CN103679254A - Novel non-contact type smart IC card and implementation method thereof - Google Patents
Novel non-contact type smart IC card and implementation method thereof Download PDFInfo
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- CN103679254A CN103679254A CN201310680391.1A CN201310680391A CN103679254A CN 103679254 A CN103679254 A CN 103679254A CN 201310680391 A CN201310680391 A CN 201310680391A CN 103679254 A CN103679254 A CN 103679254A
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Abstract
The invention relates to the field of radio frequency cards, and particularly discloses a novel non-contact type smart IC card and an implementation method thereof. The implementation method comprises the steps that one end of an antenna coil is connected with an IC smart chip, and the other end of the antenna coil is connected with a goldfinger; the IC smart chip, the antenna coil and the goldfinger are respectively placed in a groove, and the groove, the IC smart card, the antenna coil and the goldfinger are of an integral structure; a PVC card is composed of an upper PVC layer, an insulation isolating layer and a lower PVC layer; a key identification is arranged at one end of the outer surface of the upper PVC card, a conductive film corresponds to the key identification in position, a through hole is formed in one end of the insulation isolating layer, the conductive film penetrates through the through hole and is connected with the goldfinger, and the conductive film and the through hole correspond to the goldfinger in position; the insulation isolating layer is placed between the upper PVC layer and the lower PVC layer. The non-contact type smart IC card can be controlled subjectively, data in the non-contact card are effectively prevented from being stolen to read or misread in a short-distance high-frequency wireless communication technology, and using of the IC card is safer.
Description
Technical field
The present invention relates to radio-frequency card field, especially relate to a kind of novel Non-contact Intelligent IC Card and its implementation.
Background technology
Along with the development of financial industry, socioeconomic making rapid progress, particularly Public Transport Trade, wireless communication industry, health-care industry and closed site management, much more more and more identification, telephone communication, building security system etc. start to accept and use IC smart card.Especially bank service system, IC smart card substitutes ancient magnetic card, and to serve masses day by day ripe; " all-purpose card " and " one card for multiple uses " improved people's quality of life greatly, such as: IC intelligent SIM card etc. in the automatic power recorder system of IC smart card, coal gas/tap water meter system, public transport/subway automatic ticketing/ticket-checking system and mobile communication mobile phone, IC smart card is more and more pressed close to our life, becomes our step of life and divides." swipe the card " and become a part indispensable in people's daily life.
Radio-frequency (RF) identification is RFID (Radio Frequency Identification) technology, claim again radio frequency identification, be a kind of communication technology, can identify specific objective and read and write related data by radio signals, and without setting up machinery between recognition system and specific objective or optics contacts.Conventional have low frequency (125k～134.2K), high frequency (13.56Mhz), ultrahigh frequency, technology such as microwave.Rfid interrogator also divides portable with fixed, RFID technology application is at present very wide, as library, and gate control system, food security is traced to the source etc.
Non-contact Intelligent IC Card claims again radio-frequency card, by IC-card chip, induction antenna forms, and is encapsulated in the PVC card of a standard, card near read write line surface, completes the read-write operation of data in certain distance scope (being generally 5-10mm) by the transmission of radiowave.Although existing intellective IC card is easy to use, consume energy low, purposes is wide, but also exist drawback: because this short-range high frequency wireless communication technology allows to carry out contactless Point-to-Point Data Transmission swap data between electronic equipment in ten centimetres, in the place that has radio-frequency field to disturb, easily cause false sense should, make that the data of Non-contact IC smart card are stolen to be read or misread; Cause the interior data of card to be misread or steal and read, make that card is passive withholds, to user, bring loss.
Also do not have at present effective scheme to solve the problems referred to above.
Summary of the invention
Technical matters solved by the invention is design a kind of novel Non-contact Intelligent IC Card and its implementation, and Non-contact Intelligent IC Card can subjectively be controlled transaction or identification, stolenly while avoiding in Non-contact IC smart card that data are concluded the business in short distance reads or misreads.While making IC-card, there is master control, while wanting to conclude the business, conclude the business, while not wanting to conclude the business, do not conclude the business, safer during use, effectively protected in non-contact card that data are not stolen in short-range high frequency wireless communication technology to be read or misread.
In order to solve the problems of the technologies described above, the invention provides a kind of novel Non-contact Intelligent IC Card, comprising:
IC intelligent chip, aerial coil, golden finger, groove and PVC card;
One end of described aerial coil is connected with described IC intelligent chip, and the other end of described aerial coil is connected with described golden finger; Described groove is placed respectively described IC intelligent chip, described aerial coil and described golden finger, and described groove and described IC intelligent chip, described aerial coil and described golden finger are into a single integrated structure;
Described PVC card is comprised of upper PVC layer, dielectric isolation layer and lower PVC layer; Described upper PVC layer comprises PVC layer outside surface and upper PVC layer inside surface, and described lower PVC layer comprises lower PVC layer outside surface and lower PVC layer inside surface; One end of described upper PVC layer outside surface is provided with marking keys, described conducting film is corresponding with described marking keys position, one end of described dielectric isolation layer is provided with a through hole, described conducting film is connected with described golden finger through described through hole, and described conducting film, described through hole are corresponding with described golden finger position; The centre of described dielectric isolation layer PVC layer and described lower PVC layer on described.
Preferably, described shape of through holes is identical with described golden finger shape.
Be more preferably, described upper PVC layer, described dielectric isolation layer are consistent with described PVC card dimensions with described lower PVC layer.
Be more preferably, described golden finger is in one end of described lower PVC layer inside surface.
Be more preferably one end of described conducting film inside surface of PVC layer on described.
The present invention also provides a kind of implementation method of novel Non-contact Intelligent IC Card, comprising:
Described IC intelligent chip completes reading, revise and storing of data, and return signal is to card-reading apparatus, completes transaction;
Described aerial coil is responded to the electromagnetism sense of described card-reading apparatus, thus with the be coupled transmission of data of the electromagnetic induction of described card-reading apparatus;
Described golden finger is communicated with aerial coil;
Described PVC card encapsulates described IC intelligent chip, described aerial coil and described golden finger, and by radiowave, completes transaction between described card-reading apparatus;
Described PVC card is formed by upper PVC layer and lower PVC layer and middle dielectric isolation layer laminating encapsulation, described upper PVC layer is formed by upper PVC layer outside surface and the encapsulation of upper PVC layer inside surface, and described lower PVC layer is formed by lower PVC layer outside surface and the encapsulation of lower PVC layer inside surface; One end of described upper PVC layer outside surface is provided with marking keys, and one end of described upper PVC layer inside surface is provided with conducting film, and one end of described dielectric isolation layer is provided with a through hole, and described golden finger is in one end of described lower PVC layer inside surface; Described IC intelligent chip and described aerial coil and described golden finger are encapsulated between described lower PVC layer and described dielectric isolation layer after connecting; Described marking keys is connected with described conducting film, and described conducting film is communicated with described golden finger and described aerial coil is connected through the through hole of described dielectric isolation layer; Described conducting film, described through hole are corresponding with described golden finger position; The corresponding described golden finger of through hole and the described lower PVC layer of described dielectric isolation layer encapsulate, and the corresponding described golden finger of described conducting film and described dielectric isolation layer encapsulate.
Preferably, described shape of through holes is identical with described golden finger shape.
Be more preferably, described upper PVC layer, described dielectric isolation layer are consistent with described PVC card dimensions with described lower PVC layer.
Be more preferably, described golden finger is in one end of described lower PVC layer inside surface.
Be more preferably one end of described conducting film inside surface of PVC layer on described.
Be more preferably, described card-reading apparatus comprises NFC equipment.
Wherein, described IC-card (Integrated Circuit Card, integrated circuit card), also claim smart card (Smart card), smart card (Intelligent card), microcircuit card (Microcircuit card) or chip card etc.It is that a microelectronic chip is embedded and met in the card base of ISO7816 standard, makes card form.Communication modes between IC-card and read write line can be contact, can be also contactless.According to communication interface, IC-card is divided into Contact Type Ic Card, non-contact IC and double-interface card (possessing contact and contactless communication interface) simultaneously.
Wherein, described golden finger (connecting finger) be computer hardware as: (on memory bar and between memory bank, video card and card slot etc.), all signals all transmit by golden finger.Golden finger is comprised of numerous flavous conductive contact blades, because its surface gold-plating and conductive contact blade are arranged as finger-shaped, so be called " golden finger ".Golden finger is actually in copper-clad plate and is covered with layer of gold by special process again, because the inoxidizability of gold is extremely strong, and conduction is also very strong.
Wherein, described PVC is Polyvinylchloride, is called for short PVC (Polyvinyl chloride polymer=PVC molecular structure), is the thermoplastic resin being polymerized under initiating agent effect by vinyl chloride.It is the homopolymer of vinyl chloride.Ryuron and vinyl chloride copolymer are referred to as vestolit.PVC is the white powder of impalpable structure, and the degree of branching is less.Industrial PVC molecular weight generally, in 50,000～120,000 scopes, has larger polydispersity, and molecular weight increases with the reduction of polymerization temperature; Without definite melting point, 80～85 ℃ start to soften, and 130 ℃ become viscoelastic state, and 160～180 ℃ start to change into viscous state; There is good mechanical property, tensile strength 60MPa left and right, impact strength 5～10kJ/m2; There are excellent dielectric properties.But the poor stability to light and heat, more than 100 ℃ or through long-time exposure in sunshine, will decompose and produce hydrogen chloride, and further autocatalysis is decomposed, cause variable color, physical and mechanical properties also declines rapidly, must add in actual applications stabilizing agent to improve the stability to light and heat.PVC is very hard, and dissolubility is also very poor, can only be dissolved in the minority solvents such as cyclohexanone, ethylene dichloride and tetrahydrofuran, and all stable to organic and mineral acid, alkali, salt, chemical stability reduces with the rising of serviceability temperature.PVC is dissolved in acetone-carbon disulphide or Acetone-Benzene mixed solvent, for dry spinning or wet spinning, forms fiber, claims polyvinyl chloride fibre, has difficult combustion, acid and alkali-resistance, antimicrobial, wear-resisting characteristic and has good warmth retention property and elasticity.
Wherein, described NFC is Near Field Communication abbreviation, i.e. near field communication (NFC).NFC by PHILIPS Co. and Sony joint development is a kind of contactless identification and interconnection technique, can carry out wireless near field communication at mobile device, consumer electronics product, PC and smart control Tool Room.NFC provides a kind of solution of simple, touch, can allow consumer's simple, intuitive ground exchange message, access content and serve.NFC near-field communication technology is to be developed by non-contact radio-frequency identification (RFID) and the Technology Integration that interconnects, combining induction card reader, induction type card and point-to-point function on one chip can be identified and exchanges data with compatible equipment in short distance.But frequency of operation is 13.56MHz. uses the user of this mobile-phone payment scheme must change special mobile phone.This technology is widely used in Japan and Korea S at present.Cellphone subscriber just can go all over the whole nation with the mobile phone that has configured payment function: their mobile phone can board as airport gate inhibition's key, traffic all-purpose card, credit card, Payment Card of checking, mansion etc.
The present invention compared with prior art, has following beneficial effect:
The invention provides a kind of novel Non-contact Intelligent IC Card and its implementation, can effectively prevent from that card internal information is stolen to read or misread; Card is within the scope of certain distance, be generally 5～10mm, change original close read write line surface and by the transmission of radiowave, completed the mode of the read-write operation of data, square tube of the present invention is crossed effectively controlled physical layer design, effectively takes precautions against and in short-range, attacks the private data of transmitting on read line.
IC-card of the present invention has master control, has more security; Except the various cryptographic algorithm of chip come that protected data transaction, the master control of card more increase the security of transaction; When card-reading apparatus is initiated instruction, IC-card can be selected to receive data or not receive data, thereby initiatively completes transaction.
Accompanying drawing explanation
Fig. 1 is exemplary shows a kind of novel Non-contact Intelligent IC Card schematic top plan view of the present invention;
A kind of novel Non-contact Intelligent IC Card layer of the present invention that shows that Fig. 2 is exemplary cuts open structural representation;
Fig. 3 is exemplary shows a kind of novel Non-contact Intelligent IC Card inner structure schematic diagram of the present invention;
Fig. 4 is exemplary shows a kind of novel Non-contact Intelligent IC Card elevational schematic view of the present invention;
The process of exchange schematic diagram that shows a kind of novel Non-contact Intelligent IC Card of the present invention that Fig. 5 is exemplary.
Reference numeral shown in Fig. 1～Fig. 4 is as follows: 1, upper PVC layer outside surface, 2, marking keys, 3, dielectric isolation layer, 4, through hole, 5, lower PVC layer, 6, golden finger, 7, aerial coil, 8, IC intelligent chip, 9, upper PVC layer inside surface, 10, conducting film.
Embodiment
The technical matters that solved for a better understanding of the present invention, the technical scheme providing, below in conjunction with drawings and Examples, be further elaborated to the present invention.Specific embodiment described herein is only in order to explain enforcement of the present invention, but is not intended to limit the present invention.
In a preferred embodiment, the structural representation that shows a kind of novel Non-contact Intelligent IC Card of the present invention that Fig. 1～Fig. 4 is exemplary, comprising:
IC intelligent chip 8, aerial coil 7, golden finger 6, groove and PVC card; One end of described aerial coil 7 is connected with described IC intelligent chip 8, and the other end of described aerial coil 7 is connected with described golden finger 6; Described groove is placed respectively described IC intelligent chip 8, described aerial coil 7 and described golden finger 6, and described groove and described IC intelligent chip 8, described aerial coil 7 and described golden finger 6 are into a single integrated structure;
Described PVC card is comprised of upper PVC layer, dielectric isolation layer 3 and lower PVC layer 5; Described upper PVC layer comprises PVC layer outside surface 1 and upper PVC layer inside surface 9, and described lower PVC layer 5 comprises lower PVC layer 5 outside surface and lower PVC layer 5 inside surface; One end of described upper PVC layer outside surface 1 is provided with marking keys 2, described conducting film 10 is corresponding with described marking keys 2 positions, one end of described dielectric isolation layer 3 is provided with a through hole 4, described conducting film 10 is connected with described golden finger 6 through described through hole 4, and described conducting film 10, described through hole 4 are corresponding with described golden finger 6 positions; The centre of described dielectric isolation layer 3 PVC layer and described lower PVC layer 5 on described.
In the embodiment being more preferably, described through hole 4 shapes are identical with described golden finger 6 shapes.
In the embodiment being more preferably, described upper PVC layer, described dielectric isolation layer 3 are consistent with described PVC card dimensions with described lower PVC layer 5.
In the embodiment being more preferably, described golden finger 6 is in one end of described lower PVC layer 5 inside surface.
In the embodiment being more preferably, one end of described conducting film 10 inside surface of PVC layer on described.
In a preferred embodiment, the process of exchange schematic diagram that shows a kind of novel Non-contact Intelligent IC Card of the present invention that Fig. 5 is exemplary, comprising:
Described IC intelligent chip completes reading, revise and storing of data, and return signal is to card-reading apparatus, completes transaction; Described aerial coil is responded to the electromagnetism sense of described card-reading apparatus, thus with the be coupled transmission of data of the electromagnetic induction of described card-reading apparatus; Described golden finger is communicated with aerial coil; Described PVC card encapsulates described IC intelligent chip, described aerial coil and described golden finger, and by radiowave, completes transaction between described card-reading apparatus;
Described PVC card is formed by upper PVC layer and lower PVC layer and middle dielectric isolation layer laminating encapsulation, described upper PVC layer is formed by upper PVC layer outside surface and the encapsulation of upper PVC layer inside surface, and described lower PVC layer is formed by lower PVC layer outside surface and the encapsulation of lower PVC layer inside surface; One end of described upper PVC layer outside surface is provided with marking keys, and one end of described upper PVC layer inside surface is provided with conducting film, and one end of described dielectric isolation layer is provided with a through hole, and described golden finger is in one end of described lower PVC layer inside surface; Described IC intelligent chip and described aerial coil and described golden finger are encapsulated between described lower PVC layer and described dielectric isolation layer after connecting; Described marking keys is connected with described conducting film, and described conducting film is communicated with described golden finger and described aerial coil is connected through the through hole of described dielectric isolation layer; Described conducting film, described through hole are corresponding with described golden finger position; The corresponding described golden finger of through hole and the described lower PVC layer of described dielectric isolation layer encapsulate, and the corresponding described golden finger of described conducting film and described dielectric isolation layer encapsulate.
In the embodiment being more preferably, described shape of through holes is identical with described golden finger shape.
In the embodiment being more preferably, described upper PVC layer, described dielectric isolation layer are consistent with described PVC card dimensions with described lower PVC layer.
In the embodiment being more preferably, described golden finger is in one end of described lower PVC layer inside surface.
In the embodiment being more preferably, one end of described conducting film inside surface of PVC layer on described.
Be more preferably, described card-reading apparatus comprises NFC equipment.
Specific embodiment:
Non-contact Intelligent IC Card is in when transaction, the home position that pushes button, and marking keys is a position reminding, marking keys herein can be colorful film or shell fragment type, not as conventional mobile phone button or this key that can automatically upspring of Computer key; Described marking keys is connected with described conducting film, and described conducting film is through the through hole of described dielectric isolation layer, is communicated with and makes described aerial coil connection with described golden finger; Now coil just can induction field, could receive data with the electromagnetic induction coupling of card-reading apparatus, thereby complete transaction.
Dielectric isolation layer in the middle of the present invention arranges is that conducting film and golden finger are only just communicated with when Subjective need, described conducting film and described golden finger form duplexer, subjectivity is not to be communicated with while not needing, because the material of middle dielectric isolation layer is also PVC material, there is certain thickness, marking keys is also not as our mobile phone key, it is a sign, indicate that pressing position herein makes golden finger be communicated with conducting film through through hole, aerial coil is exactly connected state, when now IC-card can be used not according to this position, between conducting film and golden finger, just there is certain distance, state in disconnecting, conducting film and golden finger aerial coil when off-state is also in off-state, so now IC-card just can not be used.
IC intelligent chip in the present invention is also equivalent to a stored value card; Can be for mass transit card, financial IC card, the mess card of some schools, access control system, highway toll collection system, parking lot fee collection management system, highway toll collection system, parking lot fee collection management system etc.
More than by the detailed description of concrete and preferred embodiment the present invention; but those skilled in the art should be understood that; the present invention is not limited to the above embodiment; all within ultimate principle of the present invention; any modification of doing, combine and be equal to replacement etc., within being all included in protection scope of the present invention.
Claims (10)
1. a novel Non-contact Intelligent IC Card, is characterized in that, comprising:
IC intelligent chip, aerial coil, golden finger, groove and PVC card;
One end of described aerial coil is connected with described IC intelligent chip, and the other end of described aerial coil is connected with described golden finger; Described groove is placed respectively described IC intelligent chip, described aerial coil and described golden finger, and described groove and described IC intelligent chip, described aerial coil and described golden finger are into a single integrated structure;
Described PVC card is comprised of upper PVC layer, dielectric isolation layer and lower PVC layer; Described upper PVC layer comprises PVC layer outside surface and upper PVC layer inside surface, and described lower PVC layer comprises lower PVC layer outside surface and lower PVC layer inside surface; One end of described upper PVC layer outside surface is provided with marking keys, described conducting film is corresponding with described marking keys position, one end of described dielectric isolation layer is provided with a through hole, described conducting film is connected with described golden finger through described through hole, and described conducting film, described through hole are corresponding with described golden finger position; The centre of described dielectric isolation layer PVC layer and described lower PVC layer on described.
2. novel Non-contact Intelligent IC Card according to claim 1, is characterized in that, described shape of through holes is identical with described golden finger shape.
3. novel Non-contact Intelligent IC Card according to claim 1, is characterized in that, described upper PVC layer, described dielectric isolation layer are consistent with described PVC card dimensions with described lower PVC layer.
4. novel Non-contact Intelligent IC Card according to claim 1, is characterized in that, described golden finger is in one end of described lower PVC layer inside surface.
5. novel Non-contact Intelligent IC Card according to claim 1, is characterized in that, one end of described conducting film inside surface of PVC layer on described.
6. an implementation method for novel Non-contact Intelligent IC Card, is characterized in that, comprising:
Described IC intelligent chip completes reading, revise and storing of data, and return signal is to card-reading apparatus, completes transaction;
Described aerial coil is responded to the electromagnetism sense of described card-reading apparatus, thus with the be coupled transmission of data of the electromagnetic induction of described card-reading apparatus;
Described golden finger is communicated with aerial coil;
Described PVC card encapsulates described IC intelligent chip, described aerial coil and described golden finger, and by radiowave, completes transaction between described card-reading apparatus;
Described PVC card is formed by upper PVC layer and lower PVC layer and middle dielectric isolation layer laminating encapsulation, described upper PVC layer is formed by upper PVC layer outside surface and the encapsulation of upper PVC layer inside surface, and described lower PVC layer is formed by lower PVC layer outside surface and the encapsulation of lower PVC layer inside surface; One end of described upper PVC layer outside surface is provided with marking keys, and one end of described upper PVC layer inside surface is provided with conducting film, and one end of described dielectric isolation layer is provided with a through hole, and described golden finger is in one end of described lower PVC layer inside surface; Described IC intelligent chip and described aerial coil and described golden finger are encapsulated between described lower PVC layer and described dielectric isolation layer after connecting; Described marking keys is connected with described conducting film, and described conducting film is communicated with described golden finger and described aerial coil is connected through the through hole of described dielectric isolation layer; Described conducting film, described through hole are corresponding with described golden finger position; The corresponding described golden finger of through hole and the described lower PVC layer of described dielectric isolation layer encapsulate, and the corresponding described golden finger of described conducting film and described dielectric isolation layer encapsulate.
7. the implementation method of novel Non-contact Intelligent IC Card according to claim 6, is characterized in that, described shape of through holes is identical with described golden finger shape.
8. the implementation method of novel Non-contact Intelligent IC Card according to claim 6, is characterized in that, described upper PVC layer, described dielectric isolation layer are consistent with described PVC card dimensions with described lower PVC layer.
9. the implementation method of novel Non-contact Intelligent IC Card according to claim 6, is characterized in that, described golden finger is in one end of described lower PVC layer inside surface; One end of described conducting film inside surface of PVC layer on described.
10. the implementation method of novel Non-contact Intelligent IC Card according to claim 6, is characterized in that, described card-reading apparatus comprises NFC equipment.
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| CN201310680391.1A CN103679254A (en) | 2013-12-10 | 2013-12-10 | Novel non-contact type smart IC card and implementation method thereof |
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| CN106485800A (en) * | 2016-12-19 | 2017-03-08 | 金邦达有限公司 | A kind of new E TC joint name card and its using method |
| CN108229633A (en) * | 2016-12-14 | 2018-06-29 | 桦应智能股份有限公司 | Touch-control starts contactless card |
| CN108492976A (en) * | 2018-03-13 | 2018-09-04 | 上海量子绘景电子股份有限公司 | The preparation method of loop construction and compound coil structure |
| CN109523001A (en) * | 2018-11-13 | 2019-03-26 | 卓望信息技术（北京）有限公司 | A kind of exchange method based on student card key |
| WO2021088268A1 (en) * | 2019-11-07 | 2021-05-14 | 廊坊新奥燃气设备有限公司 | Nfc card for ic card gas meter, gas payment system, and gas payment method |
| CN112964639A (en) * | 2021-02-24 | 2021-06-15 | 福莱盈电子股份有限公司 | LCM detection method and equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108229633A (en) * | 2016-12-14 | 2018-06-29 | 桦应智能股份有限公司 | Touch-control starts contactless card |
| CN106485800A (en) * | 2016-12-19 | 2017-03-08 | 金邦达有限公司 | A kind of new E TC joint name card and its using method |
| CN108492976A (en) * | 2018-03-13 | 2018-09-04 | 上海量子绘景电子股份有限公司 | The preparation method of loop construction and compound coil structure |
| CN109523001A (en) * | 2018-11-13 | 2019-03-26 | 卓望信息技术（北京）有限公司 | A kind of exchange method based on student card key |
| WO2021088268A1 (en) * | 2019-11-07 | 2021-05-14 | 廊坊新奥燃气设备有限公司 | Nfc card for ic card gas meter, gas payment system, and gas payment method |
| CN112964639A (en) * | 2021-02-24 | 2021-06-15 | 福莱盈电子股份有限公司 | LCM detection method and equipment |
| CN112964639B (en) * | 2021-02-24 | 2021-12-28 | 福莱盈电子股份有限公司 | LCM detection method and equipment |
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Application publication date: 20140326 |