CN103682045B - The processing method of a kind of LED encapsulation cup and corresponding mould - Google Patents
The processing method of a kind of LED encapsulation cup and corresponding mould Download PDFInfo
- Publication number
- CN103682045B CN103682045B CN201310648590.4A CN201310648590A CN103682045B CN 103682045 B CN103682045 B CN 103682045B CN 201310648590 A CN201310648590 A CN 201310648590A CN 103682045 B CN103682045 B CN 103682045B
- Authority
- CN
- China
- Prior art keywords
- mould
- inner chamber
- cup
- cover piece
- base board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005538 encapsulation Methods 0.000 title claims abstract description 16
- 238000003672 processing method Methods 0.000 title claims abstract description 11
- 238000000034 method Methods 0.000 claims abstract description 18
- 239000007788 liquid Substances 0.000 claims abstract description 14
- 239000000758 substrate Substances 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 9
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 2
- 239000010408 film Substances 0.000 claims 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 1
- 239000000741 silica gel Substances 0.000 claims 1
- 229910002027 silica gel Inorganic materials 0.000 claims 1
- 239000010409 thin film Substances 0.000 claims 1
- 238000010923 batch production Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 5
- 238000001125 extrusion Methods 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229920002799 BoPET Polymers 0.000 description 2
- 239000005041 Mylar™ Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000009795 derivation Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000004438 eyesight Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
Abstract
The invention discloses processing method and the corresponding mould of a kind of LED encapsulation cup, the method comprise the steps that making one mould (1), described mould (1) includes base (7) and cover piece (8), described base (7) and cover piece (8) closely cooperate and form inner chamber (9), the bottom surface of described inner chamber (9) arranges one or more groove (2), and described cover piece (8) arranges liquid hand-hole (4)；Flexible base board (5) is placed on the bottom surface of described inner chamber (9)；Sealed after described interior intracavity injects liquid by described liquid hand-hole (4)；Pressure is applied so that described flexible base board (5) is upper forms the cup (6) consistent with the shape of described groove (2) in described inner chamber (9)；And take out described flexible base board (5) drain.The present invention has the advantage that low cost, efficiency are high, good to flexible base board not damaged, uniformity and are suitable for batch production.
Description
Technical field
The present invention relates to field of LED illumination, particularly relate to processing method and the phase of a kind of LED encapsulation cup
Answer mould.
Background technology
The printed circuit that soft base plate flexible insulation base material is made, carries out line pattern on flexible substrate
Design and the product of making, there is the advantage that many rigid printed circuit boards do not possess.Soft base plate product body
Long-pending little, lightweight, it is substantially reduced the volume of device, is suitable for electronic product to high density, miniaturization, light weight
The needs that change, slimming, highly reliable direction are developed.There is high deflections, can free bend, winding,
Reverse, folding, can three-dimensional wiring, require arbitrarily to arrange, change shape according to space layout, and in three-dimensional
Arbitrarily move and flexible in space, thus reach assembly assembling and wire connecting integration.
The processing method technique being directly connected on weld pad by LED bare chip on flexible substrates is simple, economization
Package support, simplifies operation and reduces cost.But owing to LED chip is directly mounted at plane
On substrate, the light sent from chip sides is not reflected efficiently to the light direction of requirement, causes light
Extraction efficiency is the highest.
A kind of effective way solving the problems referred to above is as reflection by processing and fabricating cup on flexible substrates
Face, is fixed on LED bare chip in cup, and the light making chip sides send reflects derivation effectively.?
On flexible base board, processing and fabricating cup typically uses metal die impact, extrusion molding, but course of processing middle mold
Tool can contact and rub with substrate surface, causes the reflection layer on flexible base board surface to wipe damages such as spending, come off
Wound, not only affects reflecting effect, and residue can pollute base chip on board solder side, affects LED chip
With contacting and welding of substrate solder side so that provide a kind of low cost, high efficiency, zero damage,
The method processing reflective cup on flexible substrates.
Summary of the invention
Aiming at of the present invention provides that a kind of low cost, high efficiency and zero damage, adds on flexible substrates
The method of work cup.
The target of the present invention is realized by the processing method of a kind of LED encapsulation cup, and the method comprising the steps of:
-making a mould, this mould includes that base and cover piece, base and cover piece closely cooperate formation inner chamber,
The bottom surface of inner chamber arranges one or more groove, and cover piece arranges liquid hand-hole；
-flexible base board is placed on the bottom surface of inner chamber；
-by sealing after liquid hand-hole inside intracavity injection liquid；
-inside intracavity applies pressure so that form the cup consistent with the shape of groove on flexible base board；And
-take out flexible base board drain.
Preferably, at flexible base before the inventive method is additionally included in and is placed on the bottom surface of inner chamber by flexible base board
Covering the step of layer protecting film on plate, this protecting film is for protecting the reflector layer material on flexible base board.
It is further preferred that protecting film can be the material that some tensilities are high, such as mylar, silicon
Glue, dry film etc..
Preferably, the notch of groove and the shape of bottom land are identical or differ.
It is further preferred that the shape of notch and bottom land is respectively circular, oval or has the four of fillet
Limit shape.
Preferably, when making mould, in base, the position corresponding to groove arranges multiple exhaust hole.
The target of the present invention also resides in provides a kind of mould for processing LED encapsulation cup on flexible substrates
Tool, this mould includes that base and cover piece, base and cover piece closely cooperate formation inner chamber, and the bottom surface of inner chamber has
One or more grooves, cover piece has liquid hand-hole.
Preferably, the position corresponding to groove in base has multiple exhaust hole.
The inventive method mode based on hydraulic pressure forms the cup for installing LED chip on flexible substrates,
Effectively prevent the damage of substrate surface metal reflective layer material.And, the inventive method is by substrate
Covered with protective film, enhances the protection to substrate surface metal reflective layer material.The letter of the inventive method technique
Singly, it is easily achieved, by its cup processed, there is high quality and concordance, be suitable for batch raw
Produce.
Accompanying drawing explanation
The present invention will below with reference to accompanying drawing, combine preferred implementation and illustrate in greater detail, wherein:
Fig. 1 is the schematic diagram according to the mould used in the method for the present invention.
Fig. 2 is the schematic diagram in the mould of Fig. 1 before flexible base board extrusion forming.
Fig. 3 is the schematic diagram in the mould of Fig. 1 after flexible base board extrusion forming.
Fig. 4 is the schematic diagram using the inventive method to be processed to form the flexible base board after cup.
Fig. 5 is the schematic diagram using the inventive method to be processed to form the flexible base board after multiple cup.
Fig. 6 is the schematic top plan view of the flexible base board being processed to form multiple cup on it.
For clarity, the figure that these accompanying drawings are schematically and simplify, they only give for understanding this
The necessary details of invention, and omit other details.In all of the figs, identical reference and title
For referring to same or corresponding part.
Detailed description of the invention
In a preferred embodiment, the present invention for being processed to form LED encapsulation cup on flexible substrates
Method, including: first making a mould 1 as shown in Figure 1, this mould 1 includes base 7 and cover piece
8, base 7 and cover piece 8 closely cooperate and form inner chamber 9, and the bottom surface of inner chamber 9 arranges a notch and bottom land shape
Shape is the groove 2 of circle, and in base 7, the position corresponding to groove 2 arranges multiple exhaust hole 3, lid
Liquid hand-hole 4 is set on part 8；Cover one layer the most on flexible substrates for protecting on flexible base board
The protecting film of reflector layer material such as mylar also will be covered with the flexible base board 5 of protecting film and is placed on inner chamber 9
On bottom surface, as shown in Figure 2；Then after injecting water or other liquid by the inside intracavity of liquid hand-hole 4
Seal, in inner chamber 9, apply pressure so that flexible base board 5 is extruded thus thereon corresponding to groove
Forming the cup 6 consistent with the shape of groove 2 in place of 2, as shown in Figure 3, wherein exhaust hole 3 helps
In being discharged by the air in groove 2 when applying pressure, and then contribute to the formation of cup 6；Finally open
Cover piece 8, is taking out the flexible base board 5 after extrusion forming from mould and is taking off and be overlying on protecting film thereon, as
Shown in Fig. 4, finally by exhaust hole 3 drain.Due to the inventive method mode based on hydraulic pressure
Process, and employ the protecting film of protection reflector layer material, effectively prevent substrate surface metal reflective
The damage of layer material, and the cup formed has high quality and concordance.
In other embodiments, multiple notch can be set in the bottom surface of inner chamber 9 and bottom land shape is circle
Groove 2, the notch of groove 2 and the shape of bottom land also can be respectively other shape such as ellipse, have fillet
Tetragon etc., thus be processed to form the flexible base board with multiple cups 6, as shown in Figures 5 and 6.
By detailed description given above, the further scope of application of the present invention will be apparent to.But,
Should be appreciated that, while detailed description and object lesson show the preferred embodiment of the present invention, they are only and say
Being given of improving eyesight.For a person skilled in the art, by these describe in detail the present invention spirit and
In the range of various changes and modifications may be made will be apparent to, all such changes and modifications are all the guarantor of the present invention
Within the scope of protecting.
Claims (10)
1. the processing method of LED encapsulation cup, it is characterised in that described method includes step:
-making a mould (1), described mould (1) includes base (7) and cover piece (8), described base
(7) closely cooperating form inner chamber (9) with described cover piece (8), the bottom surface of described inner chamber (9) arranges one
Individual or multiple grooves (2), described cover piece (8) arranges liquid hand-hole (4)；
-flexible base board (5) is placed on the bottom surface of described inner chamber (9)；
-sealed after described interior intracavity injects liquid by described liquid hand-hole (4)；
-in described inner chamber (9), applying pressure so that the upper formation of described flexible base board (5) is recessed with described
The cup (6) that the shape of groove (2) is consistent；And
-take out described flexible base board (5) drain.
The processing method of a kind of LED the most according to claim 1 encapsulation cup, is additionally included in flexibility base
Plate is placed on the bottom surface of described inner chamber the step covering layer protecting film before at described flexible base board upper surface,
Described protecting film is for protecting the reflector layer material on described flexible base board.
The processing method of a kind of LED the most according to claim 2 encapsulation cup, wherein said protecting film selects
Autopolyester thin film or silica gel.
4. according to claim 1 or the method for the processing of 2 one kind of LED encapsulation cup, wherein said groove
(2) notch is identical with the shape of bottom land or differs.
The processing method of a kind of LED the most according to claim 4 encapsulation cup, wherein said notch and institute
The shape stating bottom land is respectively tetragon that is circular, oval or that have fillet.
6. the processing method encapsulating cup according to a kind of LED of claim 1 or 2, is wherein making institute
When stating mould, in described base (7), the position corresponding to described groove (2) arranges multiple exhaust hole
(3)。
7. the mould for processing LED encapsulation cup on flexible substrates, it is characterised in that described
Mould (1) includes that base (7) and cover piece (8), described base (7) and described cover piece (8) are closely joined
Closing and form inner chamber (9), the bottom surface of described inner chamber (9) has one or more groove (2), described cover piece
(8) there is on liquid hand-hole (4).
A kind of mould for processing LED encapsulation cup on flexible substrates the most according to claim 7,
In wherein said base (7), the position corresponding to described groove (2) has multiple exhaust hole (3).
9. according to a kind of mould for processing LED encapsulation cup on flexible substrates of claim 7 or 8
Tool, the notch of wherein said groove (2) is identical with the shape of bottom land or differs.
A kind of mould for processing LED encapsulation cup on flexible substrates the most according to claim 9,
The shape of wherein said notch and described bottom land is respectively tetragon that is circular, oval or that have fillet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310648590.4A CN103682045B (en) | 2013-12-04 | 2013-12-04 | The processing method of a kind of LED encapsulation cup and corresponding mould |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310648590.4A CN103682045B (en) | 2013-12-04 | 2013-12-04 | The processing method of a kind of LED encapsulation cup and corresponding mould |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103682045A CN103682045A (en) | 2014-03-26 |
| CN103682045B true CN103682045B (en) | 2016-09-14 |
Family
ID=50318932
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310648590.4A Expired - Fee Related CN103682045B (en) | 2013-12-04 | 2013-12-04 | The processing method of a kind of LED encapsulation cup and corresponding mould |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103682045B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112968110B (en) * | 2021-02-03 | 2022-02-11 | 华引芯（武汉）科技有限公司 | All-inorganic packaging high-power LED device and manufacturing method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102130240A (en) * | 2011-02-22 | 2011-07-20 | 史杰 | Metal bracket LED chip packaging process |
| CN102738361A (en) * | 2011-03-31 | 2012-10-17 | 山一电机股份有限公司 | Luminous-body flexible board and luminous device |
| CN102916111A (en) * | 2012-10-19 | 2013-02-06 | 杨勇平 | LED (light-emitting diode) integrated light source substrate and producing method thereof |
| TW201310715A (en) * | 2011-08-29 | 2013-03-01 | Advanced Optoelectronic Tech | Manufacturing method of LED package |
| TW201349583A (en) * | 2012-05-31 | 2013-12-01 | Advanced Optoelectronic Tech | Method for manufacturing light emitting diode package |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6867539B1 (en) * | 2000-07-12 | 2005-03-15 | 3M Innovative Properties Company | Encapsulated organic electronic devices and method for making same |
-
2013
- 2013-12-04 CN CN201310648590.4A patent/CN103682045B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102130240A (en) * | 2011-02-22 | 2011-07-20 | 史杰 | Metal bracket LED chip packaging process |
| CN102738361A (en) * | 2011-03-31 | 2012-10-17 | 山一电机股份有限公司 | Luminous-body flexible board and luminous device |
| TW201310715A (en) * | 2011-08-29 | 2013-03-01 | Advanced Optoelectronic Tech | Manufacturing method of LED package |
| TW201349583A (en) * | 2012-05-31 | 2013-12-01 | Advanced Optoelectronic Tech | Method for manufacturing light emitting diode package |
| CN102916111A (en) * | 2012-10-19 | 2013-02-06 | 杨勇平 | LED (light-emitting diode) integrated light source substrate and producing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103682045A (en) | 2014-03-26 |
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| C41 | Transfer of patent application or patent right or utility model | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20160726 Address after: Korea 101300 Beijing city Shunyi District town culture camp north of the village (two Airport Road No. 1) Applicant after: BEIJING GUOLIAN WANZHONG SEMICONDUCTOR TECHNOLOGY CO.,LTD. Address before: 7, building 213161, block B, building 1, research port, science education city, Wujin District, Changzhou, Jiangsu Applicant before: CHANGZHOU INSTITUTE OF TECHNOLOGY RESEARCH FOR SOLID STATE LIGHTING |
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