CN103572254A - Heat exchange jacekt - Google Patents
Heat exchange jacekt Download PDFInfo
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- CN103572254A CN103572254A CN201210271652.XA CN201210271652A CN103572254A CN 103572254 A CN103572254 A CN 103572254A CN 201210271652 A CN201210271652 A CN 201210271652A CN 103572254 A CN103572254 A CN 103572254A
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- heat exchange
- limiting plate
- current limiting
- cover
- dividing plate
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Abstract
The invention discloses a heat exchange jacket which comprises a sleeve formed by an outer shell and an inner shell as well as an upper end cover and a lower end cover which are arranged at both ends of the sleeve, wherein at least one current-limiting plate and at least one partitioning plate are arranged in an interlayer of the sleeve; one end of the current-limiting plate is connected with the lower end cover and a predetermined distance is maintained from the other end of the current-limiting plate to the upper end cover; the lower end cover is provided with an inlet and an outlet which are formed in both sides of the current-limiting plate. According to the heat exchange jacket, a single lead heat exchange loop of a heat carrier is changed to a double lead heat exchange loop, so that the inlet and the outlet of the heat carrier are formed in the same side of the heat exchange sleeve, thereby avoiding the problem that the temperature difference between two ends of the heat exchange jacket caused by the single lead heat exchange loop is large. Temperatures are uniformly distributed in the periphery of the heat exchange sleeve, so that the thermal fields are uniformly distributed on the bottom deposition surface, and vapor deposition reaction can be uniformly carried out.
Description
Technical field
The present invention relates to chemical vapour deposition field, particularly relate to a kind of heat exchange cover for chemical vapour deposition.
Background technology
Chemical vapour deposition is that reactive material issues biochemical reaction in gaseous state condition, generates the solid matrix surface that solid matter is deposited on heating, and then makes the Technology of solid material.Chemical Vapor deposition process is widely used in purifying substances, develops new crystal, the various monocrystalline of deposit, polycrystalline or vitreous state inorganic thin film material.
In electroless plating process, be often accompanied by violent endothermic process or exothermic process, therefore need to heat exchanger be set for heating or cooling in deposition basal surface surrounding.Because heat exchanger used mostly is hollow shell-like, so be called again heat exchange cover.
The heat exchange loop of heat exchange cover refers to that the thermal barrier in heat exchange cover forms the path of circulating with certain path flows and in system.Heat exchange loop in common heat exchange cover is generally single helical pitch spiral-line pattern, in the cavity of heat exchange cover, sets up spiral type current limiting plate, in order to extend the running route of thermal barrier; During work, thermal barrier enters from one end of heat exchange cover, the other end flows out, thereby cause the two ends temperature difference of heat exchange cover large, circumferential temperature distributing disproportionation is overlapped in heat exchange, cause deposition basal surface heat exchange effect inconsistent, make to deposit basal surface thermal field skewness, and then cause vapor deposition reaction evenly not carry out.
Therefore, how to improve heat exchange cover to reduce the temperature difference at heat exchange cover two ends in working process, make heat exchange overlap circumferential uniformity of temperature profile, thereby make to deposit basal surface thermal field, be evenly distributed, vapor deposition reaction can evenly carry out, and is the current technical issues that need to address of those skilled in the art.
Summary of the invention
The object of this invention is to provide a kind of heat exchange cover, can reduce the temperature difference at two ends when this heat exchange is enclosed within work, make heat exchange overlap circumferential uniformity of temperature profile, thereby guarantee that deposition basal surface thermal field is evenly distributed, vapor deposition reaction can evenly carry out.
For solving the problems of the technologies described above, the invention provides a kind of heat exchange cover, comprise the sleeve pipe that shell and inner casing form and upper end cover and the lower end cover that is arranged on described sleeve pipe two ends, in the interlayer of described sleeve pipe, be provided with at least one current limiting plate and at least one dividing plate; Described dividing plate separates described interlayer, and one end of described current limiting plate is connected with described lower end cover, and the other end and described upper end cover keep predetermined distance; Described current limiting plate and described dividing plate are divided into described interlayer the helical pitch of two connections, and described lower end cover is provided with import and the outlet that is positioned at described current limiting plate both sides.
Preferably, described current limiting plate and described dividing plate are separately positioned on the diameter two ends of described interlayer.
Preferably, described heat exchange cover has a plurality of current limiting plates and corresponding a plurality of dividing plates, described dividing plate is circumferentially evenly arranged in its interlayer along described sleeve pipe, and described interlayer is divided into a plurality of chambers, described current limiting plate is divided into described chamber the helical pitch of two connections, on lower end cover corresponding to each chamber, is respectively equipped with import and the outlet that is positioned at described current limiting plate both sides.
Preferably, described dividing plate is linear pattern dividing plate, and described current limiting plate is linear pattern current limiting plate.
Preferably, described current limiting plate, described dividing plate and described inner casing are welded and fixed.
Preferably, the hardness of described shell is less than the hardness of described current limiting plate and described dividing plate.
Preferably, described outer casing inner wall is provided with the groove coordinating with described current limiting plate, described dividing plate.
Preferably, described shell and described current limiting plate, described dividing plate shrink-fit.
Preferably, the thermal barrier in described heat exchange cover is organic oils.
Relative above-mentioned background technology, heat exchange cover provided by the present invention comprises the sleeve pipe that shell and inner casing form and upper end cover and the lower end cover that is arranged on described sleeve pipe two ends, is provided with at least one current limiting plate and at least one dividing plate in the interlayer of described sleeve pipe; Described dividing plate separates described interlayer, and one end of described current limiting plate is connected with described lower end cover, and the other end and described upper end cover keep predetermined distance; Described current limiting plate and described dividing plate are divided into described interlayer the helical pitch of two connections, and described lower end cover is provided with import and the outlet that is positioned at described current limiting plate both sides.Heat exchange cover provided by the present invention is by the setting of dividing plate and current limiting plate, the helical pitch that the interlayer of the sleeve pipe of shell and inner casing formation is divided into two connections, during work, thermal barrier enters heat exchange cover from the import of lower end cover, when helical pitch arrives the upper end of heat exchange cover, along another helical pitch, return from the outlet of lower end cover and discharge again, two helical pitches are mutually parallel, compare with single helical pitch of the prior art, can reduce the temperature difference at heat exchange cover two ends, make the deposition basal surface thermal field of chemical vapor deposition unit even, thereby vapor deposition reaction can evenly be carried out.
A kind of preferred embodiment in, heat exchange cover provided by the present invention has a plurality of current limiting plates and a plurality of dividing plate, described dividing plate is circumferentially evenly arranged and the interlayer of heat exchange cover is divided into a plurality of chambers along described heat exchange cover, each chamber is divided into two helical pitches by current limiting plate, be equivalent to a plurality of pairs of helical pitches and be arranged in parallel, can guarantee the abundant cycle heat exchange of thermal barrier, further reduce the temperature difference at heat exchange cover two ends, guarantee to deposit basal surface thermal field and be evenly distributed, guarantee that vapor deposition reaction evenly carries out.
In another preferred embodiment, described current limiting plate and described dividing plate are linear pattern, can make full use of existing machinery complete processing advantage, guarantee the stopping property between each chamber and each helical pitch, avoid thermal barrier to leak, guarantee to deposit basal surface thermal field and be evenly distributed.
Accompanying drawing explanation
Fig. 1 is the front view that a kind of embodiment is overlapped in heat exchange provided by the present invention;
Fig. 2 is the cover of heat exchange shown in Fig. 1 A-A direction diagram;
Fig. 3 is that heat exchange cover shown in Fig. 2 is along the expansion schematic diagram of B-B direction.
Embodiment
Core of the present invention is to provide a kind of heat exchange cover, can reduce the temperature difference at two ends when this heat exchange is enclosed within work, makes heat exchange overlap circumferential uniformity of temperature profile, thereby guarantees that deposition basal surface thermal field is evenly distributed, and vapor deposition reaction can evenly carry out.
In order to make those skilled in the art person understand better the present invention program, below in conjunction with the drawings and specific embodiments, the present invention is described in further detail.
It is pointed out that herein the nouns of locality such as related upper and lower, left and right are to be arranged in figure and component position each other defines with component in Fig. 1 and Fig. 3, just in order to explain the clear and convenient of technical scheme.Should be appreciated that the noun of locality adopting should not limit the scope that the application asks for protection herein.
Please refer to Fig. 1, Fig. 2 and Fig. 3; Fig. 1 is the front view that a kind of embodiment is overlapped in heat exchange provided by the present invention; Fig. 2 is the cover of heat exchange shown in Fig. 1 A-A direction diagram; Fig. 3 is that heat exchange cover shown in Fig. 2 is along the expansion schematic diagram of B-B direction.
In a kind of embodiment, heat exchange cover provided by the present invention comprises shell 1 and inner casing 2; Inner casing 2 coaxial packages are at the interior formation sleeve pipe of shell 1, and the two ends of described sleeve pipe are connected with upper end cover 31 and lower end cover 32, can by welding, upper end cover 31 and lower end cover 32 be connected to the two ends of described sleeve pipe, guarantee its stopping property.
In the interlayer of described sleeve pipe, be provided with a current limiting plate 4 and a dividing plate 5, dividing plate 5 separates the interlayer of described sleeve pipe, the annular gap that is about to be communicated with is divided into a disconnected annular housing by dividing plate 5, and the two ends up and down of dividing plate 5 are connected with lower end cover 32 with upper end cover 31 respectively; One end of current limiting plate 4 is connected with lower end cover 32, and the other end and upper end cover 31 keep predetermined distance, so current limiting plate 4 and dividing plate 5 are divided into the interlayer of described sleeve pipe the helical pitch of two connections.Current limiting plate 4 can be welding with the mode of connection of lower end cover 32, and the mode that dividing plate 5 also can be by welding and upper end cover 31 and lower end cover 32 are connected and fixed.
The both sides that are positioned at current limiting plate 4 on lower end cover 32 are respectively equipped with import 6 and outlet 7.
During work, it is upper end cover 31 one end that thermal barrier enters into the heat exchange cover end along a helical pitch from the import of lower end cover 32 enters heat exchange cover, because current limiting plate 4 and upper end cover 31 maintain predetermined distance, so thermal barrier can turn back to lower end cover 32 one end from exporting 7 outflows along another helical pitch after arriving upper end cover 31 one end.Because the import of thermal barrier and outlet are arranged on the same side of heat exchange cover, and its two helical pitches that flow are mutually parallel, avoided the large problem of the heat exchange cover two ends temperature difference, make to deposit basal surface thermal field and are evenly distributed, and vapor deposition reaction can evenly carry out.It is pointed out that thermal barrier is generally organic oils.
In this heat exchange cover, current limiting plate 4 and dividing plate 5 are divided into two helical pitches by the interlayer of shell 1 and inner casing 2 formation, two helical pitches are communicated with in the upper end of heat exchange cover, make the import of thermal barrier and the lower end that outlet can be arranged on heat exchange cover, even if the heat exchange loop of thermal barrier in heat exchange cover is two helical pitch settings, reduced the temperature head at heat exchange cover two ends.
Further; current limiting plate 4 and dividing plate 5 are arranged on the diameter two ends of heat exchange jacket layer; the interlayer that is about to heat exchange cover is divided into two uniform helical pitches; it is consistent making the heat exchange area of thermal barrier in two helical pitches; can guarantee that heat exchange overlaps circumferential uniformity of temperature profile, the heat exchange effect that makes to deposit basal surface is consistent.
Can make further improvement to above-mentioned heat exchange cover.
Further, in order to ensure that the circumferential thermal field of deposition basal surface is evenly distributed, can adopt the mode of the two helical pitch parallel connections of many groups, in the interlayer of heat exchange cover, a plurality of dividing plates 5 are set, dividing plate 5 circumferentially evenly arranges along heat exchange cover, and the interlayer of heat exchange cover is divided into a plurality of chambers 8, the limited plate 4 of each chamber 8 is divided into left side helical pitch 81 and the right side helical pitch 82 of connection, on the lower end cover 32 of each chamber 8 correspondence, be respectively equipped with the import 6 and the outlet 7 that are positioned at limiting plate 4 both sides, as shown in Figure 3, arrow in figure in each helical pitch has indicated the flow direction of thermal barrier in working process.
During work, thermal barrier enters respectively in each chamber 8 from the import 6 of lower end cover 32, returns, from exporting 7 discharges after the left side helical pitch 81 of each chamber 8 arrives at upper end cover 31 one end along the right side helical pitch 82 of each chamber 8 again.Due to the circumferential arrangement at heat exchange cover many groups of two helical pitch heat exchange loops in parallel, can dwindle further the heat exchange cover two ends temperature difference, guarantee the abundant cycle heat exchange of thermal barrier, ensure that circumferential temperature is overlapped in heat exchange even, thereby the thermal exchange effect that makes to deposit reaches unanimity at the end, guarantee to deposit basal surface thermal field and be evenly distributed, and then guarantee that vapor deposition reaction can carry out uniformly and stably.
The number in parallel that it is pointed out that two helical pitch heat exchange loops that heat exchange cover is circumferential can arrange according to reality is required, as long as can guarantee that heat exchange overlaps circumferential uniformity of temperature profile, vapor deposition reaction can be evenly.
Further, limiting plate 4 and dividing plate 5 are preferably linear pattern; When concrete assembling, current limiting plate 4 can be welded on inner casing 2; The groove in the inwall setting of shell 1 with predetermined depth, described groove matches with current limiting plate 4.In order to guarantee being sealed and matched of shell 1 and current limiting plate 4, the material hardness of shell 1 is less than the material hardness of current limiting plate 4, during assembling, can will after shell 1 heating, be inserted in inner casing 2 and the current limiting plate 4 welding together, after shell 1 shrinkage, the mating surface of current limiting plate 4 and shell 1 can form shrink-fit, meets seal request.Certainly, shell 1 and current limiting plate 4 also can be selected other assembling modes in practice, as long as can guarantee the stopping property of current limiting plate 4 and shell 1.
Similarly, the assembling mode of dividing plate 5 and the assembling mode of current limiting plate 4 are similar, repeat no more here.It may be noted that a bit, dividing plate 5 is not only connected with lower end cover 32, is also connected with upper end cover 31; This is because dividing plate 5 is different with the effect of current limiting plate 4, and dividing plate 5 is used for the interlayer of heat exchange cover to be divided into a plurality of heat exchange loops in parallel, and current limiting plate 4 is used for heat exchange loop and is set to pair helical pitches.
Here it should be noted that, limiting plate 4 and dividing plate 5 are preferably to linear pattern, because can make full use of existing mechanical processing technique technology, guarantee the stopping property of dividing plate 5 and heat exchange jacket layer and limiting plate 5 and heat exchange jacket layer, and then the stopping property between two helical pitches in the stopping property between each chamber that guarantees to be separated by dividing plate 5 and each chamber, avoid leaking because poor sealing performance causes thermal barrier, thereby cause the circumferential temperature distributing disproportionation that heat exchange efficiency is low, heat exchange is overlapped even.Certainly, in actual use, also limiting plate 4 and dividing plate 5 can be set to the shape that other are conducive to thermal barrier heat exchange, as long as can guarantee the stopping property of limiting plate 4, dividing plate 5 and heat exchange cover, guarantee that heat exchange overlaps circumferential uniformity of temperature profile.
Here also it should be noted that, in above-described embodiment, the import 6 of thermal barrier and outlet 7 are all arranged on lower end cover 32, the import of thermal barrier 6 and outlet 7 can certainly be arranged on upper end cover 31, correspondingly, one end of limiting plate 4 is connected with upper end cover 31, and the other end and lower end cover 32 keep predetermined distance.
Compared with prior art, heat exchange cover provided by the present invention has changed single helical pitch heat exchange loop of thermal barrier into two helical pitch heat exchange loops, make the import of thermal barrier and the same side that outlet is positioned at heat exchange cover, the large problem of the heat exchange cover two ends temperature difference of having avoided single helical pitch heat exchange loop to cause; Further, at the two helical pitch heat exchange loops of the many groups of being circumferentially arranged in parallel of heat exchange cover, guarantee the abundant cycle heat exchange of thermal barrier, not only dwindled the temperature difference at heat exchange cover two ends, also make heat exchange overlap circumferential uniformity of temperature profile, thereby it is consistent to guarantee to deposit end heat exchange amount effect, guarantees that deposition basal surface thermal field is evenly distributed, and then vapor deposition reaction can be carried out uniformly and stably.
Above heat exchange cover provided by the present invention is described in detail.Applied specific case herein principle of the present invention and embodiment are set forth, the explanation of above embodiment is just for helping to understand method of the present invention and core concept thereof.It should be pointed out that for those skilled in the art, under the premise without departing from the principles of the invention, can also carry out some improvement and modification to the present invention, these improvement and modification also fall in the protection domain of the claims in the present invention.
Claims (9)
1. a heat exchange cover, comprises the sleeve pipe that shell and inner casing form and upper end cover and the lower end cover that is arranged on described sleeve pipe two ends, it is characterized in that, is provided with at least one current limiting plate and at least one dividing plate in the interlayer of described sleeve pipe; Described dividing plate separates described interlayer, and one end of described current limiting plate is connected with described lower end cover, and the other end and described upper end cover keep predetermined distance; Described current limiting plate and described dividing plate are divided into described interlayer the helical pitch of two connections, and described lower end cover is provided with import and the outlet that is positioned at described current limiting plate both sides.
2. heat exchange cover as claimed in claim 1, is characterized in that, described current limiting plate and described dividing plate are separately positioned on the diameter two ends of described interlayer.
3. heat exchange cover as claimed in claim 1, it is characterized in that, there are a plurality of current limiting plates and corresponding a plurality of dividing plates, described dividing plate is circumferentially evenly arranged in its interlayer along described sleeve pipe, and described interlayer is divided into a plurality of chambers, described current limiting plate is divided into described chamber the helical pitch of two connections, on lower end cover corresponding to each chamber, is respectively equipped with import and the outlet that is positioned at described current limiting plate both sides.
4. the heat exchange cover as described in claims 1 to 3 any one, is characterized in that, described dividing plate is linear pattern dividing plate, and described current limiting plate is linear pattern current limiting plate.
5. heat exchange cover as claimed in claim 4, is characterized in that, described current limiting plate, described dividing plate and described inner casing are welded and fixed.
6. heat exchange cover as claimed in claim 4, is characterized in that, the hardness of described shell is less than the hardness of described current limiting plate and described dividing plate.
7. heat exchange cover as claimed in claim 6, is characterized in that, described outer casing inner wall is provided with the groove coordinating with described current limiting plate, described dividing plate.
8. heat exchange cover as claimed in claim 7, is characterized in that, described shell and described current limiting plate, described dividing plate shrink-fit.
9. the heat exchange cover as described in claims 1 to 3 any one, is characterized in that, the thermal barrier in described heat exchange cover is organic oils.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210271652.XA CN103572254B (en) | 2012-08-01 | 2012-08-01 | A kind of Heat exchange jacekt |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210271652.XA CN103572254B (en) | 2012-08-01 | 2012-08-01 | A kind of Heat exchange jacekt |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103572254A true CN103572254A (en) | 2014-02-12 |
| CN103572254B CN103572254B (en) | 2016-08-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210271652.XA Expired - Fee Related CN103572254B (en) | 2012-08-01 | 2012-08-01 | A kind of Heat exchange jacekt |
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| Country | Link |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6214121B1 (en) * | 1999-07-07 | 2001-04-10 | Applied Materials, Inc. | Pedestal with a thermally controlled platen |
| JP2008098497A (en) * | 2006-10-13 | 2008-04-24 | Tokyo Electron Ltd | Water-cooled jacket for heat treatment furnace and manufacturing method thereof |
| CN101954670A (en) * | 2009-07-16 | 2011-01-26 | 中铝国际技术发展有限公司 | Internal heating die sleeve |
| CN202688447U (en) * | 2012-08-01 | 2013-01-23 | 六九硅业有限公司 | Heat exchange sleeve |
-
2012
- 2012-08-01 CN CN201210271652.XA patent/CN103572254B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6214121B1 (en) * | 1999-07-07 | 2001-04-10 | Applied Materials, Inc. | Pedestal with a thermally controlled platen |
| JP2008098497A (en) * | 2006-10-13 | 2008-04-24 | Tokyo Electron Ltd | Water-cooled jacket for heat treatment furnace and manufacturing method thereof |
| CN101954670A (en) * | 2009-07-16 | 2011-01-26 | 中铝国际技术发展有限公司 | Internal heating die sleeve |
| CN202688447U (en) * | 2012-08-01 | 2013-01-23 | 六九硅业有限公司 | Heat exchange sleeve |
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| Publication number | Publication date |
|---|---|
| CN103572254B (en) | 2016-08-03 |
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Effective date of registration: 20170615 Address after: 071000 Chaoyang North Street, Hebei, Baoding, No. 3399 Patentee after: YINGLI ENERGY (CHINA) Co.,Ltd. Address before: 071051 No. 2666 Xiangyang North Street, Hebei, Baoding Patentee before: FINE SILICON Co.,Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160803 |