CN103554924A - Addition-type organosilicone damping material prepolymer, addition-type organosilicone damping material and preparation method thereof - Google Patents
Addition-type organosilicone damping material prepolymer, addition-type organosilicone damping material and preparation method thereof Download PDFInfo
- Publication number
- CN103554924A CN103554924A CN201310511983.0A CN201310511983A CN103554924A CN 103554924 A CN103554924 A CN 103554924A CN 201310511983 A CN201310511983 A CN 201310511983A CN 103554924 A CN103554924 A CN 103554924A
- Authority
- CN
- China
- Prior art keywords
- damping material
- additional organosilicon
- organosilicon damping
- addition
- performed polymer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Vibration Prevention Devices (AREA)
Abstract
The invention discloses an addition-type organosilicone damping material prepolymer, an addition-type organosilicone damping material and a preparation method thereof. The addition-type organosilicone damping material prepolymer is mainly formed by mixing 10-100 parts by weight of methyl vinyl silicone oil, 10-100 parts by weight of methyl hydrogen silicone oil, 0.00002-0.018 parts by weight of a catalyst, 0-0.018 parts by weight of an inhibitor, and 0-40 parts by weight of a solid inorganic material. The addition-type organosilicone damping material is prepared by curing the addition-type organosilicone damping material prepolymer by virtue of an addition reaction. The addition-type organosilicone damping material prepolymer disclosed by the invention can be instantly formed by pouring, the addition-type organosilicone damping material formed from the addition-type organosilicone damping material prepolymer by virtue of curing after pouring has good damping and noise reduction effects as well as can resist to high temperature environments for a long time, and the preparation method for the addition-type organosilicone damping material is low in investment, little in energy consumption and environment-friendly.
Description
Technical field
The invention belongs to damping material formulating of recipe technical field, relate to damping material performed polymer, damping material and preparation method thereof, relate in particular to addition reaction can occur raw material additional organosilicon damping material performed polymer, additional organosilicon damping material and preparation method thereof, additional organosilicon damping material is mainly processed material as the additional damping of damping elastomeric material and structure.
Background technology
The damping vibration attenuation technology growing up based on viscoelastic damping damping material is to control the effective way of vibration, impact and noise, be the effective means of optimizing mechanical environment, viscoelastic damping damping material and goods thereof are used widely aspect making an uproar in the vibration of multiple instrument, equipment etc. and control at present.But along with vibration damping application is more and more deep, an application difficult problem for some harshnesses is constantly found by worker and is proposed, comprising following two: the one, long-term high temperature resistant environment, common damping material decomposition temperature, not higher than 100 ℃, can not meet the applied environment of high temperature; The 2nd, need instant mould molding; conventional damping material is to be connected vibration and noise reducing effect with vibration position after being first solidified into viscoelastic body; but common damping material has been solid state, for the applied environments such as filling in chuck after existing protecting sheathing, be inapplicable.Therefore, develop a kind of can be in mould form, long-term high temperature resistant and have very necessaryly to meeting some special mechanics environmental demand compared with the damping material of the high damping factor after fully solidifying, this damping material must have higher application and marketable value.
Publication number is the damping material (phenyl content is less than 7%) that the Chinese patent literature of CN101962480A discloses a kind of low-phenyl silicone rubber, the feature with wide temperature (use temperature scope is-50～+ 150 ℃), high damping (ratio of damping >=0.2), take opening rubber mixing machine or Banbury mixer, order of addition(of ingredients) according to low-phenyl silicone rubber, vinyl silicone oil, white carbon black, sulfuric peroxide agent, pigment is refined glue, through cool to room temperature after a section and post vulcanization as moulding damping material.This damping material is the damping material that a kind of first curing molding is laid at vibration position again, can not immediately pour into instant sealing moulding, is not suitable for the applied environment of filling damping material after existing protecting sheathing in chuck.
Publication number is that the Chinese patent literature of CN1340569A discloses a kind of vibration damping siloxane composition with good vibration damping performance and package stability, organic resin hollow particle and solid mineral material powder that said composition contains silicone oil, surface bears organic and/or inorganic materials powder, said composition is the semi-fluid movable property product that a kind of silicone oil adds filler, product need to be sealed in resilient packing thing and be used as buffer element.
Summary of the invention
The technical problem to be solved in the present invention is to overcome the deficiencies in the prior art, a kind of additional organosilicon damping material performed polymer of form is immediately provided, also provide a kind of have good damping noise reduction effect, can long-term high temperature resistant environment additional organosilicon damping material, and corresponding provide a kind of equipment funds drop into low, consume energy little, process safety is succinct, the preparation method of environment amenable additional organosilicon damping material.
For solving the problems of the technologies described above, the technical solution used in the present invention is a kind of additional organosilicon damping material performed polymer, and described additional organosilicon damping material performed polymer is mainly mixed by the component of following weight part:
In above-mentioned additional organosilicon damping material performed polymer, the general formula of molecular structure of described methyl vinyl silicon oil is lower formula I:
The general formula of molecular structure of described Methyl Hydrogen Polysiloxane Fluid is lower formula II:
Wherein, m, a are positive integer, and n, b are integer and at least one is non-vanishing;
In described methyl vinyl silicon oil, the massfraction of silico ethylene base preferably 0.1%～1.6%, the kinetic viscosity preferred 80cP～5000cP of described methyl vinyl silicon oil in the time of 25 ℃;
In described Methyl Hydrogen Polysiloxane Fluid, the massfraction of silicon hydrogen preferably 0.05%～0.25%, the kinetic viscosity preferred 20cP～2000cP of described Methyl Hydrogen Polysiloxane Fluid in the time of 25 ℃.
In above-mentioned additional organosilicon damping material performed polymer, the preferred transistion metal compound of described catalyzer.
In above-mentioned additional organosilicon damping material performed polymer, one or more in the preferred tetramethyl-tetrem of described inhibitor thiazolinyl cyclotetrasiloxane, wire vinyl silicone oil, 1-ethynylcyclohexanol.
In above-mentioned additional organosilicon damping material performed polymer, one or more in the preferred graphite of described solid mineral material, mica powder, calcium carbonate, talcum powder.
As a total technical conceive, the present invention also provides a kind of additional organosilicon damping material, and described additional organosilicon damping material is mainly made through addition reaction by the silico ethylene base in methyl vinyl silicon oil and the si-h bond in Methyl Hydrogen Polysiloxane Fluid after the component of following weight part is mixed:
The damping factor of above-mentioned additional organosilicon damping material in the time of 0～120 ℃ is 1～0.5, and heat resisting temperature reaches 120 ℃～200 ℃.
In above-mentioned additional organosilicon damping material, the general formula of molecular structure of described methyl vinyl silicon oil is lower formula I:
The general formula of molecular structure of described Methyl Hydrogen Polysiloxane Fluid is lower formula II:
Wherein, m, a are positive integer, and n, b are integer and at least one is non-vanishing;
In described methyl vinyl silicon oil, the massfraction of silico ethylene base preferably 0.1%～1.6%, the kinetic viscosity preferred 80cP～5000cP of described methyl vinyl silicon oil in the time of 25 ℃;
In described Methyl Hydrogen Polysiloxane Fluid, the massfraction of silicon hydrogen preferably 0.05%～0.25%, the kinetic viscosity preferred 20cP～2000cP of described Methyl Hydrogen Polysiloxane Fluid in the time of 25 ℃.
In above-mentioned additional organosilicon damping material, the preferred transistion metal compound of described catalyzer.
In above-mentioned additional organosilicon damping material, one or more in the preferred tetramethyl-tetrem of described inhibitor thiazolinyl cyclotetrasiloxane, wire vinyl silicone oil, 1-ethynylcyclohexanol.
In above-mentioned additional organosilicon damping material, one or more in the preferred graphite of described solid mineral material, mica powder, calcium carbonate, talcum powder.
As a total technical conceive, the present invention also provides a kind of preparation method of above-mentioned additional organosilicon damping material, comprise the following steps: methyl vinyl silicon oil, Methyl Hydrogen Polysiloxane Fluid and catalyzer are mixed, after gained mixture fully stirs and vacuumizes, obtain additional organosilicon damping material performed polymer; Additional organosilicon damping material performed polymer is cured, obtains additional organosilicon damping material.
In above-mentioned preparation method, in described mixture, also comprise inhibitor and/or solid mineral material.
In above-mentioned preparation method, described mixture temperature in stirring and vacuum is preferably controlled at below 50 ℃.
In above-mentioned preparation method, described condition of cure is preferably: 20 ℃～120 ℃ of solidification values, set time 0.5h～30d.
Compared with prior art, the invention has the advantages that:
1, additional organosilicon damping material performed polymer of the present invention is flowable liquids, both can use mould reshaping up to specification, also can be filled into and in airtight demand space, be solidified into the visco-elastic damping material without air gap, during moulding, both can adopt ambient cure, also can adopt heating to accelerate to solidify, adopt which kind of curing mode all not have the by products such as bubble to produce; Additional organosilicon damping material performed polymer has heating instant-forming, feature that curing speed is adjustable, after solidifying, becomes visco-elastic damping material, can meet some special mechanics environmental demands.
2, additional organosilicon damping material of the present invention has the high damping factor and high heat resistance energy, and damping noise reduction is effective.
3, method of the present invention is add-on type polymerization, utilize the feature of the silico ethylene base of methyl vinyl silicon oil and the si-h bond addition-curable of Methyl Hydrogen Polysiloxane Fluid (120 ℃/1h can be fully curing) in additional organosilicon damping material performed polymer, under catalyst action, there is addition reaction, in addition reaction process, do not produce any small molecules thing or volatile matter, thereby guarantee that this damping material performed polymer both can adopt mold cured moulding, also can in chuck or gap, pour into and be solidified into the visco-elastic damping material without air gap, therefore the additional organosilicon damping material making can be used in closed mold, chuck, the environment such as gap.
Accompanying drawing explanation
Fig. 1 is the dynamic mechanical analysis figure (DMTA figure) of the additional organosilicon damping material of preparation in the embodiment of the present invention 1.
Fig. 2 is the main TV structure schematic diagram of mould in the embodiment of the present invention 1.
Fig. 3 is the right TV structure schematic diagram of mould in the embodiment of the present invention 1.
Fig. 4 is the plan structure schematic diagram of mould in the embodiment of the present invention 1.
Embodiment
Below in conjunction with Figure of description, the invention will be further described with concrete preferred embodiment, but protection domain not thereby limiting the invention.
Embodiment 1:
An additional organosilicon damping material performed polymer, mainly the component by following weight part mixes:
Wherein, the general formula of molecular structure of methyl vinyl silicon oil is:
The general formula of molecular structure of Methyl Hydrogen Polysiloxane Fluid is:
Wherein, m, a are positive integer, and n is integer and non-vanishing;
In methyl vinyl silicon oil, silico ethylene base is positioned at end, sidepiece (being that n is not equal to 0), and the massfraction of silico ethylene base is 1%, and the kinetic viscosity of methyl vinyl silicon oil in the time of 25 ℃ is 600cP;
In Methyl Hydrogen Polysiloxane Fluid, si-h bond is positioned at end (being that b equals 0), and the massfraction of silicon hydrogen is 0.16%, and the kinetic viscosity of Methyl Hydrogen Polysiloxane Fluid in the time of 25 ℃ is 25cP.
An additional organosilicon damping material is solidified 0.5h and makes the silico ethylene base of methyl vinyl silicon oil and the si-h bond generation addition reaction of Methyl Hydrogen Polysiloxane Fluid and make at 120 ℃ by the additional organosilicon damping material performed polymer of above-mentioned the present embodiment.The damping factor of this additional organosilicon damping material in the time of 0～120 ℃ is 0.59～0.53, and heat resisting temperature reaches 180 ℃.
A preparation method for the additional organosilicon damping material of the present embodiment, comprises the following steps:
(1) by the methyl vinyl silicon oil of 80 weight parts, the Methyl Hydrogen Polysiloxane Fluid of 18.5 weight parts, the calcium carbonate of the mica powder of 1 weight part and 2 weight parts mixes and stirs 3h, stirring velocity is 800r/min, after stirring, be cooled to room temperature, add again the platinum catalyst (CAT-PL-56 of Shin-Etsu Chemial Co., Ltd) of 0.0020 weight part and the 1-ethynylcyclohexanol of 0.0025 weight part, obtain mixture, mixture is stirred to 3h, stirring velocity is 1000r/min, in whipping process, mixture temperature is controlled at 30 ℃, after completing, stirring is cooled to 23 ℃ and under-0.098MPa, vacuumize 5h with vacuum pump, obtain additional organosilicon damping material performed polymer,
(2) above-mentioned additional organosilicon damping material performed polymer is placed in the rectangular parallelepiped mould (referring to Fig. 2～4, the dark 10mm of groove) with groove and at 120 ℃, solidifies 0.5h, obtain additional organosilicon damping material.
Known after testing, additional organosilicon damping material prepared by the present embodiment damping factor in the time of 0～120 ℃ is 0.59～0.53, and heat resisting temperature can reach 180 ℃.
Leading indicator is analyzed
Additional organosilicon damping material prepared by above-mentioned the present embodiment is got 9.11g and is placed in a glass dish as sample, after cover lid, put into the constant temperature oven that temperature setting is set to 120 ℃, after 30 days, take out sample, weigh, fugitive constituent is quality and the proper mass ratio that 0.08%(fugitive constituent refers to loss), prove that thus additional organosilicon damping material prepared by the present embodiment has kept satisfactory stability under long-term hot environment.
Dynamic properties under differing temps: do dynamic properties test to being above set forth in the additional organosilicon damping material sample (detecting the sample of high-temperature stability) of drying after 30 days at 120 ℃, result as shown in Figure 1, as can be seen from the figure, this additional organosilicon damping material all the time between 0.59～0.53, illustrates that damping capacity is good the damping factor (tan δ) of 25 ℃ to 120 ℃.
Embodiment 2:
An additional organosilicon damping material performed polymer, mainly the component by following weight part mixes:
Wherein, the general formula of molecular structure of methyl vinyl silicon oil is:
The general formula of molecular structure of Methyl Hydrogen Polysiloxane Fluid is:
Wherein, m, a are positive integer, and b is integer and non-vanishing;
In methyl vinyl silicon oil, silico ethylene base is positioned at end (being that n equals 0), and the massfraction of silico ethylene base is 0.8%, and the kinetic viscosity of methyl vinyl silicon oil in the time of 25 ℃ is 3000cP;
In Methyl Hydrogen Polysiloxane Fluid, si-h bond is positioned at end, sidepiece (being that b is not equal to 0), and the massfraction of silicon hydrogen is 0.21%, and the kinetic viscosity of Methyl Hydrogen Polysiloxane Fluid in the time of 25 ℃ is 80cP.
An additional organosilicon damping material is solidified 0.5h and makes the silico ethylene base of methyl vinyl silicon oil and the si-h bond generation addition reaction of Methyl Hydrogen Polysiloxane Fluid and make at 120 ℃ by the additional organosilicon damping material performed polymer of above-mentioned the present embodiment.The damping factor of this additional organosilicon damping material in the time of 0～120 ℃ is 0.62～0.55, and heat resisting temperature reaches 180 ℃.
A preparation method for the additional organosilicon damping material of the present embodiment, comprises the following steps:
(1) by the methyl vinyl silicon oil of 90 weight parts, the Methyl Hydrogen Polysiloxane Fluid of 12.7 weight parts, the talcum powder of the graphite of 20 weight parts and 2 weight parts mixes and stirs 4h, stirring velocity is 800r/min, after stirring, be cooled to room temperature, add again the platinum catalyst (CAT-PL-56 of Shin-Etsu Chemial Co., Ltd) of 0.0027 weight part and the 1-ethynylcyclohexanol of 0.0032 weight part, obtain mixture, mixture is stirred to 4h, stirring velocity is 1000r/min, in whipping process, mixture temperature is controlled at 35 ℃, after completing, stirring is cooled to 23 ℃ and under-0.1MPa, vacuumize 5h with vacuum pump, obtain additional organosilicon damping material performed polymer,
(2) aforesaid liquid additional organosilicon damping material performed polymer is placed in to mould and at 120 ℃, solidifies 0.5h, obtain additional organosilicon damping material.
Known after testing, additional organosilicon damping material prepared by the present embodiment damping factor in the time of 0～120 ℃ is 0.62～0.55, and heat resisting temperature can reach 180 ℃.
Embodiment 3:
An additional organosilicon damping material performed polymer, mainly the component by following weight part mixes:
Wherein, the general formula of molecular structure of methyl vinyl silicon oil is:
The general formula of molecular structure of Methyl Hydrogen Polysiloxane Fluid is:
Wherein, m, a are positive integer, and n is integer and non-vanishing;
In methyl vinyl silicon oil, silico ethylene base is positioned at end, sidepiece (being that n is not equal to 0), and the massfraction of silico ethylene base is 0.4%, and the kinetic viscosity of methyl vinyl silicon oil in the time of 25 ℃ is 4500cP;
In Methyl Hydrogen Polysiloxane Fluid, si-h bond is positioned at end (being that b equals 0), and the massfraction of silicon hydrogen is 0.12%, and the kinetic viscosity of Methyl Hydrogen Polysiloxane Fluid in the time of 25 ℃ is 1750cP.
An additional organosilicon damping material is solidified 20d and makes the silico ethylene base of methyl vinyl silicon oil and the si-h bond generation addition reaction of Methyl Hydrogen Polysiloxane Fluid and make at 20 ℃ by the additional organosilicon damping material performed polymer of above-mentioned the present embodiment.Damping factor during 0～120 ℃ of this additional organosilicon damping material is 0.66～0.58, and heat resisting temperature reaches 200 ℃.
A preparation method for the additional organosilicon damping material of the present embodiment, comprises the following steps:
(1) by the methyl vinyl silicon oil of 100 weight parts, the Methyl Hydrogen Polysiloxane Fluid of 12.3 weight parts, the calcium carbonate of the mica powder of 5 weight parts and 1 weight part mixes and stirs 6h, stirring velocity is 1000r/min, after stirring, be cooled to room temperature, add again the platinum catalyst (CAT-PL-56 of Shin-Etsu Chemial Co., Ltd) of 0.0018 weight part and the 1-ethynylcyclohexanol of 0.0026 weight part, obtain mixture, mixture is stirred to 6h, stirring velocity is 1800r/min, in whipping process, mixture temperature is controlled at 40 ℃, after stirring completes, be cooled to 23 ℃ and vacuum pump and vacuumize 15h under-0.1MPa, obtain additional organosilicon damping material performed polymer,
(2) above-mentioned additional organosilicon damping material performed polymer is placed in to mould and at the temperature of 20 ℃, solidifies 20d, obtain additional organosilicon damping material.
Known after testing, additional organosilicon damping material prepared by the present embodiment damping factor in the time of 0～120 ℃ is 0.66～0.58, and heat resisting temperature can reach 200 ℃.
Embodiment 4:
An additional organosilicon damping material performed polymer, mainly the component by following weight part mixes:
80 parts of methyl vinyl silicon oils,
18.5 parts of Methyl Hydrogen Polysiloxane Fluids, and
0.0020 part of platinum catalyst (CAT-PL-56 of Shin-Etsu Chemial Co., Ltd).
Wherein, the general formula of molecular structure of methyl vinyl silicon oil is:
The general formula of molecular structure of Methyl Hydrogen Polysiloxane Fluid is:
Wherein, m, a are positive integer, and n is integer and non-vanishing;
In methyl vinyl silicon oil, silico ethylene base is positioned at end, sidepiece (being that n is not equal to 0), and the massfraction of silico ethylene base is 1%, and the kinetic viscosity of methyl vinyl silicon oil in the time of 25 ℃ is 600cP;
In Methyl Hydrogen Polysiloxane Fluid, si-h bond is positioned at end (being that b equals 0), and the massfraction of silicon hydrogen is 0.16%, and the kinetic viscosity of Methyl Hydrogen Polysiloxane Fluid in the time of 25 ℃ is 25cP.
An additional organosilicon damping material is solidified 7d and makes the silico ethylene base of methyl vinyl silicon oil and the si-h bond generation addition reaction of Methyl Hydrogen Polysiloxane Fluid and make at 20 ℃ by the additional organosilicon damping material performed polymer of above-mentioned the present embodiment.The damping factor of this additional organosilicon damping material in the time of 0～120 ℃ is 0.70～0.61, and heat resisting temperature reaches 180 ℃.
A preparation method for the additional organosilicon damping material of the present embodiment, comprises the following steps:
(1) Methyl Hydrogen Polysiloxane Fluid of the methyl vinyl silicon oil of 80 weight parts, 18.5 weight parts mixed and stir 3h, stirring velocity is 800r/min, after stirring, be cooled to room temperature, the platinum catalyst (CAT-PL-56 of Shin-Etsu Chemial Co., Ltd) that adds again 0.0020 weight part, obtain mixture, mixture is stirred to 0.1h, stirring velocity is 1000r/min, in whipping process, mixture temperature is controlled at 20 ℃, after stirring completes, with vacuum pump, under 20 ℃ ,-0.1MPa, vacuumize 5h, obtain additional organosilicon damping material performed polymer;
(2) above-mentioned additional organosilicon damping material performed polymer is placed in to mould and at 20 ℃, solidifies 7d, obtain additional organosilicon damping material.
Known after testing, additional organosilicon damping material prepared by the present embodiment damping factor in the time of 0～120 ℃ is 0.70～0.61, and heat resisting temperature can reach 180 ℃.
In the specific embodiment of the present invention, additional organosilicon damping material preparation method's correlation parameter can be preferred: room temperature is 20 ℃～26 ℃, churning time is 3h～6h, stirring velocity is 800r/min～2000r/min, vacuum tightness is-0.095～-0.1MPa, pumpdown time is 5h～20h, is determined on a case-by-case basis, but is in no way limited within the scope of these.Half fluxion additional organosilicon damping material performed polymer, can also be placed in the environment such as chuck, gap and be cured moulding, to meet special environmental demand conventional mould except being applicable to.
The above is only the preferred embodiment of the present invention, and protection scope of the present invention is also not only confined to above-described embodiment.All technical schemes belonging under thinking of the present invention all belong to protection scope of the present invention.Be noted that for those skilled in the art, improvements and modifications under the premise without departing from the principles of the invention, these improvements and modifications also should be considered as protection scope of the present invention.
Claims (15)
1. an additional organosilicon damping material performed polymer, is characterized in that, described additional organosilicon damping material performed polymer is mainly mixed by the component of following weight part:
2. additional organosilicon damping material performed polymer according to claim 1, is characterized in that, the general formula of molecular structure of described methyl vinyl silicon oil is lower formula I:
The general formula of molecular structure of described Methyl Hydrogen Polysiloxane Fluid is lower formula II:
Wherein, m, a are positive integer, and n, b are integer and at least one is non-vanishing;
In described methyl vinyl silicon oil, the massfraction of silico ethylene base is 0.1%～1.6%, and the kinetic viscosity of described methyl vinyl silicon oil in the time of 25 ℃ is 80cP～5000cP;
In described Methyl Hydrogen Polysiloxane Fluid, the massfraction of silicon hydrogen is 0.05%～0.25%, and the kinetic viscosity of described Methyl Hydrogen Polysiloxane Fluid in the time of 25 ℃ is 20cP～2000cP.
3. additional organosilicon damping material performed polymer according to claim 1 and 2, is characterized in that, described catalyzer is transistion metal compound.
4. additional organosilicon damping material performed polymer according to claim 1 and 2, is characterized in that, described inhibitor is one or more in tetramethyl-tetrem thiazolinyl cyclotetrasiloxane, wire vinyl silicone oil, 1-ethynylcyclohexanol.
5. additional organosilicon damping material performed polymer according to claim 1 and 2, is characterized in that, described solid mineral material is one or more in graphite, mica powder, calcium carbonate, talcum powder.
6. an additional organosilicon damping material, it is characterized in that, described additional organosilicon damping material is mainly made through addition reaction by the silico ethylene base in methyl vinyl silicon oil and the si-h bond in Methyl Hydrogen Polysiloxane Fluid after the component of following weight part is mixed:
7. additional organosilicon damping material according to claim 6, is characterized in that, the damping factor of described additional organosilicon damping material in the time of 0～120 ℃ is 1～0.5, and heat resisting temperature reaches 120 ℃～200 ℃.
8. additional organosilicon damping material according to claim 6, is characterized in that, the general formula of molecular structure of described methyl vinyl silicon oil is lower formula I:
The general formula of molecular structure of described Methyl Hydrogen Polysiloxane Fluid is lower formula II:
Wherein, m, a are positive integer, and n, b are integer and at least one is non-vanishing;
In described methyl vinyl silicon oil, the massfraction of silico ethylene base is 0.1%～1.6%, and the kinetic viscosity of described methyl vinyl silicon oil in the time of 25 ℃ is 80cP～5000cP;
In described Methyl Hydrogen Polysiloxane Fluid, the massfraction of silicon hydrogen is 0.05%～0.25%, and the kinetic viscosity of described Methyl Hydrogen Polysiloxane Fluid in the time of 25 ℃ is 20cP～2000cP.
9. according to the additional organosilicon damping material described in any one in claim 6～8, it is characterized in that, described catalyzer is transistion metal compound.
10. according to the additional organosilicon damping material described in any one in claim 6～8, it is characterized in that, described inhibitor is one or more in tetramethyl-tetrem thiazolinyl cyclotetrasiloxane, wire vinyl silicone oil, 1-ethynylcyclohexanol.
11. according to the additional organosilicon damping material described in any one in claim 6～8, it is characterized in that, described solid mineral material is one or more in graphite, mica powder, calcium carbonate, talcum powder.
The preparation method of 12. 1 kinds of additional organosilicon damping materials as described in any one in claim 6～11, comprise the following steps: methyl vinyl silicon oil, Methyl Hydrogen Polysiloxane Fluid and catalyzer are mixed, after gained mixture fully stirs and vacuumizes, obtain additional organosilicon damping material performed polymer; Additional organosilicon damping material performed polymer is cured, obtains additional organosilicon damping material.
13. preparation methods according to claim 12, is characterized in that, also comprise inhibitor and/or solid mineral material in described mixture.
14. according to the preparation method described in claim 12 or 13, it is characterized in that, described mixture temperature in stirring and vacuum is controlled at below 50 ℃.
15. according to the preparation method described in claim 12 or 13, it is characterized in that, described condition of cure is: 20 ℃～120 ℃ of solidification values, set time 0.5h～30d.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310511983.0A CN103554924B (en) | 2013-10-25 | 2013-10-25 | Additional organosilicon damping material performed polymer, additional organosilicon damping material and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310511983.0A CN103554924B (en) | 2013-10-25 | 2013-10-25 | Additional organosilicon damping material performed polymer, additional organosilicon damping material and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103554924A true CN103554924A (en) | 2014-02-05 |
| CN103554924B CN103554924B (en) | 2016-03-09 |
Family
ID=50009297
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310511983.0A Active CN103554924B (en) | 2013-10-25 | 2013-10-25 | Additional organosilicon damping material performed polymer, additional organosilicon damping material and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103554924B (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017114440A1 (en) | 2015-12-31 | 2017-07-06 | Bluestar Silicones Shanghai Co., Ltd. | Electrically-conductive curable organosilicon rubber |
| CN108299829A (en) * | 2018-03-16 | 2018-07-20 | 武汉大学 | Organosilicon interpenetrating net polymer and preparation method thereof |
| WO2018188471A1 (en) * | 2017-04-13 | 2018-10-18 | 东莞市帝克兰新材料科技有限公司 | High-damp silicone rubber cement, a composite material containing the high-damp silicone rubber cement and preparation method and use thereof |
| US11059264B2 (en) | 2018-03-19 | 2021-07-13 | Avery Dennison Corporation | Multilayer constrained-layer damping |
| US11701863B2 (en) | 2018-05-17 | 2023-07-18 | Avery Dennison Corporation | Partial coverage multilayer damping laminate |
| US11713406B2 (en) | 2016-09-20 | 2023-08-01 | Avery Dennison Corporation | Multilayer tape |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6075112A (en) * | 1998-09-16 | 2000-06-13 | Dow Corning Toray Silicone Co., Ltd. | Curable silicone composition for vibration-isolating laminate |
| CN1424357A (en) * | 2000-11-28 | 2003-06-18 | 陶氏康宁东丽硅氧烷株式会社 | Vibration damping siloxane composition |
| CN1646631A (en) * | 2002-02-06 | 2005-07-27 | Ge拜尔硅股份有限公司 | Self-adhesive, addition cross-linking silicone-rubber blends, method for their production, method for producing composite moulded parts and use of the latter |
| CN1746224A (en) * | 2005-09-29 | 2006-03-15 | 中蓝晨光化工研究院 | High and low temperature-resistant rubber with high damping |
| CN101412851A (en) * | 2008-11-25 | 2009-04-22 | 上海市合成树脂研究所 | Organosilicon conductive adhesive |
| CN101643582A (en) * | 2009-08-25 | 2010-02-10 | 合肥凯蒙新材料有限公司 | Dual composition addition type room temperature solidified silicon rubber used for recording left-behind tracks |
| CN101962480A (en) * | 2010-10-27 | 2011-02-02 | 航天材料及工艺研究所 | Low phenyl siloxane rubber-based wide temperature-range and high-damping material |
| CN102186907A (en) * | 2008-10-30 | 2011-09-14 | 瓦克化学股份公司 | Method for producing silicone moulded bodies from light-curable silicone mixtures |
-
2013
- 2013-10-25 CN CN201310511983.0A patent/CN103554924B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6075112A (en) * | 1998-09-16 | 2000-06-13 | Dow Corning Toray Silicone Co., Ltd. | Curable silicone composition for vibration-isolating laminate |
| CN1424357A (en) * | 2000-11-28 | 2003-06-18 | 陶氏康宁东丽硅氧烷株式会社 | Vibration damping siloxane composition |
| CN1646631A (en) * | 2002-02-06 | 2005-07-27 | Ge拜尔硅股份有限公司 | Self-adhesive, addition cross-linking silicone-rubber blends, method for their production, method for producing composite moulded parts and use of the latter |
| CN1746224A (en) * | 2005-09-29 | 2006-03-15 | 中蓝晨光化工研究院 | High and low temperature-resistant rubber with high damping |
| CN102186907A (en) * | 2008-10-30 | 2011-09-14 | 瓦克化学股份公司 | Method for producing silicone moulded bodies from light-curable silicone mixtures |
| CN101412851A (en) * | 2008-11-25 | 2009-04-22 | 上海市合成树脂研究所 | Organosilicon conductive adhesive |
| CN101643582A (en) * | 2009-08-25 | 2010-02-10 | 合肥凯蒙新材料有限公司 | Dual composition addition type room temperature solidified silicon rubber used for recording left-behind tracks |
| CN101962480A (en) * | 2010-10-27 | 2011-02-02 | 航天材料及工艺研究所 | Low phenyl siloxane rubber-based wide temperature-range and high-damping material |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017114440A1 (en) | 2015-12-31 | 2017-07-06 | Bluestar Silicones Shanghai Co., Ltd. | Electrically-conductive curable organosilicon rubber |
| US11713406B2 (en) | 2016-09-20 | 2023-08-01 | Avery Dennison Corporation | Multilayer tape |
| WO2018188471A1 (en) * | 2017-04-13 | 2018-10-18 | 东莞市帝克兰新材料科技有限公司 | High-damp silicone rubber cement, a composite material containing the high-damp silicone rubber cement and preparation method and use thereof |
| CN108299829A (en) * | 2018-03-16 | 2018-07-20 | 武汉大学 | Organosilicon interpenetrating net polymer and preparation method thereof |
| US11059264B2 (en) | 2018-03-19 | 2021-07-13 | Avery Dennison Corporation | Multilayer constrained-layer damping |
| US11701863B2 (en) | 2018-05-17 | 2023-07-18 | Avery Dennison Corporation | Partial coverage multilayer damping laminate |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103554924B (en) | 2016-03-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103554924B (en) | Additional organosilicon damping material performed polymer, additional organosilicon damping material and preparation method thereof | |
| CN105008432B (en) | Moisturecuring hot melt silicone adhesive composition comprising alkoxy-functional siloxanes reaction resin | |
| CN103468200B (en) | Environmentally friendly two-component silicone rubber adhesive and preparation method thereof | |
| CN105348813B (en) | It is a kind of can damp and hot dual cure single-component organic silicon composition and preparation method thereof | |
| CN105255438B (en) | The modified room temperature vulcanized silicone rubber and preparation method thereof of bisphenol A epoxide resin | |
| CN106046386A (en) | Epoxy resin-organosilicon polymer and preparation method and application thereof | |
| CN104212185B (en) | One stablizes not permeable oil type electronic devices and components clear silicone gel | |
| CN101311238A (en) | Light-coloured high temperature resistant organic silicone adhesive/sealant | |
| CN101768363A (en) | Method for preparing addition highly heat-conducting room temperature-curing silicon rubber | |
| CN103865272A (en) | Organic silicon impedance glue and preparation method thereof | |
| CN103589387A (en) | High-strength bonding room temperature curing organosilicone potting adhesive for LED (light-emitting diode) and preparation method of adhesive | |
| CN103289414B (en) | Heat-proof combustion-resistant room temperature silicon sulfide rubber composition | |
| CN106244093A (en) | Room temperature vulcanization addition type organic silicon pouring sealant composition | |
| CN104031389A (en) | Humid-heat resisting room-temperature vulcanized silicone rubber composition | |
| CN105778516B (en) | A kind of add-on type curable silicone compositions | |
| JP4645859B2 (en) | Addition-curable silicone rubber composition and cured silicone rubber | |
| CN103834353A (en) | High-strength single-component room temperature vulcanized silicone rubber | |
| CN104031390A (en) | Thermochromic one-component ketoxime-free room temperature vulcanized silicone rubber | |
| CN104530707A (en) | Crystal whisker reinforced organic silicon heat conducting material and preparation method thereof | |
| CN106167621B (en) | Flame-retardant room temperature vulcanized liquid silicone rubber | |
| CN102504547A (en) | Room-temperature vulcanization dual-component deketoxime type silicone rubber sealant and preparation method thereof | |
| CN104845377A (en) | Double-component room temperature curing silicone rubber and preparation method thereof | |
| CN103319901A (en) | Acid-resistant storage-stable high-strength two-component room temperature-vulcanized silicone rubber | |
| CN106905705A (en) | A kind of silicone sealant gel and preparation method thereof | |
| JP2011084600A (en) | Resin composition set |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |