CN103665850A - Thermally conductive and insulating resin composition - Google Patents
Thermally conductive and insulating resin composition Download PDFInfo
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- CN103665850A CN103665850A CN201310667856.XA CN201310667856A CN103665850A CN 103665850 A CN103665850 A CN 103665850A CN 201310667856 A CN201310667856 A CN 201310667856A CN 103665850 A CN103665850 A CN 103665850A
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- insulating resin
- heat conductive
- polymeric amide
- resin combination
- conductive insulating
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/08—Copolymers of ethene
- C08L23/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
- C08L23/0869—Acids or derivatives thereof
- C08L23/0884—Epoxide containing esters
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/02—Polyamides derived from omega-amino carboxylic acids or from lactams thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Abstract
The invention relates to modified engineering plastics and in particular relates to a thermally conductive and insulating resin composition. The composition is prepared from 15-65% of polyamides, 25-55% of filler, 0.1-3% of coupling agents, 1-22% of toughening agent, 0.2-5% of hydrolysis resistance agent, 0.1-2% of stabilizing agent, 0.1-3% of lubricating agent and 0.1-5% of nucleating agent. The thermally conductive and insulating resin composition with polyamides as base materials has the characteristics that the composition has good mechanical property, weather resistance and excellent insulativity and thermal conductivity; as the polycarbodiimide hydrolysis resistance agent is added, the hydrophilicity of polyamides can be reduced, the hydrolytic property of polyamides can be inhibited and the material stability and safety are enhanced, thus solving the problem of potential safety hazards, easily generated due to existence of moisture, of common polyamide insulating plastics; the composition can be widely applied to the industries of electronics and electricity, illumination and the like.
Description
Technical field
The present invention relates to engineering modified plastics, relate in particular to a kind of heat conductive insulating resin combination.
Background technology
As everyone knows, at LED illuminating industry, the lampshade of LED lamp adopts aluminium alloy or Electroplating Aluminum material always, and this material has the advantage of rapid heat dissipation.But in its rapid heat dissipation, aluminum metal is again electric excellence conductor.This heat conduction is conducted electricity again and not corrosion resistant metallic character, when running into water, mist, or in the situation of electric leakage, short circuit, has just brought unsafe factor, and with regard to metal itself, this specific character cannot be eliminated.Meanwhile, the destruction Of resources of manufacturing metal is large, and production energy consumption is high, and processing charges is high, and style is with low uncertainty.These factors impel polymer novel material to use as early as possible on a large scale.
Although plastics great majority there is insulativity and have corrosion-resistant, quality is light and the characteristic such as easy to process, has a unavoidable fact, thermal conductivity is very low, is the bad carrier of thermal conduction.Although in plastics field, developed heat conduction product, for example plastics+metal powder or fiber, plastics+carbon black etc., its attached effect is insulativity variation, and brings thus potential safety hazard.Therefore, can not meet that hyundai electronics is electric, illumination and the requirement in other field, must be the technical requirements of dispelling the heat and insulating.
In addition, polymeric amide is a kind of engineering plastics of high comprehensive performance, and its characteristic is strong and tough, high temperature resistant, corrosion-resistant, has self-extinguishing and good dielectric properties, in a large number for processing electrical/electronic/automotive electronics parts.Although the mechanical property of polymeric amide, electric property and Corrosion Protection are excellent, its water-absorbent cannot be avoided, and its water-intake rate can reach 2%.As everyone knows, water is electric excellence conductor, as long as there is large quantity of moisture to exist in polyamide substrate, mechanical property and dimensional stability will change, and also can be hydrolyzed, and safety performance just exists hidden danger.So, must reduce polymeric amide wetting ability, and water-disintegrable just can the reaching of suppressing polymeric amide not only insulated but also the technical requirements of the industries such as electric and illumination of heat conduction.
Summary of the invention
The object of the present invention is to provide a kind of heat conductive insulating resin combination that polymeric amide is base material of take.The technical scheme that the present invention takes is: a kind of heat conductive insulating resin combination, it is characterized in that, and described composition comprises following compositions in weight percentage and forms:
Polymeric amide 15-65%
Filler 25-55%
Coupling agent 0.1-3%
Toughner 1-22%
Hydrolysis agent 0.2-5%
Stablizer 0.1-2%
Lubricant 0.1-4%
Nucleator 0.1-5%.
Feature of the present invention is: the heat conductive insulating resin combination that the polymeric amide of take is base material has good mechanical property, weathering resistance and good insulating heat-conductive; Owing to adding the agent of polycarbodiimide hydrolysis, can reduce the wetting ability of polymeric amide, and suppress the water-disintegrable of polymeric amide, strengthen stability of material and security, thereby solved common polymeric amide insulating plastics due to the security hidden trouble that exists moisture easily to produce.Can be widely used in the industries such as electric and illumination.Embodiment
Below in conjunction with embodiment, the invention will be further described:
The polymeric amide that the present invention adopts is polyamide 6,6(example ERP27), polyamide 6 (routine M2800), polymeric amide HTN (routine RTP4400), polymeric amide 4,6 (TW341), polyamide 6 T (routine AE4200), polyamide 9T (routine N1002A), polymeric amide PPA(example RTP4000), one or more in polymeric amide 11 (routine BMV), polymeric amide 12 (routine L25 W20 X).
The filler that the present invention adopts is one or more in sapphire whisker, silicon carbide fiber, ceramic fiber, gypsum fiber, ceramics powder, hydrotalcite, kaolin, magnesium oxide, aluminum oxide, calcium oxide, zinc oxide, silicon carbide, aluminium nitride, boron nitride, wollastonite, mica.
The coupling agent that the present invention adopts is for the surface activation process of functional stuffing.Can select as silane coupling agent, titanate coupling agent and aliphatics metal-salt, or for the resin of tackiness agent, as Polyurethane or epoxy resin; Wherein, preferred silane coupling agent, more particularly: one or both in selection γ aminopropyltriethoxy silane (KH550), gamma-amino propyl trimethoxy silicane (KH1101) share.
The toughner that the present invention adopts is a kind of in polyolefin elastomer class, polyester elastomer class or nylon elastomer class.Polyolefin elastomer class: for example: ethylene-methyl acrylate-glyceryl methacrylate (routine AX8900); Polyester elastomer class: the line-type block polymer (routine P150B) that contains the hard section of polybutylene terephthalate and aliphatic polyester or polyester soft segment; Nylon elastomer class: block polyetheramides elastomerics (routine ELY2702).
The hydrolysis agent that the present invention adopts is polycarbodiimide (Stabaxol P).
The stablizer that the present invention adopts is two (2,2,6,6-tetramethyl--3-piperidines amido)-isophthaloyl amine (S-EED).
The lubricant that the present invention adopts is silicone powder, tetrafluoroethylene, a kind of in ethylene bis stearamide.The interpolation of lubricant can increase the dispersiveness of each component in polyphenylene sulfide composition, and can reach better processing characteristics.
The nucleator that the present invention adopts is montmorillonite soil, zinc oxide, one or more in silicon-dioxide.Its main purpose is to improve the mechanical property of polyphenylene sulfide, and has filled the gap that functional stuffing disperses in polyphenylene sulfide, the more important thing is functional stuffing is linked into net, reaches better heat conductive insulating performance.
Hydrolysis agent in the present invention is polycarbodiimide, and its anti-hydrolysis function can reduce the wetting ability of polymeric amide, and suppresses the water-disintegrable of polymeric amide, improves the mechanical property of polymeric amide, gives composition and better uses and safety performance.And in the preparation process of composition, what toughner and filler were distributed in polymeric amide is more even, has increased thus processing characteristics and the mechanical property of composition.
Stablizer in the present invention is two (2,2,6,6-tetramethyl--3-piperidines amido)-isophthaloyl amine (S-EED), be the multiple function stable agent of polymeric amide, it not only has good resistant function to photoaging and thermal ageing, and has improved processing stability and oilness.
Its effect of nucleator that the present invention adopts is to improve degree of crystallinity and the crystallization velocity of polymeric amide in crystallisation process, reduces spherulite size, to improve mechanical property and the use properties of polymeric amide.
The preparation method of heat conductive insulating resin combination comprises the following steps:
(1), each compositions in weight percentage is weighed, then in high-speed mixer stirring, fully mixing;
(2), send into (Nanjing Ke Ruilong CRDL-65 in air-cooled tie rod twin screw extruder, length-to-diameter ratio is 40), through screw rod shearing, mixing and conveying, material is able to abundant fusing, mixing, at extrusion temperature, be 230-320 ℃, screw speed is under 100-250 rev/min of processing condition, through extruding, cooling, last granulation, is packaged as finished product after being dried.
Embodiment 1: the weight percent of each component is:
17% polyamide 6 (M2800)
50% magnesium oxide
1.5% gamma-amino propyl trimethoxy silicane (KH1101)
1% γ aminopropyltriethoxy silane (KH550)
19% ethylene-methyl acrylate-glyceryl methacrylate (AX8900)
4% polycarbodiimide (Stabaxol P)
1.5% 2 (2,2,6,6-tetramethyl--3-piperidines amido)-isophthaloyl amine (S-EED)
3.5% ethylene bis stearamide
2.5% silicon-dioxide
The preparation method of embodiment 1 is as follows:
(1), respectively each compositions in weight percentage is weighed, then in high-speed mixer stirring, fully mixing;
(2), send into (Nanjing Ke Ruilong CRDL-65 in air-cooled tie rod twin screw extruder, length-to-diameter ratio is 40), through screw rod shearing, mixing and conveying, material is able to abundant fusing, mixing, at extrusion temperature, be 240 ℃, screw speed is under 200 revs/min of processing condition, through extruding, cooling, last granulation, is packaged as finished product after being dried.
Embodiment 2: the weight percent of each component is:
36% polymeric amide HTN (RTP 4400)
10% polymeric amide 12(L25 W20 X)
40% aluminum oxide
1.5% gamma-amino propyl trimethoxy silicane (KH1101)
6% nylon elastomer class toughner (ELY2702)
2% polycarbodiimide (Stabaxol P)
1% 2 (2,2,6,6-tetramethyl--3-piperidines amido)-isophthaloyl amine (S-EED)
2% silicone powder
1.5% zinc oxide
The preparation method of embodiment 2 is as follows:
(1), respectively above each compositions in weight percentage is weighed, then in high-speed mixer stirring, fully mixing;
(2), send into (Nanjing Ke Ruilong CRDL-65 in air-cooled tie rod twin screw extruder, length-to-diameter ratio is 40), through screw rod shearing, mixing and conveying, material is able to abundant fusing, mixing, at extrusion temperature, be 320 ℃, screw speed is under 210 revs/min of processing condition, through extruding, cooling, last granulation, is packaged as finished product after being dried.
Embodiment 3: the weight percent of each component is:
61% polymeric amide 11(BMV)
25% silicon carbide
0.5% γ aminopropyltriethoxy silane (KH550)
11.5% polyester elastomerics class toughner (P150B)
0.5% polycarbodiimide (Stabaxol P)
0.5% 2 (2,2,6,6-tetramethyl--3-piperidines amido)-isophthaloyl amine (S-EED)
0.5% polytetrafluoroethylene powder
0.5% montmorillonite soil
The preparation method of embodiment 3 is as follows:
(1), respectively above each compositions in weight percentage is weighed, then in high-speed mixer stirring, fully mixing;
(2), send into (Nanjing Ke Ruilong CRDL-65 in air-cooled tie rod twin screw extruder, length-to-diameter ratio is 40), through screw rod shearing, mixing and conveying, material is able to abundant fusing, mixing, at extrusion temperature, be 280 ℃, screw speed is under 230 revs/min of processing condition, through extruding, cooling, last granulation, is packaged as finished product after being dried.
Above three embodiment products obtained therefroms performance index after testing see the following form:
From above detected result, can find out, due to adding of hydrolysis agent, the saturated rate of moisture absorption of each embodiment all remains on very low level, has guaranteed safety in utilization of the present invention.And owing to having added silicon carbide in embodiment 3, its heat-conducting effect is best, mechanical property is also best, can promote in high-end electric industry.
In sum, the present invention has successfully solved daiamid composition and aspect heat conductive insulating and anti-hydrolytic performance, has had the difficult problem that can not meet the demands, and has indicated application direction.
Claims (9)
1. a heat conductive insulating resin combination, is characterized in that, described composition comprises following compositions in weight percentage and forms:
Polymeric amide 15-65%
Filler 25-55%
Coupling agent 0.1-3%
Toughner 1-22%
Hydrolysis agent 0.2-5%
Stablizer 0.1-2%
Lubricant 0.1-4%
Nucleator 0.1-5%.
2. a kind of heat conductive insulating resin combination as claimed in claim 1, it is characterized in that, described polymeric amide is polyamide 6,6, one or more in polyamide 6, polymeric amide HTN, polymeric amide 4,6, polyamide 6 T, polyamide 9T, polymeric amide PPA, polymeric amide 11, polymeric amide 12.
3. a kind of heat conductive insulating resin combination as claimed in claim 1, it is characterized in that, described filler is a kind of in sapphire whisker, silicon carbide fiber, ceramic fiber, gypsum fiber, ceramics powder, hydrotalcite, kaolin, magnesium oxide, aluminum oxide, calcium oxide, zinc oxide, silicon carbide, aluminium nitride, boron nitride, wollastonite, mica.
4. a kind of heat conductive insulating resin combination as claimed in claim 1, is characterized in that, described coupling agent is silicane, selects γ aminopropyltriethoxy silane, one or both in gamma-amino propyl trimethoxy silicane.
5. a kind of heat conductive insulating resin combination as claimed in claim 1, is characterized in that, described toughner is a kind of in polyolefin elastomer class, polyester elastomer class or nylon elastomer class.
6. a kind of heat conductive insulating resin combination as claimed in claim 1, is characterized in that, described hydrolysis agent is polycarbodiimide.
7. a kind of heat conductive insulating resin combination as claimed in claim 1, is characterized in that, described stablizer is two (2,2,6,6-tetramethyl--3-piperidines amido)-isophthaloyl amine.
8. a kind of heat conductive insulating resin combination as claimed in claim 1, is characterized in that, described lubricant is a kind of in silicone powder, polytetrafluoroethylene powder, ethylene bis stearamide.
9. a kind of heat conductive insulating resin combination as claimed in claim 1, is characterized in that, described nucleator is a kind of in montmorillonite soil, zinc oxide, silicon-dioxide.
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Cited By (11)
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CN104194324A (en) * | 2014-08-18 | 2014-12-10 | 东莞暨南大学研究院 | Nylon moisture retardant and preparation method of nylon moisture retardant |
CN105273402A (en) * | 2015-11-25 | 2016-01-27 | 宁波公牛电器有限公司 | Preparation and application of high-rigidity flame-retardant nylon bracket material |
CN105563631A (en) * | 2015-12-21 | 2016-05-11 | 嘉善美节陶瓷科技有限公司 | Demolding material for artificial stone and application method of demolding material |
CN106147224A (en) * | 2016-07-05 | 2016-11-23 | 上海日之升科技有限公司 | A kind of high temperature resistant, Heat conduction nylon composite material and preparation method thereof |
CN106189224A (en) * | 2016-07-22 | 2016-12-07 | 马建剑 | A kind of high tenacity high temperature resistant PA/ABS/PBI plastic alloy and preparation method thereof |
CN108239389A (en) * | 2016-12-23 | 2018-07-03 | 惠州市良化新材料有限公司 | A kind of nylon 6 of high-temp resisting high-humidity resisting enhances composite material and preparation method thereof |
CN109354862A (en) * | 2018-09-04 | 2019-02-19 | 徐州市华天塑业有限公司 | A kind of high thermal conductivity nylon material and preparation method thereof |
CN110922749A (en) * | 2019-10-26 | 2020-03-27 | 张家港大塚化学有限公司 | Preparation method of high-weather-resistance and high-reflectivity polyamide composite material for LED |
CN111286081A (en) * | 2020-02-07 | 2020-06-16 | 广州华新科智造技术有限公司 | Aluminum nitride compound, flame-retardant material containing compound and preparation method |
CN111534358A (en) * | 2020-05-09 | 2020-08-14 | 中山市特好德润滑科技有限公司 | Heat-conducting lubricating grease and preparation method and application thereof |
WO2021261147A1 (en) * | 2020-06-26 | 2021-12-30 | デクセリアルズ株式会社 | Thermally conductive resin composition, and thermally conductive sheet using same |
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CN111286081A (en) * | 2020-02-07 | 2020-06-16 | 广州华新科智造技术有限公司 | Aluminum nitride compound, flame-retardant material containing compound and preparation method |
CN111534358A (en) * | 2020-05-09 | 2020-08-14 | 中山市特好德润滑科技有限公司 | Heat-conducting lubricating grease and preparation method and application thereof |
CN111534358B (en) * | 2020-05-09 | 2022-03-29 | 中山市特好德润滑科技有限公司 | Heat-conducting lubricating grease and preparation method and application thereof |
WO2021261147A1 (en) * | 2020-06-26 | 2021-12-30 | デクセリアルズ株式会社 | Thermally conductive resin composition, and thermally conductive sheet using same |
JP6997834B1 (en) | 2020-06-26 | 2022-01-24 | デクセリアルズ株式会社 | Thermally conductive resin composition and thermally conductive sheet using it |
JP2022024210A (en) * | 2020-06-26 | 2022-02-09 | デクセリアルズ株式会社 | Heat-conductive resin composition and heat-conductive sheet using the same |
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CN114127196B (en) * | 2020-06-26 | 2023-04-25 | 迪睿合株式会社 | Thermally conductive resin composition and thermally conductive sheet using same |
US11692118B2 (en) | 2020-06-26 | 2023-07-04 | Dexerials Corporation | Thermally conductive resin composition and thermally conductive sheet using the same |
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