CN103681380A - Sealing and scalding device - Google Patents
Sealing and scalding device Download PDFInfo
- Publication number
- CN103681380A CN103681380A CN201310677426.6A CN201310677426A CN103681380A CN 103681380 A CN103681380 A CN 103681380A CN 201310677426 A CN201310677426 A CN 201310677426A CN 103681380 A CN103681380 A CN 103681380A
- Authority
- CN
- China
- Prior art keywords
- sealing
- scalding
- envelope
- fixed
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007789 sealing Methods 0.000 title abstract 29
- 238000010438 heat treatment Methods 0.000 claims abstract description 9
- 206010053615 Thermal burn Diseases 0.000 claims description 29
- 238000009835 boiling Methods 0.000 claims description 21
- 238000010409 ironing Methods 0.000 claims description 14
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66083—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by variation of the electric current supplied or the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. two-terminal devices
- H01L29/6609—Diodes
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Package Closures (AREA)
- Ceramic Engineering (AREA)
Abstract
Description
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310677426.6A CN103681380B (en) | 2013-12-13 | 2013-12-13 | A kind of envelope ironing device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310677426.6A CN103681380B (en) | 2013-12-13 | 2013-12-13 | A kind of envelope ironing device |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103681380A true CN103681380A (en) | 2014-03-26 |
CN103681380B CN103681380B (en) | 2016-04-06 |
Family
ID=50318553
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310677426.6A Active CN103681380B (en) | 2013-12-13 | 2013-12-13 | A kind of envelope ironing device |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN103681380B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106827550A (en) * | 2016-12-29 | 2017-06-13 | 上海高盾科技发展有限公司 | A kind of automatic sealing package scalds machine |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10147303A (en) * | 1996-11-14 | 1998-06-02 | Nittetsu Semiconductor Kk | Sealing structure for semiconductor packaging device |
CN202244247U (en) * | 2011-10-09 | 2012-05-30 | 广东粤东机械实业有限公司 | Thermal sealing and cutting device |
CN202848095U (en) * | 2012-10-16 | 2013-04-03 | 佛山市松川机械设备有限公司 | Reciprocating type cutter sealing mechanism applied to packing machine |
CN203812855U (en) * | 2013-12-13 | 2014-09-03 | 如皋市易达电子有限责任公司 | Sealing and scalding device |
-
2013
- 2013-12-13 CN CN201310677426.6A patent/CN103681380B/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10147303A (en) * | 1996-11-14 | 1998-06-02 | Nittetsu Semiconductor Kk | Sealing structure for semiconductor packaging device |
CN202244247U (en) * | 2011-10-09 | 2012-05-30 | 广东粤东机械实业有限公司 | Thermal sealing and cutting device |
CN202848095U (en) * | 2012-10-16 | 2013-04-03 | 佛山市松川机械设备有限公司 | Reciprocating type cutter sealing mechanism applied to packing machine |
CN203812855U (en) * | 2013-12-13 | 2014-09-03 | 如皋市易达电子有限责任公司 | Sealing and scalding device |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106827550A (en) * | 2016-12-29 | 2017-06-13 | 上海高盾科技发展有限公司 | A kind of automatic sealing package scalds machine |
CN106827550B (en) * | 2016-12-29 | 2023-08-15 | 上海高盾科技发展有限公司 | Automatic seal and scald machine |
Also Published As
Publication number | Publication date |
---|---|
CN103681380B (en) | 2016-04-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C41 | Transfer of patent application or patent right or utility model | ||
CB03 | Change of inventor or designer information |
Inventor after: Zhang Lianjia Inventor after: Ben Haijiao Inventor after: Mei Yufeng Inventor after: Yu Feng Inventor before: Huang Jianshan Inventor before: Zhang Lianjia Inventor before: Chen Jianhua Inventor before: Mei Yufeng Inventor before: Ben Haijiao |
|
COR | Change of bibliographic data | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20160301 Address after: 226500 No. 2 South Haiyang Road, Chengnan street, Jiangsu, Rugao Applicant after: NANTONG ZHONGBANG MICROELECTRONICS CO., LTD. Address before: 226500, Jiangsu Province, Nantong City, Rugao moved by the town group shore village 7 groups Applicant before: Rugao Eada Electronics Co., Ltd. |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20191122 Address after: 239400 No. 15 Xingye Road, Mingguang City, Chuzhou City, Anhui Province Patentee after: Anhui Meiyue Culture Development Co., Ltd Address before: 226500 No. 2 South Haiyang Road, Chengnan street, Jiangsu, Rugao Patentee before: RUGAO EADA ELECTRONICS CO., LTD. |
|
TR01 | Transfer of patent right | ||
CP01 | Change in the name or title of a patent holder |
Address after: 239400 No. 15 Xingye Road, Mingguang City, Chuzhou City, Anhui Province Patentee after: Anhui Meiyue Culture Development Co., Ltd Address before: 239400 No. 15 Xingye Road, Mingguang City, Chuzhou City, Anhui Province Patentee before: Anhui Meiyue Culture Development Co., Ltd |
|
CP01 | Change in the name or title of a patent holder |