CN103521930B - Laser cutting machine - Google Patents
Laser cutting machine Download PDFInfo
- Publication number
- CN103521930B CN103521930B CN201310482339.5A CN201310482339A CN103521930B CN 103521930 B CN103521930 B CN 103521930B CN 201310482339 A CN201310482339 A CN 201310482339A CN 103521930 B CN103521930 B CN 103521930B
- Authority
- CN
- China
- Prior art keywords
- folder portion
- chute
- laser head
- pedestal
- cutting machine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/0426—Fixtures for other work
- B23K37/0435—Clamps
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Laser Beam Processing (AREA)
Abstract
A kind of laser cutting machine, comprise X-axis cutter sweep and bending moving device, X-axis cutter sweep has upper laser head and lower laser head, X-axis cutter sweep is provided with the first chute and the second chute, first chute is parallel to the second chute, upper laser head is located at slip on the first chute and is positioned at the top of microscope carrier, and lower laser head is located at slip on the second chute and is positioned at the below of microscope carrier; Bending moving device comprise pedestal and control pedestal movable move cylinder, pedestal is provided with folder portion, lower folder portion, two parallel longitudinal the first guide rails and upper and lower two bending cylinders, upper folder portion and lower folder portion respectively transverse strands are located on two the first guide rails, and upper folder portion and lower folder portion are connected one of them bending cylinder respectively.This device is cut the top and bottom of wire rod by upper laser head and the cooperation of lower laser head, effectively controls depth of cut, avoids damaging wire internal; Instead of manual operation, production efficiency is high, saves human cost, and reduces defect rate.
Description
Technical field
The present invention relates to a kind of cutting machine, particularly relate to a kind of can surface trimming wire rod outer foil, laser cutting machine that defect rate is lower.
Background technology
Along with the progress of science and technology, in present stage some electron trades, such as surface-mounted integrated circuit, often needs to connect upper winding displacement.But when welding winding displacement, sometimes outer field for winding displacement aluminium foil to be removed.
The laser machine that tradition is cut wire rod outer foil, when cutting, the too dark easily damaging internal wire rod of cutting, cuts too shallow being difficult to and its waste part is peeled off; And peel off its waste part and need artificial treatment, human cost is higher, and production efficiency is low, and easily damages wire rod, and defect rate is higher.
Summary of the invention
Based on this, be necessary, for prior art problem, to provide a kind of laser cutting machine, realize surface trimming wire rod outer foil, production efficiency is high, and saves human cost, defect rate ground.
For solving prior art problem, the invention discloses a kind of laser cutting machine, comprise laser instrument and the microscope carrier for placing wire rod, also comprise X-axis cutter sweep and bending moving device, described X-axis cutter sweep has upper laser head and lower laser head, described X-axis cutter sweep is provided with the first chute and the second chute, described first chute is parallel to the second chute, described upper laser head is located at slip on described first chute and is positioned at the top of microscope carrier, and described lower laser head is located at slip on the second chute and is positioned at the below of microscope carrier; Described bending moving device comprise pedestal and control pedestal movable move cylinder, described pedestal is provided with folder portion, lower folder portion, two parallel longitudinal the first guide rails and upper and lower two bending cylinders, described upper folder portion and lower folder portion respectively transverse strands are located on two the first guide rails, and described upper folder portion and lower folder portion are connected one of them bending cylinder respectively.
Further, described bending moving device also comprises base, moves the piston end of cylinder described in described base is fixedly connected with, described in move cylinder and be fixedly connected with pedestal away from the side of piston end.
Further, the side in described upper folder portion and lower folder portion is provided with brush waste material mechanism, and the opposite side in described upper folder portion and lower folder portion is provided with reject chute.
Further, described brush waste material mechanism comprises pusher cylinder and brush, and described brush is fixedly connected on the piston end of pusher cylinder.
Further, described X-axis cutter sweep also comprises translation motor, drive and annular cingulum, and described annular cingulum surrounds translation motor and drive, and described annular cingulum is provided with a transmission block, and described transmission block is fixedly connected with laser head and lower laser head.
Further, described microscope carrier comprises pedestal, is located at the line-loosening plate above pedestal, the compression cylinder being fixedly installed on pedestal both sides and pressing plate, and described pressing plate two ends are fixedly connected with the piston end of compression cylinder respectively.
Further, described line-loosening plate is provided with several and receives wire casing.
Further, the side in described upper folder portion and lower folder portion is provided with buckle, and described buckle is fixedly connected with the piston end of bending cylinder.
In sum, this device is provided with upper laser head and lower laser head by X-axis cutter sweep, upper laser head and lower laser head lay respectively at the upper and lower of microscope carrier, X-axis cutter sweep is provided with the first chute and the second chute, upper laser head is located on described first chute and is slided, and lower laser head is located on the second chute and is slided, and upper laser head and the cooperation of lower laser head are cut the top and bottom of wire rod, effectively can control depth of cut, avoid damaging wire internal; Taking-up, under the driving of bending cylinder, is clamped to the waste part produced after cutting by upper folder portion on bending moving device and lower folder portion, replaces manual operation, production efficiency is high, save human cost, and avoid because human operational error damages wire rod, reduce defect rate.
Accompanying drawing explanation
Fig. 1 is the exploded view of laser cutting machine of the present invention;
Fig. 2 is the partial structurtes schematic diagram of X-axis cutter sweep of the present invention;
Fig. 3 is the perspective view of bending moving device of the present invention;
Fig. 4 is the exploded view of Fig. 3;
Fig. 5 is the perspective view of microscope carrier of the present invention;
Description of reference numerals is as follows:
10, microscope carrier, 11, pedestal, 12, line-loosening plate, 121, receive wire casing, 13, compression cylinder, 14, pressing plate, 20, X-axis cutter sweep, 21, upper laser head, 22, lower laser head, 23, first chute, 24, second chute, 25, translation motor, 26, delivery wheel, 27, annular cingulum, 271, transmission block, 30, bending moving device, 31, pedestal, 311, first guide rail, 312, slide, 32, move cylinder, 33, upper folder portion, 34, lower folder portion, 35, bending cylinder, 36, buckle, 37, base, 40, brush waste material mechanism, 41, pusher cylinder, 42, brush, 50, reject chute, 60, laser instrument.
Detailed description of the invention
For feature of the present invention, technological means and the specific purposes reached, function can be understood further, below in conjunction with accompanying drawing and detailed description of the invention, the present invention is described in further detail.
Referring to Fig. 1, the invention discloses a kind of laser cutting machine, comprising the microscope carrier 10 for placing wire rod, X-axis cutter sweep 20, bending moving device 30 and laser instrument 60.Described X-axis cutter sweep 20 has upper laser head 21 and lower laser head 22, and the laser that laser instrument 60 sends reaches upper laser head 21 and lower laser head 22 by light path mechanism.
See also Fig. 2, described X-axis cutter sweep 20 is provided with the first chute 23 and the second chute 24, and described first chute 23 is parallel to the second chute 24.Described upper laser head 21 is located at slip on described first chute 23 and is positioned at the top of microscope carrier 10, described lower laser head 22 is located at slip on the second chute 24 and is positioned at the below of microscope carrier 10, upper laser head 21 and lower laser head 22 are mutually corresponding, to wire rod above and carry out laser cutting below.
See also Fig. 3 and Fig. 4, described bending moving device 30 comprise pedestal 31 and control pedestal 31 movable move cylinder 32, described pedestal 31 is provided with the first parallel longitudinal guide rail 311 of folder portion 33,34, two, lower folder portion and upper and lower two bending cylinders 35, described upper folder portion 33 and lower folder portion 34 by slide 312 respectively transverse strands be located on two the first guide rails 311, described upper folder portion 33 and lower folder portion 34 are connected one of them bending cylinder 35 respectively.Under the control of bending cylinder 35, upper folder portion 33 and lower folder portion 34 can move up and down, and clamp the wire waste aluminium foil on microscope carrier 10, and realize automatically taking out waste material, automaticity is high.
In other examples, the side in described upper folder portion 33 and lower folder portion 34 is equipped with buckle 36, and described buckle 36 is fixedly connected with the piston end of bending cylinder 35.
In other examples, described bending moving device 30 also comprises base 37, moves the piston end of cylinder 32 described in described base 37 is fixedly connected with, described in move cylinder 32 and be fixedly connected with pedestal 31 away from the side of piston end.
In other examples, the side in described upper folder portion 33 and lower folder portion 34 is provided with brush waste material mechanism 40, and the opposite side in described upper folder portion 33 and lower folder portion 34 is provided with reject chute 50.In the present embodiment, described brush waste material mechanism 40 comprises pusher cylinder 41 and brush 42, and described brush 42 is fixedly connected on the piston end of pusher cylinder 41.The wire rod outer foil brush taken out through bending moving device 30 after completing laser cutting enters in reject chute 50 by brush waste material mechanism 40, instead of artificial work of receiving waste material, saves human cost, and substantially increase production efficiency.
In other examples, described X-axis cutter sweep 20 also comprises translation motor 25, drive and annular cingulum 27.Described annular cingulum 27 surrounds translation motor 25 and drive, and annular cingulum 27 engages with translation motor 25 and delivery wheel 26.Described annular cingulum 27 is provided with a transmission block 271, and translation motor 25 drives the transmission of annular cingulum 27, drives transmission block 271 and annular cingulum 27 synchronously to move left and right.Transmission block 271 is fixedly connected with laser head 21 and lower laser head 22, therefore transmission block 271 synchronously drives upper laser head 21 and lower laser head 22 to move left and right.Upper laser head 21 is driven to move left and right together with lower laser head 22 by translation motor 25 and annular cingulum 27, can accurately locate, upper laser head 21 and lower laser head about 22 correspondence move left and right simultaneously cuts the top and bottom of wire rod, and can ensure depth of cut, cutting effect is better.
See also Fig. 5, in other examples, described microscope carrier 10 comprises pedestal 11, is located at the line-loosening plate 12 above pedestal 11, the compression cylinder 13 being fixedly installed on pedestal 11 both sides and pressing plate 14, and described pressing plate 14 two ends are fixedly connected with the piston end of compression cylinder 13 respectively.Compression cylinder 13 drives the wire rod on pressing plate 14 pairs of microscope carriers 10 to compress, and is convenient to fixing wire rod and makes cutting accurate.In the present embodiment, described line-loosening plate 12 is provided with several and receives wire casing 121, for holding wire rod, fixing wire rod further, being convenient to follow-up cutting process.
The action implementation procedure of this device is as follows:
Place wire rod toward microscope carrier 10, compression cylinder 13 drives the wire rod on pressing plate 14 pairs of microscope carriers 10 to compress.The translation motor 25 of X-axis cutter sweep 20 controls upper laser head 21 and moves left and right together with lower laser head 22, cuts back and forth wire rod outer foil.After pre-cut, the upper folder portion 33 of bending moving device 30 presses down, curved under wire waste part, then folder portion 33 return is gone up, lower folder portion 34 lifts, curved in wire waste part, finally go up folder portion 33 and wire waste part is clamped in lower folder portion 34, move after cylinder 32 drives bending moving device 30 and move, the waste material aluminium foil on wire rod takes out.Finally, the pusher cylinder 41 of brush waste material mechanism 40 promotes brush 42, pushes waste material aluminium foil to going out in reject chute 50.
This device is provided with upper laser head 21 and lower laser head 22 by X-axis cutter sweep 20, upper laser head 21 and lower laser head 22 lay respectively at the upper and lower of microscope carrier 10, X-axis cutter sweep 20 is provided with the first chute 23 and the second chute 24, upper laser head 21 is located on described first chute 23 and is slided, lower laser head 22 is located on the second chute 24 and is slided, upper laser head 21 and lower laser head 22 coordinate and cut the top and bottom of wire rod, effectively can control depth of cut, avoid damaging wire internal; Taking-up, under the driving of bending cylinder 35, is clamped to the waste part produced after cutting by upper folder portion 33 on bending moving device 30 and lower folder portion 34, replaces manual operation, production efficiency is high, save human cost, and avoid because human operational error damages wire rod, reduce defect rate.
The above embodiment only have expressed several embodiment of the present invention, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.
Claims (8)
1. a laser cutting machine, comprise laser instrument and the microscope carrier for placing wire rod, it is characterized in that: also comprise X-axis cutter sweep and bending moving device, described X-axis cutter sweep has upper laser head and lower laser head, described X-axis cutter sweep is provided with the first chute and the second chute, described first chute is parallel to the second chute, and described upper laser head is located at slip on described first chute and is positioned at the top of microscope carrier, and described lower laser head is located at slip on the second chute and is positioned at the below of microscope carrier; Described bending moving device comprise pedestal and control pedestal movable move cylinder, described pedestal is provided with folder portion, lower folder portion, two parallel longitudinal the first guide rails and upper and lower two bending cylinders, described upper folder portion and lower folder portion respectively transverse strands are located on two the first guide rails, and described upper folder portion and lower folder portion are connected one of them bending cylinder respectively.
2. laser cutting machine according to claim 1, is characterized in that: described bending moving device also comprises base, moves the piston end of cylinder described in described base is fixedly connected with, described in move cylinder and be fixedly connected with pedestal away from the side of piston end.
3. laser cutting machine according to claim 1, is characterized in that: the side in described upper folder portion and lower folder portion is provided with brush waste material mechanism, and the opposite side in described upper folder portion and lower folder portion is provided with reject chute.
4. laser cutting machine according to claim 3, is characterized in that: described brush waste material mechanism comprises pusher cylinder and brush, and described brush is fixedly connected on the piston end of pusher cylinder.
5. laser cutting machine according to claim 1, it is characterized in that: described X-axis cutter sweep also comprises translation motor, drive and annular cingulum, described annular cingulum surrounds translation motor and drive, described annular cingulum is provided with a transmission block, and described transmission block is fixedly connected with laser head and lower laser head.
6. laser cutting machine according to claim 1, it is characterized in that: described microscope carrier comprises pedestal, is located at the line-loosening plate above pedestal, the compression cylinder being fixedly installed on pedestal both sides and pressing plate, and described pressing plate two ends are fixedly connected with the piston end of compression cylinder respectively.
7. laser cutting machine according to claim 6, is characterized in that: described line-loosening plate is provided with several and receives wire casing.
8. laser cutting machine according to claim 1, is characterized in that: the side in described upper folder portion and lower folder portion is provided with buckle, and described buckle is fixedly connected with the piston end of bending cylinder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310482339.5A CN103521930B (en) | 2013-10-15 | 2013-10-15 | Laser cutting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310482339.5A CN103521930B (en) | 2013-10-15 | 2013-10-15 | Laser cutting machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103521930A CN103521930A (en) | 2014-01-22 |
| CN103521930B true CN103521930B (en) | 2016-02-03 |
Family
ID=49924473
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310482339.5A Expired - Fee Related CN103521930B (en) | 2013-10-15 | 2013-10-15 | Laser cutting machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103521930B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109757838A (en) * | 2019-03-13 | 2019-05-17 | 深圳市瑞麒珠宝首饰有限公司 | A kind of radium-shine lathe tool equipment of jewelry production |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4493233A (en) * | 1983-06-22 | 1985-01-15 | Artos Engineering Company | Apparatus for cutting and conveying segments of wire or cable |
| JP3813275B2 (en) * | 1996-12-06 | 2006-08-23 | 古河電気工業株式会社 | Conductor separation method for multiple parallel lines |
| CN201338160Y (en) * | 2008-10-29 | 2009-11-04 | 武汉市恩维激光设备有限公司 | Double optical-head laser beam dynamic pair carving cutting machine |
| CN201629485U (en) * | 2009-12-29 | 2010-11-10 | 武汉凌云光电科技有限责任公司 | Fine flat cable wrapping bending and stripping all-in-one machine |
| CN202058808U (en) * | 2011-06-15 | 2011-11-30 | 哈尔滨光宇电源股份有限公司 | Device capable of automatically clearing edge fragmentary paste of small-wingding electrodes of lithium-ion secondary battery |
| CN202534932U (en) * | 2012-04-05 | 2012-11-14 | 东莞市三信精密机械有限公司 | Laser peeling module of cable connector automatic processing and welding assembly machine |
| CN202797591U (en) * | 2012-08-10 | 2013-03-13 | 东莞市凯昶德电子科技股份有限公司 | Feeding tool used for laser cutting peeling of wire rods |
| CN203526799U (en) * | 2013-10-15 | 2014-04-09 | 东莞市三信精密机械有限公司 | Laser cutting machine |
-
2013
- 2013-10-15 CN CN201310482339.5A patent/CN103521930B/en not_active Expired - Fee Related
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4493233A (en) * | 1983-06-22 | 1985-01-15 | Artos Engineering Company | Apparatus for cutting and conveying segments of wire or cable |
| JP3813275B2 (en) * | 1996-12-06 | 2006-08-23 | 古河電気工業株式会社 | Conductor separation method for multiple parallel lines |
| CN201338160Y (en) * | 2008-10-29 | 2009-11-04 | 武汉市恩维激光设备有限公司 | Double optical-head laser beam dynamic pair carving cutting machine |
| CN201629485U (en) * | 2009-12-29 | 2010-11-10 | 武汉凌云光电科技有限责任公司 | Fine flat cable wrapping bending and stripping all-in-one machine |
| CN202058808U (en) * | 2011-06-15 | 2011-11-30 | 哈尔滨光宇电源股份有限公司 | Device capable of automatically clearing edge fragmentary paste of small-wingding electrodes of lithium-ion secondary battery |
| CN202534932U (en) * | 2012-04-05 | 2012-11-14 | 东莞市三信精密机械有限公司 | Laser peeling module of cable connector automatic processing and welding assembly machine |
| CN202797591U (en) * | 2012-08-10 | 2013-03-13 | 东莞市凯昶德电子科技股份有限公司 | Feeding tool used for laser cutting peeling of wire rods |
| CN203526799U (en) * | 2013-10-15 | 2014-04-09 | 东莞市三信精密机械有限公司 | Laser cutting machine |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103521930A (en) | 2014-01-22 |
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Granted publication date: 20160203 Termination date: 20191015 |