CN103531107B - A kind of light-emitting diode (LED) module and preparation method thereof - Google Patents
A kind of light-emitting diode (LED) module and preparation method thereof Download PDFInfo
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- CN103531107B CN103531107B CN201310523312.6A CN201310523312A CN103531107B CN 103531107 B CN103531107 B CN 103531107B CN 201310523312 A CN201310523312 A CN 201310523312A CN 103531107 B CN103531107 B CN 103531107B
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Abstract
The present invention relates to field of LED display, more specifically, relate to a kind of light-emitting diode (LED) module and preparation method thereof.The PCB surface of light-emitting diode (LED) module surface and light-emitting diode (LED) module is rough surface, and described rough surface is coated with semi-transparent coating.The present invention utilizes the transmission principle of light, half transparent coatings is covered on the rough surface of light emitting diode and the rough surface smear of wiring board thereof, weaken the penetration capacity of light, the display brightness of LED display is suitably reduced, eliminate high brightness display irritating human eye.Meanwhile, coating also can block manifesting of chip electrode, eliminates epoxy resin surface to the reflection of surround lighting, makes display surface from light to greyish black transformation; The color distortion that coating also can cause wiring board is eliminated, thus realizes improving contrast and overall homogeneity.
Description
Technical field
The present invention relates to field of LED display, more specifically, relate to a kind of light-emitting diode (LED) module and preparation method thereof.
Background technology
Light emitting diode (hereinafter referred to as LED) mosaic display screen is generally made up of m × n LED unit, each unit is generally by LED wafer, reflector, metal anode, metallic cathode is formed, outsourcing has the epoxy package of printing opacity light gathering, by regulation voltage or electric current, it is made to send different lights, because luminescence display limit, the epoxy package of surface printing opacity optically focused easily produces reflection to surround lighting, form hot spot, electrode simultaneously in LED wafer is also easy to be presented through epoxy resin, brightness is reduced by regulating electric current or dutycycle mode, but because the reflective degree of epoxy package is unchanged, thus cause the contrast of display screen to decline, along with a distance is less, area shared by LED is larger, contrast will be poorer, meanwhile, LED display is in indoor use, and the high brightness possessed also also exists drawback, and the eyes of people closely will be easy to bring out eye illness facing to display screen for a long time.
In prior art, have in LED display on the surface by increasing plug-in organic board (framework), to coloring treatment on this organic board to improve the problems referred to above, but along with LED shows the raising of resolution and the reduction of LED point distance, the area of application splicing is increasing, the thermal value of LED itself greatly promotes, and easily causes the organic board on LED display surface (framework) be out of shape or do not have fixable space, and this makes substantially to eliminate in the operability of the mode increasing plug-in organic board.
Summary of the invention
The present invention, for overcoming at least one defect (deficiency) described in above-mentioned prior art, provides a kind of light-emitting diode (LED) module that can improve LED display display comparison degree.
The present invention also provides a kind of preparation method of light-emitting diode (LED) module.
For solving the problems of the technologies described above, technical scheme of the present invention is as follows:
A kind of light-emitting diode (LED) module, is characterized in that, the PCB surface of light-emitting diode (LED) module surface and light-emitting diode (LED) module is rough surface, and described rough surface is coated with semi-transparent coating.
A preparation method for above-mentioned light-emitting diode (LED) module, is characterized in that, described method comprises:
Semi-transparent coating is covered disposable the smearing in the rough surface of wiring board of the rough surface of light-emitting diode (LED) module and light-emitting diode (LED) module.
Compared with prior art, the beneficial effect of technical solution of the present invention is:
(1) the present invention utilizes the transmission principle of light, half transparent coatings is covered on the rough surface of light emitting diode and the rough surface smear of wiring board thereof, weaken the penetration capacity of light, the display brightness of LED display is suitably reduced, eliminate high brightness display irritating human eye, greatly reduce the possibility that viewing personnel produce eye illness.
(2) semi-transparent coating can block manifesting of chip electrode, eliminate epoxy resin surface to the reflection of surround lighting, make LED display display surface from light to greyish black transformation, when using m × n LED unit to form on-screen displays, can the contrast of improving picture; Semi-transparent coating can make the display module color be made up of polylith wiring board reach an agreement, and improves contrast and overall homogeneity.
(3) mode of plug-in organic board is increased with respect to LED display surface, the present invention is directly in light-emitting diode (LED) module rough surface coating, simple and convenient, without the need to plug-in organic board, also without the need to considering installation question and the problem on deformation of organic board.
Accompanying drawing explanation
Fig. 1 is the structural representation of a kind of light-emitting diode (LED) module of the present invention.
Embodiment
In order to better the present embodiment is described, some parts of accompanying drawing have omission, zoom in or out, and do not represent the size of actual product;
To those skilled in the art, in accompanying drawing, some known features and explanation thereof may be omitted is understandable.
In describing the invention, it is to be appreciated that in describing the invention, except as otherwise noted, the implication of " multiple " is two or more.
In describing the invention, it should be noted that, unless otherwise clearly defined and limited, term " installation ", " connection " should be interpreted broadly, and such as, can be fixedly connected with, also can be removably connect, or connect integratedly; Can be mechanical connection, also can be electrical connection; Can be directly be connected, also can be indirectly connected by intermediary, the connection of two element internals can be said.For the ordinary skill in the art, concrete condition above-mentioned term can be understood at concrete meaning of the present invention.
Below in conjunction with embodiment, technical scheme of the present invention is described further.
Embodiment 1
As shown in Figure 1, a kind of light-emitting diode (LED) module, wiring board 1 surface of light-emitting diode (LED) module 2 surface and light-emitting diode (LED) module 2 is rough surface, and described rough surface is coated with semi-transparent coating 3.Semi-transparent coating 3 can weaken the penetration capacity of light, and the display brightness of LED display is suitably reduced, and eliminates high brightness display irritating human eye, greatly reduces the possibility that viewing personnel produce eye illness; Meanwhile, semi-transparent coating also can block manifesting of chip electrode, eliminates epoxy resin surface to the reflection of surround lighting, makes display surface from light to gloomy transformation, thus improve picture contrast.
Wherein, rough pre-service can be carried out in light-emitting diode (LED) module 2 surface and wiring board 1 surface thereof, make semi-transparent coating 3 can be firmly attached thereto.
Wherein, semi-transparent coating 3 is disposablely coated in the rough surface of light-emitting diode (LED) module 2 and the rough surface of wiring board 1, the thickness size of semi-transparent coating 3 is controlled during coating, light penetration capacity is weakened to reach, realize hiding chip electrode, reduce the effect of LED display display brightness.
In specific implementation process, the transmittance of semi-transparent coating 3 is determined according to LED specifications parameter and viewing demand, general, and the transmittance of semi-transparent coating is 30%-90%, is preferably 60%.
In specific implementation process, the material of semi-transparent coating 3 comprises 16 hexanediol acrylates, urethane acrylate, emulsion, acrylic acid hydrogen chaff ester, red pigment, blue pigment, viridine green and black pigment.In actual applications, the allotment ratio of this material is determined according to LED specifications parameter and viewing demand with the thickness smeared.General, the thickness of semi-transparent coating 3 is 3-5 micron, and Material coating particle is less than 20 microns, and through experimental verification, under this coating thickness and coated particle, the transmittance of LED display can reach 60%.
In specific implementation process, semi-transparent coating 3 can pass through the disposable coating of spraying method.The shape of coating is generally full coat, all applies first transparent coatings 3, with the consistance of the homogeneity and outward appearance that ensure display frame by the whole surface of light-emitting diode (LED) module 2 and the whole surface of wiring board 1 thereof.
In specific implementation process, in order to make the steadiness of semi-transparent coating, the solidification of semi-transparent coating 3 material is stable can be adopted UV radiation curing, and this process completes with spraying simultaneously.
Embodiment 2
The present invention also provides a kind of preparation method for above-mentioned light-emitting diode (LED) module.Particularly, a kind of preparation method of light-emitting diode (LED) module, comprising:
Semi-transparent coating is covered disposable the smearing in the rough surface of wiring board of the rough surface of light-emitting diode (LED) module and light-emitting diode (LED) module.
This preparation method weakens the penetration capacity of light by applying semi-transparent coating, the display brightness of LED display is suitably reduced, and eliminates high brightness display irritating human eye, greatly reduces the possibility that viewing personnel produce eye illness; Meanwhile, semi-transparent coating also can block manifesting of chip electrode, eliminates epoxy resin surface to the reflection of surround lighting, makes display surface from light to gloomy transformation, thus improve picture contrast.
Wherein, light-emitting diode (LED) module surface and PCB surface thereof can, through pre-service to form rough surface, make semi-transparent coating easily apply thereon.
In specific implementation process, the material of semi-transparent coating comprises 16 hexanediol acrylates, urethane acrylate, emulsion, acrylic acid hydrogen chaff ester, red pigment, blue pigment, viridine green and black pigment, 16 hexanediol acrylates, urethane acrylate, emulsion, acrylic acid hydrogen chaff ester, red pigment, blue pigment, viridine green and black pigment is allocated the disposable rough surface of light-emitting diode (LED) module and the rough surface of light-emitting diode wiring board of being coated on of the composite material obtained and forms semi-transparent coating.The composite material smeared, its allotment ratio, smearing thickness can be determined according to LED specifications parameter and viewing personnel demand.General, control the thickness of semi-transparent coating during coating at 3-5 micron, the coating material particulate of semi-transparent coating is less than 20 microns, to reach the transmitance of 60%.
In specific implementation process, coating can adopt the mode of spraying, and coating in the mode of full coat, can all apply first transparent coatings, with the consistance of the homogeneity and outward appearance that ensure display frame by the whole surface of light emitting diode and the whole surface of wiring board thereof.Wherein, during coating by semi-transparent coating on the rough surface of light-emitting diode (LED) module and the rough surface of wiring board, control the thickness size of semi-transparent coating during coating, weaken light penetration capacity to reach, realize hiding chip electrode, reduce the effect of LED display display brightness.
In specific implementation process, in order to make the steadiness of semi-transparent coating, the solidification of semi-transparent coating material is stable can be adopted UV radiation curing, and this process completes with spraying simultaneously.
Obviously, the above embodiment of the present invention is only for example of the present invention is clearly described, and is not the restriction to embodiments of the present invention.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here exhaustive without the need to also giving all embodiments.All any amendments done within the spirit and principles in the present invention, equivalent to replace and improvement etc., within the protection domain that all should be included in the claims in the present invention.
Claims (7)
1. a light-emitting diode (LED) module, is characterized in that, the PCB surface of light-emitting diode (LED) module surface and light-emitting diode (LED) module is rough surface, and described rough surface is coated with semi-transparent coating; Wherein, the shape of coating is full coat, and the whole surface of light-emitting diode (LED) module and the whole surface of wiring board thereof all apply first transparent coatings;
The material of described semi-transparent coating comprises 16 hexanediol acrylates, urethane acrylate, emulsion, acrylic acid hydrogen chaff ester, red pigment, blue pigment, viridine green and black pigment;
The transmittance of described semi-transparent coating is 30%-90%.
2. light-emitting diode (LED) module according to claim 1, is characterized in that, the transmittance of described semi-transparent coating is 60%.
3. light-emitting diode (LED) module according to claim 1, is characterized in that, the thickness of described semi-transparent coating is 3-5 micron.
4. the light-emitting diode (LED) module according to any one of claims 1 to 3, is characterized in that, described semi-transparent coating is by the disposable coating of spraying method.
5. a preparation method for light-emitting diode (LED) module according to claim 1, is characterized in that, described method comprises:
Semi-transparent coating is covered disposable the smearing in the rough surface of wiring board of the rough surface of light-emitting diode (LED) module and light-emitting diode (LED) module; Coated with the mode of full coat, whole for light-emitting diode (LED) module surface and the whole surface of wiring board thereof are all applied first transparent coatings;
The material of described semi-transparent coating comprises 16 hexanediol acrylates, urethane acrylate, emulsion, acrylic acid hydrogen chaff ester, red pigment, blue pigment, viridine green and black pigment, 16 hexanediol acrylates, urethane acrylate, emulsion, acrylic acid hydrogen chaff ester, red pigment, blue pigment, viridine green and black pigment is allocated the disposable rough surface of light-emitting diode (LED) module and the rough surface of light-emitting diode wiring board of being coated on of the composite material obtained and forms semi-transparent coating.
6. the preparation method of light-emitting diode (LED) module according to claim 5, is characterized in that, the coverage mode of smearing of described semi-transparent coating is spraying.
7. the preparation method of the light-emitting diode (LED) module according to any one of claim 5 to 6, is characterized in that, the thickness of described semi-transparent coating is 3-5 micron, and the coating material particulate of semi-transparent coating is less than 20 microns, and the transmittance of semi-transparent coating is 60%.
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| CN201310523312.6A CN103531107B (en) | 2013-10-30 | 2013-10-30 | A kind of light-emitting diode (LED) module and preparation method thereof |
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| CN201310523312.6A CN103531107B (en) | 2013-10-30 | 2013-10-30 | A kind of light-emitting diode (LED) module and preparation method thereof |
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| CN103531107A CN103531107A (en) | 2014-01-22 |
| CN103531107B true CN103531107B (en) | 2016-04-13 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2831319Y (en) * | 2005-08-11 | 2006-10-25 | 王列卡 | Refracting flame lamp |
| CN2932066Y (en) * | 2006-07-19 | 2007-08-08 | 郑浩 | LED lamp |
| CN202093765U (en) * | 2010-01-08 | 2011-12-28 | 敦网光电股份有限公司 | Light box |
| CN103022273A (en) * | 2011-09-22 | 2013-04-03 | 景华光电科技股份有限公司 | Packaging method of flip chip light-emitting diode area source optical engine |
| CN203012243U (en) * | 2013-01-12 | 2013-06-19 | 魏长国 | Changeable dimming X-ray film reader |
-
2013
- 2013-10-30 CN CN201310523312.6A patent/CN103531107B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2831319Y (en) * | 2005-08-11 | 2006-10-25 | 王列卡 | Refracting flame lamp |
| CN2932066Y (en) * | 2006-07-19 | 2007-08-08 | 郑浩 | LED lamp |
| CN202093765U (en) * | 2010-01-08 | 2011-12-28 | 敦网光电股份有限公司 | Light box |
| CN103022273A (en) * | 2011-09-22 | 2013-04-03 | 景华光电科技股份有限公司 | Packaging method of flip chip light-emitting diode area source optical engine |
| CN203012243U (en) * | 2013-01-12 | 2013-06-19 | 魏长国 | Changeable dimming X-ray film reader |
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| CN103531107A (en) | 2014-01-22 |
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Address after: Kezhu road high tech Industrial Development Zone, Guangzhou city of Guangdong Province, No. 233 510670 Patentee after: Wei Chong group Limited by Share Ltd Address before: 510663 No. 6, color road, hi tech Industrial Development Zone, Guangdong, Guangzhou, China Patentee before: Guangdong Weichuangshixun Science and Technology Co., Ltd. |
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