CN103529351B - High-tension switch cabinet thermal defect on-line monitoring system and method - Google Patents
High-tension switch cabinet thermal defect on-line monitoring system and method Download PDFInfo
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Abstract
The present invention discloses high-tension switch cabinet thermal defect on-line monitoring system and method, comprise the data-signal of multiple temperature sensor, data handling system, data handling system reception data handling system, and temperature increase is analyzed, determine whether high-tension switch cabinet exists thermal defect.The present invention adopts the air themperature measuring top, high-voltage board inner space, then come data analysis by data handling system, utilize the characteristic of compartment headspace temperature change value to judge whether there is thermal defect between this compartment or adjacent compartments, instead of traditional judge whether to break down with temperature maximum, by the judgement of thermal defect, can occur that the initial period of hot stall is just pinpointed the problems, just report to the police when it does not also reach the limit of temperature, can thus before there is ultimate temperature, carry out overhaul plan, failure accident was eliminated in the initial budding stage.
Description
Technical field
The present invention relates to a kind of temperature testing method and test macro of high-tension switch cabinet, specifically refer to high-tension switch cabinet thermal defect on-line monitoring system and method.
Background technology
For preventing because loose contact causes local overheating, thus causing switch cubicle insulation breakdown to cause short circuit accident, being developed the scheme of various switch cubicle temperature measurement on-line.Current various temperature measurement on-line mode be all carry out for some individual contacts point of galvanic circle, its basic practice is exactly be in each contact point place sensor installation of noble potential, and by wireless signal or optical fiber, the temperature information of this point is transmitted from noble potential point, received and shown.As: describe a kind of wireless temperature measuring device for switch cabinet in the file of open (bulletin) number: CN202141526U, its objective is the problem utilizing wireless transmission to solve to be arranged on the sensor in noble potential district to transmit data to electronegative potential district.Its formation comprises temperature sensor, temperature sensing circuit, treating apparatus and radio frequency communications circuitry, contact and the cable splice of temperature sensor and switch cubicle are connected, and by temperature sensing circuit connection handling device, treating apparatus is connected with radio frequency communications circuitry.Though the temperature of the collection contact that the program can be real-time, round-the-clock on-line monitoring, directly wirelessly transmits the problem that data solve high_voltage isolation.The weak point of this mode is temperature sensor to be arranged on the position with high voltage, and the state that the equipment that changes significantly is original and original Electric Field Distribution and insulation distance, exist certain potential safety hazard.
Publication number is in the file of CN202195898U, discloses a kind of high-tension switch cabinet optical fiber type temperature on-line monitoring device.Its objective is and wish to utilize optical fiber self to be the feature that insulator has again certain temperature sensitivity simultaneously, solve the installation of sensor and the problem of data transmission, its formation comprises a supervisory control comuter and multiple temp measuring system be connected with supervisory control comuter simultaneously; Temp measuring system comprises an optic fiber thermometer and multiple fibre optic temperature sensor be connected with optic fiber thermometer; Be connected by RS485 bus between supervisory control comuter and the optic fiber thermometer of temp measuring system; Be connected by optical fiber between optic fiber thermometer with fibre optic temperature sensor.Optic fiber thermometer comprises microcontroller, display, fibre optic temperature sensor interface, RS485 bus interface and warning message output interface.The high-tension switch cabinet optical fiber type temperature on-line monitoring device of this invention, has advantages such as can solving the problem that in high-tension switch cabinet, signal is easily disturbed, the accuracy improving temperature monitoring and reliability.
Due to sensor and annex many be all electric conductor, this mode at noble potential district sensor installation will change the original insulation system in relevant range, reduce the insulation distance that nargin is little originally, destroy original Electric Field Distribution simultaneously, thus reduce the dielectric level of switch cubicle.In switch cubicle, in order to ensure due dielectric strength, insulated support generally all can in its outside design corresponding insulation shirt rim to increase surface creepage distance, so, even adopt the optical fiber of inherently insulating material to carry out thermometric, also optical fiber must be connected to electronegative potential district from noble potential district, this connection also can make effective creep distance of High-Voltage Insulation therefore reduce, and can reduce the dielectric level of switch cubicle equally.Likely cause insulation fault.
In order to overcome the above-mentioned adverse effect may brought switch cubicle dielectric level in the thermometric mode of contact point place sensor installation, also there is the mode of proposition infrared detection to carry out thermometric.If publication number is disclose a kind of switch cubicle temperature measurement on-line device based on infrared measurement of temperature in the file of 203071440V, its objective is that hope can avoid the problem of installing temperature probe at high electric field region and how to be transmitted to zero potential district by high potential signal by infrared measurement of temperature.Its method installs view window additional on the panel of switch cubicle, utilizes the temperature of view window infrared thermometer to corresponding site to test.Although this infrared measurement of temperature mode overcomes the problem of the dielectric level decline brought at contact point place sensor installation.But due in switch cubicle self structure, there is various parts blocking infrared radiation in cabinet, this way at switch cubicle wall uplifting window mouth does not detect there being the temperature of most contact point, and this just significantly limit the application of infrared temperature-test technology.And the contact point of a switch cubicle may have tens, the mode that this pointwise detects only may realize detecting some other position, can not detect, otherwise test macro will become too huge to each contact point, too complicated.Can know in practice: on main conductive circuit any one contact point all likely occur loosen and occur overheated.So the various temperature measurement on-line modes of current switch cubicle are all incomplete, all can not realize the comprehensive monitoring for switch cubicle.Nonetheless, this only can to area monitoring's mode of minority contact point temperature measurement on-line, just make system very complicated, complicated wiring and the installation of numerous associated components, change the original state of switch cabinet equipment greatly, this brings very large difficulty to switch cubicle operation maintenance in the future.And test macro self also also exists the problem needing to safeguard.What affirm very much is, the life-span of switch cubicle is more much longer than the life-span of test macro, and switch cubicle is once it is very difficult for will stopping after putting into operation, during this period, does test macro go wrong and what is to be done? do the sensor particularly the most easily broken down and connecting line after failure, have possibility to carry out in time processing and changing? these are all current switch cubicle In-Line Temperature Measure System problem demanding prompt solutions.
In a word, current existing various switch cubicle temperature measurement on-line mode, although the thermal defect caused due to loose contact finding that switch cubicle may exist can be helped to a certain extent, but, it is all the pattern according to pointwise monitoring, only can carry out area monitoring to the heat condition of minority contact point, also exist and monitor blind area; And current various temperature measurement on-line mode be all the temperature value being conceived to measure certain contact point is instantly how many, once exceed setting value just send warning, but somewhere cannot be predicted whether there will be overheated and intervened in advance; And also there is certain potential safety hazard in the mode of contact point place sensor installation itself; Various real-time online temperature measuring equipment also also exists and changes excessive to switch cubicle original equipment simultaneously, affects the conventional maintenance of switch cubicle; In addition, once monitoring system breaks down, particularly sensor and connecting line break down, and there is the problem being difficult to carry out safeguarding.
Summary of the invention
The object of the present invention is to provide high-tension switch cabinet thermal defect on-line monitoring system and method, for the thermal defect of Timeliness coverage switch cubicle, switch cubicle not yet occur overheated, be only had overheated may, just in addition early warning in advance.
Object of the present invention is achieved through the following technical solutions:
High-tension switch cabinet thermal defect on-line monitoring system, comprises multiple temperature sensor: wherein temperature sensor is arranged on testing environment temperature in the outside of high-tension switch cabinet or secondary chamber, and the environment temperature detected is transferred to data handling system; Remaining temperature sensor is arranged on the top of each current-carrying compartment space in high-tension switch cabinet, or is arranged in cavity that switch cubicle top blind flange communicates with compartment space, gathers the air themperature in corresponding current-carrying compartment, and is transferred to data handling system; Data handling system: the temperature data of temperature sensor collection transfers to data handling system, the analog quantity collected is converted to digital quantity by data handling system, and the temperature increase collected is analyzed, judge whether there is thermal defect in high-tension switch cabinet, or show simultaneously and/or send alerting signal.
Inventor finds through long-term research: because high-tension switch cabinet generally all has 2 to 3 current-carrying compartments, and the electric current that each current-carrying compartment passes through is identical, and therefore, the temperature of each current-carrying compartment has correlativity; If certain contact point because of loose contact occur overheated, so due to the convection current of air, the temperature on respective compartment top will show improper higher, due to square being directly proportional of this heating and electric current, and the electric current that each current-carrying compartment passes through is identical, therefore, the temperature of all the other compartments is exactly best reference amount.Find based on this, temperature sensor is arranged on inside switch cubicle each current-carrying compartment top cover by the present invention, or be arranged in cavity that switch cubicle top blind flange communicates with compartment space, detected by temperature sensor is no longer the heat condition of certain indivedual contact point, but the air themperature in this upper compartment space, reflection be the heat condition of component synthesis in each respective compartment, by the monitoring to each current-carrying compartment air themperature, just can realize carrying out comprehensive monitoring to the heat condition of whole switch cubicle; Because whether master of the present invention is overheatedly judged if it were not for according to occurring, more emphatically the heat-producing characteristics of switch cubicle and the change of heating rule are analyzed, thus it is overheated not yet can to occur at switch cubicle, only start to occur that contact point loosens, when having the overheated symptom of a trend, just can shift to an earlier date early warning in addition.
Also comprise a current sensor, current sensor is arranged on the secondary cable of current transformer in switch cabinet, for detecting load current and will detecting the current signal transfer that obtains to data handling system.Like this, electric current in current-carrying compartment can be utilized as a variable, thus provide more means for detecting, analyze from multi-angle, in order to the not original Electric Field Distribution of impact to voltage switch cubicle and dielectric level, be convenient to temperature sensor to install from the outside of high-tension switch cabinet, the connecting line of temperature sensor is also passed by the aperture of each compartment top cover and connects up in the outside of high-tension switch cabinet by the present invention simultaneously.
High-tension switch cabinet body has 2 or 3 current-carrying compartments usually, the top cover of at least one current-carrying compartment offers temperature sensor mounted mounting hole, also comprise the syndeton matched with this mounting hole, and this syndeton is as a temperature detection part, is then connection for ease of the installation of Temperature probe and the signal cable of Temperature probe and detected temperatures and designs.
Described syndeton comprises junction block, in the bottom of junction block, temperature sensor probe is installed, temperature sensor probe is connected on junction block by wire, is also provided with an insulation sleeve matched with the mounting hole of high-tension switch cabinet body below junction block; Or described syndeton comprises the mounting cylinder matched with mounting hole, be installed with junction block at the top of mounting cylinder, the below of junction block is provided with temperature sensor probe by wire.The structure of Connection Block has two kinds of good structures: syndeton comprises junction block, in the bottom of junction block, temperature sensor probe is installed, temperature sensor probe is connected on junction block by wire, an insulation sleeve matched with the mounting hole of high-tension switch cabinet body is also provided with below junction block, this syndeton is as a temperature detection part, both the effect making sensing head be fixed on mounting hole can be played, can be implemented in mounting hole again and plug, here junction block is for connecting the signal cable of detected temperatures, the signal cable of such detected temperatures together constitutes the connecting line of temperature sensor by junction block and the wire being connected temperature sensor probe 4, temperature sensor so just can be realized to carry out installing and changing from high-tension switch cabinet outside, syndeton can also select the structure of another kind of equivalence, described syndeton comprises the mounting cylinder matched with mounting hole, junction block is installed with at the top of mounting cylinder, the below of junction block is provided with temperature sensor probe by wire, Temperature probe equally also can be played to be placed in and to be in the same space with current-carrying compartment, thus realize object that compartment space temperature is detected.
The present invention is no longer arranged on the contact point place in noble potential district due to temperature sensor, and on the top cover being mounted in electronegative potential or be arranged in cavity that switch cubicle top blind flange communicates with compartment space, and temperature sensor can be done very little, the original insulation distance of switch cubicle and Electric Field Distribution can not be affected, therefore there is not any potential safety hazard; Connect up in the top simultaneously passing switch cubicle due to the connection wire of temperature sensor by the aperture of top cover, and Temperature probe can do very little, and on the structure of original equipment and duty impact minimum; Temperature sensor is arranged on inside switch cubicle each current-carrying compartment top cover by the present invention, or be arranged in cavity that switch cubicle top blind flange communicates with compartment space, detected by temperature sensor is no longer the heat condition of certain contact point, but the air themperature in this upper compartment space, reflection be the heat condition of component synthesis in each respective compartment, by the monitoring to each current-carrying compartment, just can realize carrying out comprehensive monitoring to the heat condition of whole switch cubicle; Temperature sensor syndeton be designed to can in the mounting hole of high-voltage switch cabinet lamina tecti pluggable structure and the line of temperature sensor is arranged in cabinet top, sensor can be realized from outside, even do not need to have a power failure and just can carry out installing and changing, the difficult problem safeguarded monitoring system self when solving not power-off well.
High-tension switch cabinet thermal defect on-line monitoring method, is characterized in that, comprise the following steps:
A () temperature sensor gathers each current-carrying compartment interior of high-tension switch cabinet and environment temperature, and the temperature value collected is passed to data handling system, and current sensor detects load current, and the current signal collected is passed to data handling system;
B the temperature simulation amount received is converted to digital quantity by () data handling system, and process the data-signal received, and analyzes temperature increase △ T, judges whether there is thermal defect in high-tension switch cabinet.
High-tension switch cabinet thermal defect on-line monitoring method of the present invention, because each current-carrying compartment of high-tension switch cabinet is installed with different current carrying element respectively, the temperature in these upper compartment spaces is corresponding with the heat condition of each current carrying element respectively, and the electric current that the element that high-tension switch cabinet has each compartment passes through is this identical feature, between the temperature of thus each compartment and between the temperature of each compartment and electric current, there is correlationship.Temperature sensor is passed to data handling system after converting the air temperature value collected to digital signal, through data handling system analysis, by to the correlation analysis between each compartment temperatures, the temperature of each compartment is to the correlation analysis of load current value, and the historical data analysis of each compartment temperatures and load current relation and current temperature value contrast, and by carrying out correlation analysis to the detection data of this cabinet and switch cubicle of the same type, can carry out comprehensively and picket surveillance switch cubicle heat condition preferably, thus can be more comprehensively, more accurate, more Timeliness coverage switch cubicle thermal defect, and determine that exception has appearred in the element in which compartment, adopt the air themperature measuring high-voltage board current-carrying compartment interior top of space, then simulating signal is converted to digital signal show and carry out the method to data analysis by data handling system, utilize the characteristic of current-carrying compartment headspace temperature change value to judge whether there is thermal defect between this compartment or adjacent compartments, instead of traditional judge whether to break down with temperature maximum, by the judgement of thermal defect, can occur that the initial period of hot stall is just pinpointed the problems, just report to the police when it does not also reach the limit of temperature, can overhaul before there is ultimate temperature, fault was eliminated in the starting stage.
Described data handling system at least comprises any one in following determination methods to the analysis of data:
(c1) carry out with characteristic parameter k value between any two current-carrying compartments the method judged, k is the ratio of the temperature increase of two tested current-carrying compartments;
(c2) carry out with characteristic parameter k and corresponding current value I between any two current-carrying compartments the method judged, k is the ratio of the temperature increase of two tested current-carrying compartments;
(c3) carry out with characteristic parameter p in each current-carrying compartment the method judged, p is the ratio of temperature increase and the corresponding current square of tested current-carrying compartment;
(c4) with the determination methods of temperature increase △ T and corresponding current value I in each current-carrying compartment, or characteristic parameter p and corresponding current value I carries out the method that judges, and p is the ratio of temperature increase and the corresponding current square of tested current-carrying compartment;
(c5) carry out the decision method contrasted with the characteristic parameter k between each current-carrying compartment of similar high-tension switch cabinet, k is the ratio of the temperature increase of two tested current-carrying compartments.
Excellent part of the present invention is can to adopt according to different physical characteristicss different determination methods to judge whether there is thermal defect in high-voltage board, and, also diverse ways can be adopted to use simultaneously, work in coordination with from different physical characteristicss and judge whether to there is thermal defect, thus improve the accuracy of monitoring.
Specifically, described step (c1) carries out with characteristic parameter k value between any two current-carrying compartments the method judged, k is the ratio of the temperature increase of two tested current-carrying compartments, and the method comprises the following steps:
(c11) temperature increase △ T1, the △ T2 in two compartments is measured respectively;
(c12) the correlation coefficient k1 between two temperature increase is calculated, k1=△ T1/ △ T2;
(c13) the scope K of a typical coefficient is determined, K ∈ [a, b];
(c14) correlation coefficient k1 step (c12) calculated and the typical coefficient scope K of step (c13) compares, if k1 is ∈ [a, b], then two compartments do not exist thermal defect,
then have at least a compartment to there is thermal defect in two compartments, need maintenance of reporting to the police.
This identical feature because high-tension switch cabinet has the electric current that all current-carrying compartments pass through, therefore, temperature value between these compartments is mutually related, that is, certain correlationship is there is between the temperature value of same each current-carrying compartment of switch cubicle, the present invention utilizes this feature of switch cubicle just, for finding the thermal defect that may exist: namely under a certain electric current, calculate the temperature increase of each current-carrying compartment, again temperature increase corresponding for each current-carrying compartment is divided by between two, obtains characteristic parameter k, due to square being directly proportional of temperature increase and electric current, when calculating characteristic parameter k, divisor and dividend all equal the product of respective equivalent resistance and current squaring, so k value in fact just eliminates the impact of electric current, and correspond to the ratio of equivalent resistance between two compartments, because the equivalent resistance of two compartments is in theory constant, thus each k value is a constant, therefore being in operation can constantly by the k value obtained and the typical coefficient scope K obtained when putting into operation at first, K ∈ [a, b] compare, once k value exceeds typical coefficient scope K, just can know that in corresponding compartment, somewhere exists the thermal defect of loose contact.
Specifically, described step (c2) carries out with characteristic parameter k and corresponding current value I between any two current-carrying compartments the method judged, k is the ratio of the temperature increase of two tested current-carrying compartments, and the method comprises the following steps:
(c21) temperature increase △ T1, the △ T2 in two compartments is measured respectively, and the electric current I 1 of correspondence;
(c22) the correlation coefficient k1 between two temperature increase is calculated, k1=△ T1/ △ T2;
(c23) curve map of correlation coefficient k and corresponding current I in the historical data of tested compartment is drawn;
(c24) the relational expression k=f (I) of correlation coefficient K and corresponding current I in historical data is drawn according to the curve map of (c23);
(c25) electric current I 1 that step (c21) obtains is brought into the formula k=f (I) in step (c24), calculates the theoretical correlation coefficient k in the historical data of electric current I 1 correspondence;
(c26) the theoretical associated data k that correlation coefficient k1 step (c22) obtained and step (c25) obtain compares, if its difference is greater than the ultimate value preset, has then occurred thermal defect, needs to overhaul; If its difference is less than or equal to the ultimate value preset, then belong to temperature normal.
Further, inventor is a constant through research discovery correlation coefficient k value is relative, just change is very little, can find in practice, along with the increase correlation coefficient k value of electric current still has some to change, in order to the thermal defect that discovery more accurately may exist, can further according to the correlation coefficient k value under electric current different in historical data, draw the curve map of correlation coefficient k and corresponding current I in the historical data of this high-voltage board, and then extrapolate the relational expression k=f (I) drawing correlation coefficient K and corresponding current I in historical data, in operational process afterwards, continuous inspection characteristic parameter k, and the electric current I 1 of correspondence, under utilizing the relational expression k=f (I) of correlation coefficient k and corresponding current I in the historical data obtained to draw theory state, the theoretical correlation coefficient K of electric current I 1 correspondence, the correlation coefficient k1 obtained and theoretical associated data K is compared, if its difference is greater than the ultimate value preset, then there is thermal defect, need to overhaul, even if at this moment temperature value might not be very high, but still can know that the original heating rule of switch cubicle changes, may occur generating heat extremely, and early warning in addition, if its difference is less than or equal to the ultimate value preset, then belong to temperature normal.
Specifically, described step (c3) carries out with characteristic parameter p in each current-carrying compartment the method judged, p is the ratio of temperature increase and the corresponding current square of tested current-carrying compartment, and the method comprises the following steps:
(c31) the temperature increase △ T in each compartment, corresponding electric current I is measured respectively;
(c32) the standard value range P of a characteristic parameter is set, P ∈ [c, d];
(c33) when calculating measuring tempeature, the characteristic parameter p1 in this compartment, p1=△ T/I2;
(c34) characteristic parameter p1 step (c33) calculated and the standard value range P of characteristic parameter compares, if p1 is ∈ [c, d], does not then occur thermal defect; If
then there is thermal defect, need maintenance.
Inventor through research find, by the temperature increase of each compartment divided by load current square, just can obtain the characteristic parameter p that this compartment is relevant with temperature.Characteristic parameter p belongs to different physical quantitys from correlation coefficient k, and characteristic parameter p's is relevant with the equivalent resistance of this compartment, can regard as a constant; At switch cubicle initial operation stage, test and calculate the standard value range P of each compartment feature parameter, P ∈ [c, d], in operation afterwards, constantly by the standard value range P of the characteristic parameter p value that obtains in real time and characteristic parameter, P ∈ [c, d] contrast, go beyond the scope once super and just can know that the equivalent resistance of this compartment there occurs change, thus can judge to there is thermal defect in compartment.
Specifically, described step (c4) is with the determination methods of temperature increase △ T and corresponding current value I in each current-carrying compartment, or characteristic parameter p and corresponding current value I carries out the method judged, p is the ratio of temperature increase and the corresponding current square of tested current-carrying compartment, and the method comprises the following steps:
(c41) electric current I 1 of temperature increase △ T1 in each compartment and correspondence is measured respectively;
(c42) the characteristic parameter p1 in compartment is calculated, p1=△ T1/ (I1) 2;
(c43) curve map of the curve map of temperature increase △ T and corresponding current I in the historical data of each compartment of this high-voltage board, characteristic parameter p and corresponding current I is drawn;
(c44) the relational expression C=f (I) of temperature increase C and corresponding current I in historical data is drawn according to the curve map of (c43), the relational expression of characteristic parameter p and corresponding current I, p=f (I);
(c45) electric current I 1 that step (c41) obtains is updated in the formula C=f (I) in step (c44), calculates the temperature increase △ T in the historical data of electric current I 1 correspondence; The electric current I 1 that step (c41) obtains is brought into the formula p=f (I) in step (c44), calculates the theory characteristic parameter p in the historical data of electric current I 1 correspondence;
(c46) the temperature increase △ T in the historical data that temperature increase △ T1 step (c41) obtained and step (c45) obtain compares, if its difference is greater than the ultimate value preset, then there is thermal defect, needed to overhaul; If its difference is less than or equal to the ultimate value preset, then belong to temperature normal; The theoretical associated data p that the characteristic parameter p1 obtain step (c42) and step (c45) obtain compares, if its difference is greater than the ultimate value preset, has then occurred thermal defect, needs to overhaul; If its difference is less than or equal to the ultimate value preset, then belong to temperature normal.
Further, inventor finds that characteristic parameter p value be a constant is relative after deliberation, just change is very little, can find in practice, along with the increase characteristic parameter P value of electric current still has some to change, in order to the thermal defect that discovery more accurately may exist, can further according to the characteristic parameter P value under electric current different in historical data, draw the curve map of characteristic parameter P and corresponding current I in the historical data of this high-voltage board, and then extrapolate the relational expression P=f (I) drawing characteristic parameter P and corresponding current I in historical data, in operational process afterwards, continuous inspection characteristic parameter p, and the electric current I 1 of correspondence, under utilizing the relational expression P=f (I) of characteristic parameter P and corresponding current I in the historical data obtained to draw theory state, the theory characteristic parameter P of electric current I 1 correspondence, the characteristic parameter p1 obtained and theory characteristic parameter P is compared, if its difference is greater than the ultimate value preset, then there is thermal defect, need to overhaul, even if at this moment temperature value might not be very high, but still can know that the original heating rule of switch cubicle changes, may occur generating heat extremely, and early warning in addition, if its difference is less than or equal to the ultimate value preset, then belong to temperature normal.
Specifically, described step (c5) carries out the decision method contrasted with the characteristic parameter k between each compartment of similar high-tension switch cabinet, k is the ratio of the temperature increase of two tested current-carrying compartments, and the method comprises the following steps:
(c51) calculate the correlation coefficient k of same position compartment in the type high-voltage board, and get its mean value K;
(c52) the temperature increase △ T of each current-carrying compartment in this high-voltage board is measured;
(c53) calculate the correlation coefficient k1 of this high-voltage board two corresponding compartments, k1=△ T1/ △ T2, △ T1, △ T2 are respectively the temperature increase of two tested compartments;
(c54) the correlation coefficient mean value K that correlation coefficient k1 step (c53) calculated and step (c51) obtain compares, if its difference is greater than the ultimate value preset, then there is thermal defect, needed to overhaul; If its difference is less than or equal to the ultimate value preset, then belong to temperature normal.
At the scene in practical application, the switch cubicle of normally 1 to 2 kind of same model of substation's installation, the switch cubicle of same model often has identical structure, although the rated current of each cabinet may be different, but the heating rule of mutually isostructural switch cubicle and heat-producing characteristics are also often same or analogous, thus likely the characteristic parameter k relevant with temperature increase between each corresponding current-carrying compartment of same model switch cubicle is analyzed, the thermal defect that lateral comparison may exist with discovery.
The present invention compared with prior art, has following advantage and beneficial effect:
1 the present invention is for traditional pointwise thermometric mode, because temperature sensor is no longer arranged on the contact point place in noble potential district, and on the top cover being mounted in electronegative potential or be arranged in cavity that switch cubicle top blind flange communicates with compartment space, and temperature sensor can be done very little, the original insulation distance of switch cubicle and Electric Field Distribution can not be affected, therefore there is not any potential safety hazard; Connect up in the top simultaneously passing switch cubicle due to the connection wire of temperature sensor by the aperture of top cover, and Temperature probe can do very little, and on the structure of original equipment and duty impact minimum.Temperature sensor is arranged on inside switch cubicle each current-carrying compartment top cover by the present invention, or be arranged in cavity that switch cubicle top blind flange communicates with compartment space, detected by temperature sensor is no longer the heat condition of certain contact point, but the air themperature in this upper compartment space, reflection be the heat condition of component synthesis in each respective compartment, by the monitoring to each current-carrying compartment, just can realize carrying out comprehensive monitoring to the heat condition of whole switch cubicle; Temperature sensor syndeton be designed to can in the mounting hole of high-voltage switch cabinet lamina tecti pluggable structure and the line of temperature sensor is arranged in cabinet top, sensor can be realized from outside, even do not need to have a power failure and just can carry out installing and changing, the difficult problem safeguarded monitoring system self when solving not power-off well;
2 high-tension switch cabinet thermal defect on-line monitoring methods of the present invention, adopt the air themperature measuring top, high-voltage board inner space, then simulating signal is converted to digital signal show and come data analysis by data handling system, utilize the characteristic of compartment headspace temperature change value to judge whether there is thermal defect between this compartment or adjacent compartments, instead of traditional judge whether to break down with temperature maximum, by the judgement of thermal defect, can occur that the initial period of hot stall is just pinpointed the problems, just report to the police when it does not also reach the limit of temperature, can overhaul before there is ultimate temperature, fault was eliminated in the starting stage,
3 high-tension switch cabinet thermal defect on-line monitoring methods of the present invention, different determination methods can be adopted to judge whether there is thermal defect in high-voltage board according to different physical characteristicss, and, also diverse ways can be adopted simultaneously to use, judge whether to there is physical imperfection from different physical characteristicss.
Accompanying drawing explanation
Accompanying drawing described herein is used to provide the further understanding to the embodiment of the present invention, forms a application's part, does not form the restriction to the embodiment of the present invention.In the accompanying drawings:
Fig. 1 is structural representation of the present invention;
Fig. 2 is the syndeton schematic diagram in the embodiment of the present invention;
Fig. 3 is the replacing structure schematic diagram of syndeton in Fig. 2 of the present invention.
Mark and corresponding parts title in accompanying drawing:
1-high-tension switch cabinet body, 2-mounting hole, 3-junction block, 4-temperature sensor probe, 5-insulation sleeve, 6-elastic fin, 7-mounting cylinder, 8-conduction hole, the secondary chamber of 9-high-tension switch cabinet, 10-data receipt unit.
Embodiment
For making the object, technical solutions and advantages of the present invention clearly understand, below in conjunction with embodiment, the present invention is described in further detail, and exemplary embodiment of the present invention and explanation thereof are only for explaining the present invention, not as a limitation of the invention.
Embodiment
As shown in Fig. 1 to 2, high-tension switch cabinet thermal defect on-line monitoring system of the present invention, form by sensor with as the data receipt unit 10 of data handling system, sensor comprises 2 to 5 temperature sensors and a current sensor, wherein a temperature sensor is arranged on the outside of high-tension switch cabinet with testing environment temperature, the headroom that remaining temperature sensor is arranged on high-voltage board current-carrying compartment is interior for detecting the air themperature in compartment, and current sensor is arranged on the secondary connection of current transformer in high-tension switch cabinet secondary chamber, high-tension switch cabinet body 1 has 3 current-carrying compartments, the high-tension switch cabinet body 1 of different model also may have the current-carrying compartment of varying number, in high-tension switch cabinet body 1, the top of each current-carrying compartment arranges mounting hole 2, in mounting hole 2, syndeton is installed, mounting hole 2 in the present embodiment is all positioned on the lamina tecti of high-tension switch cabinet body 1, as simple substitute mode, also can be arranged on backboard or on side plate, in mounting hole 2, syndeton is installed, syndeton carries out the measurement of temperature as temperature measuring point, syndeton comprises junction block 3, in the bottom of junction block 3, temperature sensor probe 4 is installed, temperature sensor probe 4 is connected on junction block 3 by wire, junction block 3 is for connecting the signal cable of detected temperatures, the signal cable of such detected temperatures together constitutes the connecting line of temperature sensor by junction block 3 and the wire being connected temperature sensor probe 4, an insulation sleeve 5 matched with the mounting hole 2 of high-tension switch cabinet body 1 is also provided with below junction block 3, the elastic fin 6 of two ring-types is had in the arranged outside of insulation sleeve 5, according to the actual needs, suitably can increase the quantity of elastic fin 6, also quantity can be reduced, elastic fin 6 can form integrative-structure with insulation sleeve 5, this version of syndeton makes it to become a kind of parts that can realize plugging in mounting hole, the temperature signal that temperature sensor probe 4 collects, and the current signal that current sensor collects passes to data receipt unit 10 by wire, the secondary chamber 9 that data receipt unit 10 is arranged on high-tension switch cabinet is usually inner, here the panel of data receipt unit 10 is embedded on the panel of secondary chamber 9, will externally show for information about, the connecting line of temperature sensor is passed by the aperture of each compartment top cover and connects up in the outside of high-tension switch cabinet, aperture through secondary locular wall is connected on data receipt unit 10, this wire laying mode being connected wire with temperature sensor by the such mounting means of temperature sensor solves the difficult problem that temperature sensor carries out from outside installing and changing well, as simple replacement, syndeton shown in Fig. 2 also can adopt the syndeton shown in Fig. 3, its difference is only: syndeton comprises the mounting cylinder 7 matched with mounting hole 2, junction block 3 is installed with at the top of mounting cylinder 7, the below of junction block 3 is provided with temperature sensor probe 4 by wire, mounting cylinder 7 is provided with two conduction holes 8, conduction hole 8 is symmetric, conduction hole 8 is positioned at above high-tension switch cabinet body 1 top board, according to the actual needs, the conduction hole 8 of different-diameter can be set, the conduction hole 8 of different number also can be set, data receipt unit 10 carries out independently data operation and judgement as data handling system, also can as a part for data handling system, only carry out the collection of data and upload, data handling system can be multiple host computer, also can be a data processing terminal.
There are three current-carrying compartments in this this high-voltage board, are respectively compartment 1, compartment 2, compartment 3, are in operation certain moment, in order to judge whether there is thermal defect in switch cubicle, can test respectively in accordance with the following methods:
Method one
(c11) it is 15 DEG C that certain moment in operational process records environment temperature, and the temperature value recorded respectively in two any current-carrying compartments 1, compartment 2 is: 31 DEG C, 28 DEG C, temperature increase △ T1=16 DEG C namely in two current-carrying compartments, △ T2=13 DEG C;
(c12) the correlation coefficient k1 now between two temperature increase is calculated, k1=△ T1/ △ T2=1.23;
(c13) in the switch cubicle initial operation stage moment, recording environment temperature is 13 DEG C, recording two any current-carrying compartments such as temperature value in compartment 1, compartment 2 is respectively: 26 DEG C, 24 DEG C, temperature increase △ T1=13 DEG C namely in two current-carrying compartments, △ T2=11 DEG C; Correlative character parameter k between these two compartment temperatures lift-off values, k=△ T1/ △ T2=1.18; Determine that the scope of a typical coefficient K is k ± 10%, i.e. K ∈ [1.06,1.30];
(c14) correlation coefficient k1=1.23 step (c12) calculated and the typical coefficient scope K of step (c13) compares, k1 ∈ [1.06,1.30], then judge that two compartments do not exist thermal defect.
Test as a comparison, artificially by the attaching nut of certain lap-joint of busbar in compartment pine, the contact resistance at this place is made to increase to 32 μ Ω from 38 original μ Ω, when by same load electric current, the temperature of this compartment will calibration constant value rise, according to following steps to some extent:
(c11) now, environment temperature is 15 DEG C, and the temperature value recorded respectively in compartment 1, compartment 2 is: 36 DEG C, 29 DEG C, temperature increase △ T1=36-15=21 DEG C, △ T2=29-15=14 DEG C namely in two current-carrying compartments;
(c12) the correlation coefficient k1 between two temperature increase is calculated, k1=△ T1/ △ T2=1.50;
(c13) scope of typical coefficient K is k ± 10%, i.e. K ∈ [1.06,1.30];
(c14) correlation coefficient k1=1.50 step (c12) calculated and the typical coefficient scope K of step (c13) compares, k1 does not belong to [1.06,1.30], then can judge that in two compartments, at least one compartment exists thermal defect.
Method two, inventor finds through research, it is relative that the characteristic parameter k1 relevant with temperature rise is regarded as constant, its k value of change along with load current still has some changes, such as, when load current is 500A, characteristic coefficient k1 between two compartments is 1.18, and when electric current becomes 1000A, k1 then becomes 1.23, in order to improve the precision analyzed hot stall further, obtain the corresponding relation of characteristic parameter k1 and current value between two any current-carrying compartments, at switch cubicle initial operation stage, when after temperature stabilization in electric current and compartment, measure the temperature increase △ T1 in two compartments respectively, △ T2, and the electric current I 1 of correspondence, when electric current is 500A, the temperature rise value △ T1=13 DEG C of two compartments, △ T2=11 DEG C, the correlative character parameter k1 between two compartment temperatures lift-off values is calculated again, k1=△ T1/ △ T2=13/11=1.18 by the method for (c22), when electric current is 800A, temperature rise value △ T1=28 DEG C of two compartments, △ T2=23 DEG C, k1=△ T1/ △ T2=28/23=1.21, when electric current is 1000A, temperature rise value △ T1=53 DEG C of two compartments, △ T2=43 DEG C, k1=△ T1/ △ T2=53/43=1.23, when electric current is 1200A, temperature rise value △ T1=56 DEG C of two compartments, △ T2=45 DEG C, k1=△ T1/ △ T2=56/45=1.24 ..., then in accordance with the following steps:
(c21) certain moment operating measures temperature increase △ T1=53 DEG C, the △ T2=43 DEG C in two compartments respectively, and the electric current I 1=1000A of correspondence;
(c22) correlation coefficient k1 is calculated, k1=△ T1/ △ T2=53/43=1.23;
(c23) according to the curve map of correlative character parameter k and corresponding current I in the historical data of this high-voltage board of Plotting data recorded;
(c24) the relational expression k=0.0001I+1.13 of correlation coefficient k and corresponding current I in historical data is drawn according to the curve map of (c23);
(c25) the electric current I 1=1000A that step (c21) obtains is brought into the formula k=f (I) in step (c24), calculates the theoretical correlation coefficient k=1.20 in the historical data of electric current I 1 correspondence;
(c26) the theoretical associated data k that correlation coefficient k1=1.23 step (c22) obtained and step (c25) obtain compares, the ultimate value of k gets its 90%---110%, namely normal range is defined as K ∈ (1.08-1.24), know that now k1=1.23 belongs to normal range, does not have thermal defect.
Test as a comparison, people is the loop resistance increased in compartment, according to above method, when by 1000A electric current, these two the compartment temperatures lift-off values obtained are respectively △ T1=58 DEG C, △ T2=44 DEG C, thus correlative character parameter k1=△ T1/ △ T2=58/44=1.32, beyond setting range, therefore can judge to there is thermal defect in these two compartments.
Method three, utilize another feature parameter p relevant with temperature increase to help find whether there is thermal defect in switch cubicle, when after the temperature stabilization in switch cubicle, record ambient temperature value and current value, be 1000A as recorded electric current, environment temperature is 13 DEG C,
(c31) certain moment, measure the temperature increase △ T in each compartment respectively, as the temperature value in current-carrying compartment 1 be: 26 DEG C, calculate to obtain the temperature increase △ T1=13 DEG C in this current-carrying compartment, corresponding electric current I=electric current is 1000A;
(c32) the standard value range P of a characteristic parameter is set, P ∈ [12 × 10
-6, 14 × 10
-6], the p1 value that standard value range P obtains according to the test data of high-tension switch cabinet initial operation stage is set;
(c33) when calculating measuring tempeature, the characteristic parameter p1 in this compartment, p1=△ T/I
2=13 × 10
-6;
(c34) the standard value range P of p1 and characteristic parameter compares, known, p1=13 × 10 of calculating
-6at setting value P ∈ [12 × 10
-6, 14 × 10
-6] in, therefore think and do not occur thermal defect.
Test as a comparison, people is the loop resistance increased in compartment, and when by same 1000A load current, and the temperature rise value recording this compartment becomes 16 DEG C from original 13 DEG C, and p1=16 × 10 of at this moment calculating
-6, exceeded [12 × 10 of setting range
-6, 14 × 10
-6], therefore think that thermal defect has appearred in this compartment.
Method four, at switch cubicle initial operation stage, when after temperature stabilization in electric current and compartment, records the temperature increase △ T1 in certain any selected compartment 1 by the method for (c41), and the electric current I 1 of correspondence.As when electric current is 500A, the temperature rise value △ T1=7 DEG C of this compartment; This compartment characteristic parameter p1 relevant with temperature increase is calculated, p1=△ T1/I again by the method for (c42)
2=28 × 10
-6; When electric current is 800A, the temperature rise value △ T1=19.5 DEG C of this compartment, p1=△ T1/I
2=30.5 × 10
-6; When electric current is 1000A, the temperature rise value △ T1=31 DEG C of this compartment, p1=△ T1/I
2=31 × 10
-6; When electric current is 1200A, the temperature rise value △ T1=45 DEG C of this compartment, p1=△ T1/I
2=31.2 × 10
-6; Thus obtain the historical data of this high-tension switch cabinet, in operation from now on, for understand whether there is thermal defect can according to following steps:
(c41) the electric current I 1=1000A of temperature increase △ T1=31 DEG C in this compartment and correspondence is measured;
(c42) the characteristic parameter p1 in this compartment is calculated, p1=△ T1/I
2=31 × 10
-6;
(c43) curve map of the curve map of temperature increase △ T and corresponding current I in the historical data of each compartment of this high-voltage board, characteristic parameter p and corresponding current I is drawn;
(c44) the relational expression C=f (I)=32 × 10 of temperature increase C and corresponding current I in historical data is drawn
-6i-1, the relational expression of characteristic parameter p and corresponding current I, p=f (I)=0.006I+25;
(c45) when electric current is 1000A, the temperature rise value △ T1=31 DEG C of this compartment is recorded, p1=△ T1/I
2=31 × 10
-6, and the theoretical temperature rise value obtained when electric current is 1000A is 31 DEG C, the theoretical value of correlative character parameter p is 31 × 10
-6, the limit range of setting is the 90%---110% of the theoretical value of C and p, namely sets normal range C to be: 28 DEG C-34 DEG C; P is: 28 × 10
-6-34 × 10
-6;
(c46) test value is within the scope of this, therefore can think that the heating of this compartment is normal.
Test as a comparison, people is the loop resistance increased in compartment, and when by same 1000A load current, this compartment temperatures lift-off value is respectively △ T1=39 DEG C, thus characteristic parameter p1=△ T1/I
2=39 × 10
-6, its temperature rise and characteristic parameter p all beyond setting range, therefore can judge that this compartment exists heat and lacks.
Method five: in order to realize carrying out lateral comparison between the different same type switch cubicle of rated current, help the thermal defect finding may exist in high-tension switch cabinet with the characteristic parameter k relevant with temperature increase;
(c51) be the high-tension switch cabinet of 1600A for certain rated current, recording environment temperature is 13 DEG C, the temperature value recorded respectively in two any current-carrying compartments 1, compartment 2 is: 26 DEG C, 24 DEG C, temperature increase △ T1=13 DEG C, △ T2=11 DEG C namely in two current-carrying compartments; Obtain the correlative character parameter k1 between two compartment temperatures lift-off values, k1=△ T1/ △ T2=1.18 under this electric current; Use the same method, the characteristic parameter k obtained respectively between same compartment that rated current is the switch cubicle of 1200A, 1000A, 600A is respectively 1.22,1.17,1.12, gets the scope that its mean value obtains 1.17, K and is set to: 1.17 ± 10%, i.e. K ∈ [1.05,1.29];
(c52) the temperature increase △ T of each current-carrying compartment in this high-voltage board is measured;
(c53) the correlation coefficient k1 of this high-voltage board two corresponding compartments is calculated, k1=△ T1/ △ T2=1.20;
(c54) k1 is in the scope of K, there is not thermal defect.
Test as a comparison, the artificial loop resistance increased in compartment, recording this two compartments temperature rise value is 21 DEG C, 14 DEG C, and the k1 value at this moment calculated is 1.5, has exceeded the scope of setting and can think that this compartment of this high-tension switch cabinet exists thermal defect.
In sum, the present embodiment adopts diverse ways accurately can judge whether high-tension switch cabinet exists thermal defect.
Above-described embodiment; object of the present invention, technical scheme and beneficial effect are further described; be understood that; the foregoing is only the specific embodiment of the present invention; the protection domain be not intended to limit the present invention; within the spirit and principles in the present invention all, any amendment made, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (11)
1. high-tension switch cabinet thermal defect on-line monitoring system, is characterized in that, comprising:
Multiple temperature sensor: wherein temperature sensor is arranged on testing environment temperature in the outside of high-tension switch cabinet or secondary chamber, and the environment temperature detected is transferred to data handling system; Remaining temperature sensor is arranged on the top of each current-carrying compartment space in high-tension switch cabinet, or is arranged in cavity that switch cubicle top blind flange communicates with compartment space, gathers the air themperature in corresponding current-carrying compartment, and is transferred to data handling system;
Data handling system: the temperature data of temperature sensor collection transfers to data handling system, the analog quantity collected is converted to digital quantity by data handling system, and the temperature increase collected is analyzed, judge whether there is thermal defect in high-tension switch cabinet, or show simultaneously and/or send alerting signal;
Data handling system at least comprises any one in following determination methods to the analysis of data:
(c1) carry out with characteristic parameter k value between any two current-carrying compartments the method judged, k is the ratio of the temperature increase of two tested current-carrying compartments;
(c2) carry out with characteristic parameter k and corresponding current value I between any two current-carrying compartments the method judged, k is the ratio of the temperature increase of two tested current-carrying compartment air;
(c3) carry out with characteristic parameter p in each current-carrying compartment the method judged, p is the ratio of temperature increase and the corresponding current square of tested current-carrying compartment;
(c4) with the determination methods of temperature increase △ T and corresponding current value I in each current-carrying compartment, or characteristic parameter p and corresponding current value I carries out the method that judges, and p is the ratio of temperature increase and the corresponding current square of tested current-carrying compartment;
(c5) carry out the decision method contrasted with the characteristic parameter k between each current-carrying compartment of similar high-tension switch cabinet, k is the ratio of the temperature increase of two tested current-carrying compartments.
2. high-tension switch cabinet thermal defect on-line monitoring system according to claim 1, it is characterized in that: also comprise a current sensor, current sensor is arranged on the secondary cable of current transformer in switch cabinet, for detecting load current and will detecting the current signal transfer that obtains to data handling system.
3. high-tension switch cabinet thermal defect on-line monitoring system according to claim 1, is characterized in that: the connecting line of temperature sensor is passed by the aperture of each compartment top cover and connects up in the outside of high-tension switch cabinet.
4. high-tension switch cabinet thermal defect on-line monitoring system as claimed in any of claims 1 to 3, it is characterized in that: described high-tension switch cabinet comprises high-tension switch cabinet body (1), high-tension switch cabinet body (1) has 2 or 3 current-carrying compartments, the top cover of at least one current-carrying compartment offers temperature sensor mounted mounting hole (2), also comprises the syndeton matched with this mounting hole (2).
5. high-tension switch cabinet thermal defect on-line monitoring system according to claim 4, it is characterized in that: described syndeton comprises junction block (3), in the bottom of junction block (3), temperature sensor probe (4) is installed, temperature sensor probe (4) is connected on junction block (3) by wire, is also provided with an insulation sleeve (5) matched with the mounting hole (2) of high-tension switch cabinet body (1) in junction block (3) below; Or described syndeton comprises the mounting cylinder (7) matched with mounting hole (2), be installed with junction block (3) at the top of mounting cylinder (7), the below of junction block (3) is provided with temperature sensor probe (4) by wire.
6. high-tension switch cabinet thermal defect on-line monitoring method, is characterized in that, comprises the following steps:
A () temperature sensor gathers each current-carrying compartment interior of high-tension switch cabinet and environment temperature, and the temperature value collected is passed to data handling system, and current sensor detects load current, and the current signal collected is passed to data handling system;
B the temperature simulation amount received is converted to digital quantity by () data handling system, and process the data-signal received, and analyzes temperature increase △ T, judges whether there is thermal defect in high-tension switch cabinet;
Described data handling system at least comprises any one in following determination methods to the analysis of data:
(c1) carry out with characteristic parameter k value between any two current-carrying compartments the method judged, k is the ratio of the temperature increase of two tested current-carrying compartments;
(c2) carry out with characteristic parameter k and corresponding current value I between any two current-carrying compartments the method judged, k is the ratio of the temperature increase of two tested current-carrying compartment air;
(c3) carry out with characteristic parameter p in each current-carrying compartment the method judged, p is the ratio of temperature increase and the corresponding current square of tested current-carrying compartment;
(c4) with the determination methods of temperature increase △ T and corresponding current value I in each current-carrying compartment, or characteristic parameter p and corresponding current value I carries out the method that judges, and p is the ratio of temperature increase and the corresponding current square of tested current-carrying compartment;
(c5) carry out the decision method contrasted with the characteristic parameter k between each current-carrying compartment of similar high-tension switch cabinet, k is the ratio of the temperature increase of two tested current-carrying compartments.
7. high-tension switch cabinet thermal defect on-line monitoring method according to claim 6, it is characterized in that, described step (c1) carries out with characteristic parameter k value between any two current-carrying compartments the method judged, k is the ratio of the temperature increase of two tested current-carrying compartments, specifically comprises the following steps:
(c11) temperature increase △ T1, the △ T2 in two compartments is measured respectively;
(c12) the correlation coefficient k1 between two temperature increase is calculated, k1=△ T1/ △ T2;
(c13) the scope K of a typical coefficient is determined, K ∈ [a, b];
(c14) correlation coefficient k1 step (c12) calculated and the typical coefficient scope K of step (c13) compares, if k1 is ∈ [a, b], then two compartments do not exist thermal defect,
then have at least a compartment to there is thermal defect in two compartments, need maintenance of reporting to the police.
8. high-tension switch cabinet thermal defect on-line monitoring method according to claim 6, it is characterized in that, described step (c2) carries out with characteristic parameter k and corresponding current value I between any two current-carrying compartments the method judged, k is the ratio of the temperature increase of two tested current-carrying compartments, specifically comprises the following steps:
(c21) temperature increase △ T1, the △ T2 in two compartments is measured respectively, and the electric current I 1 of correspondence;
(c22) the correlation coefficient k1 between two temperature increase is calculated, k1=△ T1/ △ T2;
(c23) curve map of correlation coefficient k and corresponding current I in the historical data of tested compartment is drawn;
(c24) the relational expression k=f (I) of correlation coefficient k and corresponding current I in historical data is drawn according to the curve map of (c23);
(c25) electric current I 1 that step (c21) obtains is updated to the formula k=f (I) in step (c24), calculates the theoretical correlation coefficient k in the historical data of electric current I 1 correspondence;
(c26) the theoretical associated data k that correlation coefficient k1 step (c22) obtained and step (c25) obtain compares, if its difference is greater than the ultimate value preset, has then occurred thermal defect, needs to overhaul; If its difference is less than or equal to the ultimate value preset, then belong to temperature normal.
9. high-tension switch cabinet thermal defect on-line monitoring method according to claim 6, it is characterized in that, described step (c3) carries out with characteristic parameter p in each current-carrying compartment the method judged, p is the ratio of temperature increase and the corresponding current square of tested current-carrying compartment, specifically comprises the following steps:
(c31) the temperature increase △ T in each compartment, corresponding electric current I is measured respectively;
(c32) the standard value range P of a characteristic parameter is set, P ∈ [c, d];
(c33) when calculating measuring tempeature, the characteristic parameter p1 in this compartment, p1=△ T/I
2;
(c34) characteristic parameter p1 step (c33) calculated and the standard value range P of characteristic parameter compares, if p1 is ∈ [c, d], does not then occur thermal defect; If
then there is thermal defect, need maintenance.
10. high-tension switch cabinet thermal defect on-line monitoring method according to claim 6, it is characterized in that, described step (c4) is with the determination methods of temperature increase △ T and corresponding current value I in each current-carrying compartment, or characteristic parameter p and corresponding current value I carries out the method judged, p is the ratio of temperature increase and the corresponding current square of tested current-carrying compartment, specifically draws together following steps:
(c41) electric current I 1 of temperature increase △ T1 in each compartment and correspondence is measured respectively;
(c42) the characteristic parameter p1 in compartment is calculated, p1=△ T1/ (I1)
2;
(c43) curve map of temperature increase △ T and corresponding current I, the curve map of characteristic parameter p and corresponding current I in the historical data of each compartment of high-tension switch cabinet is drawn;
(c44) the relational expression C=f (I) of temperature increase C and corresponding current I in historical data is drawn according to the curve map of (c43), the relational expression of characteristic parameter p and corresponding current I, p=f (I);
(c45) electric current I 1 that step (c41) obtains is updated in the formula C=f (I) in step (c44), calculates the temperature increase △ T in the historical data of electric current I 1 correspondence; The electric current I 1 that step (c41) obtains is updated to the formula p=f (I) in step (c44), calculates the theory characteristic parameter p in the historical data of electric current I 1 correspondence;
(c46) the temperature increase △ T in the historical data that temperature increase △ T1 step (c41) obtained and step (c45) obtain compares, if its difference is greater than the ultimate value preset, then there is thermal defect, needed to overhaul; If its difference is less than or equal to the ultimate value preset, then belong to temperature normal; The theoretical associated data p that the characteristic parameter p1 obtain step (c42) and step (c45) obtain compares, if its difference is greater than the ultimate value preset, has then occurred thermal defect, needs to overhaul; If its difference is less than or equal to the ultimate value preset, then belong to temperature normal.
11. high-tension switch cabinet thermal defect on-line monitoring methods according to claim 6, it is characterized in that, described step (c5) carries out the decision method contrasted with the characteristic parameter k between each compartment of similar high-tension switch cabinet, k is the ratio of the temperature increase of two tested current-carrying compartments, specifically comprises the following steps:
(c51) calculate the correlation coefficient k of same position compartment in high-voltage board of the same type, and get its mean value K;
(c52) the temperature increase △ T of each current-carrying compartment in this high-voltage board is measured;
(c53) calculate the correlation coefficient k1 of this high-voltage board two corresponding compartments, k1=△ T1/ △ T2, △ T1, △ T2 are respectively the temperature increase of two tested compartments;
(c54) the correlation coefficient mean value K that correlation coefficient k1 step (c53) calculated and step (c51) obtain compares, if its difference is greater than the ultimate value preset, then there is thermal defect, needed to overhaul; If its difference is less than or equal to the ultimate value preset, then belong to temperature normal.
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