CN103500766A - 宽频带长波响应的GaAs/AlxGa1-xAs量子阱红外探测器及其制备方法与应用 - Google Patents
宽频带长波响应的GaAs/AlxGa1-xAs量子阱红外探测器及其制备方法与应用 Download PDFInfo
- Publication number
- CN103500766A CN103500766A CN201310494669.6A CN201310494669A CN103500766A CN 103500766 A CN103500766 A CN 103500766A CN 201310494669 A CN201310494669 A CN 201310494669A CN 103500766 A CN103500766 A CN 103500766A
- Authority
- CN
- China
- Prior art keywords
- gaas
- layer
- contact layer
- infrared detector
- quantum well
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910001218 Gallium arsenide Inorganic materials 0.000 title claims abstract description 98
- 230000004044 response Effects 0.000 title claims abstract description 37
- 238000004519 manufacturing process Methods 0.000 title description 3
- 239000000758 substrate Substances 0.000 claims abstract description 11
- 230000004888 barrier function Effects 0.000 claims abstract description 6
- 238000002360 preparation method Methods 0.000 claims description 13
- 230000005855 radiation Effects 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 8
- 230000007704 transition Effects 0.000 claims description 6
- 238000005036 potential barrier Methods 0.000 claims description 5
- 238000001514 detection method Methods 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 230000003287 optical effect Effects 0.000 claims description 4
- 238000010521 absorption reaction Methods 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 230000008020 evaporation Effects 0.000 claims description 3
- 238000001704 evaporation Methods 0.000 claims description 3
- 230000005284 excitation Effects 0.000 claims description 3
- 239000002784 hot electron Substances 0.000 claims description 3
- 230000005641 tunneling Effects 0.000 claims description 3
- 230000003595 spectral effect Effects 0.000 abstract description 9
- 230000005684 electric field Effects 0.000 abstract description 2
- 229910000661 Mercury cadmium telluride Inorganic materials 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 238000001228 spectrum Methods 0.000 description 3
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000004043 responsiveness Effects 0.000 description 2
- 238000001931 thermography Methods 0.000 description 2
- 229910000980 Aluminium gallium arsenide Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000003331 infrared imaging Methods 0.000 description 1
- 230000035800 maturation Effects 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000004297 night vision Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0352—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
- H01L31/035236—Superlattices; Multiple quantum well structures
- H01L31/035263—Doping superlattices, e.g. nipi superlattices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
- H01L31/0264—Inorganic materials
- H01L31/0304—Inorganic materials including, apart from doping materials or other impurities, only AIIIBV compounds
- H01L31/03044—Inorganic materials including, apart from doping materials or other impurities, only AIIIBV compounds comprising a nitride compounds, e.g. GaN
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
- H01L31/0264—Inorganic materials
- H01L31/0304—Inorganic materials including, apart from doping materials or other impurities, only AIIIBV compounds
- H01L31/03046—Inorganic materials including, apart from doping materials or other impurities, only AIIIBV compounds including ternary or quaternary compounds, e.g. GaAlAs, InGaAs, InGaAsP
- H01L31/03048—Inorganic materials including, apart from doping materials or other impurities, only AIIIBV compounds including ternary or quaternary compounds, e.g. GaAlAs, InGaAs, InGaAsP comprising a nitride compounds, e.g. InGaN
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
- H01L31/10—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by potential barriers, e.g. phototransistors
- H01L31/101—Devices sensitive to infrared, visible or ultraviolet radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/184—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof the active layers comprising only AIIIBV compounds, e.g. GaAs, InP
- H01L31/1844—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof the active layers comprising only AIIIBV compounds, e.g. GaAs, InP comprising ternary or quaternary compounds, e.g. Ga Al As, In Ga As P
- H01L31/1848—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof the active layers comprising only AIIIBV compounds, e.g. GaAs, InP comprising ternary or quaternary compounds, e.g. Ga Al As, In Ga As P comprising nitride compounds, e.g. InGaN, InGaAlN
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/184—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof the active layers comprising only AIIIBV compounds, e.g. GaAs, InP
- H01L31/1856—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof the active layers comprising only AIIIBV compounds, e.g. GaAs, InP comprising nitride compounds, e.g. GaN
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Light Receiving Elements (AREA)
Abstract
本发明提供一种宽频带长波响应的GaAs/AlxGa1-xAs量子阱红外探测器,包括由下而上顺次设置的GaAs衬底、GaAs底接触层,所述的GaAs底接触层包括凸起的台形结构,在所述台形结构上顺次设置有多量子阱层MQW、GaAs顶接触层和上电极,在所述所述的GaAs底接触层上还设置有下电极;所述的多量子阱层MQW为周期交替生长的AlxGa1-xAs层和GaAs层;所述的红外探测器根据超晶格量子阱结构中的电子干涉理论,通过对于超晶格结构参数的精细设计,在势垒顶以上引入几个分立的微带,在外电场作用下,光电子跃迁形成相应的几个光电流峰彼此相互交叠,从而使光谱带宽增大。
Description
技术领域
本发明涉及宽频带长波响应的GaAs/AlxGa1-xAs量子阱红外探测器及其制备方法与应用,属于半导体红外探测器的技术领域。
背景技术
红外探测器作为当今高科技领域的重要发展方向,在民用、军事、太空等诸多领域都取得了显著的成绩。六十年代的硅基化合物探测器其截止响应波长很难达到长波长波段,1980年之后HgCdTe探测器日益发展成熟但是其越来越不能满足人们对于探测器的均匀性和大面积阵列的需求,QWIP探测器是近年来国际上的高新技术。QWIP探测器具有响应速度快,探测率与HgCdTe探测器相近,可人工调制探测波长等优点,但其光谱响应带宽较HgCdTe探测器来比较窄。
光谱响应带宽较窄带来了一些波长的光信号的丢失从而影响了热成像质量,S.V.Bandara et al报导了对GaAs/AlGaAs材料系统用几个不同阱宽和阱深的量子阱构成一个基本单元,然后用多个这样的基本单元制成一个量子阱红外探测器,其光谱带宽已达到Δλ/λP=42%,但是其制作工艺相当复杂。
发明内容
发明概述
针对现有技术的问题,本申请提供一种宽频带长波响应的GaAs/AlxGa1-xAs量子阱红外探测器。所述的红外探测器根据超晶格量子阱结构中的电子干涉理论,通过对于超晶格结构参数的精细设计,在势垒顶以上引入几个分立的微带,在外电场作用下,光电子跃迁形成相应的几个光电流峰彼此相互交叠,从而使光谱带宽增大。
本发明还提供了上述宽频带长波响应的GaAs/AlxGa1-xAs量子阱红外探测器及其制备方法。
本发明还提供了在8-14μm长波段的宽频带长波响应的GaAs/AlxGa1-xAs量子阱红外探测器的应用。
发明详述
本发明的技术方案如下:
一种宽频带长波响应的GaAs/AlxGa1-xAs量子阱红外探测器,包括由下而上顺次设置的GaAs衬底、GaAs底接触层,所述的GaAs底接触层包括凸起的台形结构,在所述台形结构上顺次设置有多量子阱层MQW、GaAs顶接触层和上电极,在所述所述的GaAs底接触层上还设置有下电极;所述的多量子阱层MQW为周期交替生长的AlxGa1-xAs层和GaAs层;根据探测所需的红外光子频率和光谱展宽应用量子干涉模型设计量子阱区域的势垒宽度、势阱宽度、组分、掺杂浓度:
所述量子阱层MQW的交替生长周期为40-60,优选的选取周期为50;其中GaAs层厚度为4.7nm,Si掺杂浓度为0.6-1*10^18cm-3,优选的Si掺杂浓度为7*10^17cm-3;AlxGa1-xAs层厚度为21nm,不掺杂,势垒高度由AlxGa1-xAs中的Al组分x决定,x的取值为0.29-0.31,优选的选取x为0.29;
所述的GaAs底接触层的Si掺杂浓度为0.5-2*10^18cm-3,厚度为1μm;优选的Si的掺杂浓度为1*10^18cm-3;
其中所述的GaAs顶接触层的Si掺杂浓度为0.5-2*10^18cm-3,厚度为0.5μm;优选的Si的掺杂浓度为1*10^18cm-3;
所述量子阱探测器采用边耦合方式,及在所述的GaAs衬底的台面结构一侧打磨成45°,红外光线垂直于入射面入射。边耦合适用于单元或者线阵列器件,容易获得器件的响应率、探测率等参数,得到的性能参数较准确,可以作为标尺。
上述宽频带长波响应的GaAs/AlxGa1-xAs量子阱红外探测器的制备方法,包括步骤如下:
(1)在所述GaAs衬底上利用分子束外延方法依次制备生长出GaAs底接触层、GaAs/AlxGa1-xAs MQW多量子阱层
(2)在所述MQW多量子阱层上制备GaAs顶接触层;
(3)利用现有的刻蚀技术在上述制备的晶片上刻蚀到GaAs底接触层表面,形成台面结构;
(4)采用蒸镀方法,分别在GaAs顶接触层上制备上电极,在GaAs底接触层表面上制备下电极,并引出导线。
根据本发明优选的,所述台面结构的表面积为200μm×200μm。
在8-14μm长波段的宽频带长波响应的GaAs/AlxGa1-xAs量子阱红外探测器的应用:
所述宽频带长波响应的GaAs/AlxGa1-xAs量子阱红外探测器对红外辐射的探测是基于导带内子带间的光跃迁;当有外界红外辐射式,量子阱内子带间产生共振吸收,电子被激发到激发态,激发的电子隧穿出势垒形成热电子,引起材料电导变化,垂直于量子阱加偏压后则收集到红外辐射引起的热电流从而探测到外界的信息。不同于传统探测器在导带和价带间发生的Bloch态间的跃迁,GaAs/AlxGa1-xAs量子阱探测器对红外辐射的探测是基于导带内子带间的光跃迁。传统的GaAs/AlxGa1-xAs红外探测器为一种窄带器件,响应带宽窄,如果应用于整个8-14μm频带则工艺上很复杂,且窄带器件带来了某些频段信息的丢失,影响红外成像的成像质量,本发明设计的宽频带GaAs/AlxGa1-xAs红外探测器可以很好的解决这一问题。红外探测器不光在传统的红外夜视、红外制导等军事领域有着广泛的应用,近年来在医疗成像、安防检验、环境工业监测等民用领域也起到了主要作用。8-14μm的长波红外热成像仪波长较长,穿透雨、雾的能力较高因此也常用于恶劣气候条件,可以检测大气分布。由于抗辐射,特别适于天基红外探测及应用。
本发明的优点在于:
本发明其优点在于光谱响应截止频率处于8-14μm的大气窗口,通过调整量子阱的参数使得势垒以上形成分立的微带,跃迁到各微带上的光子形成的光谱彼此交叠使整体的光谱响应带宽增大,光谱响应带宽可以达到50%左右,无需复杂的量子阱探测器器件结构即可实现扩展响应光谱的目的,且制作工艺相当简单成熟,易于实现。具有光谱响应带宽宽,成像质量高,可响应长波长波段。
附图说明
图1是本发明宽频带长波响应的GaAs/AlxGa1-xAs量子阱红外探测器的结构示意图;
在图1中,1、GaAs衬底;2、GaAs底接触层;3、势垒区AlxGa1-xAs层;4、势阱区GaAs层;5、GaAs顶接触层;6、制作在GaAs顶接触层5上的上电极;7、制作在腐蚀出的GaAs底接触层2上的下电极;α为所述的GaAs衬底的一侧的夹角。
具体实施方式
下面结合实施例和说明书附图对本发明做详细的说明,但不限于此。
实施例1、
如图1所示。
一种宽频带长波响应的GaAs/AlxGa1-xAs量子阱红外探测器,包括由下而上顺次设置的GaAs衬底1、GaAs底接触层2,所述的GaAs底接触层2包括凸起的台形结构,在所述台形结构上顺次设置有多量子阱层MQW、GaAs顶接触层5和上电极6,在所述所述的GaAs底接触层上还设置有下电极7;所述的多量子阱层MQW为周期交替生长的AlxGa1-xAs层3和GaAs层4;
所述量子阱层MQW的交替生长周期为50;其中GaAs层4厚度为4.7nm,Si掺杂浓度为7*10^17cm-3;AlxGa1-xAs层3厚度为21nm,不掺杂,势垒高度由AlxGa1-xAs中的Al组分x决定,x的取值为0.29;
所述的GaAs底接触层2的Si掺杂浓度为1*10^18cm-3,厚度为1μm;
其中所述的GaAs顶接触层5的Si掺杂浓度为1*10^18cm-3,厚度为0.5μm;
所述量子阱探测器采用边耦合方式,及在所述的GaAs衬底1的一侧打磨成α=45°,红外光线垂直于入射面入射。仅对有台面结构一侧做磨角处理,边耦合适用于单元或者线阵列器件,容易获得器件的响应率、探测率等参数,得到的性能参数较准确,可以作为标尺。
实施例2、
如实施例1所述宽频带长波响应的GaAs/AlxGa1-xAs量子阱红外探测器的制备方法,包括步骤如下:
(1)在所述GaAs衬底1上利用分子束外延方法依次制备生长出GaAs底接触层2、GaAs/AlxGa1-xAs MQW多量子阱层
(2)在所述MQW多量子阱层上制备GaAs顶接触层5;
(3)利用现有的刻蚀技术在上述制备的晶片上刻蚀到GaAs底接触层2表面,形成台面结构;
(4)采用蒸镀方法,分别在GaAs顶接触层5上制备上电极6,在GaAs底接触层表面上制备下电极7,并引出导线。
所述台面结构的表面积为200μm×200μm。
实施例3、
如实施例1、2所述的宽频带长波响应的GaAs/AlxGa1-xAs量子阱红外探测器,在8-14μm长波段的宽频带长波响应的GaAs/AlxGa1-xAs量子阱红外探测器的应用:
所述宽频带长波响应的GaAs/AlxGa1-xAs量子阱红外探测器对红外辐射的探测是基于导带内子带间的光跃迁;当有外界红外辐射式,量子阱内子带间产生共振吸收,电子被激发到激发态,激发的电子隧穿出势垒形成热电子,引起材料电导变化,垂直于量子阱加偏压后则收集到红外辐射引起的热电流从而探测到外界的信息。
Claims (9)
1.一种宽频带长波响应的GaAs/AlxGa1-xAs量子阱红外探测器,其特征在于,该红外探测器包括由下而上顺次设置的GaAs衬底、GaAs底接触层,所述的GaAs底接触层包括凸起的台形结构,在所述台形结构上顺次设置有多量子阱层MQW、GaAs顶接触层和上电极,在所述所述的GaAs底接触层上还设置有下电极;所述的多量子阱层MQW为周期交替生长的AlxGa1-xAs层和GaAs层;
所述量子阱层MQW的交替生长周期为40-60,其中GaAs层厚度为4.7nm,Si掺杂浓度为0.6-1*10^18cm-3;AlxGa1-xAs层厚度为21nm,不掺杂,势垒高度由AlxGa1-xAs中的Al组分x决定,x的取值为0.29-0.31;
所述的GaAs底接触层的Si掺杂浓度为0.5-2*10^18cm-3,厚度为1μm;
其中所述的GaAs顶接触层的Si掺杂浓度为0.5-2*10^18cm-3,厚度为0.5μm。
2.如权利要求1所述一种宽频带长波响应的GaAs/AlxGa1-xAs量子阱红外探测器,其特征在于,所述量子阱层MQW的交替生长周期为50。
3.如权利要求1所述一种宽频带长波响应的GaAs/AlxGa1-xAs量子阱红外探测器,其特征在于,所述量子阱层MQW中GaAs层的Si掺杂浓度为7*10^17cm-3。
4.如权利要求1所述一种宽频带长波响应的GaAs/AlxGa1-xAs量子阱红外探测器,其特征在于,所述AlxGa1-xAs层中的Al组分x,x的取值为0.29。
5.如权利要求1所述一种宽频带长波响应的GaAs/AlxGa1-xAs量子阱红外探测器,其特征在于,所述的GaAs底接触层的Si掺杂浓度为1*10^18cm-3。
6.如权利要求1所述一种宽频带长波响应的GaAs/AlxGa1-xAs量子阱红外探测器,其特征在于,其中所述的GaAs顶接触层的Si的掺杂浓度为1*10^18cm-3。
7.如权利要求1所述宽频带长波响应的GaAs/AlxGa1-xAs量子阱红外探测器的制备方法,包括步骤如下:
(1)在所述GaAs衬底上利用分子束外延方法依次制备生长出GaAs底接触层、GaAs/AlxGa1-xAs MQW多量子阱层
(2)在所述MQW多量子阱层上制备GaAs顶接触层;
(3)利用现有的刻蚀技术在上述制备的晶片上刻蚀到GaAs底接触层表面,形成台面结构;
(4)采用蒸镀方法,分别在GaAs顶接触层上制备上电极,在GaAs底接触层表面上制备下电极,并引出导线。
8.如权利要求7所述的宽频带长波响应的GaAs/AlxGa1-xAs量子阱红外探测器的制备方法,其特征在于,所述台面结构的表面积为200*200μm。
9.如权利要求1所述一种宽频带长波响应的GaAs/AlxGa1-xAs量子阱红外探测器,在8-14μm长波段的宽频带长波响应的GaAs/AlxGa1-xAs量子阱红外探测器的应用:
所述宽频带长波响应的GaAs/AlxGa1-xAs量子阱红外探测器对红外辐射的探测是基于导带内子带间的光跃迁;当有外界红外辐射式,量子阱内子带间产生共振吸收,电子被激发到激发态,激发的电子隧穿出势垒形成热电子,引起材料电导变化,垂直于量子阱加偏压后则收集到红外辐射引起的热电流从而探测到外界的信息。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310494669.6A CN103500766A (zh) | 2013-10-19 | 2013-10-19 | 宽频带长波响应的GaAs/AlxGa1-xAs量子阱红外探测器及其制备方法与应用 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310494669.6A CN103500766A (zh) | 2013-10-19 | 2013-10-19 | 宽频带长波响应的GaAs/AlxGa1-xAs量子阱红外探测器及其制备方法与应用 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN103500766A true CN103500766A (zh) | 2014-01-08 |
Family
ID=49865954
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310494669.6A Pending CN103500766A (zh) | 2013-10-19 | 2013-10-19 | 宽频带长波响应的GaAs/AlxGa1-xAs量子阱红外探测器及其制备方法与应用 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN103500766A (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107369738A (zh) * | 2017-06-27 | 2017-11-21 | 上海集成电路研发中心有限公司 | 一种多频段探测的量子阱探测器及其制造方法 |
CN108520904A (zh) * | 2018-06-12 | 2018-09-11 | 中国科学院上海技术物理研究所 | 一种基于共振遂穿效应的GaAs基双色量子阱红外探测器 |
EP3388799A3 (en) * | 2017-04-14 | 2018-12-26 | Sharp Kabushiki Kaisha | Infrared detection system |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1286397A (zh) * | 2000-10-19 | 2001-03-07 | 中国科学院上海技术物理研究所 | 多量子阱红外级联光伏探测器 |
US20030205704A1 (en) * | 1996-08-27 | 2003-11-06 | California Institute Of Technology, A California Corporation | Infrared radiation-detecting device |
CN101847672A (zh) * | 2010-05-07 | 2010-09-29 | 中国科学院半导体研究所 | 10-14微米同时响应的双色量子阱红外探测器及其制作方法 |
-
2013
- 2013-10-19 CN CN201310494669.6A patent/CN103500766A/zh active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030205704A1 (en) * | 1996-08-27 | 2003-11-06 | California Institute Of Technology, A California Corporation | Infrared radiation-detecting device |
CN1286397A (zh) * | 2000-10-19 | 2001-03-07 | 中国科学院上海技术物理研究所 | 多量子阱红外级联光伏探测器 |
CN101847672A (zh) * | 2010-05-07 | 2010-09-29 | 中国科学院半导体研究所 | 10-14微米同时响应的双色量子阱红外探测器及其制作方法 |
Non-Patent Citations (1)
Title |
---|
陈世达: "8-12um量子阱超晶格红外探测器材料与器件", 《红外技术》 * |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3388799A3 (en) * | 2017-04-14 | 2018-12-26 | Sharp Kabushiki Kaisha | Infrared detection system |
US10684168B2 (en) | 2017-04-14 | 2020-06-16 | Sharp Kabushiki Kaisha | Infrared detection system |
CN107369738A (zh) * | 2017-06-27 | 2017-11-21 | 上海集成电路研发中心有限公司 | 一种多频段探测的量子阱探测器及其制造方法 |
CN108520904A (zh) * | 2018-06-12 | 2018-09-11 | 中国科学院上海技术物理研究所 | 一种基于共振遂穿效应的GaAs基双色量子阱红外探测器 |
CN108520904B (zh) * | 2018-06-12 | 2023-09-12 | 中国科学院上海技术物理研究所 | 一种基于共振遂穿效应的GaAs基双色量子阱红外探测器 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
Gunapala et al. | 640$\,\times\, $512 Pixels Long-Wavelength Infrared (LWIR) Quantum-Dot Infrared Photodetector (QDIP) Imaging Focal Plane Array | |
CA1302546C (en) | Infrared-radiation detector device | |
JP6080092B2 (ja) | 受光素子、半導体エピタキシャルウエハ、検出装置および受光素子の製造方法 | |
EP2109146B1 (en) | Infrared detector, infrared detecting apparatus, and method of manufacturing infrared detector | |
US20070137693A1 (en) | Intermediate-band photosensitive device with quantum dots having tunneling barrier embedded in inorganic matrix | |
Gunapala et al. | Recent Developments in Quantum-Well Infrared | |
EP2306523B1 (en) | Infrared detector, infrared detecting apparatus and method of manufacturing infrared detector | |
JP5975417B2 (ja) | 受光素子の製造方法 | |
CN102623523B (zh) | 一种有多色响应的量子点红外探测器 | |
WO2012073539A1 (ja) | 受光素子、検出装置、半導体エピタキシャルウエハ、およびこれらの製造方法 | |
CN104465853A (zh) | 一种雪崩光电二极管及其制作方法 | |
CN109285911A (zh) | 一种短波/中波/长波三波段红外探测器及其制备方法 | |
CN106684200B (zh) | 一种三色红外探测器的制备方法 | |
CN101271933A (zh) | 量子点-阱红外探测器的结构及其制备方法 | |
CN110323289A (zh) | 一种单载流子光电探测器 | |
CN102820365A (zh) | 半导体红外上转换单光子探测设备及方法 | |
Yakimov et al. | Influence of delta-doping on the performance of Ge/Si quantum-dot mid-infrared photodetectors | |
JP6471120B2 (ja) | 光電変換素子およびそれを備えた光電変換装置 | |
CN106024931A (zh) | InAs/GaSb超晶格光子晶体红外探测器及其制备方法 | |
CN106384755A (zh) | InP基量子阱远红外探测器及其制作方法 | |
CN103500766A (zh) | 宽频带长波响应的GaAs/AlxGa1-xAs量子阱红外探测器及其制备方法与应用 | |
CN101866933B (zh) | 两端结构中长波同时响应量子阱红外探测器及其制作方法 | |
CN103247637B (zh) | 红外探测器及其制作方法 | |
Kinugawa et al. | Reciprocal Relation Between Intraband Carrier Generation and Interband Recombination at the Heterointerface of Two-Step Photon Up-Conversion Solar Cells | |
CN102832289B (zh) | 基于光子频率上转换的太赫兹成像器件、转换方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140108 |