CN103589110A - Polymer PTC composite material and method for preparing polymer PTC chip by using the material - Google Patents
Polymer PTC composite material and method for preparing polymer PTC chip by using the material Download PDFInfo
- Publication number
- CN103589110A CN103589110A CN201210287247.7A CN201210287247A CN103589110A CN 103589110 A CN103589110 A CN 103589110A CN 201210287247 A CN201210287247 A CN 201210287247A CN 103589110 A CN103589110 A CN 103589110A
- Authority
- CN
- China
- Prior art keywords
- high molecular
- matrix material
- polymer
- material according
- polymer ptc
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Thermistors And Varistors (AREA)
Abstract
The invention discloses a polymer PTC composite material and a method for preparing a polymer PTC chip by using the material. The material is composed of 4%-20% of thermosetting resin, 1%-20% of a curing agent, 1%-20% of a polymer filler, 40%-90% of metal conductive particles and 0.5%-10% of other additives. The method is below: at room temperature, conducting mixing on the components of the material according to the ratio into a homogeneous slurry; then coating the slurry on the surface of a layer of metal foil electrode, then covering another layer of metal foil electrode, and carrying out hot pressing curing molding on a press vulcanizer, so as to prepare the polymer PTC composite sheet; finally cutting the material to obtain polymer PTC chips. The polymer PTC chip prepared from the polymer PTC composite material provided by the invention has the advantages of high PTC strength, low resistance, good electrical performance, wide scope of application, low requirements for production equipment and simple processing technology, and is suitable for industrial mass production.
Description
Technical field
The present invention relates to a kind of electronic element device materials for overcurrent protection, specifically, a kind of method that relates to high molecular PTC matrix material and made high polymer PTC chip by described material.
Background technology
High molecular PTC matrix material is mainly by high molecular polymer and be dispersed in its inner conductive filler material and form, when lower temperature, present lower resistivity, and work as temperature, be elevated to it more than high molecular polymer fusing point, namely during so-called " shutoff " temperature, polymkeric substance, because crystalline region melts, expands suddenly by changing mutually generation volume, causes the hurried rising of resistivity.Conventional polymer materials comprises the thermoplastic resins such as polyethylene, polyvinylidene difluoride (PVDF), polypropylene, polystyrene, EVA, EAA, EBA at present, and conductive filler material comprises carbon black, graphite, charcoal fiber, nickel powder, carbonized titanium powder, tungsten carbide powder etc.Also comprise some processing aids, dispersion agent, oxidation inhibitor, fire retardant, coupling agent, linking agent etc.This class material has been made thermistor; be applied to the overcurrent protection setting of circuit; at hyundai electronics electric field, be used widely, the electronic devices and components of this type of matrix material and formation thereof are generally referred to as high molecular PTC (positive temperature coefficient) material/element.
At present, the main macromolecule resin using in the synthetic manufacture of high molecular PTC material is thermoplastic resin.Thermoplastic resin is added to conductive filler material at high temperature fused state, through dispersing and mixing, calendering formation, laminating tinsel electrode, make high polymer PTC chip.But thermoplastic resin need to could mix with conductive filler material and process under high temperature fused state, complex process is wayward, brings very big inconvenience to the manufacturing of high molecular PTC.
Chinese patent CN200610148189.4 discloses a kind ofly take thermosetting resin as base material, nickel powder is that conducting particles and other auxiliary agents are prepared high molecular PTC matrix material and preparation method thereof, although can overcoming thermoplastic resin, this patented technology makes the existing a series of defects of high molecular PTC matrix material, have advantages of simple for process, but it is less that this patented technology is limited by the thermosetting resin coefficient of expansion, there is no the restriction obviously changing mutually, can not obtain the obvious product of ptc characteristics, and only can take nickel powder as conducting particles, narrow application range, and in mixing process, need to heat, in industrialization, still have limitation.
Summary of the invention
The problems referred to above that exist for prior art, the object of this invention is to provide the high molecular PTC matrix material that a kind of complete processing is simple, resistance is low, applied widely, PTC intensity is high and the method for being made high polymer PTC chip by described material.
For achieving the above object, the technical solution used in the present invention is as follows:
A matrix material, is comprised of by following mass percent thermosetting resin, solidifying agent, polymer carrier, metal conductive particles and other auxiliary agent:
The mass percent sum of above-mentioned each component is 100%; Described thermosetting resin is epoxy resin; Described solidifying agent is selected from a kind of or its composition in acid anhydride type curing agent, aliphatics amine solidifying agent, aliphatic amide type solidifying agent, aromatic tertiary amine solidifying agent, boron amine curing agent, Dyhard RU 100 class solidifying agent; Described polymer carrier is crystallization or hemicrystalline high molecular polymer; Described other auxiliary agent is selected from a kind of or its composition in curing catalyst, fire retardant, expanding material.
As a kind of preferred version, the oxirane value 0.30～0.60 of described epoxy resin.
As a kind of preferred version, described solidifying agent is acid anhydride type curing agent or Dyhard RU 100 class solidifying agent.
As a kind of preferred version, described polymer carrier is selected from a kind of or its composition in polyethylene, polypropylene, polyvinylidene difluoride (PVDF), ethylene acrylic acid co polymer and the nylon of crystallization or hemicrystalline.
As further preferred version, described polymer carrier is polyethylene.
As a kind of preferred version, the shared mass percent of described polymer carrier is 5%～15%.
As a kind of preferred version, described metal conductive particles is selected from a kind of or its composition in nickel powder, silver powder and Stainless Steel Powder.
As a kind of preferred version, the shared mass percent of described metal conductive particles is 60%～90%.
As a kind of preferred version, the shared mass percent of described other auxiliary agent is 1%～5%.
A kind of method of being made high molecular PTC chip by described high molecular PTC matrix material, it is characterized in that, comprise the steps: at room temperature, described thermosetting resin, solidifying agent, polymer carrier, metal conductive particles and other auxiliary agent are put into container by proportioning, mechanical stirring 5～10 minutes, then utilize three-roller to grind 1～3 time, make the slurry mixing; Described slurry is coated on to layer of metal foil electrode surface, and then covers upper another layer of metal foil electrode; Hot-press solidifying moulding on vulcanizing press, makes high molecular PTC composite board; Cut into high polymer PTC chip.
Compared with prior art, the present invention's unusual effect specific as follows:
Because the present invention has added the polymer carrier with certain degree of crystallinity in thermosetting resin matrix, in the time of near temperature is elevated to polymer carrier fusing point, the volume of polymer carrier can expand suddenly, thereby makes the PTC intensity of high molecular PTC matrix material obtain greatly improving.Experimental result shows, the high polymer PTC chip of being made by high molecular PTC matrix material provided by the invention has obvious ptc characteristics, and PTC intensity is high, and resistance is low; After rush of current repeatedly or long-time energising, resistance value has no significant change, and has preferably resistance to electric current shock resistance and withstand voltage properties.In addition, the conducting particles in high molecular PTC matrix material provided by the invention can be selected other metal conductive particles except nickel powder, and the scope of application is more wide compared with prior art; And complete processing is simple, without the heating batch mixing that heats up, only at room temperature just can complete the batch mixing pulping process of each component, low to production unit requirement, energy-conserving and environment-protective, are applicable to industrialized production, have practical value, have a extensive future.
Accompanying drawing explanation
Fig. 1 is resistance-temperature characteristics curve (R-T curve) the contrast figure of the high polymer PTC chip of embodiment 1～6 made.
Embodiment
Below in conjunction with embodiment to the present invention do further in detail, intactly explanation.In following embodiment:
Epoxy resin used: originate from the bright Chemical Co., Ltd. in Wuxi, the trade mark is E-51;
Crystallization used or hemicrystalline high molecular polymer are that median size is the high density polyethylene(HDPE) powder of 10 microns, originate from and raise sub-petrochemical industry 5000S, pulverize at low temperature;
Acid anhydride type curing agent used is HK-021, originates from the clear and bright Chemical Co., Ltd. in Wenzhou;
Dyhard RU 100 class solidifying agent used is HTP-302, originates from Suzhou Sheng Jie Special Resin company limited;
Nickel powder used: the trade mark is T255, originates from INCO company, and median size is 2.2～2.8 microns;
Silver powder used: originate from Ningbo Jingxin Electron Material Co., Ltd., median size is 0.6～1.1 micron;
Curing catalyst used is imidazoles, and chemical pure originates from Wuhan Xin Runde Chemical Co., Ltd.;
Expanding material used is silane coupling agent, and the trade mark is KBM-903, originates from Japan XINYUE;
Fire retardant used is magnesium hydroxide, and the trade mark is M-SO, originates from Zhengzhou Fulong New Material Technology Co., Ltd..
Embodiment
At room temperature, thermosetting resin, solidifying agent, crystallization or hemicrystalline high molecular polymer, metal conductive particles and other auxiliary agent are added in container by each component proportion shown in table 1, mechanical stirring 5～10 minutes, then grinds and makes the slurry mixing 1～3 time through three-roller; The above-mentioned slurry making is coated on to layer of metal foil electrode surface, then covers another layer of metal foil electrode; On vulcanizing press, in 180 ℃ of hot pressing, within 1～3 hour, make curing molding, then cold pressing to room temperature, making thickness is 0.25～0.30mm, the high molecular PTC composite board that length and width are 200mm*100mm; Cut into the sheet that length and width are 3mm*4mm, obtain described high molecular PTC chip.
Each component proportion of table 1 (mass parts)
On the both sides metal electrode of the polymer PCT of made chip, difference welding pin is so that electric performance test.
1, resistance-temperature characteristics curve (R-T curve) detects
In program-control baking oven, according to the temperature rise rate of 1 ℃/min, be warming up to 200 ℃ from 30 ℃, the high molecular PTC chip that detects embodiment 1～6 made in temperature-rise period is the zero-power resistance under different temperature points respectively, and specific experiment result as shown in Figure 1; As seen from Figure 1: the high molecular PTC chip by made of the present invention has obvious ptc characteristics.
2, resistance to rush of current Performance Detection
By the high polymer PTC chip of embodiment 1～6 made respectively at DC 6V, rush of current under 50A, conduction time 6s, time of having a rest 120s, circulates 200 times, records resistance change, concrete detected result is shown in Table 2.
The resistance to rush of current performance test results of table 2
| | Embodiment | 1 | Embodiment 2 | Embodiment 3 | Embodiment 4 | Embodiment 5 | Embodiment 6 |
| R 0Average (m Ω) | 35 | 23 | 39 | 14 | 45 | 32 | |
| R 200Average (m Ω) | 74 | 36 | 58 | 29 | 71 | 52 |
From table 2: by the high polymer PTC chip of made of the present invention, through after rush of current repeatedly, resistance change is little, has preferably resistance to rush of current performance.
3, withstand voltage properties detects
By the high polymer PTC chip of embodiment 1～6 made, respectively at DC 6V, rush of current under 50A, continuously 48 hours conduction time, records resistance change, and concrete detected result is shown in Table 3.
Table 3 withstand voltage properties detected result
| | Embodiment | 1 | Embodiment 2 | Embodiment 3 | Embodiment 4 | Embodiment 5 | Embodiment 6 |
| R 0Average (m Ω) | 35 | 23 | 39 | 14 | 45 | 32 | |
| R 48Average (m Ω) | 54 | 38 | 59 | 19 | 51 | 44 |
From table 3: by the high polymer PTC chip of made of the present invention, after long-time continuous energising, resistance change is little, has preferably withstand voltage properties.
To sum up experimental result is visible: by the high polymer PTC chip of made of the present invention, have the advantages such as complete processing is simple, resistance is low, PTC intensity is high, good electrical property.
Finally be necessary described herein: above embodiment is only for being described in more detail technical scheme of the present invention; can not be interpreted as limiting the scope of the invention, some nonessential improvement that those skilled in the art's foregoing according to the present invention is made and adjustment all belong to protection scope of the present invention.
Claims (10)
1. a high molecular PTC matrix material, is characterized in that, thermosetting resin, solidifying agent, polymer carrier, metal conductive particles and other auxiliary agent, by following mass percent, consists of:
The mass percent sum of above-mentioned each component is 100%; Described thermosetting resin is epoxy resin; Described solidifying agent is selected from a kind of or its composition in acid anhydride type curing agent, aliphatics amine solidifying agent, aliphatic amide type solidifying agent, aromatic tertiary amine solidifying agent, boron amine curing agent, Dyhard RU 100 class solidifying agent; Described polymer carrier is crystallization or hemicrystalline high molecular polymer; Described other auxiliary agent is selected from a kind of or its composition in curing catalyst, fire retardant, expanding material.
2. high molecular PTC matrix material according to claim 1, is characterized in that: the oxirane value of described epoxy resin is 0.3～0.6.
3. high molecular PTC matrix material according to claim 1, is characterized in that: described solidifying agent is acid anhydride type curing agent or Dyhard RU 100 class solidifying agent.
4. high molecular PTC matrix material according to claim 1, is characterized in that: described polymer carrier is selected from a kind of or its composition in polyethylene, polypropylene, polyvinylidene difluoride (PVDF), ethylene acrylic acid co polymer and the nylon of crystallization or hemicrystalline.
5. high molecular PTC matrix material according to claim 4, is characterized in that: described polymer carrier is polyethylene.
6. high molecular PTC matrix material according to claim 1, is characterized in that: the shared mass percent of described polymer carrier is 5%～15%.
7. high molecular PTC matrix material according to claim 1, is characterized in that: described metal conductive particles is selected from a kind of or its composition in nickel powder, silver powder and Stainless Steel Powder.
8. high molecular PTC matrix material according to claim 1, is characterized in that: the shared mass percent of described metal conductive particles is 60%～90%.
9. high molecular PTC matrix material according to claim 1, is characterized in that: the shared mass percent of described other auxiliary agent is 1%～5%.
10. a method of being made high polymer PTC chip by high molecular PTC matrix material claimed in claim 1, it is characterized in that, comprise the steps: at room temperature, thermosetting resin, solidifying agent, polymer carrier, metal conductive particles and other auxiliary agent of forming described material are become to uniform slurry by proportioning is mixing; Described slurry is coated on to layer of metal foil electrode surface, and then covers upper another layer of metal foil electrode; Hot-press solidifying moulding on vulcanizing press, makes high molecular PTC composite board; Cut into high polymer PTC chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210287247.7A CN103589110A (en) | 2012-08-13 | 2012-08-13 | Polymer PTC composite material and method for preparing polymer PTC chip by using the material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210287247.7A CN103589110A (en) | 2012-08-13 | 2012-08-13 | Polymer PTC composite material and method for preparing polymer PTC chip by using the material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103589110A true CN103589110A (en) | 2014-02-19 |
Family
ID=50079445
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210287247.7A Pending CN103589110A (en) | 2012-08-13 | 2012-08-13 | Polymer PTC composite material and method for preparing polymer PTC chip by using the material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103589110A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105462478A (en) * | 2015-12-14 | 2016-04-06 | 天津凯华绝缘材料股份有限公司 | Ultraviolet light cured PPTC electrode slurry and preparation method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005294550A (en) * | 2004-03-31 | 2005-10-20 | Tdk Corp | Organic positive characteristic thermistor |
| CN102127287A (en) * | 2011-01-31 | 2011-07-20 | 上海长园维安电子线路保护股份有限公司 | Conductive composite material and PTC (Positive Temperature Coefficient) thermal sensitive element prepared from same |
-
2012
- 2012-08-13 CN CN201210287247.7A patent/CN103589110A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005294550A (en) * | 2004-03-31 | 2005-10-20 | Tdk Corp | Organic positive characteristic thermistor |
| CN102127287A (en) * | 2011-01-31 | 2011-07-20 | 上海长园维安电子线路保护股份有限公司 | Conductive composite material and PTC (Positive Temperature Coefficient) thermal sensitive element prepared from same |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105462478A (en) * | 2015-12-14 | 2016-04-06 | 天津凯华绝缘材料股份有限公司 | Ultraviolet light cured PPTC electrode slurry and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8653932B2 (en) | Conductive composite material with positive temperature coefficient of resistance and overcurrent protection component | |
| JP6598231B2 (en) | Polymer conductive composite material and PTC element | |
| CN1794369B (en) | Manufacturing method of improved high temperature polymer PTC beat-sensitive resistor | |
| CN102477226B (en) | High current resistant thermistor polymer composite material and preparation method thereof | |
| CN102660106A (en) | Phenylthiocarbamide (PTC) composite material and PTC chip prepared by same and preparation method | |
| CN102522172A (en) | Resistance positive temperature effect conductive composite material and thermistor element | |
| CN103975009A (en) | Polymeric PTC thermistors | |
| CN104252935B (en) | thermistor and preparation method thereof | |
| CN1996513B (en) | A thermal concretion PTC thermal resistor and its making method | |
| CN103756103B (en) | Graphene/high density polyethylene(HDPE) thermistor composite material and preparation method | |
| CN101556849A (en) | Macromolecular positive temperature coefficient thermosensitive resistor and manufacturing method thereof | |
| CN102167858A (en) | Positive temperature coefficient material, preparation method thereof and thermistor containing material | |
| CN101728039A (en) | Over-current protection element | |
| CN101192461A (en) | High polymer PTC chip electrical heating composite process | |
| CN101556851A (en) | Positive temperature coefficient conductive composite material and resistance element manufactured by same | |
| CN102140194A (en) | Material with positive temperature coefficient, preparation method thereof and thermosensitive resistor having same | |
| CN102050977B (en) | PTC material and preparation method thereof, and material-containing thermistor and preparation method thereof | |
| CN103589110A (en) | Polymer PTC composite material and method for preparing polymer PTC chip by using the material | |
| CN101183575A (en) | Novel plug-in thermal sensitive element with overflowing and ESD double protection and method of producing the same | |
| US7304562B2 (en) | Organic PTC thermistor and production | |
| CN102260385B (en) | Positive temperature coefficient material and thermistor containing same | |
| CN112210176B (en) | Polyvinylidene fluoride-based conductive composite material and PTC element | |
| CN106189219A (en) | A kind of polymer base conductive composite material and circuit protecting element | |
| CN112094449A (en) | Curie point adjustable PTC polymer conductive composite material and preparation method thereof | |
| CN116003938B (en) | Polymer PTC composite material with island structure and preparation method and application thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140219 |