CN103533753A - Printed circuit board for preventing device from short circuiting - Google Patents
Printed circuit board for preventing device from short circuiting Download PDFInfo
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- CN103533753A CN103533753A CN201310500739.4A CN201310500739A CN103533753A CN 103533753 A CN103533753 A CN 103533753A CN 201310500739 A CN201310500739 A CN 201310500739A CN 103533753 A CN103533753 A CN 103533753A
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- printed circuit
- circuit board
- pcb
- metal shell
- high level
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Abstract
The invention relates to a printed circuit board for preventing a device from short circuiting. The printed circuit board comprises a substrate, wherein an electronic component between a high level and an earth wire is arranged on the substrate, electrically connected with the high level by a first welding disc, and electrically connected with the earth wire by a second welding disc; a first electric connection area, a thermal fusing area and a second electric connection area are sequentially arranged between the first welding disc and the high level; and the electronic component is a capacitor, a transient diode or a voltage stabilizing tube. The printed circuit board can timely disconnect bypasses of short-circuit electronic components such as the capacitor, the transient diode and the voltage stabilizing tube under high voltage and great surge current impact, so that the short-circuit electronic components cannot generate fateful damage to a loop any more.
Description
Technical field
The invention belongs to the technical field of printed circuit board (PCB), in particular, the present invention relates to a kind of printed circuit board (PCB) that prevents device short circuit.
Background technology
When the task of the printing safeties of printed circuit board (PCB) is abnormal operating state, particularly when short circuit, interrupts fast and reliably and being connected of power supply, thereby can prevent the loss that spread and cause other of short circuit on printed circuit board (PCB).And, by printed circuit cable safeties, move to avoid activating electric network protection switch ahead of time.
A kind of fault mode that conventionally can occur in electronic circuit is exactly device failure short circuit, and this is mainly because electromagnetic interference causes device breakdown short circuit, and conventional electric capacity, transient diode, voltage-stabiliser tube all belong to this class device up to now; Under the impact of high pressure, large surge current, can there is expendable inefficacy in such device, except the special device of minority, most failure modes are short-circuit conditions, and this will cause complete machine not work.If the electronic device of these short circuits can be bypassed in engineering application, make it not in original loop, the device of this class short circuit just no longer produces mortality damage for loop, complete machine also can work, function, do not affect normal use, so will effectively extend the mean free error time of complete machine, save a large amount of maintenance costs.
Summary of the invention
In order to solve above-mentioned technical problem of the prior art, the object of the present invention is to provide a kind of printed circuit board (PCB) that prevents device short circuit.
The printed circuit board (PCB) that prevents device short circuit of the present invention, comprises substrate, is provided with the electronic devices and components between high level and ground wire on described substrate; Described electronic devices and components are electrically connected by the first pad and high level, and described electronic devices and components are electrically connected by the second pad and ground wire; It is characterized in that: between described the first pad and described high level, be disposed with the first electric bonding land, hot fuse area and the second electric bonding land.
Wherein, described electronic devices and components are electric capacity, transient diode or voltage-stabiliser tube.
Wherein, described hot fuse area comprises thermo-sensitive material.
Wherein, described hot fuse area comprises hot fuse element, described hot fuse element comprises metal shell, the first wire, the second wire and be arranged on the insulating material in metal shell, removable conducting strip, the first Compress Spring, the second Compress Spring and thermo-sensitive material; Described the first wire is from the first end extension of described metal shell to metal shell, and the second end outer wall of described the second wire and described metal shell is electrically connected and stretches out; Described insulating material is arranged near the first end of metal shell, and described thermo-sensitive material is arranged near the second end of metal shell, and described removable conducting strip can contact the line slip of going forward side by side along the inner surface of described metal shell; Between described removable conducting strip and insulating material, there is the first Compress Spring, between described removable conducting strip and thermo-sensitive material, there is the second Compress Spring; The elastic force of wherein said the second Compress Spring is greater than described the first Compress Spring so that removable conducting strip is crimped on the first wire.
Wherein, described the first electric bonding land and the second electric bonding land comprise printed circuit cable and are arranged on arc protection on printed circuit cable and the insulating protection coating of plasma erosion.
Wherein, between described the second electric bonding land and high level, also have transition region, described transition region has exposed printed circuit cable.
Wherein, described high level is provided by power supply or high level input line.
Compared with prior art, of the present inventionly prevent that the printed circuit board (PCB) of device short circuit has following beneficial effect:
Printed circuit board (PCB) of the present invention, can solve electric capacity, transient diode and voltage-stabiliser tube electron-like components and parts under the impact of high pressure, large surge current, can in time the electronic devices and components that are short-circuited be disconnected and being bypassed, thereby make the electronic devices and components of short circuit no longer for loop, produce mortality damage.
Accompanying drawing explanation
Fig. 1 is the structural representation that prevents the printed circuit board (PCB) of device short circuit described in embodiment 1.
Fig. 2 is the structural representation of hot fuse element in printed circuit board (PCB) described in embodiment 1.
Embodiment
Below with reference to accompanying drawing and specific embodiment, 26S Proteasome Structure and Function of the printed circuit board (PCB) that prevents device short circuit of the present invention etc. is described in further detail.
As shown in Figure 1, the printed circuit board (PCB) that prevents device short circuit described in the present embodiment, comprises substrate, is provided with the electronic devices and components 10 between high level (power supply or high level connecting line) and ground wire on described substrate; Described electronic devices and components are that electric capacity, transient diode or voltage-stabiliser tube etc. are subject to electromagnetic interference easily to cause the electronic devices and components of puncture short.Described electronic devices and components 10 are electrically connected with high level by the first pad 20, and described electronic devices and components 10 are electrically connected with ground wire by the second pad 30; And between described the first pad and described high level, be disposed with the first electric bonding land 40, the electric bonding land 60 of hot fuse area 50, second and transition region 70, and described transition region has exposed printed circuit cable.
Described hot fuse area comprises hot fuse element, described hot fuse element comprises metal shell 51, the first wires 57, the second wire 58 and is arranged on the insulating material 52 in metal shell 51, removable conducting strip 54, the first Compress Spring 55, the second Compress Spring 56 and thermo-sensitive material 53; Described the first wire 57 is from the first end extension of described metal shell 51 to metal shell, and described the second wire 58 is electrically connected and stretches out with the second end outer wall of described metal shell; Described insulating material 52 is arranged near the first end of metal shell, and described thermo-sensitive material 53 is arranged near the second end of metal shell, and described removable conducting strip 54 can contact the line slip of going forward side by side along the inner surface of described metal shell; Between described removable conducting strip 54 and insulating material 52, there is the first Compress Spring 55, between described removable conducting strip 54 and thermo-sensitive material 53, there is the second Compress Spring 56; The elastic force of described the second Compress Spring 56 is greater than described the first Compress Spring 55 so that removable conducting strip 54 is crimped on the first wire 57.Wherein, described insulating material can be selected heat-resisting dielectric resin material, such as conventional polyvinyl chloride resin material etc.; And described thermo-sensitive material, in order to guarantee that it shrinks more than the specified temp of setting, softening or melting, need to be selected and be prepared.In the present embodiment, in order to be 180 ℃ of left and right by the disconnected Temperature Setting of hot melt, be chosen in 180 ℃ of above oleic acid modified alkyd resins that contraction (> 50%) can occur significantly to soften; The manufacturing process of described oleic acid modified resin is as follows: soy(a)-bean oil fatty acid, polyalcohol, phthalate anhydride, benzoic acid are all added in reactor, pass into CO
2, be warming up to 155 ℃ and keep 45min; Be warmed up to 200 ℃ and keep 100min, while being warmed up to 235 ℃, add dimethylbenzene esterification, remain to acid number and be less than 10mgKOH/g.When the operating temperature that reaches described 180 ℃, there is softening contraction in described oleic acid modified alkyd resin, thereby the load that makes to be applied to the second Compress Spring is unloaded, thereby making the second Compress Spring uphold elastic force is released, the compressive state of corresponding the first Compress Spring is also released, thereby the first Compress Spring is upheld, thereby make removable conducting strip separated with the first wire and realize the object that cut-out bypasses.And the electric arc or the plasma that between described removable conducting strip and the first wire, excite when preventing short circuit, described removable conducting strip is selected Cu alloy material, described Cu alloy material, by the copper of the Cr of 0.03～0.05wt%, the Mn of 0.5～0.8wt% and surplus and inevitably impurity form.Adopt above-mentioned Cu alloy material can effectively avoid exciting electric arc between removable conducting strip and the first wire.
Wherein, described the first electric bonding land and the second electric bonding land comprise printed circuit cable and are arranged on arc protection on printed circuit cable and the insulating protection coating of plasma erosion.Described insulating protection coating is by applying by the MDI of 16～20wt%, the adipic acid of 8～10wt% 1,1 of 4-butanediol ester, 8～10wt%, in the methyl etherified melmac of 4-butanediol, 5～8wt%, the gamma-amino of 3.2～5.0wt%, ethyl triethoxy silicane alkane, the dibutyl tin laurate of 0.20～0.25wt% are, the coating that the bisphenol F epoxy resin of the organophosphorus ester of 0.05～0.08wt% and surplus prepares 225-230 ℃ of reaction forms, and the thickness of described protective coating is 15～50 μ m.By applying above-mentioned insulating protection coating, can prevent due to electric arc, the plasma especially exciting, even after opening circuit, still to the shock on the printed circuit cable surface of electric bonding land the uncontrolled burning causing therefrom and the harm of infringement.
Printed circuit board (PCB) described in the present embodiment, by said structure, design and the selection of material and coating and preparation can solve electric capacity, transient diode and voltage-stabiliser tube electron-like components and parts under the impact of high pressure, large surge current, can in time the electronic devices and components that are short-circuited be disconnected and being bypassed, and no longer for the other parts of printed circuit board (PCB), produce mortality damage from the circuit that comprises electronic devices and components that makes to the full extent short circuit or open circuit.
For the ordinary skill in the art; specific embodiment is just exemplarily described the present invention by reference to the accompanying drawings; obviously specific implementation of the present invention is not subject to the restrictions described above; as long as adopted the improvement of the various unsubstantialities that method of the present invention design and technical scheme carry out; or without improving, design of the present invention and technical scheme are directly applied to other occasion, all within protection scope of the present invention.
Claims (8)
1. a printed circuit board (PCB) that prevents device short circuit, comprises substrate, is provided with the electronic devices and components between high level and ground wire on described substrate; Described electronic devices and components are electrically connected by the first pad and high level, and described electronic devices and components are electrically connected by the second pad and ground wire; It is characterized in that: between described the first pad and described high level, generate successively and be equipped with the first electric bonding land, hot fuse area and the second electric bonding land.
2. the printed circuit board (PCB) that prevents device short circuit according to claim 1, is characterized in that: described electronic devices and components are electric capacity, transient diode or voltage-stabiliser tube.
3. the printed circuit board (PCB) that prevents device short circuit according to claim 1, is characterized in that: described hot fuse area comprises thermo-sensitive material.
4. the printed circuit board (PCB) that prevents device short circuit according to claim 1 and 2, it is characterized in that: described hot fuse area comprises hot fuse element, described hot fuse element comprises metal shell, the first wire, the second wire and be arranged on the insulating material in metal shell, removable conducting strip, the first Compress Spring, the second Compress Spring and thermo-sensitive material; Described the first wire is from the first end extension of described metal shell to metal shell, and the second end outer wall of described the second wire and described metal shell is electrically connected and stretches out; Described insulating material is arranged near the first end of metal shell, and described thermo-sensitive material is arranged near the second end of metal shell, and described removable conducting strip can contact the line slip of going forward side by side along the inner surface of described metal shell; Between described removable conducting strip and insulating material, there is the first Compress Spring, between described removable conducting strip and thermo-sensitive material, there is the second Compress Spring; The elastic force of wherein said the second Compress Spring is greater than described the first Compress Spring so that removable conducting strip is crimped on the first wire.
5. the printed circuit board (PCB) that prevents device short circuit according to claim 4, is characterized in that: described removable conducting strip is made by Cu alloy material; Described Cu alloy material consists of copper and the inevitable impurity of the Cr of 0.03～0.05wt%, the Mn of 0.5～0.8wt% and surplus.
6. the printed circuit board (PCB) that prevents device short circuit according to claim 4, is characterized in that: described the first electric bonding land and the second electric bonding land comprise printed circuit cable and send out the arc protection put on printed circuit cable and the insulating protection coating of plasma erosion.
7. the printed circuit board (PCB) that prevents device short circuit according to claim 1 and 2, is characterized in that: between described the second electric bonding land and high level, also have transition region, described transition region has exposed printed circuit cable.
8. the printed circuit board (PCB) that prevents device short circuit according to claim 6, is characterized in that: described high level is provided by power supply or high level input line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310500739.4A CN103533753A (en) | 2013-10-23 | 2013-10-23 | Printed circuit board for preventing device from short circuiting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310500739.4A CN103533753A (en) | 2013-10-23 | 2013-10-23 | Printed circuit board for preventing device from short circuiting |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103533753A true CN103533753A (en) | 2014-01-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310500739.4A Pending CN103533753A (en) | 2013-10-23 | 2013-10-23 | Printed circuit board for preventing device from short circuiting |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115873386A (en) * | 2023-02-20 | 2023-03-31 | 广东金驭科技有限公司 | Composite organic temperature sensing material, preparation method thereof and fuse |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0624053A2 (en) * | 1993-04-08 | 1994-11-09 | Sony Corporation | Mounting device and method of connecting miniaturized electronic components by bump connections |
| JPH09134809A (en) * | 1995-11-10 | 1997-05-20 | Matsushita Electric Ind Co Ltd | Surge absorber with safety assurance function |
| CN1835161A (en) * | 2005-03-17 | 2006-09-20 | 恩益禧肖特电子零件有限公司 | Thermal fuse employing thermosensitive pellet |
| CN101064288A (en) * | 2006-04-06 | 2007-10-31 | 力特保险丝有限公司 | Leadless integrated circuit protection device |
| WO2013005801A1 (en) * | 2011-07-06 | 2013-01-10 | 株式会社徳力本店 | Electrode material for thermal fuses, manufacturing process therefor and thermal fuses using said electrode material |
-
2013
- 2013-10-23 CN CN201310500739.4A patent/CN103533753A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0624053A2 (en) * | 1993-04-08 | 1994-11-09 | Sony Corporation | Mounting device and method of connecting miniaturized electronic components by bump connections |
| JPH09134809A (en) * | 1995-11-10 | 1997-05-20 | Matsushita Electric Ind Co Ltd | Surge absorber with safety assurance function |
| CN1835161A (en) * | 2005-03-17 | 2006-09-20 | 恩益禧肖特电子零件有限公司 | Thermal fuse employing thermosensitive pellet |
| CN101064288A (en) * | 2006-04-06 | 2007-10-31 | 力特保险丝有限公司 | Leadless integrated circuit protection device |
| WO2013005801A1 (en) * | 2011-07-06 | 2013-01-10 | 株式会社徳力本店 | Electrode material for thermal fuses, manufacturing process therefor and thermal fuses using said electrode material |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115873386A (en) * | 2023-02-20 | 2023-03-31 | 广东金驭科技有限公司 | Composite organic temperature sensing material, preparation method thereof and fuse |
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Application publication date: 20140122 |