CN103680954A - Thin film capacitor suitable for high-temperature and low-temperature environments - Google Patents
Thin film capacitor suitable for high-temperature and low-temperature environments Download PDFInfo
- Publication number
- CN103680954A CN103680954A CN201310709713.0A CN201310709713A CN103680954A CN 103680954 A CN103680954 A CN 103680954A CN 201310709713 A CN201310709713 A CN 201310709713A CN 103680954 A CN103680954 A CN 103680954A
- Authority
- CN
- China
- Prior art keywords
- positive
- negative electrode
- tin
- electrode pins
- negative polarity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Abstract
The invention relates to a thin film capacitor suitable for the high-temperature and low-temperature environments. The thin film capacitor is installed on a PCB and comprises a body and positive-negative electrode pins, wherein one ends of the positive-negative electrode pins are connected to the body, the other ends of the positive-negative electrode pins are connected to the PCB through soldering tin, and the positive-negative electrode pins are made of columnar metal. Each positive-negative electrode pin comprises a metal core, the outer layer of the metal core is wrapped by a copper layer, the outer layer of the copper layer is wrapped by a tin layer, and the metal core, the copper layer and the tin layer are mutually pressed to form a whole. As the positive-negative electrode pins are formed by the metal cores, the copper layers and the tin layers in a mutually-pressed mode, when the positive-negative electrode pins are soldered to the PCB, the soldering tin and the tin layers on the outer layers of the positive-negative electrode pins are directly soldered, in the high temperature-low temperature-high temperature alternative use environment, even the soldering tin is overheated to flow, the tin layers on the outer layers can also be melted to enable the positive-negative electrode pins to be tightly fixed to the PCB, the loosened phenomenon can be avoided, the good operation environment is kept, the accident rate is reduced, and the safety performance is improved.
Description
Technical field
The present invention relates to capacitor technology field, relate in particular to a kind of film capacitor that is applicable to high temperature and low temperature environment.
Background technology
Capacitor is commonly referred to electric capacity, and electric capacity is also called " capacitance ", refers to the electric charge reserves under given potential difference, is designated as C, and international unit is farad (F).In general, electric charge is understood stressed and is moved in electric field, has had medium between conductor, has hindered electric charge move and make charge accumulation on conductor, causes the accumulation of electric charge to store, and the quantity of electric charge of storage is called electric capacity.Electric capacity is one of a large amount of electronic components that use in electronic equipment, is widely used in every aspects such as straight, coupling, bypass, filtering, resonant tank, power conversion, control circuits.
The pin of existing film capacitor is directly plain conductor, in soldering to after on pcb board, in the process of using, tend to move under different temperatures environment, in the environment that high temperature-low temperature-high temperature different temperatures substitutes, be easy to make the overheated generation fusing in scolding tin place to flow, meet condensation knot, make the junction loose contact of pin, cause whole circuit to produce potential safety hazard.
Summary of the invention
In view of this, be necessary to provide a kind of film capacitor that is applicable to high temperature and low temperature environment that is difficult for making the junction loose contact of pin.
The present invention realizes like this, a kind of film capacitor that is applicable to high temperature and low temperature environment, be arranged on pcb board, comprise body and both positive and negative polarity pin, one end of described both positive and negative polarity pin is connected on body, the other end of both positive and negative polarity pin is connected on pcb board by scolding tin, described both positive and negative polarity pin is cylindrical metal, comprise metal-cored, the copper layer of described metal-cored skin parcel one deck, skin parcel one deck tin matter layer of described copper layer, described metal-cored, copper layer is laminated into whole with tin matter layer.
Further, described pcb board is provided with the hole of passing for both positive and negative polarity pin, and both positive and negative polarity pin interts in hole, and both positive and negative polarity pin is fastened on pcb board by tin matter layer and scolding tin.
A kind of advantage that is applicable to the film capacitor of high temperature and low temperature environment provided by the invention is: by both positive and negative polarity pin is laminated and is formed by metal-cored, copper layer and tin matter layer, in the time of on being welded to pcb board, scolding tin directly welds with the outer field tin matter of both positive and negative polarity pin layer, in the environment for use replacing at high temperature-low temperature-high temperature, even if scolding tin is overheated, flow, also can be by the fusing of outer field tin matter layer and being fixed on pcb board tightly, there will not be loosening phenomenon to occur, keep good running environment, reduce accident rate, improve security performance.
Accompanying drawing explanation
Fig. 1 is a kind of structural representation that is applicable to the film capacitor of high temperature and low temperature environment of the present invention.
Fig. 2 is the sectional view of the both positive and negative polarity pin in Fig. 1.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein, only in order to explain the present invention, is not intended to limit the present invention.
See also Fig. 1 and Fig. 2, wherein Fig. 1 is a kind of structural representation that is applicable to the film capacitor of high temperature and low temperature environment of the present invention, and Fig. 2 is the sectional view of the both positive and negative polarity pin in Fig. 1.
Described a kind of film capacitor that is applicable to high temperature and low temperature environment, be arranged on pcb board 10, comprise body 20 and both positive and negative polarity pin 30, one end of described both positive and negative polarity pin 30 is connected on body 20, the other end of both positive and negative polarity pin 30 is connected on pcb board 10 by scolding tin 40, described both positive and negative polarity pin 30 is cylindrical metal, comprise metal-cored 31, the copper layer 32 of described metal-cored 31 skin parcel one deck, skin parcel one deck tin matter layer 33 of described copper layer 32, described metal-cored 31, copper layer 32 is laminated into whole with tin matter layer 33.
Described pcb board 10 is provided with the hole (not shown) of passing for both positive and negative polarity pin 30, and both positive and negative polarity pin 30 interts in hole, and both positive and negative polarity pin 30 is fastened on pcb board 10 by tin matter layer 33 and scolding tin 40.
Described copper layer 32 increases conductivity and the toughness of both positive and negative polarity pin 30, prevents that both positive and negative polarity pin 30 is because of repeatedly crooked phenomenon generation of rupturing.
By both positive and negative polarity pin 30 is laminated and is formed by metal-cored 31, copper layer 32 and tin matter layer 33, in the time of on being welded to pcb board 10, scolding tin 40 directly welds with the outer field tin matter of both positive and negative polarity pin 30 layer 33, in the environment for use replacing at high temperature-low temperature-high temperature, even if scolding tin 40 is overheated, flow, also can be by outer field tin matter layer 33 fusing and being fixed on pcb board 10 tightly, there will not be loosening phenomenon to occur, keep good running environment, reduce accident rate, improve security performance.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any modifications of doing within the spirit and principles in the present invention, be equal to and replace and improvement etc., within all should being included in protection scope of the present invention.
Claims (2)
1. a film capacitor that is applicable to high temperature and low temperature environment, be arranged on pcb board (10), comprise body (20) and both positive and negative polarity pin (30), one end of described both positive and negative polarity pin (30) is connected on body (20), the other end of both positive and negative polarity pin (30) is connected on pcb board (10) by scolding tin (40), it is characterized in that, described both positive and negative polarity pin (30) is cylindrical metal, comprise metal-cored (31), the skin parcel copper layer of one deck (32) of described metal-cored (31), skin parcel one deck tin matter layer (33) of described copper layer (32), described metal-cored (31), copper layer (32) is laminated into whole with tin matter layer (33).
2. a kind of film capacitor that is applicable to high temperature and low temperature environment according to claim 1, it is characterized in that, described pcb board (10) is provided with the hole of passing for both positive and negative polarity pin (30), both positive and negative polarity pin (30) interts in hole, and both positive and negative polarity pin (30) is fastened on pcb board (10) by tin matter layer (33) and scolding tin (40).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310709713.0A CN103680954A (en) | 2013-12-21 | 2013-12-21 | Thin film capacitor suitable for high-temperature and low-temperature environments |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310709713.0A CN103680954A (en) | 2013-12-21 | 2013-12-21 | Thin film capacitor suitable for high-temperature and low-temperature environments |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103680954A true CN103680954A (en) | 2014-03-26 |
Family
ID=50318220
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310709713.0A Pending CN103680954A (en) | 2013-12-21 | 2013-12-21 | Thin film capacitor suitable for high-temperature and low-temperature environments |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103680954A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104485228A (en) * | 2014-12-11 | 2015-04-01 | 铜陵市启动电子制造有限责任公司 | Flat thin-film capacitor |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3543653A1 (en) * | 1985-12-11 | 1987-06-19 | Standard Elektrik Lorenz Ag | ELECTRIC CAPACITOR |
| JP2000124073A (en) * | 1998-10-14 | 2000-04-28 | Matsushita Electric Ind Co Ltd | Aluminum electrolytic capacitor |
| CN201897978U (en) * | 2010-12-03 | 2011-07-13 | 南通弘扬金属制品有限公司 | Low-intensity composition metal wire |
| CN203706884U (en) * | 2013-12-21 | 2014-07-09 | 铜陵源丰电子有限责任公司 | Thin film capacitor suitable for high-temperature and low-temperature environments |
-
2013
- 2013-12-21 CN CN201310709713.0A patent/CN103680954A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3543653A1 (en) * | 1985-12-11 | 1987-06-19 | Standard Elektrik Lorenz Ag | ELECTRIC CAPACITOR |
| JP2000124073A (en) * | 1998-10-14 | 2000-04-28 | Matsushita Electric Ind Co Ltd | Aluminum electrolytic capacitor |
| CN201897978U (en) * | 2010-12-03 | 2011-07-13 | 南通弘扬金属制品有限公司 | Low-intensity composition metal wire |
| CN203706884U (en) * | 2013-12-21 | 2014-07-09 | 铜陵源丰电子有限责任公司 | Thin film capacitor suitable for high-temperature and low-temperature environments |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104485228A (en) * | 2014-12-11 | 2015-04-01 | 铜陵市启动电子制造有限责任公司 | Flat thin-film capacitor |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6096303B2 (en) | connector | |
| CN204668163U (en) | A kind of metallic film capacitor | |
| CN203706884U (en) | Thin film capacitor suitable for high-temperature and low-temperature environments | |
| CN203644547U (en) | Main return circuit structure for zero sequence current mutual inductor of moulded case circuit breaker | |
| CN103680954A (en) | Thin film capacitor suitable for high-temperature and low-temperature environments | |
| EP3616298A1 (en) | Balancing circuit for an electrical energy storage device | |
| CN203787710U (en) | Laminated bus bar with flexible connection structure | |
| CN101997343A (en) | Novel pulse power accumulator with high specific volume and large current | |
| CN203871186U (en) | Novel high-frequency aluminum electrolytic capacitor | |
| CN203951172U (en) | Lithium battery protection board circuit based on NTC paster thermistor element | |
| WO2019005536A1 (en) | Interconnect strip for an ultracapacitor module | |
| CN204243733U (en) | Based on the lithium battery protection board circuit of NTC paster thermistor element | |
| JP2014120760A (en) | Super capacitor and manufacturing method of the same | |
| CN203659631U (en) | Capacitor | |
| CN203931806U (en) | A kind of explosion-proof block | |
| CN103680955B (en) | A kind of thin film capacitor being easy to vertical and horizontal installation | |
| CN205508631U (en) | With arcuation pipeline through -hole | |
| CN205609363U (en) | Graphite alkene condenser with overvoltage protection | |
| CN102394169A (en) | Capacitor with heat shield | |
| CN203562302U (en) | Capacitor wiring terminal | |
| CN104485228A (en) | Flat thin-film capacitor | |
| CN203589716U (en) | Combined element including capacitor and voltage dependent resistor (VDR) connected in parallel | |
| CN204030547U (en) | Circuit brake | |
| CN204270883U (en) | A kind of intermediately remained border film capacitor | |
| CN203706885U (en) | Thin film capacitor capable of being conveniently longitudinally and transversely installed |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140326 |