CN103668138A - Chemical copper plating solution and chemical copper plating method - Google Patents
Chemical copper plating solution and chemical copper plating method Download PDFInfo
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- CN103668138A CN103668138A CN201210357448.XA CN201210357448A CN103668138A CN 103668138 A CN103668138 A CN 103668138A CN 201210357448 A CN201210357448 A CN 201210357448A CN 103668138 A CN103668138 A CN 103668138A
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Abstract
The invention provides a chemical copper plating solution. The chemical copper plating solution comprises a copper salt, a complexing agent, a pH regulating agent, a reducing agent, adenine and potassium nickel cyanide, wherein the complexing agent comprises EDTA (ethylenediaminetetraacetic acid) and/or disodium EDTA, and the reducing agent is formaldehyde. A chemical copper plating method comprises the following steps: enabling a workpiece to be plated to come into direct contact with the chemical copper plating solution, cleaning and drying to obtain a plated piece, wherein the chemical copper plating solution is the chemical copper plating solution disclosed by the invention. When the chemical copper plating solution provided by the invention is used to perform chemical copper plating, the ductility and the toughness of a plated layer can be effectively improved.
Description
Technical field
The invention belongs to Nonmetallic Electroless Copper Plating field, relate in particular to a kind of chemical bronze plating liquid and preparation method thereof.
Background technology
Since first the 40's of 20th century Brenner and Ridlell develop electroless copper technology, through the effort of over half a century, this technology has obtained application in the every field of national economy.Electroless copper occupies very consequence in electroless plating, has been widely used in all respects such as electro-magnetic screen layer of the bottom of non-metal electroplating, the hole metallization of printed board and electronic machine at present.Over nearly 30 years, research about electroless copper has obtained a large amount of achievements, but still exist at present many problems, for example, how to coordinate stability and this contradiction of plating speed of chemical bronze plating liquid, acquisition has the chemical bronze plating liquid of certain plating speed and high stability, is the important topic of this area always.
Since electroless copper technology is born, scientific worker constantly explores the dynamic process of its out-phase surface catalysis deposition; Propose mechanism, the hypothesis of various electroless platings, attempted the experimental fact of electroless copper to make reasonable dismissal, increased the essential understanding to electroless copper phenomenon.At present, most of commercial chemistry copper plating solutions adopt formaldehyde as reductive agent, in reaction process, there are two basic chemical reactions, that is: Cu2++2e → Cu and 2HCHO+40H-→ H2 ↑+2H20+2HC00-+2e, chemical reaction occurs in catalytic out-phase surface, does not have exterior power supply and electronics.The net reaction of electroless copper can be expressed as: Cu2++2HCHO+40H-→ Cu+H2 ↑+2H20+2HC00-, this reaction formula only represents the relation of reactant and final reaction product, real reaction process is more complex, be divided into two steps or multistep and carry out, may have cuprous salt to form as the intermediate product of reaction.It is generally acknowledged, electroless copper reaction mechanism is to occur by two coherent reactions, and electronics discharges in anode part reaction, in cathode portion reaction, consumes.
In the process of electroless copper, except cupric ion carries out effective redox reaction at catalytic surface, by formaldehyde, be reduced into outside metallic copper, also there are many side reactions.Main side reaction comprises: Cannizzaro (Cannizzaro) reaction 2HCHO+OH-→ CH30H+HC00-, and on-catalytic type reaction 2Cu2++HCHO+50H-→ Cu20 ↓+2HC00-+3H20, particulate by this reaction Red copper oxide is reduced out, after this, Red copper oxide may be further reduced into particulate copper again, , Cu20+2HCH0+20H-→ 2Cu ↓+2HC00-+H2 ↓+H20, these side reactions have not only consumed the effective constituent in plating solution, and the Red copper oxide producing with imperceptible powder suspension in plating solution, very difficult use removes by filter, easily cause that plating solution decomposes, if with copper codeposition, the copper deposits obtaining is loose coarse, poor with basal body binding force.In addition, entering of impurity inevitably can cause the interior partial solution of plating solution to produce a large amount of copper powders, causes the irreversible destruction of liquid medicine.
The kind of chemical copper plating solution is a lot, by the thickness of copper plate, is divided into the thin copper solutions of plating and the thick copper solutions of plating; By complexing agent kind, can be divided into tartrate type, EDETATE DISODIUM type and mixed twine mixture type etc.; By reductive agent used, be divided into the solution such as formaldehyde, hydrazine, hypophosphite, hydroborate; And according to the purposes of solution, can be divided into the solution such as plastic-metal, PCB Hole Metallization again.Development through decades, some stablizers and complexing agent are found to improve chemical bronze plating liquid one after another, modern advanced chemical bronze plating liquid has been realized continuous high density production, and the thickness of reaction is also more and more thicker, and having replaced must electroplating technique before a part of.
Chemical plating copper layer, with respect to copper electroplating layer, is mainly that plating speed, ductility and toughness all lower greatly.Although chemical plating copper layer has greater advantage in some field for electro-coppering, such as thickness evenness and be difficult to electroplate hole.But along with the application of chemical plating copper layer is more and more wider, also more and more higher to the requirement of coating performance, for example ductility and counter-bending experiment aspect.So this respect performance that improves electroless copper can further be expanded the Application Areas of electroless copper, solves the technical barrier of this area.
Summary of the invention
In order to solve chemical bronze plating liquid in prior art, be difficult to realize the raising ductility of coating and the problem of toughness, the invention provides a kind of chemical bronze plating liquid, comprise mantoquita, EDTA, sodium hydroxide, formaldehyde, VITAMIN B4, nickel potassium cyanide.
The present invention also provides a kind of electroless copper plating method, comprises workpiece to be plated is directly contacted with chemical bronze plating liquid, obtains plating piece after cleaning-drying; Wherein, described chemical bronze plating liquid is chemical bronze plating liquid provided by the invention.
The present inventor finds by a large amount of experiments, in chemical bronze plating liquid provided by the invention, by adding VITAMIN B4 and nickel potassium cyanide, in reaction process, the two is adsorbed on workpiece surface and controls the heavy copper reaction on coating, thereby the toughness that synergy has improved coating widely occurs for the two, increased cold-hot attack time and the pliability test number of times of coating.VITAMIN B4 in the present invention, is conducive to control the grown junction crystal type of copper plate, reduces cupric oxide in the residual ratio of coating.Nickel potassium cyanide and VITAMIN B4 act synergistically and control the grown junction crystal type of copper plate in chemical bronze plating liquid disclosed by the invention, reduce coating hydrionic residual, reduce cupric oxide in the residual ratio of coating, thereby have improved the purity of coating.
Therefore,, while adopting electroless plating copper plating bath provided by the invention to carry out electroless copper, can effectively improve ductility and the toughness of coating.
Embodiment
The invention provides a kind of chemical bronze plating liquid, comprise mantoquita, complexing agent, PH conditioning agent, reductive agent, VITAMIN B4 and nickel potassium cyanide; Wherein, described complexing agent comprises EDTA, and described reductive agent is formaldehyde.
In the present invention, the main salt that described mantoquita is electroless copper, for bivalent cupric ion is provided, is follow-uply reduced agent reduction and forms metallic copper, and be deposited on unplated piece surface, forms chemical plating copper layer.Wherein, described mantoquita is various water-soluble mantoquita conventional in prior art, including, but not limited to any one in copper sulfate, cupric chloride, cupric sulfate pentahydrate, anhydrous cupric sulfate, cupric chloride, cupric nitrate.
The contriver of invention finds by a large amount of experiments, in the chemical bronze plating liquid that invention provides, by adding VITAMIN B4 and nickel potassium cyanide, in reaction process, the two is adsorbed on workpiece surface and controls the heavy copper reaction on coating, thereby the toughness that synergy has improved coating widely occurs for the two, increased cold-hot attack time and the pliability test number of times of coating.VITAMIN B4 in the present invention, is conducive to control the grown junction crystal type of copper plate, reduces cupric oxide in the residual ratio of coating.Nickel potassium cyanide and VITAMIN B4 act synergistically and control the grown junction crystal type of copper plate in chemical bronze plating liquid disclosed by the invention, reduce coating hydrionic residual, reduce cupric oxide in the residual ratio of coating, thereby have improved the purity of coating.
In the present invention, described reductive agent is formaldehyde, and its content is in the usual range of existing formaldehyde reduction system chemical bronze plating liquid, and the present invention is not particularly limited.For example, in described chemical bronze plating liquid, the content of reductive agent is 1-5g/L.
Described stablizer is various stablizers common in chemical bronze plating liquid, for example, can be selected from one or more in yellow prussiate of potash, dipyridyl, methyl alcohol.As a kind of preferred implementation of the present invention, described stablizer is the mixture of yellow prussiate of potash and dipyridyl.More preferably in situation, described stablizer is yellow prussiate of potash and dipyridyl, and in described chemical bronze plating liquid, the content of yellow prussiate of potash is 0.001-0.1g/L, and the content of described dipyridyl is 0.001-
0.025g/L.
Described pH adjusting agent, for regulating the pH value of plating solution; It can be selected from one or more in sodium carbonate, sodium hydroxide, boric acid.Under preferable case, in described chemical bronze plating liquid, the content of pH adjusting agent is 5-20g/L.
As a kind of preferred implementation of the present invention, complexing agent in described chemical bronze plating liquid also comprises sodium tartrate, form stable complex compound with cupric ion, under high alkalinity condition, avoid forming copper hydroxide precipitation, also prevent that copper from directly causing plating solution to lose efficacy with formaldehyde reaction, is conducive to control the carrying out that copper facing is reacted simultaneously.
As a kind of preferred implementation of the present invention, in described chemical bronze plating liquid, also contain tensio-active agent.Tensio-active agent, can reduce the volatilization of reductive agent formaldehyde, guarantees electroless copper fluid component stability on the one hand, guarantees its work-ing life, can avoid affecting in formaldehyde volatilization process on the other hand the density of coating, guarantees quality of coating.Described tensio-active agent is selected from one or more in Sodium dodecylbenzene sulfonate, sodium lauryl sulphate, n-octyl sodium sulfate, polyoxyethylene type tensio-active agent.Under preferable case, in described chemical bronze plating liquid, the content of tensio-active agent is 0.001-0.1g/L.
According to the present invention, described each component concentration can be more preferably: mantoquita 10-12g/L, EDTA20-30g/L, sodium hydroxide 10-15g/L, formaldehyde 3-4g/L, dipyridyl 0.005-0.02g/L, yellow prussiate of potash 0.005-0.05g/L, VITAMIN B4 0.003-0.005g/L, nickel potassium cyanide 0.003-0.005g/L.VITAMIN B4 and nickel potassium cyanide excessive concentration quality of coating on the contrary can variation, and both synergies need to embody in certain concentration range.
The present invention also provides a kind of electroless copper plating method, comprises workpiece to be plated is directly contacted with chemical bronze plating liquid, obtains plating piece after cleaning-drying; Wherein, described chemical bronze plating liquid is chemical bronze plating liquid provided by the invention.
According to the present invention, preferably, the temperature of described chemical bronze plating liquid is 45-55 ℃, and be 60-300 minute described duration of contact.
The present invention also provides the preparation method of chemical bronze plating liquid of the present invention, first each component is used respectively to water dissolution, then by the mantoquita after dissolving and the aqueous solution of complexing agent, the aqueous solution that adds again PH conditioning agent, adds other component can obtain chemical bronze plating liquid of the present invention after stirring.
While adopting electroless plating copper plating bath provided by the invention to carry out electroless copper, can effectively improve ductility and the toughness of coating.
In order to make technical problem solved by the invention, technical scheme and beneficial effect clearer, below in conjunction with embodiment, the present invention is further elaborated.Should be appreciated that specific embodiment described herein, only in order to explain the present invention, is not intended to limit the present invention.
Embodiment 1-5
By the formula in table 1, prepare respectively chemical bronze plating liquid S1-S5.
Table 1
| Component | Embodiment 1/ (g/L) | Embodiment 2/ (g/L) | Embodiment 3/ (g/L) | Embodiment 4/ (g/L) | Embodiment 5/ (g/L) |
| Cupric sulfate pentahydrate | 15 | 7 | / | 16 | 8 |
| Cupric nitrate | / | / | 10 | / | / |
| EDTA | / | 10 | / | / | / |
| EDETATE SODIUM | 30 | / | 42 | 40 | 20 |
| Sodium hydroxide | 16 | / | 21 | 5 | 12 |
| VITAMIN B4 | 0.005 | 0.001 | 0.012 | 0.01 | 0.007 |
| Nickel potassium cyanide | 0.005 | 0.001 | 0.01 | 0.012 | 0.008 |
| Formaldehyde | 4 | 1 | 6 | 5 | 3 |
| Rocchelle's salt | / | 20 | 10 | 40 | 8 |
| Yellow prussiate of potash | 0.005 | 0.003 | 0.02 | 0.02 | / |
| Dipyridyl | 0.005 | 0.003 | / | 0.01 | 0.005 |
| Sodium lauryl sulphate | / | 0.005 | 0.001 | 0.1 | / |
| Sodium dodecylbenzene sulfonate | / | 0.005 | / | / | 0.12 |
| Sodium carbonate | / | 20 | / | / | / |
Comparative example 1
Compare with embodiment 1, lack component VITAMIN B4 and nickel potassium cyanide, other are identical with embodiment 1, obtain chemical bronze plating liquid DS1.
Comparative example 2
Compare with embodiment 1, with 2-mercaptobenzothiazole, replace VITAMIN B4, other are identical with embodiment 1, obtain chemical bronze plating liquid DS1.
Comparative example 3
Electroless copper plating solution described in the embodiment 1 of employing CN 201210266830.X is as the chemical bronze plating liquid DS3 of this comparative example.
Comparative example 4
Adopt < < complexing agent and the additive electrochemical research > > (electrochemistry on electroless copper impact; The 10th the 1st phase of volume; In February, 2004; Article numbering: 1006-3471(2004) 01-0014-06; Gu Xin, Wang Zhoucheng, the disclosed chemical bronze plating liquid of experimental technique Lin Changjian): CuSO45H2O 15g/L, EDETATE SODIUM 28g/L, trolamine (TEA) 15ml/L, 2,2 '-dipyridyl 5mg/L, HCHO 3g/L, tensio-active agent 0.005g/L, NaOH 13g/L, agents useful for same is analytical pure; Chemical bronze plating liquid DS4 as this comparative example.
Embodiment 6
Get the ABS plastic part of 10cm * 10cm, the degreasing fluid (NaOH 1mol/L, Na2CO3 1mol/L, sodium laurylsulfonate 0.1mol/L) that it is first dipped in to 50 ℃, soaks 8 minutes, takes out after washing.ABS plastic part after cleaning is proceeded to alligatoring agent (the chromic anhydride 150g/L of 60 ℃, sulfuric acid 150g/L) in, soak the 15min time, then proceed in the 10wt% oxalic acid solution of 30 ℃ and soak the 3min time, take out after washing, and proceed to preimpregnation 1min in the hydrochloric acid of 30wt%, then proceed to 25 ℃ of colloidal pd activation solutions (colloidal pd activation solution: get Atotech Noviganth Activator PL liquid medicine 6ml/L, added and be dissolved with 8g/L tin protochloride, in 300g/L salt aqueous acid, stir) the middle 3min of immersion, after washing, proceed in the 10wt% hydrochloric acid of 45 ℃ and soak 3min, take out after washing, obtain unplated piece.Then unplated piece integral body is put into 200mL chemical plating bath S1, the electroless plating time is 20min.After electroless plating completes, use deionized water washing surface, obtain plating piece, be designated as S10.
Embodiment 7-10
Adopt the method identical with embodiment 6 to prepare plating piece S20-S40, difference is to adopt respectively the S1 in chemical bronze plating liquid S2-S5 alternate embodiment 6.
Comparative example 5-8
Adopt the method identical with embodiment 6 to prepare plating piece DS10-DS40, difference is to adopt respectively the S1 in chemical bronze plating liquid DS1-DS4 alternate embodiment 6.
Performance test
1, resistance to crooked experiment: repeatedly bend the chemical plating copper layer on copper coin, copper layer plane bends to 60 degree by 180 degree, alternating bending, until there is crackle in chemical plating copper layer, number of bends when crackle appears in record, number of times is more, and ductility and toughness are better.
Test result is as shown in table 2.
Table 2:
| Experimental program | Resistance to crooked experiment result |
| S10 | 15 times |
| S20 | 12 times |
| S30 | 8 times |
| S40 | 10 times |
| S50 | 13 times |
| DS10 | 4 times |
| DS20 | 4 times |
| DS30 | 5 times |
| DS40 | 4 times |
From the test result of upper table 2, can find out, while adopting electroless plating copper plating bath provided by the invention to carry out electroless copper, the synergy of VITAMIN B4 and nickel potassium cyanide, can improve ductility and the toughness of coating greatly.And for other combination, we find no identical effect at present.The present invention can meet the demand of the Application Areas that change copper ductility is had higher requirements.Wherein, the VITAMIN B4 of mentioning in the document of comparative example 4 is just as stablizer or accelerator, cannot solve the technical issues that need to address of the present invention, and the chemical cooperated effect of VITAMIN B4 that the present invention should be mentioned that and nickel potassium cyanide, playing the effect that increases coating ductility and toughness, is not to use as stablizer or accelerator.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any modifications of doing within the spirit and principles in the present invention, be equal to and replace and improvement etc., within all should being included in protection scope of the present invention.
Claims (13)
1. a chemical bronze plating liquid, comprises mantoquita, complexing agent, PH conditioning agent, reductive agent, VITAMIN B4 and nickel potassium cyanide; Described complexing agent comprises EDTA and/or EDETATE SODIUM, and described reductive agent is formaldehyde.
2. chemical bronze plating liquid according to claim 1, is characterized in that, described mantoquita is selected from one or more in copper sulfate, cupric chloride, cupric nitrate, anhydrous cupric sulfate, cupric sulfate pentahydrate.
3. chemical bronze plating liquid according to claim 1, is characterized in that, the pH value scope of described chemical bronze plating liquid is 12-13.
4. according to the chemical bronze plating liquid described in claim 1-3 any one, it is characterized in that, the total amount of described chemical bronze plating liquid of take is benchmark, described each component concentration is: mantoquita 7-15g/L, complexing agent 10-40g/L, PH conditioning agent 5-20g/L, formaldehyde 1-5g/L, VITAMIN B4 0.001-0.01g/L, nickel potassium cyanide 0.001-0.01g/L.
5. according to the chemical bronze plating liquid described in claim 1-3 any one, it is characterized in that, described complexing agent also comprises Seignette salt.
6. chemical bronze plating liquid according to claim 5, is characterized in that, the total amount of described chemical bronze plating liquid of take is benchmark, and described soluble tartrate sodium content is 10-40g/L.
7. according to the chemical bronze plating liquid described in claim 1-3 any one, it is characterized in that, described chemical bronze plating liquid also comprises stablizer, and described stablizer is selected from one or more in yellow prussiate of potash, dipyridyl, methyl alcohol.
8. chemical bronze plating liquid according to claim 7, it is characterized in that, described stablizer is yellow prussiate of potash and dipyridyl, and the total amount of described chemical bronze plating liquid of take is benchmark, the content of described yellow prussiate of potash is 0.001-0.1g/L, and the content of described dipyridyl is 0.001-0.025g/L.
9. according to the chemical bronze plating liquid described in claim 1-3 any one, it is characterized in that, also comprise tensio-active agent, described tensio-active agent is selected from one or more in Sodium dodecylbenzene sulfonate, sodium lauryl sulphate, n-octyl sodium sulfate, polyoxyethylene type tensio-active agent.
10. chemical bronze plating liquid according to claim 9, is characterized in that, the total amount of described chemical bronze plating liquid of take is benchmark, and the content of described tensio-active agent is 0.001-0.1g/L.
11. according to the chemical bronze plating liquid described in claim 1-3 any one, it is characterized in that, described PH conditioning agent is sodium hydroxide.
12. 1 kinds of electroless copper plating methods, comprise workpiece to be plated are directly contacted with chemical bronze plating liquid, obtain plating piece after cleaning-drying; It is characterized in that, described chemical bronze plating liquid is the chemical bronze plating liquid described in 1-11 any one.
13. methods according to claim 12, is characterized in that, the temperature of described chemical bronze plating liquid is 45-55 ℃, and be 60-300 minute described duration of contact.
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106676502A (en) * | 2017-01-17 | 2017-05-17 | 广东成德电子科技股份有限公司 | Palladium-free copper deposition preparation process of printed circuit board |
| CN108468039A (en) * | 2018-05-24 | 2018-08-31 | 江苏时瑞电子科技有限公司 | A kind of chemical bronze plating liquid and its copper-plating technique applied in zinc oxide varistor copper electrode |
| CN110846646A (en) * | 2019-12-10 | 2020-02-28 | 卢桂珍 | ABS plastic chemical copper plating solution and preparation method thereof |
| CN111318688A (en) * | 2020-03-24 | 2020-06-23 | 昆明理工大学 | Preparation method and application of aluminum-based conductive powder |
| CN111893466A (en) * | 2020-08-05 | 2020-11-06 | 广州皓悦新材料科技有限公司 | Horizontal copper precipitation solution and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101684554A (en) * | 2008-09-23 | 2010-03-31 | 比亚迪股份有限公司 | Chemical copper plating solution for polyimide film and surface chemical copper plating method thereof |
| CN102051607A (en) * | 2009-10-29 | 2011-05-11 | 比亚迪股份有限公司 | Electroless copper plating solution |
| CN102191491A (en) * | 2010-03-10 | 2011-09-21 | 比亚迪股份有限公司 | Chemical copper-plating solution and chemical copper-plating method |
-
2012
- 2012-09-24 CN CN201210357448.XA patent/CN103668138B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101684554A (en) * | 2008-09-23 | 2010-03-31 | 比亚迪股份有限公司 | Chemical copper plating solution for polyimide film and surface chemical copper plating method thereof |
| CN102051607A (en) * | 2009-10-29 | 2011-05-11 | 比亚迪股份有限公司 | Electroless copper plating solution |
| CN102191491A (en) * | 2010-03-10 | 2011-09-21 | 比亚迪股份有限公司 | Chemical copper-plating solution and chemical copper-plating method |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106676502A (en) * | 2017-01-17 | 2017-05-17 | 广东成德电子科技股份有限公司 | Palladium-free copper deposition preparation process of printed circuit board |
| CN108468039A (en) * | 2018-05-24 | 2018-08-31 | 江苏时瑞电子科技有限公司 | A kind of chemical bronze plating liquid and its copper-plating technique applied in zinc oxide varistor copper electrode |
| CN110846646A (en) * | 2019-12-10 | 2020-02-28 | 卢桂珍 | ABS plastic chemical copper plating solution and preparation method thereof |
| CN111318688A (en) * | 2020-03-24 | 2020-06-23 | 昆明理工大学 | Preparation method and application of aluminum-based conductive powder |
| CN111893466A (en) * | 2020-08-05 | 2020-11-06 | 广州皓悦新材料科技有限公司 | Horizontal copper precipitation solution and preparation method thereof |
| CN111893466B (en) * | 2020-08-05 | 2021-03-23 | 广州皓悦新材料科技有限公司 | Horizontal copper precipitation solution and preparation method thereof |
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