CN103551096A - Carbon fiber microchip reactor - Google Patents
Carbon fiber microchip reactor Download PDFInfo
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- CN103551096A CN103551096A CN201310514522.9A CN201310514522A CN103551096A CN 103551096 A CN103551096 A CN 103551096A CN 201310514522 A CN201310514522 A CN 201310514522A CN 103551096 A CN103551096 A CN 103551096A
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Abstract
The invention discloses a carbon fiber microchip reactor. The carbon fiber microchip reactor is a multi-layer structure, and comprises a heat conducting or electricity conducting layer, an upper-layer carbon fiber blanking plate, a carbon fiber reaction channel layer, a lower-layer carbon fiber blanking plate and a second heat conducting or electricity conducting layer sequentially from top to bottom, wherein the carbon fiber reaction channel layer comprises a micro-channel for chemical reaction of fluid; the carbon fiber reaction channel layer, the upper-layer carbon fiber blanking plate and the lower-layer carbon fiber blanking plate are all made of carbon fiber plates. The carbon fiber microchip reactor has the following advantages: 1. the reactor has light weight and is portable; 2. the reactor has extremely high corrosion resistance and can resist acid and base; 3. the reactor has ultra high heat conducting property; 4. the reactor can be formed in one time conveniently, so that the mass production is realized, and the requirement of equipment of development tendency of a chemical process in future is met.
Description
Technical field
Patent application of the present invention relates to a kind of carbon fiber microchip reactor, belongs to the special equipment field of chemical reaction.
Background technology
One of development trend of chemical engineering process (PI) is the microminiaturization development of equipment.The microchannel size of microchip reactor inner fluid has reached micron to submillimeter magnitude, compares with traditional consersion unit, and its advantage is the improvement to the strengthening of quality and heat transfer process and fluid-flow mode.In microchip microreactor, thermograde along with linear content reduce increase very soon, the remarkable increase of driving force of heat transfer, has expanded the thermal diffusion flux of unit volume or unit are; In addition,, by reducing fluid thickness, increased area-volume ratio.Therefore by accurate reaction time and the reaction temperature controlled, control the process of reaction, improve the conversion ratio of raw material, and due to the reducing of reaction volume, can reduce to greatest extent the dangerous harm that produces of occurring.
Chinese invention patent (application number 200610088398.4) discloses a kind of composite heat transfer micro reactor, can realize the control of many humidity provinces, Chinese invention patent (application number 200710048166.0) discloses a kind of combined type heat exchange filling type micro-reactor, Chinese invention patent (application number 200610085433.7) discloses a kind of method of utilizing micro passage reaction to prepare biodiesel, Chinese invention patent (application number 200710134498.0) discloses a kind of method and a kind of method of utilizing micro passage reaction to prepare nano zeolite of Chinese invention patent (application number 200710021824.7) that micro passage reaction is prepared fatty acid ester, Chinese invention patent (patent No. ZL200910029362.2, ZL20910029363.7) above reactor is prepared by metal material, relatively difficult from machining angle, can not realize the production of mass equipment.And metal material has certain limitation for suitable chemical reaction on material, easily occur corrosivity causing equipment failure, bulk density is large.Metal material is relative engineering plastics on heat conduction, electric conductivity, have certain superiority, but without room for promotion, are not best heat conduction and conductive material.
Summary of the invention
The most basic technical problem that the present invention will solve is to provide a kind of high heat conduction or electric conductivity, and corrosion-resistant, be convenient to the microchip reactor of mass production, the problem that the present invention will further solve is to provide a kind of heat conduction and the further carbon fiber microchip reactor strengthening of electric conductivity.
In order to overcome the shortcoming of the minisize reaction chip of metal material, select carbon fibre material to prepare microchip reactor, this material has the features such as intensity is high, quality is light, anticorrosive, especially its heat conductivility promotes along with the rising of heat treatment temperature, graphitization temperature, in the thermal conductivity that is parallel to carbon fiber length direction, can reach 180W/ (m*K), vertical direction can reach 70W/ (m*K).The epoxy composite material of selecting the carbon fiber knit of all or part of vapor phase growth to strengthen to carbon fiber composite board, thermal conductivity factor can reach 600W/ (m*K).Solution hardware is heavy, not corrosion-resistant, and the shortcoming that processing can not mass relatively, and promoted greatly the heat conductivility of equipment has been saved investment and the maintenance cost of the required thermodynamic apparatus of system response.
This carbon fiber microchip reactor manufactures sandwich construction, is followed successively by from top to down the first heat conduction or conductive layer, upper strata carbon fiber shrouding, carbon fiber reaction channel Ceng, lower floor's carbon fiber shrouding and the second heat conduction or conductive layer; Described carbon fiber reaction channel layer contains the microchannel of carrying out chemical reaction for fluid; Described carbon fiber reaction channel layer, upper strata carbon fiber shrouding and lower floor's carbon fiber shrouding are made by carbon fiber board, and with heat conduction and the electric conductivity of reinforced partly product, more corrosion-resistant, mechanical strength is higher.
Described carbon fiber board is obtained by following steps processing:
1) carbon fiber is woven and formed three dimension stereo fabric by 3 D stereo, with respect to ordinary two dimensional flat fabric, can increase the ratio that carbon fiber in the middle of fabric is parallel to heat conduction direction along its length, thereby improve whole thermal conductivity, and simplified processing process, is convenient to mass and produces formation carbon fiber board;
2) product impregnating resin step 1) being obtained, solidifies, and pressurization maintenance, to strengthen whole mechanical strength;
3) by step 2) product that obtains cuts, polishing.
Can also be in step 2) described in resin in be mixed with carbon dust or metal_based material oozes material as mixing, further improve whole thermal conductivity.The content that carbon dust or metal_based material add is 5-30%.
In step 1), the carbon fiber that the carbon fiber of use is all or part of vapor phase growth.
Step 2), in, described resin can be epoxy resin, thermosetting phenolic resin or acrylic resin.When selecting epoxy resin, solidification temperature is 150-200 degree Celsius, and pressurization keeps 2-5 hour.Those skilled in the art can select suitable resin as step 2 according to the concrete situation of carbon fiber three dimension stereo fabric) described in resin, and suitably select corresponding solidification temperature and pressurization retention time according to selected resin.
Can also further improve, by the polishing step in step 3), the burnishing surface that is polished to carbon fiber board exposes carbon fiber cross section, and surface roughness is 0.6-3.2.By the unnecessary resin in carbon fiber board surface, also have part carbon fiber length direction to grind off perpendicular to the carbon fiber of heat conduction direction like this, further improve whole thermal conductivity.Concrete operations are (three dimension stereo fabric of the two step method of take braiding is example) as shown in Figure 2, the Partial Resection of polishing the part of weaving carbon fiber perpendicular to hot conduction orientation, only left weaving carbon fiber parallel and compared to the part of hot conduction orientation, again because carbon fiber will be much larger than the thermal conductivity perpendicular to fibre length direction along the thermal conductivity of fibre length direction, so the skim part of carbon fiber of polishing can significantly strengthen carbon fiber board along being the thermal conductivity of heat conduction direction perpendicular to board plane direction.In addition, by polishing, go out the resin on carbon fiber board surface, also can strengthen carbon fiber board along being the thermal conductivity of heat conduction direction perpendicular to board plane direction.Therefore carbon fiber board being polished to carbon fiber board surface exposes the cross section of carbon fiber and can significantly strengthen carbon fiber board along being the thermal conductivity of heat conduction direction perpendicular to board plane direction.
Described carbon fiber reaction channel layer is made by one of following manner:
1) use the carbon fiber board described in, adopt the mode of precision optical machinery processing and/or precise injection molding and/or compression molding to process described carbon fiber board, make to form the MCA that carries out chemical reaction for fluid on described carbon fiber board, to make carbon fiber reaction channel layer;
2) use the carbon fiber board described in, the mode of employing precision optical machinery processing and/or precise injection molding and/or compression molding is processed a side of described carbon fiber board, make to form for fluid and carry out the MCA of chemical reaction on described carbon fiber board, thereby on this piece carbon fiber board, make carbon fiber reaction channel layer and upper strata carbon fiber shrouding simultaneously;
3) use the carbon fiber board described in, the mode of employing precision optical machinery processing and/or precise injection molding and/or compression molding is processed a side of described carbon fiber board, make to form for fluid and carry out the MCA of chemical reaction on described carbon fiber board, thereby on this piece carbon fiber board, make carbon fiber reaction channel Ceng He lower floor carbon fiber shrouding simultaneously;
4) use the carbon fiber board described in two, the side that the mode of employing precision optical machinery processing and/or precise injection molding and/or compression molding is processed respectively the carbon fiber board described in two, make to form on a carbon fiber board wherein the latter half and lower floor's carbon fiber shrouding of carbon fiber reaction channel layer, on another piece carbon fiber board, form the first half and the upper strata carbon fiber shrouding of carbon fiber reaction channel layer, then two carbon fiber boards are bonding to make the complete described carbon fiber reaction channel layer containing microchannel.
In addition, further, can also under the condition of 2400-3000 degree Celsius, carry out high-temperature heat treatment to described upper strata carbon fiber shrouding and/or lower floor's carbon fiber shrouding and/or containing the carbon fiber reaction channel layer of microchannel, can make material graphitization like this, thereby improve whole thermal conductivity, by graphitization and high temperature sintering, make reactor material graphitization on the other hand, the electric conductivity of this microchip reactor of raising that can also be significantly.
Further can be preferably between layers by bolt hard link and/or use adhesive bond, to improve the mechanical strength of reactor.
Remarkable result of the present invention: 1, quality is light; 2, extremely strong corrosion resistance, antiacid, alkali resistant; 3, superpower heat conductivility; 4, be convenient to one-shot forming, batch production.
Accompanying drawing explanation
Fig. 1 is carbon fiber microchip reactor schematic diagram of the present invention
As shown in FIG.: 1 is upper strata carbon fiber shrouding; 2 is carbon fiber microchannel layer; 3 is lower floor's carbon fiber shrouding; 4 is the first heat conduction or conductive layer; 5 is the second conduction or heat-conducting layer.
Fig. 2 is that the carbon fiber burnishing surface that is polished to of the present invention exposes carbon fiber schematic cross-section (take two step method three dimension stereo fabric as example)
As shown in FIG.: 6 is burnishing surface; 7 is weaving carbon fiber; 8 is carbon fiber cross section.
The specific embodiment
According to following embodiment, the present invention may be better understood.Yet, those skilled in the art will readily understand, the described content of embodiment is only for the present invention is described, and should also can not limit the present invention described in detail in claims.
Embodiment 1: the manufacture method of carbon fiber board.
Use the two step method braiding in carbon fiber 3 D stereo weaving method to obtain a thick plate-like fabric, this textile impregnation, in epoxy resin, then is solidified under the condition of 150 degrees Celsius, and pressurization keeps 2 hours, cut again, be polished to 40mm * 80mm, the carbon fiber board that thickness is 2.8mm.
Embodiment 2: the manufacture method of carbon fiber board.
Use the carbon fiber of part vapor phase growth to obtain a tubing by the four step rule braiding in 3 D stereo weaving method, by this textile impregnation in epoxy resin, under the condition of 200 degrees Celsius, solidify again, pressurization keeps 5 hours, cut again, be polished to 40mm * 80mm, the carbon fiber board that thickness is 2.8mm.
Embodiment 3: the manufacture method of carbon fiber board.
Use the two step method braiding in carbon fiber 3 D stereo weaving method to obtain a thick plate-like fabric, by this textile impregnation in thermosetting phenolic resin, under the condition of 100 degrees Celsius, solidify again, pressurization keeps 3 hours, cut again, be polished to 40mm * 80mm, the carbon fiber board that thickness is 2.8mm.
Embodiment 4: the manufacture method of carbon fiber board.
Use the carbon fiber of whole vapor phase growths to obtain a thick plate-like fabric by the two step method braiding in 3 D stereo weaving method, by this textile impregnation in the acrylic resin melting, cooling curing at normal temperatures again, pressurization keeps 3 hours, cutting, be polished to 40mm * 80mm, the carbon fiber board that thickness is 2.8mm.
Embodiment 5: the cutting of carbon fiber board, finishing method.
Use commercially available Two-dimensional Carbon fiberboard composite, cut, be polished to 40mm * 80mm, the carbon fiber board that thickness is 2.8mm.
Embodiment 6:
Other conditions are with embodiment 1, but in epoxy resin, having added relative epoxy resin 10%wt silver-based powder oozes material as mixing.
Embodiment 7:
Other conditions are with embodiment 1, but in epoxy resin, having added relative epoxy resin 20%wt silver-based powder oozes material as mixing.
Embodiment 8:
Other conditions are with embodiment 1, but in epoxy resin, having added relative epoxy resin 20%wt carbon dust oozes material as mixing.
Embodiment 9:
Other conditions are with embodiment 1, but in epoxy resin, having added relative epoxy resin 30%wt carbon dust oozes material as mixing.
Embodiment 10:
Other conditions are with embodiment 1, but in described polishing step, the area that is polished to carbon fiber board burnishing surface 6 is carbon fiber cross section 8, and surface roughness is 0.6.
Embodiment 11:
Other conditions are with embodiment 1, but in described polishing step, are polished to that carbon fiber board polished surface 6 has just exposed carbon fiber cross section 8 and surface roughness is 3.2.
Embodiment 12:
The carbon fiber board of embodiment 1 gained is heated to 2400 degrees Celsius and carries out graphitization processing.
Embodiment 13:
The carbon fiber board of embodiment 1 gained is heated to 2800 degrees Celsius and carries out graphitization processing.
Embodiment 14:
The carbon fiber board of getting embodiment 1 gained is used precision optical machinery processing method on described carbon fiber board, to cut a S shaped reaction passage, forms described carbon fiber reaction channel layer.
Embodiment 15:
The carbon fiber board of getting embodiment 2 gained is used the method for precise injection molding on described carbon fiber board, to form a S shaped reaction passage, forms described carbon fiber reaction channel layer.
Embodiment 16:
The carbon fiber board of getting embodiment 3 gained is used the method for compression molding to become a S shaped reaction passage in described carbon fiber board patrix swaging, forms described carbon fiber reaction channel layer.
Embodiment 17:
The carbon fiber board of getting embodiment 4 gained is used precision optical machinery to process the method combining with precise injection molding and in described carbon fiber board one side, forms a Y shape reaction channel, form described reaction channel Ceng Yu lower floor carbon fiber shrouding.
Embodiment 18:
The common commercially available carbon fiber board of getting embodiment 5 gained is used precision optical machinery to process the method combining with precise injection molding and in described carbon fiber board one side, forms a Y shape reaction channel, form described reaction channel layer and upper strata carbon fiber shrouding.
Embodiment 19:
Get two carbon fiber boards of embodiment 6 gained, the method of using precision optical machinery processing to combine with compression molding with precise injection molding forms Lower Half and lower floor's carbon fiber shrouding of a Y shape reaction channel layer on a carbon fiber board, forms the first half and the upper strata carbon fiber shrouding of a Y shape reaction channel layer on another piece carbon fiber board.
Embodiment 20:
Get a carbon fiber board of embodiment 7 gained, the method for using precise injection molding to combine forms a Y shape reaction channel in described carbon fiber board one side, forms described reaction channel layer and upper strata carbon fiber shrouding.
Embodiment 21:
Get a carbon fiber board of embodiment 8 gained, the method for using precise injection molding to combine forms a Y shape reaction channel in described carbon fiber board one side, forms described reaction channel layer and upper strata carbon fiber shrouding.
Embodiment 22:
Get a carbon fiber board of embodiment 9 gained, the method for using precise injection molding to combine forms a Y shape reaction channel in described carbon fiber board one side, forms described reaction channel layer and upper strata carbon fiber shrouding.
Embodiment 23:
Get a carbon fiber board of embodiment 10 gained, the method for using precise injection molding to combine forms a Y shape reaction channel in described carbon fiber board one side, forms described reaction channel layer and upper strata carbon fiber shrouding.
Embodiment 24:
Get a carbon fiber board of embodiment 11 gained, the method for using precision optical machinery processing to combine with precise injection molding forms a Y shape reaction channel in described carbon fiber board one side, forms described reaction channel layer and upper strata carbon fiber shrouding.
Embodiment 25:
Get a carbon fiber board of embodiment 12 gained, the method for using precision optical machinery processing to combine with precise injection molding forms a Y shape reaction channel in described carbon fiber board one side, forms described reaction channel layer and upper strata carbon fiber shrouding
Embodiment 26:
Get a carbon fiber board of embodiment 13 gained, the method for using precision optical machinery processing to combine with precise injection molding forms a Y shape reaction channel in described carbon fiber board one side, forms described reaction channel layer and upper strata carbon fiber shrouding
Embodiment 27:
Get the carbon fiber board obtaining in carbon fiber reaction channel layer 2 that embodiment 14 obtains and two embodiment 1.Using one of two carbon fiber board as 1 one of upper strata carbon fiber shroudings as lower floor's carbon fiber shrouding 3, be arranged in order from top to down as upper strata carbon fiber shrouding 1, carbon fiber reaction channel layer 2, lower floor's carbon fiber shrouding 3, in addition on upper strata carbon fiber shrouding 1, cover again the first conduction or heat-conducting layer 4 ， lower floor carbon fiber shrouding and cover the second conduction or heat-conducting layer 5 for 3 times.Interlayer is bolted, and obtains carbon fiber microchip reactor A.
Embodiment 28:
Get the carbon fiber board obtaining in carbon fiber reaction channel layer 2 that embodiment 15 obtains and two embodiment 2.Using one of two carbon fiber board as 1 one of upper strata carbon fiber shroudings as lower floor's carbon fiber shrouding 3, be arranged in order from top to down as upper strata carbon fiber shrouding 1, carbon fiber reaction channel layer 2, lower floor's carbon fiber shrouding 3, in addition on upper strata carbon fiber shrouding 1, cover again the first conduction or heat-conducting layer 4, at lower floor's carbon fiber shrouding, cover the second conduction or heat-conducting layer 5 for 2 times, interlayer is bonding by epobond epoxyn, obtains carbon fiber microchip reactor B.
Embodiment 29:
Get the carbon fiber board obtaining in carbon fiber reaction channel layer 2 that embodiment 16 obtains and two embodiment 3.Using one of two carbon fiber board as 1 one of upper strata carbon fiber shroudings as lower floor's carbon fiber shrouding 3, be arranged in order from top to down as upper strata carbon fiber shrouding 1, carbon fiber reaction channel layer 2, lower floor's carbon fiber shrouding 3, in addition on upper strata carbon fiber shrouding 1, cover again the first conduction or heat-conducting layer 4 ， lower floor carbon fiber shrouding and cover the second conduction or heat-conducting layer 5 for 3 times.Interlayer is bonding by epobond epoxyn, obtains carbon fiber microchip reactor C.
Embodiment 30:
Get carbon fiber reaction channel layer 2 and lower floor's carbon fiber shrouding 3 that embodiment 17 obtains, then get a carbon fiber board obtaining in embodiment 4 as upper strata carbon fiber shrouding 1.Be arranged in order from top to down as upper strata carbon fiber shrouding 1, carbon fiber reaction channel layer 2, lower floor's carbon fiber shrouding 3, in addition on upper strata carbon fiber shrouding 1, cover again the first conduction or heat-conducting layer 4, at lower floor's carbon fiber shrouding, cover the second conduction or heat-conducting layer 5 for 3 times, interlayer is bonding by aerodux, obtains carbon fiber microchip reactor D.
Embodiment 31:
Get carbon fiber reaction channel layer 2 and upper strata carbon fiber shrouding 1 that embodiment 18 obtains, then get a carbon fiber board obtaining in embodiment 5 as lower floor's carbon fiber shrouding 3.Be arranged in order from top to down as upper strata carbon fiber shrouding 1, carbon fiber reaction channel layer 2, lower floor's carbon fiber shrouding 3, in addition on upper strata carbon fiber shrouding 1, cover again the first conduction or heat-conducting layer 4, at lower floor's carbon fiber shrouding, cover the second conduction or heat-conducting layer 5 for 3 times, interlayer is bonding by aerodux, obtains carbon fiber microchip reactor E.
Embodiment 32:
Get Lower Half and lower floor's carbon fiber shrouding 3 of the carbon fiber reaction channel layer 2 that embodiment 19 obtains, and the first half of carbon fiber reaction channel layer 2 and upper strata carbon fiber shrouding 1.By the first half appropriate section laminating of the Lower Half of carbon fiber reaction channel layer 2 and reaction channel layer 2, be arranged in order from top to down as upper strata carbon fiber shrouding 1, carbon fiber reaction channel layer 2, lower floor's carbon fiber shrouding 3, in addition on upper strata carbon fiber shrouding 1, cover again the first conduction or heat-conducting layer 4, at lower floor's carbon fiber shrouding, cover the second conduction or heat-conducting layer 5 for 2 times, interlayer is bonding by aerodux, obtains carbon fiber microchip reactor F.
Embodiment 33:
Get carbon fiber reaction channel layer 2 and upper strata carbon fiber shrouding 1 that embodiment 20 obtains, then get a carbon fiber board obtaining in embodiment 7 as lower floor's carbon fiber shrouding 3.Be arranged in order from top to down as upper strata carbon fiber shrouding 1, carbon fiber reaction channel layer 2, lower floor's carbon fiber shrouding 3, in addition on upper strata carbon fiber shrouding 1, cover again the first conduction or heat-conducting layer 4, at lower floor's carbon fiber shrouding, cover the second conduction or heat-conducting layer 5 for 3 times, interlayer is bonding by epobond epoxyn, obtains carbon fiber microchip reactor G.
Embodiment 34:
Get carbon fiber reaction channel layer 2 and upper strata carbon fiber shrouding 1 that embodiment 21 obtains, then get a carbon fiber board obtaining in embodiment 8 as lower floor's carbon fiber shrouding 3.Be arranged in order from top to down as upper strata carbon fiber shrouding 1, carbon fiber reaction channel layer 2, lower floor's carbon fiber shrouding 3, in addition on upper strata carbon fiber shrouding 1, cover again the first conduction or heat-conducting layer 4, at lower floor's carbon fiber shrouding, cover the second conduction or heat-conducting layer 5 for 3 times, interlayer is bonding by epobond epoxyn, obtains carbon fiber microchip reactor H.
Embodiment 35:
Get carbon fiber reaction channel layer 2 and upper strata carbon fiber shrouding 1 that embodiment 22 obtains, then get a carbon fiber board obtaining in embodiment 9 as lower floor's carbon fiber shrouding 3.Be arranged in order from top to down as upper strata carbon fiber shrouding 1, carbon fiber reaction channel layer 2, lower floor's carbon fiber shrouding 3, in addition on upper strata carbon fiber shrouding 1, cover again the first conduction or heat-conducting layer 4, at lower floor's carbon fiber shrouding, cover the second conduction or heat-conducting layer 5 for 3 times, interlayer is bonding by epobond epoxyn, obtains carbon fiber microchip reactor I.
Embodiment 36:
Get carbon fiber reaction channel layer 2 and upper strata carbon fiber shrouding 1 that embodiment 23 obtains, then get a carbon fiber board obtaining in embodiment 10 as lower floor's carbon fiber shrouding 3.Be arranged in order from top to down as upper strata carbon fiber shrouding 1, carbon fiber reaction channel layer 2, lower floor's carbon fiber shrouding 3, in addition on upper strata carbon fiber shrouding 1, cover again the first conduction or heat-conducting layer 4, at lower floor's carbon fiber shrouding, cover the second conduction or heat-conducting layer 5 for 3 times, interlayer is bonding by epobond epoxyn, obtains carbon fiber microchip reactor J.
Embodiment 37:
Get carbon fiber reaction channel layer 2 and upper strata carbon fiber shrouding 1 that embodiment 24 obtains, then get a carbon fiber board obtaining in embodiment 11 as lower floor's carbon fiber shrouding 3.Be arranged in order from top to down as upper strata carbon fiber shrouding 1, carbon fiber reaction channel layer 2, lower floor's carbon fiber shrouding 3, in addition on upper strata carbon fiber shrouding 1, cover again the first conduction or heat-conducting layer 4, at lower floor's carbon fiber shrouding, cover the second conduction or heat-conducting layer 5 for 3 times, interlayer is bonding by epobond epoxyn, obtains carbon fiber microchip reactor K.
Embodiment 38:
Get carbon fiber reaction channel layer 2 and upper strata carbon fiber shrouding 1 that embodiment 25 obtains, then get a carbon fiber board obtaining in embodiment 12 as lower floor's carbon fiber shrouding 3.Be arranged in order from top to down as upper strata carbon fiber shrouding 1, carbon fiber reaction channel layer 2, lower floor's carbon fiber shrouding 3, in addition on upper strata carbon fiber shrouding 1, cover again the first conduction or heat-conducting layer 4, at lower floor's carbon fiber shrouding, cover the second conduction or heat-conducting layer 5 for 3 times, interlayer is bonding by epobond epoxyn, obtains carbon fiber microchip reactor L.
Embodiment 39:
Get carbon fiber reaction channel layer 2 and upper strata carbon fiber shrouding 1 that embodiment 26 obtains, then get a carbon fiber board obtaining in embodiment 13 as lower floor's carbon fiber shrouding 3.Be arranged in order from top to down as upper strata carbon fiber shrouding 1, carbon fiber reaction channel layer 2, lower floor's carbon fiber shrouding 3, in addition on upper strata carbon fiber shrouding 1, cover again the first conduction or heat-conducting layer 4, at lower floor's carbon fiber shrouding, cover the second conduction or heat-conducting layer 5 for 3 times, interlayer is bonding by epobond epoxyn, obtains carbon fiber microchip reactor M.
Embodiment 31:
Sample thief microchip reactor A, B, C, D, E, F, G, H, I, J, K, L, M are uniform temperature in conduction oil temperature, under certain flow, measurement is heated fluid under same flow velocity and temperature conditions, measure respectively conduction oil and be heated fluid in the temperature of microreactor outlet, to obtain respectively test result, as shown in the table through converting:
| Microchip reactor | After red fuming nitric acid (RFNA) 3d soaks, quality reduces percentage % | Reactor heat transfer efficiency % |
| A | 0 | 20-33 |
| B | 0 | 18-23 |
| C | 0 | 25-28 |
| D | 0 | 85-95 |
| E | 0 | 5-10 |
| F | 0 | 23-36 |
| G | 0.14 | 29-39 |
| H | 0 | 31-40 |
| I | 0 | 35-45 |
| J | 0 | 24-36 |
| K | 0 | 22-30 |
| L | 0 | 94-97 |
| M | 0 | 96-98 |
Claims (10)
1. a carbon fiber microchip reactor, it is characterized in that, described carbon fiber microchip reactor is sandwich construction, is followed successively by from top to down the first heat conduction or conductive layer (4), upper strata carbon fiber shrouding (1), carbon fiber reaction channel layer (2), lower floor's carbon fiber shrouding (3) and the second heat conduction or conductive layer (5); Described carbon fiber reaction channel layer (2) contains the microchannel of carrying out chemical reaction for fluid; Described carbon fiber reaction channel layer (2), upper strata carbon fiber shrouding (1) and lower floor's carbon fiber shrouding (3) are made by carbon fiber board.
2. carbon fiber microchip reactor according to claim 1, is characterized in that, described carbon fiber board is obtained by following steps processing:
1) carbon fiber is woven and formed three dimension stereo fabric by 3 D stereo;
2) product impregnating resin step 1) being obtained, solidifies;
3) by step 2) product that obtains cuts, polishing.
3. carbon fiber microchip reactor according to claim 2, is characterized in that, in step 1), and the carbon fiber that the carbon fiber of use is all or part of vapor phase growth.
4. carbon fiber microchip reactor according to claim 2, is characterized in that step 2) in, in described resin, be mixed with the carbon dust of relative resin 20-30%wt or relatively the metal_based material of resin 10-20%wt as mixing, ooze material.
5. carbon fiber microchip reactor according to claim 4, is characterized in that, when being mixed with metal_based material as mixing while oozing material in described resin, described metal_based material is silver-based powder.
6. carbon fiber microchip reactor according to claim 2, is characterized in that step 2) in, described resin is epoxy resin; Solidification temperature is 150-200 degree Celsius, and pressurization keeps 2-5 hour.
7. carbon fiber microchip reactor according to claim 2, is characterized in that, in step 3), be polished to carbon fiber board burnishing surface (6) and expose carbon fiber cross section (8), and surface roughness is 0.6-3.2.
8. carbon fiber microchip reactor according to claim 1, is characterized in that, described carbon fiber reaction channel layer (2) is made by one of following manner:
1) use the carbon fiber board described in, adopt the mode of precision optical machinery processing and/or precise injection molding and/or compression molding to process described carbon fiber board, make to form the MCA that carries out chemical reaction for fluid on described carbon fiber board, to make carbon fiber reaction channel layer (2);
2) use the carbon fiber board described in, the mode of employing precision optical machinery processing and/or precise injection molding and/or compression molding is processed a side of described carbon fiber board, make to form for fluid and carry out the MCA of chemical reaction on described carbon fiber board, thereby on this piece carbon fiber board, make carbon fiber reaction channel layer (2) and upper strata carbon fiber shrouding (1) simultaneously;
3) use the carbon fiber board described in, the mode of employing precision optical machinery processing and/or precise injection molding and/or compression molding is processed a side of described carbon fiber board, make to form for fluid and carry out the MCA of chemical reaction on described carbon fiber board, thereby on this piece carbon fiber board, make carbon fiber reaction channel layer (2) and lower floor's carbon fiber shrouding (3) simultaneously;
4) use the carbon fiber board described in two, the side that the mode of employing precision optical machinery processing and/or precise injection molding and/or compression molding is processed respectively the carbon fiber board described in two, make to form on a carbon fiber board wherein the latter half and lower floor's carbon fiber shrouding (3) of carbon fiber reaction channel layer (2), on another piece carbon fiber board, form the first half and the upper strata carbon fiber shrouding (1) of carbon fiber reaction channel layer (2), then two carbon fiber boards are bonding to make the complete described carbon fiber reaction channel layer (2) containing microchannel.
9. carbon fiber microchip reactor according to claim 1, it is characterized in that, to described upper strata carbon fiber shrouding (1) and/or lower floor's carbon fiber shrouding (3) and/or containing the carbon fiber reaction channel layer (2) of microchannel, under the condition of 2400-3000 degree Celsius, carry out high-temperature heat treatment.
10. carbon fiber microchip reactor according to claim 1, is characterized in that, between layers by bolt hard link and/or use adhesive bond.
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