CN103515726A - Novel bonding structure - Google Patents
Novel bonding structure Download PDFInfo
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- CN103515726A CN103515726A CN201210218457.0A CN201210218457A CN103515726A CN 103515726 A CN103515726 A CN 103515726A CN 201210218457 A CN201210218457 A CN 201210218457A CN 103515726 A CN103515726 A CN 103515726A
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- workpiece
- bonding
- spring
- copper
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Abstract
The invention discloses a novel grounding structure. Springs are arranged on a bonding body, in an insulated sleeve, on a copper bond and on a connected conductive wire, permanent magnetic outer covers are arranged on the bonding body and the insulated sleeve, the permanent magnetic outer cover can be tightly attracted to a workpiece, and the copper bond can tightly abut against the workpiece through the spring. The novel bonding structure has the advantages that the copper bond can tightly abut against the workpiece through the spring, the problems that the conductivity of an existing iron bond is not good and lap joint of workpieces is not firm are solved, and the copper bond is directly connected with the conductive wire and is good in conductivity.
Description
Technical field
The present invention relates to a kind of ground structure, particularly a kind of novel ground structure, belongs to technical field of welding equipment.
Background technology
At present, electric welding is after transformer transformation, Contact short circuit between the workpiece of the welding rod of electric welding machine and ground wire overlap joint and form electric arc, welding rod arrives weldering with ionic forms and meets, after cooling, make two blocks of metals link together, at present, the ground wire of electric welding machine is overlapped on the ground structure that is mostly irony on workpiece, the conductivity of irony bonding bad or and workpiece overlap joint insecure, in this way, often occur not producing electric arc between the workpiece of bonding overlap joint and welding rod and the problem that causes welding normally not carry out.
Summary of the invention
The object of the invention is to: a kind of novel ground structure is provided, overcomes the existing above-mentioned defect of existing ground structure, thereby can bring the facility in work.
The technical solution adopted for the present invention to solve the technical problems is: it is comprised of bonding body, insulating case, copper bonding, wire, spring, permanent magnetism enclosing cover, workpiece; In bonding body, insulating case, on the wire of copper bonding, connection, be provided with spring, bonding body, insulating case are provided with permanent magnetism enclosing cover, and permanent magnetism enclosing cover can be adsorbed on workpiece closely, and copper bonding can push up and be pressed on workpiece closely under the effect of spring.
Beneficial effect: copper bonding can push up closely and be pressed on workpiece under the effect of spring, it can overcome the conductivity of current irony bonding bad and and workpiece overlap to obtain unstable problem, copper bonding is directly connected and good conductivity with wire.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention.
Shown in figure: 1, bonding body; 2, insulating case; 3, copper bonding; 4, wire; 5, spring; 6, permanent magnetism enclosing cover; 7, workpiece.
Embodiment
Ground structure has a bonding body (1), in bonding body (1), insulating case, on the wire (4) of (2), copper bonding (3), connection, be provided with spring (5), bonding body (1), insulating case (2) are provided with permanent magnetism enclosing cover (6), it is upper that permanent magnetism enclosing cover (6) can be adsorbed on workpiece (7) closely, and copper bonding (3) can push up closely and be pressed on workpiece (7) under the effect of spring (5).
Claims (3)
1. a novel ground structure, is characterized in that: in bonding body (1), insulating case, on the wire (4) of (2), copper bonding (3), connection, be provided with spring (5).
2. according to claims 1, described a kind of novel ground structure, it is characterized in that: bonding body (1), insulating case (2) are provided with permanent magnetism enclosing cover (6), and permanent magnetism enclosing cover (6) can be adsorbed on workpiece (7) closely.
3. according to a kind of novel ground structure described in claims 1,2, it is characterized in that: copper bonding (3) can push up closely and be pressed on workpiece (7) under the effect of spring (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210218457.0A CN103515726A (en) | 2012-06-28 | 2012-06-28 | Novel bonding structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210218457.0A CN103515726A (en) | 2012-06-28 | 2012-06-28 | Novel bonding structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103515726A true CN103515726A (en) | 2014-01-15 |
Family
ID=49898060
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210218457.0A Pending CN103515726A (en) | 2012-06-28 | 2012-06-28 | Novel bonding structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103515726A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112350088A (en) * | 2020-12-04 | 2021-02-09 | 中国建筑第八工程局有限公司 | Magnetic bonding device of electric welding machine |
-
2012
- 2012-06-28 CN CN201210218457.0A patent/CN103515726A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112350088A (en) * | 2020-12-04 | 2021-02-09 | 中国建筑第八工程局有限公司 | Magnetic bonding device of electric welding machine |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140115 |