CN103646926B - A kind of pressure sensor chip installation structure - Google Patents
A kind of pressure sensor chip installation structure Download PDFInfo
- Publication number
- CN103646926B CN103646926B CN201310618184.3A CN201310618184A CN103646926B CN 103646926 B CN103646926 B CN 103646926B CN 201310618184 A CN201310618184 A CN 201310618184A CN 103646926 B CN103646926 B CN 103646926B
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- CN
- China
- Prior art keywords
- chip
- hole
- pressure sensor
- installation structure
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Measuring Fluid Pressure (AREA)
Abstract
The invention discloses a kind of pressure sensor chip installation structure, comprise substrate (1) and chip (2), substrate (1) is provided with through hole (11), chip (2) is arranged in through hole (11), the outer wall of chip (2) is connected by glue (3) with the inwall of through hole (11), pressure all can be experienced in chip (2) both sides, improves utilance and the operating efficiency of chip (2), has widened the scope of application of chip (2).
Description
Technical field
The invention belongs to pressure sensor technique field, particularly relate to a kind of pressure sensor chip installation structure.
Background technology
The chip of conventional pressure sensor directly by die bottom surface and substrate cementing, as shown in Figure 2, chip can only experience the pressure in a direction, and efficiency is low, and suitable environment is limited.
Summary of the invention
Technical problem to be solved by this invention is to provide the pressure sensor chip installation structure that pressure all can be experienced in a kind of chip both sides.
In order to solve the problems of the technologies described above, the technical solution adopted in the present invention is: a kind of pressure sensor chip installation structure, comprises substrate and chip, and described substrate is provided with through hole, described chip is arranged in through hole, and the outer wall of chip is connected by glue with the inwall of through hole.
Described chip is the chip that pressure all can be experienced in both sides.
Described chip periphery is provided with the extension that vertical chip direction extends, and described extension outer wall is connected by glue with through hole.
The invention has the advantages that, chip is arranged in the through hole of substrate, and pressure all can be experienced in chip both sides, improves utilance and the operating efficiency of chip, has widened the scope of application of chip.
Accompanying drawing explanation
Fig. 1 is the structural representation of a kind of pressure sensor chip installation structure of the present invention;
Fig. 2 is prior art structural representation;
Mark in above-mentioned figure is: 1, substrate, and 11, through hole, 2, chip, 21, extension, 3, glue.
Embodiment
Fig. 1 is the structural representation of a kind of pressure sensor chip installation structure of the present invention, and comprise substrate 1 and chip 2, substrate 1 is provided with through hole 11, and chip 2 is arranged in through hole 11, and the outer wall of chip 2 is connected by glue 3 with the inwall of through hole 11.Chip 2 is the chip that pressure all can be experienced in both sides.
Chip 2 periphery is provided with the extension 21 that vertical chip 2 direction extends, and extension 21 outer wall is connected by glue 3 with through hole 11.Be connected with through hole 11 by the outer wall of extension 21, increase the contact area of chip 2 and through hole 11, thus improve the bearing capacity of chip 2, chip 2 is worked more reliable and more stable.
After adopting above-mentioned structure, chip 2 is arranged in the through hole 11 of substrate 1, and pressure all can be experienced in chip 2 both sides, improves utilance and the operating efficiency of chip 2, has widened the scope of application of chip 2.
Above by reference to the accompanying drawings to invention has been exemplary description; obvious specific implementation of the present invention is not subject to the restrictions described above; as long as have employed the improvement of the various unsubstantialities that method of the present invention is conceived and technical scheme is carried out; or design of the present invention and technical scheme directly applied to other occasion, all within protection scope of the present invention without to improve.
Claims (2)
1. a pressure sensor chip installation structure, comprise substrate (1) and chip (2), it is characterized in that, described substrate (1) is provided with through hole (11), described chip (2) is arranged in through hole (11), and the outer wall of chip (2) is connected by glue (3) with the inwall of through hole (11);
Described chip (2) is for all experiencing the chip of pressure in both sides.
2. chip installing structure as claimed in claim 1, it is characterized in that, described chip (2) periphery is provided with the extension (21) that vertical chip (2) direction extends, and described extension (21) outer wall is connected by glue (3) with through hole (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310618184.3A CN103646926B (en) | 2013-11-27 | 2013-11-27 | A kind of pressure sensor chip installation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310618184.3A CN103646926B (en) | 2013-11-27 | 2013-11-27 | A kind of pressure sensor chip installation structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103646926A CN103646926A (en) | 2014-03-19 |
| CN103646926B true CN103646926B (en) | 2016-04-06 |
Family
ID=50252124
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310618184.3A Expired - Fee Related CN103646926B (en) | 2013-11-27 | 2013-11-27 | A kind of pressure sensor chip installation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103646926B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05187943A (en) * | 1992-01-16 | 1993-07-27 | Mitsubishi Heavy Ind Ltd | Pressure detector |
| JPH07221222A (en) * | 1994-01-27 | 1995-08-18 | Fujikura Ltd | Semiconductor |
| JPH10185718A (en) * | 1996-12-20 | 1998-07-14 | Nippon Seiki Co Ltd | Pressure defector |
| JPH10300617A (en) * | 1997-04-30 | 1998-11-13 | Matsushita Electric Works Ltd | Characteristic measuring device of pressure sensor |
-
2013
- 2013-11-27 CN CN201310618184.3A patent/CN103646926B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05187943A (en) * | 1992-01-16 | 1993-07-27 | Mitsubishi Heavy Ind Ltd | Pressure detector |
| JPH07221222A (en) * | 1994-01-27 | 1995-08-18 | Fujikura Ltd | Semiconductor |
| JPH10185718A (en) * | 1996-12-20 | 1998-07-14 | Nippon Seiki Co Ltd | Pressure defector |
| JPH10300617A (en) * | 1997-04-30 | 1998-11-13 | Matsushita Electric Works Ltd | Characteristic measuring device of pressure sensor |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103646926A (en) | 2014-03-19 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| ASS | Succession or assignment of patent right |
Owner name: WUHU ZHITONG AUTOMOBILE ELECTRONICS CO., LTD. Free format text: FORMER OWNER: WUHU TONGHE AUTO PIPELINE SYSTEM CO., LTD. Effective date: 20150611 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20150611 Address after: 8 A building, block 35, car electronics Pioneer Park, Hengshan Road, Wuhu economic and Technological Development Zone, Anhui 241009, China Applicant after: Wuhu causes the Electronics Co., Ltd. that is open to the traffic Address before: 241009 Hengshan Road economic and Technological Development Zone, Anhui, No. 26, Applicant before: Wuhu Tonhe Automobile Fluid System Co., Ltd. |
|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160406 Termination date: 20201127 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |