CN103579019A - Equipment packaging chip with adhesives - Google Patents
Equipment packaging chip with adhesives Download PDFInfo
- Publication number
- CN103579019A CN103579019A CN201210270095.XA CN201210270095A CN103579019A CN 103579019 A CN103579019 A CN 103579019A CN 201210270095 A CN201210270095 A CN 201210270095A CN 103579019 A CN103579019 A CN 103579019A
- Authority
- CN
- China
- Prior art keywords
- container
- equipment
- control unit
- adhesive
- described container
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 83
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 83
- 238000004806 packaging method and process Methods 0.000 title abstract 3
- 238000005507 spraying Methods 0.000 abstract description 7
- 239000007788 liquid Substances 0.000 abstract description 3
- 238000003825 pressing Methods 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 5
- 239000007921 spray Substances 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- RKTYLMNFRDHKIL-UHFFFAOYSA-N copper;5,10,15,20-tetraphenylporphyrin-22,24-diide Chemical compound [Cu+2].C1=CC(C(=C2C=CC([N-]2)=C(C=2C=CC=CC=2)C=2C=CC(N=2)=C(C=2C=CC=CC=2)C2=CC=C3[N-]2)C=2C=CC=CC=2)=NC1=C3C1=CC=CC=C1 RKTYLMNFRDHKIL-UHFFFAOYSA-N 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 239000004834 spray adhesive Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention provides equipment packaging a chip with adhesives. The equipment comprises a container used for containing the adhesives, a pressure control unit and a position control unit. The volume of the container can be adjusted, at least one first through hole is formed in the bottom of the container, and the bottom of the container is arranged at the upper end of the bonding area of a chip packaging shell. The pressure control unit is arranged at the upper end of the container and used for applying pressure to the container based on preset frequency. The position control unit is used for moving the position of the container at the upper end of the bonding area based on the range of the adhesives sprayed on the bonding area according to the pressure applying frequency of the pressure control unit so that the adhesives can be evenly sprayed on the bonding area. Therefore, the adhesives are sprayed on the bonding area of the shell in a spraying mode, the adhesives can be evenly distributed on the bonding area of the shell through the fluidity of liquid, and the situation that too many adhesives are leaked or bonding is not tight due to too few adhesives is avoided.
Description
Technical field
The present invention relates to a kind of equipment of packaged chip, particularly a kind of equipment that utilizes adhesive package chip.
Background technology
Chip needs to encapsulate after making, so that chip is protected.Utilizing technology that adhesive encapsulates chip is a kind of technology of packaged chip wherein, and this technology is mainly applied to adhesive the bonded areas of the shell of packaged chip, then another shell is covered on this chip, to complete the encapsulation to this chip.The existing mode of adhesive package chip of utilizing comprises:
1) utilize point gum machine to smear adhesive.Particularly, this kind of technology utilizes point gum machine continuously adhesive to be smeared along bonded areas, and adhesive is distributed in bonded areas with end to end ring-type.This kind of technology is in the automated process of chip package, played huge impetus, but the raising along with chip precision, this kind of technology cannot accurately guarantee the even of adhesive in the process of smearing, and adhesive can not effectively be controlled last adhesive when bonded areas finishes up, make the blank area of adhesive have too much adhesive, the situation that there will be adhesive to overflow when chip package.
2) adopt mode of printing to smear adhesive.Particularly, after chip is covered, utilize print principle, adhesive is spread upon to bonded areas, then take the parts that cover chip away.Although this kind of technology solved the problem that adhesive overflows, the chip high for precision, size is little, should block chip, again can printing binder, the precision of equipment is required high, cost is excessive.
Therefore need to improve the existing equipment of adhesive package chip that utilizes, so as easier, smear adhesive more equably.
Summary of the invention
The shortcoming of prior art, the object of the present invention is to provide a kind of equipment that utilizes adhesive package chip in view of the above, so as easier, smear adhesive more equably.
For achieving the above object and other relevant objects, the invention provides a kind of equipment that utilizes adhesive package chip, it comprises: for holding container adhesive, that volume is adjustable, its bottom has at least one first through hole, and the bottom of described container is positioned at the upper end of bonded areas of the shell of packaged chip; Be positioned at described container upper end, the pressure control unit for exerting pressure to described container based on predeterminated frequency; For the scope based on being ejected into the described adhesive of described bonding zone, the frequency of exerting pressure by described pressure control unit, mobile described container is at the position control unit of the position of described bonded areas upper end, so that described bonded areas is sprayed described adhesive equably.
Preferably, described container comprises: the diameter of described the first through hole is 0.05mm.
Preferably, described container comprises: the diameter in the region that all described the first through holes form is between 0.2mm-0.25mm.
Preferably, described container comprises: the pressure plate that is positioned at described container upper end and is slidably connected with described container inside wall.
Preferably, described pressure control unit is connected with described pressure plate.
Preferably, when described container bottom has first through hole, described equipment also comprises: be connected and cover the conduit of all described the first through holes with described container bottom; With the shower nozzle that described conduit is connected, described shower nozzle has a plurality of the second through holes.
Preferably, the diameter of described the second through hole is 0.05mm.
Preferably, the diameter of described shower nozzle is between 0.2mm-0.25mm.
Preferably, on described conduit, be also provided with valve.
Preferably, described position control unit is controlled described vessel moving.
As mentioned above, the equipment that utilizes adhesive package chip of the present invention, there is following beneficial effect: adopt the mode of injection to the bonded areas spraying binder of described shell, can make adhesive utilize the mobility of liquid to be evenly distributed in the bonded areas of described shell, avoid adhesive too much to leak outside or the generation of the very few bonding situation such as not tight; At described container bottom, connect shower nozzle, be beneficial to maintenance and the replacing of equipment; The size of described shower nozzle, between 0.2-0.25mm, can guarantee that described equipment both guaranteed that described bonded areas can spray described adhesive equably, can make again described adhesive can not be sprayed onto on described chip when spraying.
Accompanying drawing explanation
Fig. 1 is shown as the structural representation that utilizes the equipment of adhesive package chip of the present invention.
Fig. 2 is shown as the enlarged diagram of the container bottom in the equipment that utilizes adhesive package chip of the present invention.
Fig. 3 is shown as the schematic diagram of a kind of preferred structure of the equipment that utilizes adhesive package chip of the present invention.
Fig. 4 is shown as chip to be packaged and the structural representation of shell.
Element numbers explanation
1 utilizes the equipment of adhesive package chip
11 containers
111 first through holes
112 pressure plates
12 pressure control units
13 position control units
14 conduits
15 shower nozzles
151 second through holes
2 adhesives
3 chips
4 shells
41 bonded areas
Embodiment
By particular specific embodiment explanation embodiments of the present invention, person skilled in the art scholar can understand other advantages of the present invention and effect easily by the disclosed content of this specification below.
Refer to Fig. 1 to Fig. 3.Notice, appended graphic the illustrated structure of this specification, ratio, size etc., equal contents in order to coordinate specification to disclose only, for person skilled in the art scholar, understand and read, not in order to limit the enforceable qualifications of the present invention, therefore the technical essential meaning of tool not, the adjustment of the modification of any structure, the change of proportionate relationship or size, not affecting under the effect that the present invention can produce and the object that can reach, all should still drop on disclosed technology contents and obtain in the scope that can contain.Simultaneously, in this specification, quote as " on ", the term of D score, " left side ", " right side ", " centre " and " " etc., also only for ease of understanding of narrating, but not in order to limit the enforceable scope of the present invention, the change of its relativeness or adjustment, under without essence change technology contents, when being also considered as the enforceable category of the present invention.
Fig. 1 is shown as a kind of structural representation that utilizes the equipment of adhesive package chip of the present invention.Wherein, the described equipment 1 of adhesive package chip that utilizes is for by chip package in the enclosure.As shown in Figure 4, the size of described shell 4 is greater than the size of described chip 3, the shape of described shell 4 can be concave shape, also can be plane body, the region of described shell 4 outside the shared region of described chip 3 is bonded areas 41, for coating adhesive (as silica gel etc.), to described chip 3 is encapsulated between two described shells 4.
Described equipment 1 comprises: container 11, pressure control unit 12 and position control unit 13.
Described container 11 is for holding adhesive and volume is adjustable, and its bottom has at least one first through hole 111, and the bottom of described container 11 is positioned at the upper end of bonded areas 41 of the shell 4 of packaged chip 3.Wherein, the shape of described container 11 includes but not limited to: cylinder, tetragonal body, Rotary-table etc.Described container 11 bottoms can be plane, concave surface etc.Described container 11 can comprise soft material, so that volume is adjustable after its pressurized, preferably, described container 11 also can be fully hard material, and described container 11 also comprises: the pressure plate 112 that is positioned at described container 11 upper ends and is slidably connected with described container 11 madial walls.For example, described pressure plate 112 is piston structure.More preferably, described container 11 is syringe cylinder structure.
The quantity of described the first through hole 111 can be one, also can be for a plurality of, preferably, the quantity of described the first through hole 111 is a plurality of, as shown in Figure 2, the diameter of described the first through hole 111 is preferably 0.05mm, and the widest size in region that a plurality of described the first through holes 111 form is not more than the narrowest size of described bonded areas 41, the width in the region that preferably, a plurality of described the first through holes 111 form is between 0.2mm-0.25mm.
Described container 11 bottoms are relevant with the scope that distance and described container 11 pressurizeds of described bonded areas 41 eject adhesive.For example, described container 11 pressurizeds are by described the first through hole 111 ejections, 3mm place below described the first through hole 111, the width of the scope of the adhesive spraying is between 0.23-0.27mm, be slightly less than the width of bonded areas 41, the distance of described container 11 bottoms and described bonded areas 41 is 3mm.
Preferably, if the quantity of described the first through hole 111 is only one, described equipment 1 also comprises: conduit 14 and shower nozzle 15.As shown in Figure 3.
Described conduit 14 is connected with described container 11 bottoms and covers all described the first through holes 111.The width of the bore of described conduit 14 is more than or equal to the width in the region that all described the first through holes 111 form.Described conduit 14 includes but not limited to the mode that described container 11 bottoms are connected: bonding method, thread connecting mode etc.
More preferably, on described conduit 14, be also provided with valve (not giving diagram).
Described valve is for seal described conduit 14 when described equipment 1 is not in running order, to prevent that described adhesive from flowing out.Described valve can be ball valve.
Described shower nozzle 15 is connected with described conduit 14, and has a plurality of the second through holes (not giving diagram).Wherein, described shower nozzle 15 the widest sizes are not more than the narrowest size of described bonded areas 41, and preferably, the diameter of described shower nozzle 15 is between 0.2mm-0.25mm.The shape of described shower nozzle 15 can have any shape, and it includes but not limited to: circle, square etc.Described shower nozzle 15 is relevant with the scope that distance and described container 11 pressurizeds of described bonded areas 41 eject adhesive.For example, described container 11 pressurizeds are sprayed by described shower nozzle 15,3mm place below described shower nozzle 15, and the width of the scope of the adhesive spraying is between 0.17-0.24mm, be slightly less than the width of bonded areas 41, described shower nozzle 15 is 3mm with the distance of described bonded areas 41.
The diameter of described the second through hole (not giving diagram) is preferably 0.05mm.
Described pressure control unit 12 is positioned at described container 11 upper ends, for exerting pressure to described container 11 based on predeterminated frequency.
Particularly, described pressure control unit 12 was exerted pressure to described container 11 again and again according to default force value and the time interval, so that the adhesive in described container 11 is by bottom first through hole 111 ejections of described container 11.
For example, described pressure control unit 12 is exerted pressure to described container 11 with the frequency of 1 N/second, so that described adhesive is by bottom first through hole 111 ejections of described container 11.
Preferably, described pressure control unit 12 is connected with described pressure plate 112.
For example, described pressure control unit 12 is exerted pressure to described pressure plate 112 with the frequency of 1 N/second, so that described pressure plate 112 moves down, to reduce the volume of described container 11, the shower nozzle 15 that described adhesive is connected by the bottom with described container 11 is sprayed.
Described position control unit 13 is for the scope based on being ejected into the described adhesive of described bonding zone, the frequency of exerting pressure by described pressure control unit 12, mobile described container 11 is in the position of described bonded areas 41 upper ends, so that described bonded areas 41 is sprayed described adhesive equably.
Particularly, the radius of the scope of the described adhesive that be ejected into described bonding zone of described position control unit 13 based on default moves described container 11 in the position of described bonded areas 41 upper ends, so that described bonded areas 41 is sprayed described adhesive equably.
Described position control unit 13 moves the mode of described container 11 in the position of described bonded areas 41 upper ends and includes but not limited to: the position of moving to change described container 11 by controlling described shell 4, preferably, by controlling described container 11, move to change the position of described container 11.
For example, centered by the described adhesive that is ejected into described bonded areas 41 is evenly distributed in and take under shower nozzle 15, in the radius scope that is 0.14mm, the distance that described position control unit 13 moves along the described container 11 of described bonded areas 41 control is at every turn 0.28mm, so makes described bonded areas 41 be sprayed equably described adhesive.
It should be noted that, those skilled in the art should understand that, the mode of the described container 11 of above-mentioned movement in the position of described bonded areas 41 upper ends is only for example, but not limitation of the present invention, in fact, any scope based on being ejected into the described adhesive of described bonding zone, mobile described container 11 is within the mode of the position of described bonded areas 41 upper ends is all included in the present invention.
The course of work of described equipment 1 is as follows:
Described container 11 bottoms are connected with shower nozzle 15, and the pressure plate 112 of described container 11 upper ends is connected with described pressure control unit 12, and described container 11 is also connected with described position control unit 13; When described shower nozzle 15 is from a point top of the bonded areas 41 of described shell 4, with predeterminated frequency, near described a point region, spray the adhesive in described container 11, and with the clockwise mobile described container 11 of identical frequency, so that described container 11 starts to rotate a circle along described bonded areas 41 with a point, spray adhesive equably, to guarantee that described bonded areas 41 can spray described adhesive equably.Thus, be convenient to that described chip 3 is encapsulated in to two described between shell 4.
In sum, the equipment that utilizes adhesive package chip of the present invention, adopt the mode of injection to the bonded areas spraying binder of described shell, can make adhesive utilize the mobility of liquid to be evenly distributed in the bonded areas of described shell, avoid adhesive too much to leak outside or the generation of the very few bonding situation such as not tight; At described container bottom, connect shower nozzle, be beneficial to maintenance and the replacing of equipment; The size of described shower nozzle, between 0.2-0.25mm, can guarantee that described equipment both guaranteed that described bonded areas can spray described adhesive equably, can make again described adhesive can not be sprayed onto on described chip when spraying.So the present invention has effectively overcome various shortcoming of the prior art and tool high industrial utilization.
Above-described embodiment is illustrative principle of the present invention and effect thereof only, but not for limiting the present invention.Any person skilled in the art scholar all can, under spirit of the present invention and category, modify or change above-described embodiment.Therefore, such as in affiliated technical field, have and conventionally know that the knowledgeable, not departing from all equivalence modifications that complete under disclosed spirit and technological thought or changing, must be contained by claim of the present invention.
Claims (10)
1. an equipment that utilizes adhesive package chip, is characterized in that, at least comprises:
For holding container adhesive, that volume is adjustable, its bottom has at least one first through hole, and the bottom of described container is positioned at the upper end of bonded areas of the shell of packaged chip;
Be positioned at described container upper end, the pressure control unit for exerting pressure to described container based on predeterminated frequency;
For the scope based on being ejected into the described adhesive of described bonding zone, the frequency of exerting pressure by described pressure control unit, mobile described container is at the position control unit of the position of described bonded areas upper end, so that described bonded areas is sprayed described adhesive equably.
2. the equipment that utilizes adhesive package chip according to claim 1, is characterized in that, described container comprises: the diameter of described the first through hole is 0.05mm.
3. the equipment that utilizes adhesive package chip according to claim 1, is characterized in that, described container comprises: the diameter in the region that all described the first through holes form is between 0.2mm-0.25mm.
4. the equipment that utilizes adhesive package chip according to claim 1, is characterized in that, described container comprises: the pressure plate that is positioned at described container upper end and is slidably connected with described container inside wall.
5. the equipment that utilizes adhesive package chip according to claim 4, is characterized in that, described pressure control unit is connected with described pressure plate.
6. the equipment that utilizes adhesive package chip according to claim 1, is characterized in that, when described container bottom has first through hole, described equipment also comprises:
Be connected and cover the conduit of all described the first through holes with described container bottom;
With the shower nozzle that described conduit is connected, described shower nozzle has a plurality of the second through holes.
7. the equipment that utilizes adhesive package chip according to claim 6, is characterized in that, the diameter of described the second through hole is 0.05mm.
8. the equipment that utilizes adhesive package chip according to claim 6, is characterized in that, the diameter of described shower nozzle is between 0.2mm-0.25mm.
9. the equipment that utilizes adhesive package chip according to claim 6, is characterized in that, is also provided with valve on described conduit.
10. the equipment that utilizes adhesive package chip according to claim 1, is characterized in that, described position control unit is controlled described vessel moving.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210270095.XA CN103579019A (en) | 2012-07-31 | 2012-07-31 | Equipment packaging chip with adhesives |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210270095.XA CN103579019A (en) | 2012-07-31 | 2012-07-31 | Equipment packaging chip with adhesives |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103579019A true CN103579019A (en) | 2014-02-12 |
Family
ID=50050524
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210270095.XA Pending CN103579019A (en) | 2012-07-31 | 2012-07-31 | Equipment packaging chip with adhesives |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103579019A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1527102A (en) * | 2003-03-06 | 2004-09-08 | ������������ʽ���� | Film forming method and apparatus, method and apparatus for producing base plate and electronic equipment |
| US20050132955A1 (en) * | 2003-12-19 | 2005-06-23 | Sharp Kabushiki Kaisha | Chemical solution coating method and chemical solution coating apparatus |
| CN201231212Y (en) * | 2008-07-22 | 2009-05-06 | 东莞洲亮通讯科技有限公司 | Adhesive spraying device |
| CN101844124A (en) * | 2010-03-17 | 2010-09-29 | 上海大学 | Ejecting adhesive dispenser based on dual-function cylinder |
| CN201676799U (en) * | 2010-03-24 | 2010-12-22 | 厦门台松精密电子有限公司 | Multi-needle type spot gluing device |
| CN102049365A (en) * | 2010-11-01 | 2011-05-11 | 深圳市华星光电技术有限公司 | Liquid crystal sprayer, spraying device and liquid crystal spraying method |
| CN202816881U (en) * | 2012-07-31 | 2013-03-20 | 无锡市葆灵电子科技有限公司 | Device for packaging chip by using adhesive |
-
2012
- 2012-07-31 CN CN201210270095.XA patent/CN103579019A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1527102A (en) * | 2003-03-06 | 2004-09-08 | ������������ʽ���� | Film forming method and apparatus, method and apparatus for producing base plate and electronic equipment |
| US20050132955A1 (en) * | 2003-12-19 | 2005-06-23 | Sharp Kabushiki Kaisha | Chemical solution coating method and chemical solution coating apparatus |
| CN201231212Y (en) * | 2008-07-22 | 2009-05-06 | 东莞洲亮通讯科技有限公司 | Adhesive spraying device |
| CN101844124A (en) * | 2010-03-17 | 2010-09-29 | 上海大学 | Ejecting adhesive dispenser based on dual-function cylinder |
| CN201676799U (en) * | 2010-03-24 | 2010-12-22 | 厦门台松精密电子有限公司 | Multi-needle type spot gluing device |
| CN102049365A (en) * | 2010-11-01 | 2011-05-11 | 深圳市华星光电技术有限公司 | Liquid crystal sprayer, spraying device and liquid crystal spraying method |
| CN202816881U (en) * | 2012-07-31 | 2013-03-20 | 无锡市葆灵电子科技有限公司 | Device for packaging chip by using adhesive |
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| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
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| RJ01 | Rejection of invention patent application after publication | ||
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Application publication date: 20140212 |