CN103635059B - A kind of electronic equipment - Google Patents
A kind of electronic equipment Download PDFInfo
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- CN103635059B CN103635059B CN201310554258.1A CN201310554258A CN103635059B CN 103635059 B CN103635059 B CN 103635059B CN 201310554258 A CN201310554258 A CN 201310554258A CN 103635059 B CN103635059 B CN 103635059B
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- electronic equipment
- isolator
- substrate
- circulator
- storage tank
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Abstract
The open a kind of electronic equipment of the present invention, described electronic equipment includes: substrate, and described substrate offers storage tank；Circuit board, is arranged on described substrate, described circuit board is provided with electronic device；Circulator or the core component of isolator, be arranged in described storage tank, and is electrically connected with described electronic device.
Description
Technical field
The present invention relates to electronic technology field, particularly relate to a kind of electronic equipment.
Background technology
Along with development and the progress of society of science and technology, electronic equipment has become indispensable in people's work and life
A few part.Electronic equipment generally includes housing, substrate, radiator, circuit board and circulator or isolation
Device.Substrate, radiator, circuit board and circulator or isolator are arranged in housing.
Substrate includes first surface and the second surface relative with first surface.Described circuit board and circulator or
Isolator is juxtaposed on the first surface of described substrate, and described radiator is arranged at the second of described substrate
On surface.Substrate distributes for the heat that circuit board produces is transferred to described radiator, to avoid electricity
Electronic device on the plate of road affects use because temperature is too high.Circulator or isolator are for isolation signals, ring
Shape device or isolator are connected with the electronic device on described circuit board.
Because the height of of signal isolator itself is higher, and the signal isolator of above-mentioned electronic equipment is overlapped in base
On plate, thus the cavity in causing housing is higher so that the thickness of electronic equipment is thicker, is unfavorable for that electronics sets
Standby frivolous development trend.
Summary of the invention
The application provides a kind of electronic equipment, for solving the thickness of the electronic equipment also existed in prior art
Thicker technical problem.
Embodiment of the present invention first aspect provides one electronic equipment, including: substrate, described substrate is opened
It is provided with storage tank；Circuit board, is arranged on described substrate, described circuit board is provided with electronic device；Ring
Shape device or the core component of isolator, be arranged in described storage tank, and is electrically connected with described electronic device.
In the first possible implementation of first aspect, in described storage tank, it is provided with electrodeposition of metals.
In conjunction with first aspect, in the implementation that first aspect the second is possible, described storage tank and described
Magnetic conduction sheet it is provided with between core component.
In conjunction with the implementation that first aspect, the first of first aspect or the second are possible, in first aspect
In three kinds of possible implementations, described core component includes two ferrite gyromagnet sheets, is arranged at described two
Circuit wafer between individual ferrite gyromagnet sheet and be arranged at said two ferrite gyromagnet sheet on one of them
Magnetic part.
In conjunction with first aspect first to the third arbitrary possible implementation, may first aspect the 4th kind
Implementation in, described electronic equipment also includes that cover plate, described cover plate are covered on described core component,
And be fixed on described substrate.
In conjunction with the arbitrary possible implementation of first aspect first to the 4th kind, may first aspect the 5th kind
Implementation in, described substrate has first surface and the second surface relative with first surface, described electricity
Road plate is arranged on described first surface, and described storage tank is opened on described second surface.
In conjunction with the 5th kind of possible implementation of first aspect, in the 6th kind of possible implementation of first aspect
In, described first surface offers one or more intercommunicating pore connected with described storage tank.
In conjunction with first aspect the first to the 6th kind of any one possible implementation, first aspect the 7th kind
In possible implementation, described electronic device includes power amplifier, described power amplifier and described core
Heart parts are electrically connected.
Embodiment of the present invention second aspect provides a kind of electronic equipment, including: substrate, described substrate is opened
It is provided with storage tank；Circuit board, is arranged on the first surface of described substrate, described circuit board is provided with electricity
Sub-device；Radiator, is arranged on second surface opposing with first surface on described substrate, described heat radiation
The groove relative with described storage tank is offered on device；Circulator or the core component of isolator, be arranged at institute
State in storage tank and described groove, and be electrically connected with described electronic device.
In the first possible implementation of second aspect, in described storage tank and described groove, it is provided with gold
Belong to electrodeposited coating.
In conjunction with second aspect, in the implementation that second aspect the second is possible, described storage tank and described
It is provided with magnetic conduction sheet between groove and described core component.
In conjunction with the implementation that second aspect, the first of second aspect or the second are possible, in second aspect
In three kinds of possible implementations, described core component includes two ferrite gyromagnet sheets, is arranged at described two
Circuit wafer between individual ferrite gyromagnet sheet and be arranged at said two ferrite gyromagnet sheet on one of them
Magnetic part.
In conjunction with second aspect, second aspect first to the third arbitrary possible implementation, in second party
In the possible implementation in the 4th kind of face, described electronic device includes power amplifier, described power amplifier
It is electrically connected with described core component.
The application has the beneficial effect that:
Above-mentioned electronic equipment is by offering the core component for housing circulator or isolator on substrate
Storage tank, or by offering storage tank on substrate and offer groove on a heat sink, pass through storage tank
House circulator or the core component of isolator with groove, thus avoid the core component of circulator or isolator
Overlap on substrate, to reduce the height of electronic equipment, thus reduce the thickness of electronic equipment.
Accompanying drawing explanation
Fig. 1 is the structural representation of the application the first embodiment electronic equipment；
Fig. 2 is the structural representation of the core component of the circulator of electronic equipment in Fig. 1 or isolator；
Fig. 3 is the structural representation of the application the second embodiment electronic equipment.
Detailed description of the invention
The embodiment of the present application, by providing a kind of electronic equipment, solves in prior art because of signal isolator weight
It is laminated on substrate, thus causes the thickness of electronic equipment thicker, be unfavorable for the development trend that electronic equipment is frivolous
Technical problem, reach reduce electronic equipment thickness, beneficially the frivolous development trend of electronic equipment technology effect
Really.
Technical scheme in the embodiment of the present application is for solving the problems referred to above, and general thought is as follows:
A kind of electronic equipment, including: substrate, described substrate offers storage tank；Circuit board, is arranged at
On described substrate, described circuit board is provided with electronic device；Circulator or the core component of isolator, if
It is placed in described storage tank, and is electrically connected with described electronic device.
Or, it would however also be possible to employ following scheme:
A kind of electronic equipment, including: substrate, described substrate offers storage tank；Circuit board, is arranged at
On the first surface of described substrate, described circuit board is provided with electronic device；Radiator, is arranged at described
On second surface opposing with first surface on substrate, described radiator offer relative with described storage tank
Groove；Circulator or the core component of isolator, be arranged in described storage tank and described groove, and with
Described electronic device is electrically connected.
Above-mentioned electronic equipment is by offering the core for housing circulator or isolator at heat abstractor
The storage tank of part, or by offering storage tank on substrate and offering groove on a heat sink, by accommodating
Groove and groove house circulator or the core component of isolator, thus avoid circulator or isolator to overlap
On substrate, to reduce the height of electronic equipment, thus reduce the thickness of electronic equipment, solve existing skill
In art, circulator or isolator are overlapped on substrate, thus cause the thickness of electronic equipment thicker, are unfavorable for electricity
The technical problem of the development trend that subset is frivolous, reaches to reduce the thickness of electronic equipment, beneficially electronic equipment
The technique effect of frivolous development trend.
In order to be better understood from technique scheme, below in conjunction with Figure of description and concrete embodiment party
Technique scheme is described in detail by formula.
As it is shown in figure 1, be the structural representation of the application the first better embodiment electronic equipment 100.Electricity
Subset 100 can be mobile phone, computer, TV, the network equipment etc..Electronic equipment 100 includes: substrate
11, the core component 30 of circuit board 20 and circulator or isolator.
Storage tank 111 is offered on described substrate 11.
Circuit board 20 is arranged on described substrate 11.Be provided with on described circuit board 20 electronic device 21,
22.In the present embodiment, described electronic device includes power amplifier.
The core component 30 of circulator or isolator, is arranged in described storage tank 111, and with described circuit
The electronic device 21 of plate 20 is electrically connected.The core component 30 of circulator or isolator is used for isolation signals,
As inputted, output signal will be mutually isolated.The core component 30 of circulator or isolator is common annular
Device removes the part after shell.The temperature benefit that common circulator generally includes housing, is sequentially arranged in housing
Repaying sheet, Magnet, ferrite gyromagnet sheet, circuit wafer, ferrite gyromagnet sheet, this core component is on circuit board
Operational module, therefore, can be electrically connected with other operational module, such as, with power amplifier 22
Electrical connection.
Above-mentioned electronic equipment 100 is by offering collecting circulator or the core component of isolator on the substrate 11
The storage tank 111 of 30, thus avoid the core component 30 of circulator or isolator to overlap in substrate 11
On, to reduce the height of electronic equipment 100, thus reduce the thickness of electronic equipment 100, solve existing
There are circulator or isolator in technology to be overlapped on substrate, thus cause the thickness of electronic equipment thicker, unfavorable
In the technical problem of the frivolous development trend of electronic equipment, reach to reduce the thickness of electronic equipment, beneficially electronics
The technique effect of the frivolous development trend of equipment.
In order to form magnetic confining field to the core component 30 of circulator or isolator, improve permeability, permissible
Employing following two mode:
First kind of way, directly carries out metal plating, such as electroplating iron-nickel alloy to storage tank 111 so that institute
It is provided with electrodeposition of metals in stating storage tank 111；
The second way, described storage tank 111 and described circulator or isolator core component 30 it
Between be provided with magnetic conduction sheet, such as iron plate, ferroalloy sheet etc..
Specifically, in the present embodiment, the core component 30 of described circulator or isolator is directly to put
It is placed in storage tank 111, it is not provided with housing.As in figure 2 it is shown, described circulator or isolator
Core component 30 includes two ferrite gyromagnet sheets 31, is arranged between said two ferrite gyromagnet sheet 31
Circuit wafer 32 and be arranged at the said two ferrite gyromagnet sheet 31 magnetic part 33 on one of them.?
In other embodiments, the core component 30 of described circulator or isolator is not limited to said structure and unit
Part.
Specifically, in order to prevent the core component 30 of circulator or isolator from separating with substrate 11, described electricity
Subset 100 also includes that the cover plate 40 being made up of permeability magnetic material, described cover plate 40 are covered on described circulator
Or on the core component 30 of isolator, and it is fixed on described substrate 11.
Specifically, described substrate 11 has first surface 112 and second table relative with first surface 112
Face 113, described circuit board 20 is arranged on described first surface 112, and described storage tank 111 is opened in institute
State on second surface 113.By circuit board 20 and storage tank 111 are respectively arranged at described substrate 11
First surface 112 and the second surface 113 relative with first surface 112, in order to substrate 11, circuit board
20 and the assembly and disassembly of core component 30 of circulator or isolator so that at installation and removal circulator
Or be independent of each other when the core component 30 of isolator and circuit board 20.It addition, because storage tank 111 is offered
On the second surface 113 of substrate, so that circulator or isolator are no longer set up in parallel with circuit board 20
On first surface 112, thus reducing the space that signal isolator takies, beneficially electronic equipment 100 is small-sized
The development trend changed.
It addition, offer what one or more connected with described storage tank 111 on described first surface 112
Intercommunicating pore 114.The number of intercommunicating pore 114 can according to the core component 30 of circulator or isolator need with
The number of the pin of circuit board 20 electrical connection determines.By offering intercommunicating pore 114, for circulator or isolation
Core component 30 and the described circuit board 20 of device provide path, in order to circulator or the core of isolator
Parts 30 are electrically connected with the electronic device 21 of described circuit board 20.
Above-mentioned electronic equipment 100 is by offering collecting circulator or the core component of isolator on the substrate 11
The storage tank 111 of 30, thus avoid the core component 30 of circulator or isolator to overlap in substrate 11
On, to reduce the height of electronic equipment 100 inner chamber body, thus reduce the thickness of electronic equipment 100, solve
In prior art of having determined, circulator or isolator are overlapped on substrate, thus cause the thickness of electronic equipment relatively
Thickness, is unfavorable for the technical problem of the frivolous development trend of electronic equipment, reaches to reduce the thickness of electronic equipment,
It is beneficial to the technique effect of the frivolous development trend of electronic equipment.
By being provided with electrodeposition of metals in described storage tank 111 or at described storage tank 111 and described
It is provided with magnetic conduction sheet between the core component 30 of circulator or isolator, thinks the core of circulator or isolator
Heart parts 30 form magnetic confining field, improve permeability.
It is covered on the core component 30 of described circulator or isolator by setting, and is fixed on described base
Cover plate 40 on plate 11, prevents the core component 30 of circulator or isolator from separating with substrate 11.
By circuit board 20 and storage tank 111 being respectively arranged at first surface 112 He of described substrate 11
The second surface 113 relative with first surface 112, in order to substrate 11, circuit board 20 and circulator or
The assembly and disassembly of the core component 30 of isolator so that at installation and removal circulator or the core of isolator
It is independent of each other when heart parts 30 and circuit board 20.
By offering intercommunicating pore 114, for core component 30 and the described circuit board 20 of circulator or isolator
Provide path, in order to core component 30 and the described circuit board 20 of circulator or isolator are carried out electrically
Connect.
Based on same inventive concept, the thickness at substrate 11 is less than circulator or the core component of isolator
30 height time, can use following scheme:
As it is shown on figure 3, be the structural representation of the application the second better embodiment electronic equipment 200.Electricity
Subset 200 includes: substrate 11, circuit board 20, radiator 12 and circulator or the core of isolator
Part 30.
Storage tank 111 is offered on described substrate 11.
Circuit board 20 is arranged on the first surface 112 of described substrate 11, and described circuit board 20 is arranged
There is electronic device 21,22.In the present embodiment, described electronic device includes power amplifier.
Radiator 12, is arranged on second surface 113 opposing with first surface 112 on described substrate 11,
The groove 121 relative with described storage tank 111 is offered on described radiator 12.By by described radiator
12 are arranged on described second surface 113, and described substrate 11 is for the heat produced by described circuit board 20
Conduction to described radiator 12 distributes, and thinks that circuit board 20 dispels the heat, thus prevents from leading because temperature is too high
Cause to affect the use of electronic device 21.
The core component 30 of circulator or isolator, is arranged in described storage tank 111 and described groove 121,
And be electrically connected with described electronic device 21.The core component 30 of circulator or isolator is used for isolation signals,
As inputted, output signal will be mutually isolated.The core component 30 of circulator or isolator is common annular
Device removes the part after shell.The temperature benefit that common circulator generally includes housing, is sequentially arranged in housing
Repay sheet, Magnet, ferrite gyromagnet sheet, circuit wafer, ferrite gyromagnet sheet.Specifically, described core component
It is electrically connected with described power amplifier.
Above-mentioned electronic equipment 200 is by offering storage tank 111 on the substrate 11 and offering on radiator 12
Groove 121, houses the core component 30 of circulator or isolator by storage tank 111 and groove 121, from
And avoid the core component 30 of circulator or isolator to overlap on substrate 11, set reducing electronics
The height of standby 200, thus reduce the thickness of electronic equipment 200, solve in prior art circulator or every
It is laminated on substrate from thinking highly of, thus causes the thickness of electronic equipment thicker, be unfavorable for frivolous the sending out of electronic equipment
The technical problem of exhibition trend, reaches to reduce the thickness of electronic equipment, the beneficially frivolous development trend of electronic equipment
Technique effect.
Specifically, described substrate 11 is made for metal heat-conducting material.In the present embodiment, in order to improve
Heat transfer efficiency, it is simple to the development trend that electronic equipment 200 is light, described substrate 11 is set to aluminium sheet.?
In other embodiments, described substrate 11 can be copper coin, white steel plate, iron plate etc..
In order to form magnetic confining field to the core component 30 of circulator or isolator, improve permeability, permissible
Employing following two mode:
First kind of way, directly carries out metal plating to storage tank 111 and groove 121, as electroplating iron-nickel closes
Gold so that be provided with electrodeposition of metals in described storage tank 111 and groove 121；
The second way, in described storage tank 111 and groove 121 and described circulator or the core of isolator
It is provided with magnetic conduction sheet, such as iron plate, ferroalloy sheet etc. between parts 30.
As the core component 30 of the described circulator in the first embodiment or isolator, described ring
The core component 30 of shape device or isolator includes two ferrite gyromagnet sheets 31, is arranged at said two ferrum oxygen
Circuit wafer 32 between body gyromagnet sheet 31 and be arranged at said two ferrite gyromagnet sheet 31 one of them
On magnetic part 33.In other embodiments, described circulator or isolator 30 are not limited to above-mentioned knot
Structure and element.
Above-mentioned electronic equipment 200 is by offering storage tank 111 on the substrate 11 and offering on radiator 12
Groove 121, houses the core component 30 of circulator or isolator by storage tank 111 and groove 121, from
And avoid the core component 30 of circulator or isolator to overlap on substrate 11, set reducing electronics
The height of standby 200 inner chamber body, thus reduce the thickness of electronic equipment 200, solve annular in prior art
Device or isolator are overlapped on substrate, thus cause the thickness of electronic equipment thicker, are unfavorable for that electronic equipment is light
The technical problem of thin development trend, reaches to reduce the thickness of electronic equipment, the beneficially frivolous development of electronic equipment
The technique effect of trend.
By being provided with electrodeposition of metals in described storage tank 111 and groove 121 or at described storage tank
It is provided with magnetic conduction sheet between 111 and the core component 30 of groove 121 and described circulator or isolator, thinks
The core component 30 of circulator or isolator forms magnetic confining field, improves permeability.
By circuit board 20 and storage tank 111 are respectively arranged at described substrate first surface 112 and with
The second surface 113 that first surface 112 is relative, in order to substrate 11, circuit board 20 and circulator or every
Assembly and disassembly from the core component 30 of device so that in installation and removal circulator or the core of isolator
It is independent of each other when parts 30 and circuit board 20.
By being arranged on described second surface 113 by described radiator 12, described substrate 11 is by described electricity
The heat conduction that road plate 20 produces distributes to described radiator 12, thinks that circuit board 20 dispels the heat, from
And prevent from causing affecting the use of electronic device 21 because temperature is too high.
By offering intercommunicating pore 114, for core component 30 and the described circuit board 20 of circulator or isolator
Provide path, in order to core component 30 and the described circuit board 20 of circulator or isolator are carried out electrically
Connect.
Although preferred embodiments of the present invention have been described, but those skilled in the art once know base
This creativeness concept, then can make other change and amendment to these embodiments.So, appended right is wanted
Ask and be intended to be construed to include preferred embodiment and fall into all changes and the amendment of the scope of the invention.
Obviously, those skilled in the art can carry out various change and modification without deviating from this to the present invention
Bright spirit and scope.So, if the present invention these amendment and modification belong to the claims in the present invention and
Within the scope of its equivalent technologies, then the present invention is also intended to comprise these change and modification.
Claims (5)
1. an electronic equipment, it is characterised in that described electronic equipment includes:
Substrate, described substrate offers storage tank；
Circuit board, is arranged on the first surface of described substrate, described circuit board is provided with electronic device；
Radiator, is arranged on second surface opposing with first surface on described substrate, on described radiator
Offer the groove relative with described storage tank；
Circulator or the core component of isolator, be arranged in described storage tank and described groove, and with described
Electronic device is electrically connected.
2. electronic equipment as claimed in claim 1, it is characterised in that described storage tank and described groove
Inside it is provided with electrodeposition of metals.
3. electronic equipment as claimed in claim 1, it is characterised in that described storage tank and described groove
And it is provided with magnetic conduction sheet between described core component.
4. the electronic equipment as described in any claim in claim 1-3, it is characterised in that described
Core component includes two ferrite gyromagnet sheets, the circuit wafer being arranged between said two ferrite gyromagnet sheet
And it is arranged at said two ferrite gyromagnet sheet magnetic part on one of them.
5. the electronic equipment as described in any claim in claim 1-3, it is characterised in that described
Electronic device includes that power amplifier, described power amplifier are electrically connected with described core component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310554258.1A CN103635059B (en) | 2013-11-08 | 2013-11-08 | A kind of electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310554258.1A CN103635059B (en) | 2013-11-08 | 2013-11-08 | A kind of electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103635059A CN103635059A (en) | 2014-03-12 |
| CN103635059B true CN103635059B (en) | 2016-09-28 |
Family
ID=50215529
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310554258.1A Active CN103635059B (en) | 2013-11-08 | 2013-11-08 | A kind of electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103635059B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101281901A (en) * | 2007-04-04 | 2008-10-08 | 欣相光电股份有限公司 | Multi-chip conformity type image sensing chip module and encapsulating method thereof |
| CN101421834A (en) * | 2006-04-11 | 2009-04-29 | Lg伊诺特有限公司 | Module |
| CN101777682A (en) * | 2009-01-08 | 2010-07-14 | 世达普(苏州)通信设备有限公司 | Novel casing-free microwave isolator with external magnet |
| CN103369831A (en) * | 2012-03-26 | 2013-10-23 | 纬创资通股份有限公司 | Electrical connection mechanism and connection unit thereof |
-
2013
- 2013-11-08 CN CN201310554258.1A patent/CN103635059B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101421834A (en) * | 2006-04-11 | 2009-04-29 | Lg伊诺特有限公司 | Module |
| CN101281901A (en) * | 2007-04-04 | 2008-10-08 | 欣相光电股份有限公司 | Multi-chip conformity type image sensing chip module and encapsulating method thereof |
| CN101777682A (en) * | 2009-01-08 | 2010-07-14 | 世达普(苏州)通信设备有限公司 | Novel casing-free microwave isolator with external magnet |
| CN103369831A (en) * | 2012-03-26 | 2013-10-23 | 纬创资通股份有限公司 | Electrical connection mechanism and connection unit thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103635059A (en) | 2014-03-12 |
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