CN103613931A - Antistatic organosilicon gel used for heat-conducting gasket and preparation method of the organosilicon gel - Google Patents

Antistatic organosilicon gel used for heat-conducting gasket and preparation method of the organosilicon gel Download PDF

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CN103613931A
CN103613931A CN201310497048.3A CN201310497048A CN103613931A CN 103613931 A CN103613931 A CN 103613931A CN 201310497048 A CN201310497048 A CN 201310497048A CN 103613931 A CN103613931 A CN 103613931A
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vinyl
component
viscosity
silicone gel
centipoises
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CN103613931B (en
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陈维
张丽娅
王建斌
陈田安
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Yantai Darbond Technology Co Ltd
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YANTAI DEBANG ADVANCED SILICON MATERIALS CO Ltd
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Abstract

The invention relates to antistatic organosilicon gel used for a heat-conducting gasket and a preparation method of the organosilicon gel. The organosilicon gel comprises an A component and a B component in a weight ratio of 1:1. The A component comprises following raw materials by weight: 95-99.84 parts of a basic material, 0.1-1 part of a catalyst, 0.05-2 parts of an adhesive and 0.01-2 parts of an antistatic agent. The B component comprises following raw materials by weight: 84-94.9 parts of the basic material, 5-15 parts of a cross-linking agent and 0.1-1 part of an inhibitor. The organosilicon gel prepared by the invention has good fluidity. After sulfuration, the organosilicon gel has excellent adhesive property, holding power and antistatic property.

Description

A kind of antistatic silicone gel for heat-conducting pad and preparation method thereof
Technical field
The present invention relates to a kind of antistatic silicone gel for heat-conducting pad and preparation method thereof, belong to organic silicon electronic material technology field.
Background technology
Heat-conducting pad is mainly used to fill the clearance between heater members and radiator element or metab, cover very irregular surface, heat is transmitted to metal shell or diffuser plate from discrete device or whole PCB, improves the efficiency of heating electronic package and extend its work-ing life.
At present, the material being applied on heat-conducting pad is by selecting suitable resin, then adding certain heat conductive filler, fire retardant, and pigment, softening agent and scorch retarder etc. gets a desired effect.Conventionally the resin of selecting has epoxy resin, one or more in acrylic resin and silicone resin; The temperature tolerance of epoxy resin is poor, easily ftractures, and shock proof weak effect; Acrylic resin cost is high, and condition of cure is harsh, and technique is loaded down with trivial details; Silicone resin class generally adopts silicon gel.Silicon gel application, on heat-conducting pad, can be fitted well with contact surface, gives full play to its good elasticity and restorative, adapts to pressure change and temperature fluctuation.There are some defects in the domestic silicon gel that can be applied in this field, cementability is inadequate, holds viscosity not good, and antistatic effect is poor.Low cementability can have a strong impact on the combination between colloid and base material in using for a long time, causes polluting and destroying.Polymkeric substance is because resistance own is very large, and surface is easily put aside static and caused danger, and antistatic compounds can make static leak in time.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of antistatic silicone gel for heat-conducting pad and preparation method thereof, silicon gel prepared by the present invention is that a kind of surface viscosity control is proper, and good to base material adhesivity, lasting adhesion property is desirable, cementability is strong, antistatic.
The technical scheme that the present invention solves the problems of the technologies described above is as follows: A component and B component that a kind of antistatic silicone gel for heat-conducting pad is 1:1 by weight proportion form, wherein
Described A component is comprised of the raw material of following weight part: 95～99.84 parts of base-materials, 0.1～1 part of catalyzer, 0.05～2 part of caking agent, 0.01～2 part, static inhibitor;
Described B component is comprised of the raw material of following weight part: 84～94.9 parts of base-materials, 5～15 parts of linking agents, 0.1～1 part, inhibitor;
Wherein, at base-material described in A and B, be the mixture that contains the organopolysiloxane of vinyl and contain the silicone resin of vinyl.
On the basis of technique scheme, the present invention can also do following improvement.
Further, the described organopolysiloxane containing vinyl is that vinyl bonds is combined in polysiloxane molecule chain end, molecular chain side chain or is bonded in molecule chain end and side chain.Organopolysiloxane or its mixture of vinyl polysiloxane at least containing two vinyl.
Further, the above-mentioned organopolysiloxane containing vinyl is the raw material of low volatile content, and at 150 ℃ of fugitive constituents 2 hours, mass loss was less than 0.03%, and viscosity is 100～10000 centipoises, and the content of vinyl is 0.1～10wt%, specifically sees structural formula (1);
R 1for-Vi, work as R 2during for-Me, n wherein 1>=10, n 2>=10.
R 1, R 2for-Vi, wherein n 1>=10, n 2>=10.
Adopt the beneficial effect of above-mentioned further scheme to be: by the adjustment to matrix material viscosity, consumption, to realize the control to viscosity and intensity.
Further, the resin containing vinyl is vinyl MQ resin or the MDT resin that contains vinyl.
Further, vinyl MQ resin is the raw material of low volatile content, and at 150 ℃ of fugitive constituents, mass loss in 2 hours is less than 0.5%, and viscosity is 500～10000 centipoises, and the content of vinyl is 0.01～5wt%, and molecular formula is as follows:
(Me 3siO 0.5) a(ViMe 2siO 0.5) b(SiO 2) molecular formula 1
Wherein, a=0～1.5, b=0～1.5
Further, the MDT resin of vinyl is the raw material of low volatile content, and at 150 ℃ of volatile matters, mass loss in 2 hours is less than 0.5%, and viscosity is 500～10000 centipoises, and the content of vinyl is 0.01～5wt%, and molecular formula is as follows:
(Me 3siO 0.5) a(ViMe 2siO 0.5) b(Me 2siO) (MeSiO 1.5) molecular formula 2
Wherein, a=0～1.5, b=0～1.5
Adopt the beneficial effect of above-mentioned further scheme to be: contain the MQ resin of vinyl and contain the functions such as the MDT resin of vinyl is a kind of good organosilicon supporting material, and it also has tackify, toughness reinforcing, wear-resisting, weather-proof.
Further, described linking agent is the hydrogen containing siloxane of hydrogen content 0.01～2wt%, viscosity is 10～100 centipoises, described linking agent is to contain the organic hydrogen polysiloxanes that two or more are bonded to the hydrogen atom on Siliciumatom in hydrogen containing siloxane molecule, specifically comprise, organic hydrogen polysiloxanes, the Si-H that organic hydrogen polysiloxanes, the Si-H that Si-H is bonded in hydrogen containing siloxane molecule chain end is bonded in hydrogen containing siloxane molecular chain side chain is bonded in one or more the mixture in the organic hydrogen polysiloxanes of hydrogen containing siloxane molecule chain end and side chain.Described hydrogen containing siloxane is other raw material of refining level; Specifically see structural formula (2)
Figure BDA0000399090110000031
K 1, K 2for-Me or-H, wherein have one at least for-H, n 1>=0, n 2>=10.
Adopt the beneficial effect of above-mentioned further scheme to be: the molecular structure of organic hydrogen polysiloxanes can provide the active hydrogen of certain mass mark, contribute to regulate the hardness of silicon gel, modulus and vulcanization rate etc.The organic hydrogen polysiloxanes of active hydrogen end-blocking is a kind of chainextender, regulates its consumption can adjust the intensity of silicon gel, and toughness and viscosity change the mechanical property of silicon gel.
Further, described catalyzer is platinum vinyl siloxane complex, and consumption is to account for 0.1～1.0% of A component gross weight, and platinum content is 1000～10000ppm, be preferably platinum (0)-2,4,6,8-tetramethyl--2,4,6,8-tetrem thiazolinyl cyclotetrasiloxane complex solution;
Further, the mixture of one or more in the organopolysiloxane that described caking agent is following structure, concrete as shown in structural formula (3), (4), (5), (6):
Figure BDA0000399090110000041
Wherein, n >=5,
Wherein, n >=5,
Figure BDA0000399090110000043
Wherein, n >=5,
Figure BDA0000399090110000051
Wherein, n >=5.
Adopt the beneficial effect of above-mentioned further scheme to be: adopt caking agent can improve the surface viscosity of silicon gel, the bonding force of increase and base material, reduces internal stress.
Further, described inhibitor is alkynes alcohols material; Inhibitor consumption is to account for 0.1～1.0% of B component gross weight.
Further, described alkynes alcohols material is a kind of in 3-methyl isophthalic acid-butine-3-alcohol, 1-ethynylcyclohexanol, 3-propyl group-ethyl acetylene-3-alcohol, 3-octyl group-ethyl acetylene-3-alcohol, is preferably 1-ethynylcyclohexanol;
The beneficial effect that adopts above-mentioned further scheme is adding the working hour that extends silicon gel of inhibitor, and the package stability of silicon gel is improved;
Further, the mixture of one or more in the organopolysiloxane that described static inhibitor is following structure, concrete as shown in structural formula (7) and (8):
Figure BDA0000399090110000052
Wherein, n >=10,
Figure 1
Wherein, n >=10.
The beneficial effect that adopts above-mentioned further scheme is that static inhibitor can reduce surface resistivity and electric charge enrichment, improves its antistatic property, avoids the unnecessary disasters such as presence of fire.
The invention has the beneficial effects as follows:
1) after sulfuration to the adhesivity of base material with to hold viscous force splendid, good sealing effect;
2) static resistance after sulfuration is strong;
The preparation method who the invention provides a kind of above-mentioned antistatic silicone gel for heat-conducting pad, comprising:
The preparation of A component: under 25 ℃ of conditions, by the base-material of 95～99.84 weight parts, the caking agent of the catalyzer of 0.1～1 weight part and 0.05～2 weight part, the static inhibitor of 0.01～2 weight part, joins in stirrer successively, mixes, and obtains described A component;
The preparation of B component: under 25 ℃ of conditions, by the base-material of 84～94.9 weight parts, the linking agent of 5～15 weight parts, the inhibitor of 0.1～1 weight part, joins in stirrer successively, mixes, and obtains described B component;
Under 25 ℃ of conditions, A component and B component are mixed by the weight proportion of 1:1, the sizing material of mixing is placed in the middle of the mixing raw material system of heat-conducting pad, under 0.05～-0.1MPa vacuum, deaeration is 10～40 minutes, 100～150 ℃ of heating are solidified for 0.4～2 hour.
On the basis of technique scheme, the present invention can also do following improvement.
Further, described vacuum condition is 0.09MPa;
Further, the described deaeration time is 20 minutes, specifically according to the deaeration time of heat-conducting pad material system, determines;
Further, described in the condition that is heating and curing be 125 ℃, 30 minutes, adjusted concrete set time according to the actual condition of cure of heat-conducting pad;
The preparation method's of silicon gel of the present invention beneficial effect is:
The preparation method of silicon gel of the present invention is simple to operate, process stabilizing, and operable time is long, and cementability is good, is heating and curing fast, and antistatic effect is good, excellent storage stability.
Embodiment
Below principle of the present invention and feature are described, example, only for explaining the present invention, is not intended to limit scope of the present invention.
In this manual, viscosity number refers to and at 25 ℃, adopts TA rheometer, the numerical value recording under the condition of rotating speed 60/S.The resin of A and B component and silicone oil are other raw material of refining level.
Embodiment 1
The preparation of A component: take viscosity and be 10000 centipoises as structural formula (1), wherein R 1for-Vi, R 2for both-end vinyl polysiloxane (contents of ethylene 0.1wt%) 46.95g of-Me, viscosity be 100 centipoises as structural formula (1), wherein R 1, R 2for-the end of Vi, side vinyl polysiloxane (contents of ethylene 10wt%) 15.0g, vinyl MQ resin as molecular formula 1(viscosity be 500 centipoises, contents of ethylene 5wt%) 35g, add caking agent as structural formula (3), n=5,0.05g, adds static inhibitor, as structural formula (7), n=10,2.0g, catalyst platinum (0)-2,4,6,8-tetramethyl--2,4,6,8-tetrem thiazolinyl cyclotetrasiloxane complex solution 1.0g, platinum content 1000ppm, adds in stirrer successively, mixing and stirring, obtains described A component;
The preparation of B component: take viscosity and be 500 centipoises as structural formula (1), wherein R 1for-Vi, R 2for both-end vinyl polysiloxane (contents of ethylene 0.5wt%) 79.9g of-Me, vinyl MQ resin as molecular formula 1(viscosity be 10000 centipoises, contents of ethylene=0.01wt%) 15.0g, hydrogen containing siloxane is as structural formula (2), K 1for-Me and K 2for-H, viscosity is 10 centipoises, hydrogen richness is 2.0wt%, 5.0g, 1-ethynylcyclohexanol 0.1g, adds in stirrer successively, and mixing and stirring obtains described B component;
During use, A component, B component, by weight for the proportioning of 1:1 mixes, are placed in the middle of the mixing raw material of heat-conducting pad, vacuum 0.05MPa, deaeration 40 minutes, and in 125 ℃ of heating 0.5 hour.
Embodiment 2
The preparation of A component: take viscosity and be 2000 centipoises as structural formula (1), wherein R 1for-Vi, R 2for both-end vinyl polysiloxane (contents of ethylene 0.2wt%) 77.89g of-Me, vinyl MDT resin as molecular formula 2(viscosity be 500 centipoises, contents of ethylene 5wt%) 20.0g, add caking agent as structural formula (4), n=10,2.0g, adds static inhibitor, as structural formula (8), n=20,0.01g, catalyst platinum (0)-2,4,6,8-tetramethyl--2,4,6,8-tetrem thiazolinyl cyclotetrasiloxane complex solution 0.1g, platinum content 10000ppm, adds in stirrer successively, mixing and stirring, obtains described A component;
The preparation of B component: take viscosity and be 500 centipoises as structural formula (1), wherein R 1for-Vi, R 2for both-end vinyl polysiloxane (contents of ethylene 0.5wt%) 64.0g of-Me, vinyl MDT resin as molecular formula 2(viscosity be 10000 centipoises, contents of ethylene 0.01wt%) 20.0g, hydrogen containing siloxane is as structural formula (2), K 1and K 2for-H, hydrogen content is 1.0wt%, viscosity is 100 centipoises, 15.0g, 3-methyl isophthalic acid-butine-3-alcohol 1.0g, adds in stirrer successively, and mixing and stirring obtains described B component;
During use, A component, B component, by weight for the proportioning of 1:1 mixes, are placed in the middle of the mixing raw material of heat-conducting pad, vacuum-0.1MPa, deaeration deaeration 10 minutes, and in 125 ℃ of heating 0.5 hour.
Embodiment 3
The preparation of A component: take viscosity and be 1000 centipoises as structural formula (1), wherein R 1for-Vi, R 2for both-end vinyl polysiloxane (contents of ethylene 0.3wt%) 62.2g of-Me, viscosity be 2000 centipoises as structural formula (1), wherein R 1, R 2for-the end of Vi, side vinyl polysiloxane (contents of ethylene 8wt%) 15.0g, vinyl MDT resin as molecular formula 2(viscosity be 5000 centipoises, contents of ethylene 3.6wt%) 20.0g, add caking agent as structural formula (5), n=15,1.0g, adds static inhibitor, as structural formula (7), n=20,1.2g, catalyst platinum (0)-2,4,6,8-tetramethyl--2,4,6,8-tetrem thiazolinyl cyclotetrasiloxane complex solution 0.6g, platinum content 5000ppm, adds in stirrer successively, mixing and stirring, obtains described A component;
The preparation of B component: take viscosity and be 500 centipoises as structural formula (1), wherein R 1for-Vi, R 2for both-end vinyl polysiloxane (contents of ethylene 0.5wt%) 64.5g of-Me, vinyl MQ resin as molecular formula 1(viscosity be 5000 centipoises, contents of ethylene 3.6wt%) 25.0g, hydrogen containing siloxane is as structural formula (2), K 1for-H, K 2for-Me, viscosity is 30 centipoises, hydrogen content is 0.01wt%, 4.0g, hydrogen containing siloxane is as structural formula (2), K 1for-Me and K 2for-H, viscosity is 10 centipoises, and hydrogen content is, 2.0wt%, and 6.0g, 3-propyl group-ethyl acetylene-3-alcohol 0.5g, adds in stirrer successively, and mixing and stirring obtains described B component;
During use, A component, B component, by weight for the proportioning of 1:1 mixes, are placed in the middle of the mixing raw material of heat-conducting pad, vacuum 0.09MPa, deaeration 20 minutes, and in 125 ℃ of heating 0.5 hour.
Comparative example 1
The preparation of A component: take viscosity and be 10000 centipoises as structural formula (1), wherein R 1for-Vi, R 2for both-end vinyl polysiloxane (contents of ethylene 0.1wt%) 47.0g of-Me, viscosity be 100 centipoises as structural formula (1), wherein R 1, R 2for-the end of Vi, side vinyl polysiloxane (contents of ethylene 10wt%) 15.0g, vinyl MQ resin as molecular formula 1(viscosity be 500 centipoises, contents of ethylene 5wt%) 35g, add static inhibitor, as structural formula (7), n=10,2.0g, catalyst platinum (0)-2,4,6,8-tetramethyl--2,4,6,8-tetrem thiazolinyl cyclotetrasiloxane complex solution 1.0g, platinum content 1000ppm, add successively in stirrer, mixing and stirring, obtains described A component;
The preparation of B component: take viscosity and be 500 centipoises as structural formula (1), wherein R 1for-Vi, R 2for both-end vinyl polysiloxane (contents of ethylene 0.5wt%) 79.9g of-Me, vinyl MQ resin as molecular formula 1(viscosity be 10000 centipoises, contents of ethylene=0.01wt%) 15.0g, hydrogen containing siloxane is as structural formula (2), K 1for-Me and K 2for-H, viscosity is 10 centipoises, hydrogen richness is 2.0wt%, 5.0g, 1-ethynylcyclohexanol 0.1g, adds in stirrer successively, and mixing and stirring obtains described B component;
During use, A component, B component, by weight for the proportioning of 1:1 mixes, are placed in the middle of the mixing raw material of heat-conducting pad, vacuum 0.05MPa, deaeration 40 minutes, and in 125 ℃ of heating 0.5 hour.
Comparative example 2
The preparation of A component: take viscosity and be 2000 centipoises as structural formula (1), wherein R 1for-Vi, R 2for both-end vinyl polysiloxane (contents of ethylene 0.2wt%) 77.9g of-Me, vinyl MDT resin as molecular formula 2(viscosity be 500 centipoises, contents of ethylene 5wt%) 20.0g, add caking agent as structural formula (4), n=10,2.0g, catalyst platinum (0)-2,4,6,8-tetramethyl--2,4,6,8-tetrem thiazolinyl cyclotetrasiloxane complex solution 0.1g, platinum content 10000ppm, adds in stirrer successively, mixing and stirring, obtains described A component;
The preparation of B component: take viscosity and be 500 centipoises as structural formula (1), wherein R 1for-Vi, R 2for both-end vinyl polysiloxane (contents of ethylene 0.5wt%) 64.0g of-Me, vinyl MDT resin as molecular formula 2(viscosity be 10000 centipoises, contents of ethylene 0.01wt%) 20.0g, hydrogen containing siloxane is as structural formula (2), K 1and K 2for-H, hydrogen content is 1.0wt%, viscosity is 100 centipoises, 15.0g, 3-methyl isophthalic acid-butine-3-alcohol 1.0g, adds in stirrer successively, and mixing and stirring obtains described B component;
During use, A component, B component, by weight for the proportioning of 1:1 mixes, are placed in the middle of the mixing raw material of heat-conducting pad, vacuum-0.1MPa, deaeration deaeration 10 minutes, and in 125 ℃ of heating 0.5 hour.
The present invention is the A making in each embodiment, B component, and 1:1 mixes in mass ratio, 125 ℃ of solidification values, 30 minutes time, the standard of each test event is carried out as follows, as shown in table 1.
Table 1 performance index
Figure BDA0000399090110000101
The foregoing is only preferred embodiment of the present invention, in order to limit the present invention, within the spirit and principles in the present invention not all, any modification of doing, be equal to replacement, improvement etc., within all should being included in protection scope of the present invention.

Claims (10)

1. for an antistatic silicone gel for heat-conducting pad, it is characterized in that, the A component that is 1:1 by weight proportion and B component form,
Described A component is comprised of the raw material of following weight part: 95～99.84 parts of base-materials, 0.1～1 part of catalyzer, 0.05～2 part of caking agent, 0.01～2 part, static inhibitor;
Described B component is comprised of the raw material of following weight part: 84～94.9 parts of base-materials, 5～15 parts of linking agents, 0.1～1 part, inhibitor;
Wherein, at base-material described in A and B, be the resin compound that contains the organopolysiloxane of vinyl and contain vinyl.
2. antistatic silicone gel according to claim 1, is characterized in that, the described organopolysiloxane containing vinyl is that vinyl bonds is combined on organopolysiloxane molecule chain end, molecular chain side chain or molecule chain end and side chain.
3. antistatic silicone gel according to claim 2, is characterized in that, organopolysiloxane or its mixture of the described organopolysiloxane containing vinyl at least containing two vinyl.
4. according to the arbitrary described antistatic silicone gel of claims 1 to 3, it is characterized in that, the described resin containing vinyl is vinyl MQ resin or vinyl MDT resin,
Described vinyl MQ resin, is the raw material of low volatile content, and at 150 ℃ of fugitive constituents, mass loss in 2 hours is less than 0.5%, and viscosity is 500～10000 centipoises, and the content of vinyl is 0.01～5wt%, and molecular formula is as follows:
(Me 3siO 0.5) a(ViMe 2siO 0.5) b(SiO 2) molecular formula 1
Wherein, a=0～1.5, b=0～1.5;
Described vinyl MDT resin, is the raw material of low volatile content, and at 150 ℃ of fugitive constituents, mass loss in 2 hours is less than 0.5%, and viscosity is 500～10000 centipoises, and the content of vinyl is 0.01～5wt%, and molecular formula is as follows:
(Me 3siO 0.5) a(ViMe 2siO 0.5) b(Me 2siO) (MeSiO 1.5) molecular formula 2
Wherein, a=0～1.5, b=0～1.5.
5. according to the arbitrary described antistatic silicone gel of claims 1 to 3, it is characterized in that: described catalyzer is platinum vinyl siloxane complex;
Described caking agent is one or more the mixture in the organopolysiloxane of following structure, and concrete structure formula is as follows:
Figure FDA0000399090100000021
Wherein, n >=5,
Figure FDA0000399090100000022
Wherein, n >=5,
Wherein, n >=5,
Figure FDA0000399090100000024
Wherein, n >=5,
Described static inhibitor is one or more the mixture in the organic compound of following structure, and concrete structure formula is as follows,
Wherein, n >=10,
Wherein, n >=10.
6. antistatic silicone gel according to claim 4, is characterized in that: described catalyzer is platinum vinyl siloxane complex;
Described caking agent is one or more the mixture in the organopolysiloxane of following structure, and concrete structure formula is as follows:
Figure FDA0000399090100000033
Wherein, n >=5,
Figure FDA0000399090100000034
Wherein, n >=5,
Figure FDA0000399090100000041
Wherein, n >=5,
Figure FDA0000399090100000042
Wherein, n >=5,
Described static inhibitor is one or more the mixture in the organic compound of following structure, and concrete structure formula is as follows,
Figure FDA0000399090100000043
Wherein, n >=10,
Figure FDA0000399090100000044
Wherein, n >=10.
7. antistatic silicone gel according to claim 5, it is characterized in that, described linking agent is to contain the organic hydrogen polysiloxanes that two or more are bonded to the hydrogen atom on Siliciumatom in hydrogen containing siloxane molecule, and hydrogen content is 0.01～2wt%, and viscosity is 10～100 centipoises;
Described inhibitor is alkynes alcohols material.
8. antistatic silicone gel according to claim 6, it is characterized in that, described linking agent is to contain the organic hydrogen polysiloxanes that two or more are bonded to the hydrogen atom on Siliciumatom in hydrogen containing siloxane molecule, and hydrogen content is 0.01～2wt%, and viscosity is 10～100 centipoises;
Described inhibitor is alkynes alcohols material.
9. for a preparation method for the antistatic silicone gel of heat-conducting pad, it is characterized in that, comprising:
The preparation of A component: under 25 ℃ of conditions, by the base-material of 95～99.84 weight parts, the catalyzer of 0.1～1 weight part, the caking agent of 0.05～2 weight part, the static inhibitor of 0.01～2 weight part joins in stirrer successively, mixes, and obtains described A component;
The preparation of B component: under 25 ℃ of conditions, by the base-material of 84～94.9 weight parts, the linking agent of 5～15 weight parts, the inhibitor of 0.1～1 weight part, joins in stirrer successively, mixes, and obtains described B component;
Under 25 ℃ of conditions, A component and B component are mixed by the weight proportion of 1:1, the sizing material of mixing is placed in the middle of the mixing raw material system of heat-conducting pad, under 0.05～-0.1MPa vacuum, deaeration is 10～40 minutes, 100～150 ℃ of heating are solidified for 0.4～2 hour, obtain.
10. preparation method according to claim 9, described vacuum condition is 0.08MPa, deaeration 30 minutes; The described condition being heating and curing is 125 ℃ of heating 30 minutes.
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CN111218116A (en) * 2020-02-24 2020-06-02 广东盛唐新材料技术有限公司 Low-modulus high-strength silicone rubber and preparation method thereof
CN111592766A (en) * 2020-05-20 2020-08-28 宿迁市同创化工科技股份有限公司 Preparation method of high-insulation solvent-free silicone resin for composite insulator
CN113480854A (en) * 2021-07-14 2021-10-08 中广核达胜加速器技术有限公司 Heat-conducting silica gel sheet and preparation method thereof
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CN113881237A (en) * 2021-11-02 2022-01-04 湖北航天化学技术研究所 Heat-conducting gel and preparation method thereof
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CN105368053B (en) * 2015-11-23 2018-06-12 苏州盖德精细材料有限公司 A kind of single-component organic silicon heat-conducting glue and preparation method thereof
CN108286195A (en) * 2017-11-17 2018-07-17 启东纳恩新材料有限公司 A kind of expansion type organosilicon synthetic leather and preparation method thereof
CN111218116A (en) * 2020-02-24 2020-06-02 广东盛唐新材料技术有限公司 Low-modulus high-strength silicone rubber and preparation method thereof
CN111218116B (en) * 2020-02-24 2022-02-22 广东盛唐新材料技术有限公司 Low-modulus high-strength silicone rubber and preparation method thereof
CN111592766A (en) * 2020-05-20 2020-08-28 宿迁市同创化工科技股份有限公司 Preparation method of high-insulation solvent-free silicone resin for composite insulator
CN113480854A (en) * 2021-07-14 2021-10-08 中广核达胜加速器技术有限公司 Heat-conducting silica gel sheet and preparation method thereof
CN113698911A (en) * 2021-08-25 2021-11-26 杭州之江新材料有限公司 Organic silicon gel and preparation method thereof
CN113881237A (en) * 2021-11-02 2022-01-04 湖北航天化学技术研究所 Heat-conducting gel and preparation method thereof
CN115595116A (en) * 2022-10-24 2023-01-13 中山市皇冠胶粘制品有限公司（Cn） Silica gel, preparation method thereof and electronic product

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