CN103682897A - Double-layer card seat - Google Patents

Double-layer card seat Download PDF

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Publication number
CN103682897A
CN103682897A CN201310640079.XA CN201310640079A CN103682897A CN 103682897 A CN103682897 A CN 103682897A CN 201310640079 A CN201310640079 A CN 201310640079A CN 103682897 A CN103682897 A CN 103682897A
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CN
China
Prior art keywords
card slot
sim card
deck
double
little
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Granted
Application number
CN201310640079.XA
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Chinese (zh)
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CN103682897B (en
Inventor
王玉田
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DONGTAI RUNTIAN PRECISION TECHNOLOGY Co.,Ltd.
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KUNSHAN AOHONG ELECTRONIC SCIENCE & TECHNOLOGY Co Ltd
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Priority to CN201310640079.XA priority Critical patent/CN103682897B/en
Publication of CN103682897A publication Critical patent/CN103682897A/en
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Publication of CN103682897B publication Critical patent/CN103682897B/en
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Abstract

The invention discloses a double-layer card seat which comprises a card seat base. A hollow portion is defined by a base plate and a shell in the card seat base; a sunken zone, a first protruded zone and a second protruded zone which are sequentially connected with one another are arranged on the side, which faces the shell, of the base plate; a TF (trans-flash) card contact plate is arranged in the sunken zone, a first TF card slot and a second TF card slot are respectively formed in the left side and the right side of the sunken zone; standard SIM (subscriber identity module) card contact plates are arranged in the first protruded zone, a first standard SIM card slot is formed in the right side of the first protruded zone, and a second standard SIM card slot is further formed in the left side of the sunken zone and is positioned above the first TF card slot; small SIM card contact plates are arranged in the second protruded zone, and a first small SIM card slot and a second small SIM card slot are respectively formed in the left side and the right side of the second protruded zone. The double-layer card seat has the advantages that the double-layer card seat is thin, internal circuit arrangement of a mobile phone can be utilized, and the double-layer card seat is favorable for miniaturizing and thinning the mobile phone.

Description

A kind of double-deck deck
 
Technical field
The present invention relates to a kind of mobile phone card seat, relate in particular to a kind of double-deck deck.
?
Background technology
Along with the continuous progress of science, the development of communication tool, the structure of mobile phone, pattern and performance are more aobvious also day by day frequent, and people are also more and more higher to the requirement of mobile phone.The application of general mobile phone, mostly by SIM(subscriber identification module) block and insert in the set draw-in groove of mobile phone, and complete after the program of reinstating, can use mobile phone to receive, call.Existing mobile phone, much has the function of double-card dual-standby or perhaps dual-network and dual-standby, in a mobile phone card seat, two SIM card is housed, and in addition, in existing mobile phone card seat, also TF card can be installed.And in existing mobile phone card seat, a plurality of SIM card and TF card are all arranged side by side in the same way, such design is larger for the restriction ratio of the circuit layout of interior of mobile phone, can not make full use of mobile phone space, also make the integral thickness of mobile phone card seat increase, for the miniaturization of mobile phone, lightening unfavorable.
 
Summary of the invention
The technical problem to be solved in the present invention is, large for mobile phone card seat thickness in prior art, large and be unfavorable for the above-mentioned defects such as miniaturization of mobile phone to the restriction ratio of the circuit layout of interior of mobile phone, provide that a kind of thickness is little, the circuit layout that is beneficial to interior of mobile phone and contribute to realize the miniaturization of mobile phone and lightening double-deck deck.
The technical solution adopted for the present invention to solve the technical problems is: a kind of double-deck deck, comprise deck matrix, and deck matrix comprises substrate and shell, and substrate and shell limit for holding the hollow bulb of standard SIM card, little SIM card and TF card; Substrate is provided with connected successively depressed area, the first convex area and the second convex area in the side towards shell;
In depressed area, be provided with TF clamping contact, the left and right sides of depressed area is respectively equipped with a TF card slot and the 2nd TF card slot;
In the first convex area, be provided with standard SIM clamping contact, the first right side, convex area is provided with the first standard SIM card slot, and is also provided with the second standard SIM card slot on the left of depressed area, and the second standard SIM card slot is positioned at the top position of a TF card slot;
In the second convex area, be provided with little SIM card contact chip, and the left and right sides of the second convex area is respectively equipped with the first little SIM card slot and the second little SIM card slot.
In technical scheme of the present invention, this bilayer deck comprises deck matrix, and in deck matrix, substrate is provided with connected successively depressed area, the first convex area and the second convex area in the side towards shell.Wherein, in depressed area, be provided with TF clamping contact, and the left and right sides of depressed area is respectively equipped with a TF card slot and the 2nd TF card slot, in the first convex area, be provided with standard SIM clamping contact, the first right side, convex area is provided with the first standard SIM card slot, and is also provided with the second standard SIM card slot on the left of depressed area, and the second standard SIM card slot is positioned at the top position of a TF card slot, in the second convex area, be provided with little SIM card contact chip, and the left and right sides of the second convex area is respectively equipped with the first little SIM card slot and the second little SIM card slot, on substrate, hollow out a part, make this mobile phone card seat become double-deck deck, installation code SIM card and little SIM card successively in upper sheaf space, TF card is set in lower layer space, and TF is positioned in the below of standard SIM card, such design that hence one can see that not only makes can hold standard SIM card in this mobile phone card seat simultaneously, little SIM card and TF card, but also can not increase the thickness of described mobile phone card seat, utilize the circuit layout of interior of mobile phone, and also contribute to realize the miniaturization of mobile phone and lightening.
As a kind of improvement to technical scheme of the present invention, the cup depth h of depressed area is 0.8mm.
As a kind of improvement to technical scheme of the present invention, the height of projection H of the first convex area and the second convex area is 1.8mm.
In technical scheme of the present invention, the cup depth h of depressed area is set to 0.8mm, the height of projection H of the first convex area and the second convex area is set to 1.8mm, when such design can guarantee mobile phone card seat to become double-deck deck, also can not increase the thickness of this mobile phone card seat.
As a kind of improvement to technical scheme of the present invention, the top of TF clamping contact upper terminal is circular-arc.The tip designs of TF clamping contact upper terminal is become to circular-arc, and the pcb board and the interlock circuit that are conducive to like this separately establishing are protected, thereby can avoid traditional most advanced and sophisticated terminal to damage pcb board and circuit.
As a kind of improvement to technical scheme of the present invention, the top of standard SIM clamping contact upper terminal is circular-arc.In like manner, the tip designs of standard SIM clamping contact upper terminal is become to circular-arc, the pcb board and the interlock circuit that are conducive to like this separately establishing are protected, thereby can avoid traditional most advanced and sophisticated terminal to damage pcb board and circuit.
As a kind of improvement to technical scheme of the present invention, the top of little SIM card contact chip upper terminal is circular-arc.In like manner, the tip designs of little SIM card contact chip upper terminal is become to circular-arc, the pcb board and the interlock circuit that are conducive to like this separately establishing are protected, thereby can avoid traditional most advanced and sophisticated terminal to damage pcb board and circuit.
As a kind of improvement to technical scheme of the present invention, the distance between a TF card slot and the 2nd TF card slot is 11.20mm.
As a kind of improvement to technical scheme of the present invention, the distance between the first standard SIM card slot and the second standard SIM card slot is 25.20mm.
As a kind of improvement to technical scheme of the present invention, the distance between the first little SIM card slot and the second little SIM card slot is 12.20mm.
In technical scheme of the present invention, in substrate left side, be also provided with flange, the design of flange can be so that plug-in card be more smooth and easy.
In addition, in the technical scheme of the present invention, all being not specifically noted, all can be by adopting the conventional means in this area realize the technical program.
Therefore, the invention provides a kind of double-deck deck, the thickness of this bilayer deck is little, utilizes the circuit layout of interior of mobile phone, and also contributes to realize the miniaturization of mobile phone and lightening.
 
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the invention will be further described, in accompanying drawing:
Fig. 1 is the structural representation of the double-deck deck of the present invention;
Fig. 2 is the left view of Fig. 1;
Fig. 3 is the upward view of Fig. 1;
Fig. 4 is the partial enlarged drawing at A place in Fig. 3;
Fig. 5 is the structural representation of substrate;
Now that the label declaration in accompanying drawing is as follows: 1 is substrate, 2 is shell, and 3 is depressed area, 4 is the first convex area, and 5 is the second convex area, and 6 is TF clamping contact, 7 is a TF card slot, and 8 is the 2nd TF card slot, and 9 is standard SIM clamping contact, 10 is the first standard SIM card slot, and 11 is the second standard SIM card slot, and 12 is little SIM card contact chip, 13 is the first little SIM card slot, 14 is the second little SIM card slot, and 15 is tin pin, and 16 is flange.
 
Embodiment
In order to make object of the present invention, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein, only in order to explain the present invention, is not intended to limit the present invention.
In preferred embodiment of the present invention, a kind of double-deck deck, as shown in Figure 1, comprises deck matrix, and deck matrix comprises substrate 1 and shell 2, and substrate 1 and shell 2 limit for holding the hollow bulb of standard SIM card, little SIM card and TF card; Again as shown in Figure 5, substrate 1 is provided with connected successively depressed area 3, the first convex area 4 and the second convex area 5 in the side towards shell 2; In depressed area 3, be provided with TF clamping contact 6, the left and right sides of depressed area 3 is respectively equipped with a TF card slot 7 and the 2nd TF card slot 8; In the first convex area 4, be provided with standard SIM clamping contact 9, the first 4 right sides, convex area is provided with the first standard SIM card slot 10, and 3 left sides, depressed area are also provided with the second standard SIM card slot 11, and the second standard SIM card slot 11 is positioned at the top position of a TF card slot 7; In the second convex area 5, be provided with little SIM card contact chip 12, and the left and right sides of the second convex area 5 is respectively equipped with the first little SIM card slot 13 and the second little SIM card slot 14.
In the present embodiment, as shown in Figure 3 and Figure 4, the cup depth h of depressed area 3 is 0.8mm, and again as shown in Figure 2, the height of projection H of the first convex area 4 and the second convex area 5 is 1.8mm; And the distance between a TF card slot 7 and the 2nd TF card slot 8 is 11.20mm; Distance between the first standard SIM card slot 10 and the second standard SIM card slot 11 is 25.20mm; Distance between the first little SIM card slot 13 and the second little SIM card slot 14 is 12.20mm.
In addition, in the present embodiment, the top of TF clamping contact 6, standard SIM clamping contact 9 and little SIM card contact chip 12 upper terminals is circular-arc.At substrate 1 two ends, left and right, be equipped with a plurality of tin pin 15, and substrate 1 left side is also provided with flange 16.
Should be understood that, for those of ordinary skills, can be improved according to the above description or convert, and all these improvement and conversion all should belong to the protection range of claims of the present invention.

Claims (9)

1. a double-deck deck, is characterized in that, comprises deck matrix, and described deck matrix comprises substrate (1) and shell (2), and described substrate (1) and shell (2) limit for holding the hollow bulb of standard SIM card, little SIM card and TF card; Described substrate (1) is provided with connected successively depressed area (3), the first convex area (4) and the second convex area (5) in the side towards shell (2);
In described depressed area (3), be provided with TF clamping contact (6), the left and right sides of described depressed area (3) is respectively equipped with a TF card slot (7) and the 2nd TF card slot (8);
In described the first convex area (4), be provided with standard SIM clamping contact (9), right side, described the first convex area (4) is provided with the first standard SIM card slot (10), and described depressed area (3) left side is also provided with the second standard SIM card slot (11), and described the second standard SIM card slot (11) is positioned at the top position of a described TF card slot (7);
In described the second convex area (5), be provided with little SIM card contact chip (12), and the left and right sides of described the second convex area (5) is respectively equipped with the first little SIM card slot (13) and the second little SIM card slot (14).
2. double-deck deck according to claim 1, is characterized in that, the cup depth h of described depressed area (3) is 0.8mm.
3. double-deck deck according to claim 1, is characterized in that, the height of projection H of described the first convex area (4) and the second convex area (5) is 1.8mm.
4. double-deck deck according to claim 1, is characterized in that, the top of described TF clamping contact (6) upper terminal is circular-arc.
5. double-deck deck according to claim 1, is characterized in that, the top of described standard SIM clamping contact (9) upper terminal is circular-arc.
6. double-deck deck according to claim 1, is characterized in that, the top of described little SIM card contact chip (12) upper terminal is circular-arc.
7. double-deck deck according to claim 1, is characterized in that, the distance between a described TF card slot (7) and the 2nd TF card slot (8) is 11.20mm.
8. double-deck deck according to claim 1, is characterized in that, the distance between described the first standard SIM card slot (10) and the second standard SIM card slot (11) is 25.20mm.
9. double-deck deck according to claim 1, is characterized in that, the distance between described the first little SIM card slot (13) and the second little SIM card slot (14) is 12.20mm.
CN201310640079.XA 2013-12-04 2013-12-04 A kind of double-layer card seat Active CN103682897B (en)

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Application Number Priority Date Filing Date Title
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CN103682897B CN103682897B (en) 2016-04-06

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104038586A (en) * 2014-05-19 2014-09-10 昆山鸿日达电子科技有限公司 Mobile phone card holder capable of identifying three cards simultaneously

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5790659A (en) * 1996-08-30 1998-08-04 Telefonaktiebolaget Lm Ericsson Subscriber identity module (SIM) card holder
CN201638977U (en) * 2010-01-06 2010-11-17 东莞捷仕美电子有限公司 Double-layer SIM card seat
CN202652309U (en) * 2012-07-03 2013-01-02 昆山鸿日达电子科技有限公司 Multi-SIM card handset stand
CN203645098U (en) * 2013-12-04 2014-06-11 昆山澳鸿电子科技有限公司 Double-layer card holder

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5790659A (en) * 1996-08-30 1998-08-04 Telefonaktiebolaget Lm Ericsson Subscriber identity module (SIM) card holder
CN201638977U (en) * 2010-01-06 2010-11-17 东莞捷仕美电子有限公司 Double-layer SIM card seat
CN202652309U (en) * 2012-07-03 2013-01-02 昆山鸿日达电子科技有限公司 Multi-SIM card handset stand
CN203645098U (en) * 2013-12-04 2014-06-11 昆山澳鸿电子科技有限公司 Double-layer card holder

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104038586A (en) * 2014-05-19 2014-09-10 昆山鸿日达电子科技有限公司 Mobile phone card holder capable of identifying three cards simultaneously

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Address after: 523711 No. 2, West Lake Industrial Park, Lincun Community, Tangxia Town, Dongguan City, Guangdong Province

Patentee after: Dongguan Engang Electronic Technology Co., Ltd.

Address before: 215316 West Side of Qingsong Road, Yushan Town, Kunshan City, Suzhou City, Jiangsu Province

Patentee before: KUNSHAN JIEHUANG ELECTRONIC PRECISION TECHNOLOGY CO., LTD.

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Effective date of registration: 20200827

Address after: 224200 East Side of Dongzao Road and North Side of Dongzao Road, Dongtai Economic Development Zone, Yancheng City, Jiangsu Province

Patentee after: DONGTAI RUNTIAN PRECISION TECHNOLOGY Co.,Ltd.

Address before: 523711 No. 2, West Lake Industrial Park, Lincun Community, Tangxia Town, Dongguan City, Guangdong Province

Patentee before: DONGGUAN ENGANG ELECTRONIC TECHNOLOGY Co.,Ltd.