CN103660200A - Flexible glue runner ejector pin - Google Patents

Flexible glue runner ejector pin Download PDF

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Publication number
CN103660200A
CN103660200A CN201210359195.XA CN201210359195A CN103660200A CN 103660200 A CN103660200 A CN 103660200A CN 201210359195 A CN201210359195 A CN 201210359195A CN 103660200 A CN103660200 A CN 103660200A
Authority
CN
China
Prior art keywords
thimble
flexible glue
ejector pin
glue runner
runner
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201210359195.XA
Other languages
Chinese (zh)
Inventor
刘楠
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitac Precision Technology Kunshan Ltd
Original Assignee
Mitac Precision Technology Kunshan Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitac Precision Technology Kunshan Ltd filed Critical Mitac Precision Technology Kunshan Ltd
Priority to CN201210359195.XA priority Critical patent/CN103660200A/en
Publication of CN103660200A publication Critical patent/CN103660200A/en
Pending legal-status Critical Current

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/38Cutting-off equipment for sprues or ingates
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/38Cutting-off equipment for sprues or ingates
    • B29C2045/384Cutting-off equipment for sprues or ingates cutting the sprue by a plunger movable into the runner channel

Abstract

The invention discloses a flexible glue runner ejector pin which is applied to molds. The flexible glue runner ejector pin comprises an ejector pin countersunk head as well as an ejector pin rod, wherein the ejector pin countersunk head is arranged at the tail end of the ejector pin rod; the outer diameter of the tail end is less than that of the head end at the other end of the ejector pin rod; the head end of the ejector pin rod is in contact with a runner, and an integral transition end is also arranged between the tail end and the head end of the ejector pin rod; the outer diameter of the transition end is increased gradually in the direction from the tail end to the head end. According to the flexible glue runner ejector pin provided by the invention, a flexible glue runner and a mold plate generate a pocket hole when the flexible glue runner is arranged in a mold by changing outer diameters of different sections of the ejector pin rod, so that overflow glue falls out of the mold from the pocket hole, the phenomenon the clamping of the flexible glue runner ejector pin by the overflow glue is prevented, and the mold cost is reduced.

Description

Flexible glue runner thimble
[technical field]
The present invention relates to a kind of thimble, be specifically related to a kind of thimble for top flexible glue runner.
[background technology]
Thimble, when the flexible glue runner of top, when service time is long, easily grinds gap between thimble and runner, and because flexible glue is more liquid, glue especially easily overflows.Refer to shown in Fig. 1, the flexible glue runner thimble 10 of prior art is when the flexible glue runner 20 of top, and excessive glue makes thimble 10 easily stuck, need to change thimble or incision, has greatly increased die cost.
In view of this, be necessary to develop in fact a kind of novel flexible glue runner thimble, this novel flexible glue runner thimble can avoid overflowing glue by the stuck phenomenon appearance of thimble.
[summary of the invention]
Therefore, the object of this invention is to provide a kind of novel flexible glue runner thimble, this flexible glue runner thimble can avoid overflowing glue by the stuck phenomenon generation of thimble, has reduced die cost.
In order to achieve the above object, flexible glue runner thimble of the present invention, is applied in mould, and this flexible glue runner thimble comprises:
Thimble countersunk head; And
Thimble rod, above-mentioned thimble countersunk head is located at the tail end of this thimble rod, the outside dimension of this tail end is less than the outside dimension of thimble rod other end head end, this thimble rod head end contacts with runner, and between the tail end of this thimble rod and head end, be also provided with the transitioning end of one, it is large that the outside dimension of this transitioning end becomes gradually in the direction to head end from tail end.
Especially, described flexible glue runner thimble is column.
Especially, the outside dimension of described thimble countersunk head is greater than the outside dimension of thimble rod.
Especially, when described flexible glue runner thimble is located in mould, between the tail end of thimble rod and transitioning end and mould template, produce emptiness avoiding hole.
Compared to prior art, flexible glue runner thimble of the present invention, by the outside dimension of conversion thimble rod, thereby while making flexible glue runner in being located at mould, produce emptiness avoiding hole with mould template, make excessive glue from emptiness avoiding hole, drop out mould, avoided excessive glue that the stuck phenomenon of flexible glue runner thimble is occurred, reduced die cost.
[accompanying drawing explanation]
Fig. 1 illustrates the structural representation of prior art flexible glue runner thimble.
Fig. 2 illustrates the structural representation of flexible glue runner thimble of the present invention.
Fig. 3 illustrates the local enlarged diagram of flexible glue runner thimble of the present invention in mould.
[specific embodiment]
Refer to shown in Fig. 2, flexible glue runner thimble of the present invention, is applied in mould, and in the present embodiment, this flexible glue runner thimble 100 is column, and it comprises:
Thimble countersunk head 110; And
Thimble rod 120, above-mentioned thimble countersunk head 110 is positioned at the tail end 121 of this thimble rod 120, the outside dimension of the tail end 121 of this thimble rod 120 is less than the outside dimension of thimble rod 120 other end head ends 122, the head end 122 of this thimble rod 120 contacts with runner 200, and 122 of the tail end 121 of this thimble rod 120 and head ends are also provided with the transitioning end 123 of one, it is large that the outside dimension of this transitioning end 123 becomes gradually in the direction to head end 122 from tail end 121.This transitioning end 123 has strengthened the intensity of this flexible glue runner thimble 100, prevents that this flexible glue runner thimble 100 from fractureing.
Wherein, the outside dimension of described thimble countersunk head 110 is greater than the outside dimension of thimble rod 120.When this flexible glue runner thimble 100 is placed in to mould, in mould, be provided with corresponding holding tank located therein for this flexible glue runner thimble 100.
Refer to shown in Fig. 3, the head end 122 of thimble rod 120 matches with the holding tank of mould, for sealing; And due to the tail end 121 of thimble rod 120 and the outside dimension of transitioning end 123 less, and 300 of mould templates have produced emptiness avoiding hole 310, flexible glue runner thimble 100 is ejecting and excessive adhesive tape can entered during return in described emptiness avoiding hole 310 like this, excessive glue can drop out mould along the emptiness avoiding hole 310 of mould template 300, avoided excessive glue by the stuck phenomenon of this flexible glue runner thimble 100, reduce the action of changing thimble or inserting piece, saved die cost.

Claims (4)

1. a flexible glue runner thimble, is applied to, in mould, it is characterized in that, this flexible glue runner thimble comprises:
Thimble countersunk head; And
Thimble rod, above-mentioned thimble countersunk head is located at the tail end of this thimble rod, the outside dimension of this tail end is less than the outside dimension of thimble rod other end head end, this thimble rod head end contacts with runner, and between the tail end of this thimble rod and head end, be also provided with the transitioning end of one, it is large that the outside dimension of this transitioning end becomes gradually in the direction to head end from tail end.
2. flexible glue runner thimble according to claim 1, is characterized in that, described flexible glue runner thimble is column.
3. flexible glue runner thimble according to claim 1, is characterized in that, the outside dimension of described thimble countersunk head is greater than the outside dimension of thimble rod.
4. flexible glue runner thimble according to claim 1, is characterized in that, when described flexible glue runner thimble is located in mould, between the tail end of thimble rod and transitioning end and mould template, produces emptiness avoiding hole.
CN201210359195.XA 2012-09-25 2012-09-25 Flexible glue runner ejector pin Pending CN103660200A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201210359195.XA CN103660200A (en) 2012-09-25 2012-09-25 Flexible glue runner ejector pin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201210359195.XA CN103660200A (en) 2012-09-25 2012-09-25 Flexible glue runner ejector pin

Publications (1)

Publication Number Publication Date
CN103660200A true CN103660200A (en) 2014-03-26

Family

ID=50299570

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201210359195.XA Pending CN103660200A (en) 2012-09-25 2012-09-25 Flexible glue runner ejector pin

Country Status (1)

Country Link
CN (1) CN103660200A (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07276446A (en) * 1994-04-13 1995-10-24 Seikosha Co Ltd Injection mold device
JPH08281708A (en) * 1995-04-11 1996-10-29 Sekisui Chem Co Ltd Injection mold
CN2873470Y (en) * 2006-01-20 2007-02-28 佛山市顺德区汉达精密电子科技有限公司 Center lift-out structure
CN2886167Y (en) * 2006-02-14 2007-04-04 戴光华 Step shaft without stress concentration
CN201220465Y (en) * 2008-06-10 2009-04-15 东莞市黄江新百通模具五金加工厂 Mould centre
CN202826280U (en) * 2012-09-25 2013-03-27 汉达精密电子(昆山)有限公司 Flexible glue flow channel thimble

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07276446A (en) * 1994-04-13 1995-10-24 Seikosha Co Ltd Injection mold device
JPH08281708A (en) * 1995-04-11 1996-10-29 Sekisui Chem Co Ltd Injection mold
CN2873470Y (en) * 2006-01-20 2007-02-28 佛山市顺德区汉达精密电子科技有限公司 Center lift-out structure
CN2886167Y (en) * 2006-02-14 2007-04-04 戴光华 Step shaft without stress concentration
CN201220465Y (en) * 2008-06-10 2009-04-15 东莞市黄江新百通模具五金加工厂 Mould centre
CN202826280U (en) * 2012-09-25 2013-03-27 汉达精密电子(昆山)有限公司 Flexible glue flow channel thimble

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Application publication date: 20140326

RJ01 Rejection of invention patent application after publication