CN103602093A - High temperature resistant PTC composite material - Google Patents
High temperature resistant PTC composite material Download PDFInfo
- Publication number
- CN103602093A CN103602093A CN201310513660.5A CN201310513660A CN103602093A CN 103602093 A CN103602093 A CN 103602093A CN 201310513660 A CN201310513660 A CN 201310513660A CN 103602093 A CN103602093 A CN 103602093A
- Authority
- CN
- China
- Prior art keywords
- parts
- temperature resistant
- ptc
- matrix material
- composite material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002131 composite material Substances 0.000 title abstract description 5
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 9
- 229920000642 polymer Polymers 0.000 claims abstract description 9
- 229920005989 resin Polymers 0.000 claims abstract description 5
- 239000011347 resin Substances 0.000 claims abstract description 5
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 4
- 239000011159 matrix material Substances 0.000 claims description 18
- 239000012752 auxiliary agent Substances 0.000 claims description 6
- 150000008064 anhydrides Chemical group 0.000 claims description 2
- 238000004132 cross linking Methods 0.000 claims description 2
- 239000006185 dispersion Substances 0.000 claims description 2
- 239000003063 flame retardant Substances 0.000 claims description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 2
- 239000003112 inhibitor Substances 0.000 claims description 2
- 230000003647 oxidation Effects 0.000 claims description 2
- 238000007254 oxidation reaction Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 10
- 239000000919 ceramic Substances 0.000 abstract description 5
- 239000002245 particle Substances 0.000 abstract description 5
- 239000002904 solvent Substances 0.000 abstract description 5
- 229920001187 thermosetting polymer Polymers 0.000 abstract description 5
- 239000003822 epoxy resin Substances 0.000 abstract description 4
- 238000010438 heat treatment Methods 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract description 4
- 229920000647 polyepoxide Polymers 0.000 abstract description 4
- 238000005516 engineering process Methods 0.000 abstract description 2
- 230000007613 environmental effect Effects 0.000 abstract description 2
- 239000011148 porous material Substances 0.000 abstract description 2
- 238000010790 dilution Methods 0.000 abstract 1
- 239000012895 dilution Substances 0.000 abstract 1
- 239000000945 filler Substances 0.000 abstract 1
- 230000005855 radiation Effects 0.000 abstract 1
- 239000004698 Polyethylene Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000004634 thermosetting polymer Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000008186 active pharmaceutical agent Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Thermistors And Varistors (AREA)
Abstract
The invention discloses a high temperature resistant PTC (positive temperature coefficient) composite material. The PTC composite material comprises, by weight, 10-20 parts of a polymer filler, 5-10 parts of an epoxy resin, 40-80 parts of a conductive ceramic particle, 5-10 parts of a curing agent and 5-10 parts of other assistants. The whole processing and making process of the PTC composite material has the advantages of no solvent, no radiation, environmental protection and safety. The disadvantages of long processing technology and complex heat treatment process of a thermoplastic resin, and the solvent dilution needing and solvent volatilization of a thermosetting resin are simultaneously overcome. A polymer PTC chip obtained in the invention has a room temperature resistor of 15momega; and the solvent-free chip material has extremely few pores, and has a highest peeling strength reaching 3.9kg/cm.
Description
Technical field
The present invention relates to a kind of PTC composition, be specifically related to a kind of high-temperature resistant PTC matrix material.
Background technology
PTC (Positive Temperature Coefficient) material is the conductive heat-sensitive material with positive temperature coefficient, in narrower temperature range, the resistivity of this material can sharply increase along with the rising of temperature (can increase 1.5～1.8 orders of magnitude).Exist a temperature (Curie temperature Tc, below temperature, it has semi-conductive characteristic at this, and more than temperature transmits isolator characteristic at this) that makes its electroconductibility generation drastic change.The automatic control heating unit that utilizes this characteristic to make, after applying certain interchange or volts DS, can heat up rapidly, and resistance also increases rapidly, and constant in preset temperature, thereby plays temperature adjustment function and sensitive switching effect.
Polymer matrix PTC material be take macromolecular material as matrix, by adding conductive filler material (carbon black, carbon fiber, metal-powder, steel fiber etc.), adopt to disperse compound, lamination is compound and form the modes such as surface conduction film and a kind of heterogeneous composite high-molecular conduction system that makes.The most frequently used polymer matrix PTC material is polyethylene/carbon ink (PE/CB) system, and its Curie temperature is between 110～120 ℃.
Current most macromolecular self-regulating heating tape exists that starting current is large, companion's hot temperature degree is low, the shortcoming of unstable properties, and along with the increase of duration of service, its resistance to elevated temperatures and other safety indexs all progressively reduce, and have very large potential safety hazard.
Summary of the invention
The object of the invention is to for the deficiencies in the prior art, a kind of long service life, stable performance, PTC matrix material that resistance to elevated temperatures is good are provided.
Above-mentioned purpose of the present invention is achieved by the following scheme:
A high-temperature resistant PTC matrix material, described PTC matrix material comprises the component of following weight parts:
As improvement of the present invention, a kind of high-temperature resistant PTC matrix material, described PTC matrix material comprises the component of following weight parts:
Above-mentioned solidifying agent is the organism that contains two or more anhydride groups or active hydrogen group.
Above-mentioned other auxiliary agent comprises oxidation inhibitor, crosslinking sensitizer, fire retardant, stablizer and dispersion agent.
Above-mentioned polymer carrier is a kind of or its multiple combination of thermoplastic resin, modified heat convertible resin, rubber.
PTC matrix material of the present invention possesses direct ability to cure, without after fixing; Solidify with moulding one step and complete, without high-temperature mixing; Whole processing and making process is solvent-free, radiationless, environmental friendliness, green safety.Overcome that thermoplastic resin complete processing is long, heat treatment process is complicated and thermosetting resin needs the shortcoming of solvent cut, solvent evaporates simultaneously.Meanwhile, high polymer PTC chip room temperature resistance of the present invention is low to moderate 15m Ω; The few pore of solvent-free core, stripping strength is up to 3.9kg/cm.
Embodiment
Embodiment 1
The weight part of each component is as follows: 15 parts of polymer carriers; 5 parts of epoxy resin; 60 parts, conductivity ceramics particle; 6 parts, solidifying agent; 6 parts of other auxiliary agents.
Preparation process is as follows:
(1) described thermosetting resin, solidifying agent, polymer carrier, conductivity ceramics particle and other auxiliary agents being put into container stirs 5～60 minutes in the ultrasound bath of 40～100 ℃;
(2) surface of metal electrode is filled/be coated on to the slurry (1) being made, then cover upper another layer of metal electrode;
(3) vacuum hotpressing curing molding, makes thermosetting polymer PTC Sandwich type combined board material;
(4) described thermosetting polymer PTC Sandwich type combined board material is cut to finished product.
Embodiment 2
The weight part of each component is as follows: 20 parts of molecular stuffings; 10 parts of epoxy resin; 80 parts, conductivity ceramics particle; 10 parts, solidifying agent; 10 parts of other auxiliary agents.
Embodiment 3
The weight part of each component is as follows: 10 parts of molecular stuffings; 5 parts of epoxy resin; 40 parts, conductivity ceramics particle; 5 parts, solidifying agent; 5 parts of other auxiliary agents.
Claims (5)
1. a high-temperature resistant PTC matrix material, is characterized in that, described PTC matrix material comprises the component of following weight parts:
2. a kind of high-temperature resistant PTC matrix material according to claim 1, is characterized in that, described PTC matrix material comprises the component of following weight parts:
3. a kind of high-temperature resistant PTC matrix material according to claim 1 and 2, is characterized in that: described solidifying agent is the organism that contains two or more anhydride groups or active hydrogen group.
4. a kind of high-temperature resistant PTC matrix material according to claim 1 and 2, is characterized in that: described other auxiliary agent comprises oxidation inhibitor, crosslinking sensitizer, fire retardant, stablizer and dispersion agent.
5. a kind of high-temperature resistant PTC matrix material according to claim 1 and 2, is characterized in that: described polymer carrier is a kind of or its multiple combination of thermoplastic resin, modified heat convertible resin, rubber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310513660.5A CN103602093A (en) | 2013-10-25 | 2013-10-25 | High temperature resistant PTC composite material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310513660.5A CN103602093A (en) | 2013-10-25 | 2013-10-25 | High temperature resistant PTC composite material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103602093A true CN103602093A (en) | 2014-02-26 |
Family
ID=50120364
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310513660.5A Pending CN103602093A (en) | 2013-10-25 | 2013-10-25 | High temperature resistant PTC composite material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103602093A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005294550A (en) * | 2004-03-31 | 2005-10-20 | Tdk Corp | Organic positive characteristic thermistor |
| CN101597396A (en) * | 2009-07-02 | 2009-12-09 | 浙江华源电热有限公司 | Polymer-based positive temperature coefficient thermistor material |
| CN102660106A (en) * | 2012-05-18 | 2012-09-12 | 上海神沃电子有限公司 | Phenylthiocarbamide (PTC) composite material and PTC chip prepared by same and preparation method |
-
2013
- 2013-10-25 CN CN201310513660.5A patent/CN103602093A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005294550A (en) * | 2004-03-31 | 2005-10-20 | Tdk Corp | Organic positive characteristic thermistor |
| CN101597396A (en) * | 2009-07-02 | 2009-12-09 | 浙江华源电热有限公司 | Polymer-based positive temperature coefficient thermistor material |
| CN102660106A (en) * | 2012-05-18 | 2012-09-12 | 上海神沃电子有限公司 | Phenylthiocarbamide (PTC) composite material and PTC chip prepared by same and preparation method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105778740B (en) | Graphene conductive coating, preparation method and application | |
| CN103476158B (en) | PTC composite material heating film and manufacturing method and application thereof | |
| CN102660106A (en) | Phenylthiocarbamide (PTC) composite material and PTC chip prepared by same and preparation method | |
| CN106098145B (en) | A kind of low-temperature cured conductive paste based on flexible parent metal and preparation method thereof | |
| KR101637903B1 (en) | Heater using heating paste composition and manufacturing method thereof | |
| CN109852274B (en) | Graphene heat-conducting adhesive film and preparation process thereof | |
| US20220240351A1 (en) | Self-regulating electric heating film and preparation method and use thereof | |
| CN103627101A (en) | Preparation method and applications of thermosetting phenolic resin coated hollow glass microspheres | |
| Vaisakh et al. | Effect of nano/micro‐mixed ceramic fillers on the dielectric and thermal properties of epoxy polymer composites | |
| CN104202846B (en) | Rollable exothermic plastic material | |
| CN104151825A (en) | Thermally-conductive insulating polysulfone composite material and preparation method thereof | |
| KR20140114187A (en) | The plate heating element applied a coating fabric having an even surface and the manufacturing method thereof | |
| KR101993883B1 (en) | Method for Manufacturing Non Metallic Silicon Complex Using Nano Hole of CNT and the Silicon Complex | |
| CN103602093A (en) | High temperature resistant PTC composite material | |
| CN105966019B (en) | For the heat conduction graphite patch of adhesive tape | |
| KR101348950B1 (en) | Via paste for non-sintering ceramic hybrid substrate and producing method the same | |
| CN103694640A (en) | Preparation method of conductive thermo-cured epoxy resin system | |
| CN106675360A (en) | Anti-static polyether ketone ketone powder coating and preparation method thereof | |
| CN102360587A (en) | Low-temperature halogen-free high-conductivity carbon paste and preparation method thereof | |
| WO2024012511A1 (en) | Self-temperature-limiting far-infrared carbon-fiber composite planar electric-heating material and preparation method therefor | |
| CN108048011A (en) | A kind of heat dissipation mica tape | |
| CN105038626B (en) | Compound two-sided tape | |
| CN102816380B (en) | Heat tracing cable and preparation method thereof | |
| CN106700423A (en) | Polycarbonate insulating heat-conducting composite material and preparation method thereof | |
| KR102792105B1 (en) | Plate heater |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140226 |