be chosen corresponding MT lock pin and manufacture for different optical printed circuit board application requirements, thereby increases the application of optical printed circuit board.
Further, the first sheet material can be single sheet material or multilayer composite board; The second sheet material can be single sheet material or multilayer composite board.
Further, described smooth material be in Teflon, dimethyl silicone polymer and polymethyl methacrylate any one.
Further, link slot connects the second hole, and link slot extends on Teflon, is convenient to place fibre ribbon.
Further, in step S4, the temperature of pressing plate is 201 ℃, and pressure is 351psi.Under high temperature and high pressure environment, prepreg fusing, the first sheet material, the second sheet material and prepreg are formed an integral body.
Further, the first hole is identical with the Teflon size of inserting, and makes Teflon fill up the first hole.
Further, MT lock pin is placed in the second hole, and it is large that the second boring ratio MT lock pin is wanted.
Further, the degree of depth summation of two link slots is identical with the thickness of fibre ribbon, and the width of link slot is identical with the width of fibre ribbon, is convenient to fixed fiber band.
Further, in step S5, the copper clad laminate of the first top, hole and bottom is outputed the hole identical with the Teflon size of inserting, and is convenient to MT lock pin all to expose.
Beneficial effect: the MT lock pin of standard is incorporated on optical printed circuit board, has improved the conversion efficiency between optical printed circuit board glazing and electricity, reduced the operation of producing additional optical coupling assembly simultaneously, be convenient to large-scale production.
Accompanying drawing explanation
Fig. 1 is the plane graph of the first sheet material in an embodiment of the present invention.
Fig. 2 is the plane graph of the second sheet material in the another kind of embodiment of the present invention.
Fig. 3 is the plane graph in the first hole in another kind of embodiment.
Fig. 4 is the plane graph of the second sheet material in the another kind of embodiment of the present invention.
Fig. 5 is the plane graph of the second sheet material in the another kind of embodiment of the present invention.
Fig. 6 is the plane graph of the second sheet material in the another kind of embodiment of the present invention.
Fig. 7 be in the another kind of embodiment of the present invention, uncap and the smooth material of the inside is taken away after plane graph.
Mark in figure: 1-the first sheet material; 2-the second sheet material; 3-the first hole; 4-the second hole; 5-link slot; 6-MT lock pin.
Embodiment
Below in conjunction with accompanying drawing, preferably embodiment of the present invention is described in further detail:
Referring to Fig. 1 to 5, a kind of manufacture method that the optical printed circuit board of MT lock pin 6 is housed, comprises the steps:
S1, perforate: on the first sheet material 1 and the second sheet material 2, output two the first holes 3, these two the first holes 3 are all rectangle, horizontally set on the first sheet material 1 and the second sheet material 2;
S2, insert smooth material: in the first hole 3, insert smooth material, then in this smooth material, output the second hole 4;
S3, fluting: in described the first sheet material 1 lower surface and the second sheet material 2 upper faces, open a link slot 5 that connects described two the first holes 3, then the fibre ribbon that connects MT lock pin 6 is put into link slot 5, the degree of depth of described link slot 5 is 0.175mm;
S4, pressing plate: place in order from top to bottom copper clad laminate, prepreg, the first sheet material 1, prepreg, the second sheet material 2, prepreg and copper clad laminate, by HTHP pressing; And,
S5, uncap: the bottom surface copper clad laminate of the first sheet material 1 and the corresponding MT lock pin 6 of the second sheet material 2 is cut away, the smooth material of the inside is taken away.
After pressing plate, the prepreg fusing in the middle of the first sheet material 1 and the second sheet material 2, solidify, and fibre ribbon is bonded together, fibre ribbon fixed, thereby formed photosphere.The copper clad laminate protection MT lock pin 6 of the first sheet material 1 top and the second plate 2 bottoms exempts from subsequent handling as the damage of plating, circuit etching.
After uncapping and the smooth material of the inside being taken away, because MT lock pin 6 directly exposes, can directly externally connect like this, thereby increase light source coupling and receiving efficiency between optical printed circuit board and laser and optical sensor, reduce the operation of producing additional optical coupling assembly simultaneously, be convenient to large-scale production.In addition, the present embodiment can be chosen corresponding MT lock pin 6 and manufacture for different optical printed circuit board application requirements, thereby increases the application of optical printed circuit board.
Further, the first sheet material 1 is single sheet material, and the second sheet material 2 is single sheet material.
Preferably, the first sheet material 1 is multilayer composite board, and the second sheet material 2 is multilayer composite board.
Preferably, the first sheet material 1 is single sheet material, and the second sheet material 2 is multilayer composite board.
Preferably, the first sheet material 1 is multilayer composite board, and the second sheet material 2 is single sheet material.
Preferably, described smooth material is Teflon.
Preferably, described smooth material is dimethyl silicone polymer.
Preferably, described smooth material is polymethyl methacrylate.
Referring to Fig. 3, link slot 5 connects the second hole 4, and link slot 5 extends on Teflon, is convenient to place fibre ribbon.
Preferably, in step S4, the temperature of pressing plate is 201 ℃, and pressure is 351psi.Under high temperature and high pressure environment, prepreg fusing, the first sheet material 1, the second sheet material 2 and prepreg are formed an integral body.
Referring to Fig. 3 to 6, the first hole 3 is identical with the Teflon size of inserting, and makes Teflon fill up the first hole 3.
Referring to Fig. 6, MT lock pin 6 is placed in the second hole 4, and the second hole 4 is larger than MT lock pin 6.
Referring to Fig. 5 to 6, the degree of depth summation of two link slots 5 is identical with the thickness of fibre ribbon, and the width of link slot 5 is identical with the width of fibre ribbon, is convenient to fixed fiber band.
Referring to Fig. 7, in step S5, the copper clad laminate of 4 tops, the second hole and bottom is outputed the hole identical with the Teflon size of inserting, and is convenient to MT lock pin 6 all to expose.
The MT lock pin 6 of standard is incorporated on optical printed circuit board, has improved the conversion efficiency between optical printed circuit board glazing and electricity, reduced the operation of producing additional optical coupling assembly simultaneously, be convenient to large-scale production.
Above content is in conjunction with concrete preferred implementation further description made for the present invention, can not assert that specific embodiment of the invention is confined to these explanations.For general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, can also make some simple deduction or replace, all should be considered as belonging to protection scope of the present invention.
Claims (10)
1. the manufacture method that the optical printed circuit board of MT lock pin is housed, is characterized in that, comprises the steps:
S1, perforate: on the first sheet material and the second sheet material, output respectively two the first holes;
S2, insert smooth material: in the first hole, insert smooth material, then in this smooth material, output the second hole;
S3, fluting: at described the first plate surface and the second plate surface, open a link slot that is connected described two the first holes, then the fibre ribbon that connects MT lock pin is put into link slot, the degree of depth of described link slot is 0.175mm;
S4, pressing plate: place in order from top to bottom copper clad laminate, prepreg, the first sheet material, prepreg, the second sheet material, prepreg and copper clad laminate, by HTHP pressing; And,
S5, uncap: the bottom surface copper clad laminate of the first sheet material and the corresponding MT lock pin of the second sheet material is cut away, the smooth material of the inside is taken away.
2. the manufacture method that the optical printed circuit board of MT lock pin is housed according to claim 1, is characterized in that: the first sheet material can be single sheet material or multilayer composite board; The second sheet material can be single sheet material or multilayer composite board.
3. the manufacture method that the optical printed circuit board of MT lock pin is housed according to claim 2, is characterized in that: described smooth material be in Teflon, dimethyl silicone polymer and polymethyl methacrylate any one.
4. the manufacture method that the optical printed circuit board of MT lock pin is housed according to claim 3, is characterized in that: link slot connects the second hole.
5. the manufacture method that the optical printed circuit board of MT lock pin is housed according to claim 3, is characterized in that: in step S4, the temperature of pressing plate is 201 ℃, and pressure is 351psi.
6. the manufacture method that the optical printed circuit board of MT lock pin is housed according to claim 2, is characterized in that: the first hole of outputing is identical with the smooth material size of inserting.
7. the manufacture method that the optical printed circuit board of MT lock pin is housed according to claim 6, is characterized in that: the second boring ratio MT lock pin wants large.
8. the manufacture method that the optical printed circuit board of MT lock pin is housed according to claim 7, is characterized in that: the degree of depth summation of two link slots is identical with the thickness of fibre ribbon, and the width of link slot is identical with the width of fibre ribbon.
9. the manufacture method that the optical printed circuit board of MT lock pin is housed according to claim 7, is characterized in that: MT lock pin is placed in the second hole.
10. the manufacture method that the optical printed circuit board of MT lock pin is housed according to claim 3, is characterized in that: in step S5, the copper clad laminate of the first top, hole and bottom is outputed the hole identical with the Teflon size of inserting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310708758.6A CN103687304B (en) | 2013-12-20 | A kind of manufacture method of the optical printed circuit board equipped with MT lock pin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310708758.6A CN103687304B (en) | 2013-12-20 | A kind of manufacture method of the optical printed circuit board equipped with MT lock pin |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103687304A true CN103687304A (en) | 2014-03-26 |
| CN103687304B CN103687304B (en) | 2016-11-30 |
Family
ID=
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115767886A (en) * | 2022-11-03 | 2023-03-07 | 深圳市金百泽科技有限公司 | Printed circuit board with built-in optical fiber and processing method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1471648A (en) * | 2000-10-31 | 2004-01-28 | ���Ǽ��Ź�˾ | Fiber optic circuit board connector |
| US20050063638A1 (en) * | 2003-09-24 | 2005-03-24 | Alger William O. | Optical fibers embedded in a printed circuit board |
| CN102928936A (en) * | 2012-11-12 | 2013-02-13 | 依利安达(广州)电子有限公司 | Manufacture method of optical printed wiring board |
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1471648A (en) * | 2000-10-31 | 2004-01-28 | ���Ǽ��Ź�˾ | Fiber optic circuit board connector |
| US20050063638A1 (en) * | 2003-09-24 | 2005-03-24 | Alger William O. | Optical fibers embedded in a printed circuit board |
| CN102928936A (en) * | 2012-11-12 | 2013-02-13 | 依利安达(广州)电子有限公司 | Manufacture method of optical printed wiring board |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115767886A (en) * | 2022-11-03 | 2023-03-07 | 深圳市金百泽科技有限公司 | Printed circuit board with built-in optical fiber and processing method thereof |
| CN115767886B (en) * | 2022-11-03 | 2024-04-30 | 深圳市造物工场科技有限公司 | Printed circuit board with built-in optical fibers and processing method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9054024B2 (en) | Apparatus and method for optical communications | |
| CN103517563B (en) | Flexibility printed circuit board reinforcement steel disc method of attaching | |
| EP1786042A4 (en) | Light-emitting module and light-emitting system | |
| CN106476393B (en) | The production method of conductive graphite piece | |
| CN104995906A (en) | Method for producing camera module | |
| JP2013186310A5 (en) | ||
| CN103648235B (en) | A kind of preparation method of aluminum base circuit board | |
| CN102928936B (en) | Manufacture method of optical printed wiring board | |
| CN103857177A (en) | Transparent circuit board, and transparent circuit board module and manufacturing method thereof | |
| CN105269877A (en) | Composite plate structure and manufacturing method thereof | |
| CN202231298U (en) | Miniature fiber amplifier | |
| CN103687304A (en) | Manufacturing method of optical printing circuit board with MT inserting core | |
| CN103687304B (en) | A kind of manufacture method of the optical printed circuit board equipped with MT lock pin | |
| CN203675444U (en) | Optical printed circuit board with MT insertion cores | |
| CN104048272A (en) | Sticking structure and sticking method | |
| CN203037900U (en) | Optical module | |
| CN201976339U (en) | High-density laminated printed circuit board and explosion-proof structure thereof | |
| CN203204196U (en) | Coarse wavelength division multiplexer/demultiplexer based on planar optical waveguide | |
| CN202998642U (en) | Multilayer printed circuit board | |
| CN203313521U (en) | Flexible circuit connector | |
| CN106385768B (en) | A kind of transparent medium wiring board and its manufacturing method | |
| CN103257412B (en) | A kind of Single-module double-layer parallel optical fiber array | |
| CN202013827U (en) | Keyboard structure | |
| CN106550533B (en) | A kind of MEMS microphone printed circuit board and its processing method | |
| CN207274040U (en) | LED television backlight covers copper aluminum substrate with high pressure resistant high heat conduction |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161130 Termination date: 20191220 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |