CN103493606B - Circuit board assemblies with the system of antivibration - Google Patents
Circuit board assemblies with the system of antivibration Download PDFInfo
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- CN103493606B CN103493606B CN201280019645.9A CN201280019645A CN103493606B CN 103493606 B CN103493606 B CN 103493606B CN 201280019645 A CN201280019645 A CN 201280019645A CN 103493606 B CN103493606 B CN 103493606B
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- circuit board
- region
- face
- vibration
- antivibration
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- 230000000712 assembly Effects 0.000 title claims abstract description 44
- 238000000429 assembly Methods 0.000 title claims abstract description 44
- 238000013016 damping Methods 0.000 claims abstract description 34
- 238000005452 bending Methods 0.000 claims abstract description 10
- 239000002984 plastic foam Substances 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 239000004744 fabric Substances 0.000 claims description 3
- 230000001133 acceleration Effects 0.000 description 11
- 230000005540 biological transmission Effects 0.000 description 8
- 238000001514 detection method Methods 0.000 description 6
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
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- 239000000835 fiber Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229920002379 silicone rubber Polymers 0.000 description 3
- 239000004945 silicone rubber Substances 0.000 description 3
- 229920005830 Polyurethane Foam Polymers 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000000499 gel Substances 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 239000000017 hydrogel Substances 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 239000011496 polyurethane foam Substances 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
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Abstract
The present invention relates to a kind of circuit board assemblies, particularly multilayer circuit board.Described circuit board assemblies includes that at least two pieces are arranged parallel to each other and interconnective circuit board.According to the present invention, in the circuit board assemblies starting the type mentioned, make at least one region, face of one of circuit board by means of flexibly and/or vibration damping the element that constructs be connected with another block circuit board of described circuit board assemblies so that described region and described element by means of described circuit board form the system of antivibration, particularly spring mass system, the bent strip of antivibration or the plate of counter-bending vibration.
Description
Technical field
The present invention relates to a kind of circuit board assemblies, particularly multilayer circuit board.This circuit board group
Part includes that at least two is arranged parallel to each other and interconnective circuit board.
Background technology
At known, electronic structure element equipped with such as sensor from the prior art
In circuit board, it is known that such problem, i.e. circuit board may be with the structure being disposed thereon
Element is activated to carry out self-vibration together, and this may interfere with the detection knot to be detected by sensor
Really.This problem such as occurs in the sensor being configured to vibration receiver, such as sound conducting apparatus,
Pressure transducer or acceleration transducer.Furthermore, it is possible to there is problems in that, i.e. electricity
The frequency of vibration of road plate falls in the detection frequency range of sensor and thus causes with to be checked
The measurement parameter surveyed does not has the testing result of causalnexus.
Summary of the invention
According to the present invention, in the circuit board assemblies starting the type mentioned, make one piece of circuit board
At least one region, face by means of flexibly and/or vibration damping the ground element that constructs and circuit board group
Another block circuit board of part is connected so that by means of described region of circuit board and described
Element forms the system of antivibration, particularly spring-quality system, the bent strip of antivibration or anti-
The plate of bending vibration.
Thus, described region and the structural detail being connected with described region, such as structure
The vibration according to receiving is caused to produce the vibration receiver of sensor signal of reflection vibration, spy
It not pressure transducer, speed probe or acceleration transducer, can be with described region
Vibrate on the element flexibly constructed together.
Preferably, the described element flexibly constructed additionally be configured to vibration damping and for this
The vibration damping portion of inside can be formed when vibration.Thus, it may be advantageous to formed with vibration vibration damping
The spring-quality system of device.
Multilamellar construct include at least two, the circuit board of the most multiple board layer
In assembly, element that is described that flexibly construct and that more preferably construct can be favourable vibration damping
Be arranged between two pieces of circuit boards.The circuit that these circuit boards construct with forming multilamellar respectively
One layer of board component.
Such as, this circuit board assemblies is HDI circuit board (the HDI=high density that constructs of multilamellar ground
Interconnection) or ECP circuit board (encapsulation of ECP=embedded element).Circuit board assemblies, spy
It not that the conductor circuit of single circuit board in multilayer circuit board is preferably by means of penetration type
(also referred to as Via) is connected with each other in contact.Also may be formed at located adjacent one another by means of Via
Thermally coupled between circuit board.
Preferably, described region is connected with the structural detail of electronics.The structure of this electronics
Element for example, sound conducting apparatus, acceleration transducer, speed probe or pressure transducer.
Such as, acceleration transducer can have vibrations quality and the pressure being connected with this quality
Electric device.In another embodiment, acceleration transducer is micro mechanical sensor, especially
Being MEMS sensor (MEMS=microelectromechanical systems), it is configured for electric capacity
Mode detect the deflection of sensor mass.The most several milligrams of weights of sensor mass and having
Have that be connected with crossbeam, along crossbeam bridge part longitudinally spaced apart from each other, these bridge joint
Portion can vibrate between two electrodes forming electric capacity.This sensor mass the most particularly with
The mode of vibration is kept in the electric field.The vibration of this sensor mass can be by being applied to biography
The qualitative acceleration of sensor changes in frequency and/or amplitude, thus can examine according to this change
Survey frequency and/or the amplitude of this acceleration.
In speed probe, the quality of this acceleration transducer can be according to the rotating speed rotated
Centrifugal force is deflected and thus according to this deflection, be particularly deflected into the electric capacity of ratio with this
Change or piezoelectric voltage detection acceleration.
This pressure transducer is preferably configured to, for detecting the air pressure, especially of static state
It is the change of air pressure and produces sensor signal, this sensor signal reflection air pressure
Power or the change of air pressure.To this end, can make rosette (Dose) to pressure-sensitive
Diaphragm is connected with the piezoelectric element of the deflection that can detect diaphragm or the element of electric capacity.
By means of the structural detail of this electronics, advantageously can form additional quality, it can be with
Described region vibrates together on the element flexibly constructed.It can also be envisaged that another electronics
Structural detail is as the sensor sensitive to vibrations, such as microprocessor.
Preferably, including region, face, the structural detail of electronics of circuit board and flexibly construct
The resonant frequency of spring-quality system of element less than the frequency that can be detected by the sensors.Have
Profit ground, can be achieved in damping vibration well.More advantageously, this sensor can with fall
The bending vibration resonance of resonance in the frequency detection range of sensor, particularly circuit board
Depart from.
In one preferred embodiment, region, face and circuit board with described region neighbour
Near face is in vibration, particularly depart from terms of bending vibration, wherein, circuit board have for
Recess and this region, face in this region, face are arranged in this recess.Such as, this region, face with
Surround the region, face in this region, face depart from by means of the groove of groove, particularly sawing and thus separate.
Such as can be by means of sawing or by means of cut realization disengaging.By means of being consequently formed
Disengaging, this region, face can relative to surround circuit board this region, face region, face freely
Elastic element vibrates.
Preferably, this region, face and this face district of encirclement of the face of circuit board, particularly circuit board
The face in territory is connected by means of paper tinsel, particularly cover foil.Preferably, this paper tinsel has and compares circuit
The gauge that plate is less.Hence it is advantageous to be enclosed in the antivibration of circuit board and circuit board
Region, face between space, particularly gap.Advantageously, dirt can not pass through this sealing
Enter in the space between circuit board.Such as, this paper tinsel at least utilizes binding agent coating in side.
The paper tinsel of this particularly self bonding also can be advantageously after equipment circuit board and also by electronics
Structural detail weld mutually with circuit board and be enclosed in this region, face afterwards and surround this region, face
The gap formed to depart between the face of circuit board.
In one preferred embodiment, the element flexibly constructed has element silicon.Logical
Crossing this element silicon, this element advantageously also has damping behavior in addition to elastic characteristic.
Advantageously, element silicon can largely resist different chemical reagent.
In another embodiment, this element flexibly constructed is plastic foam, particularly
Polyurethane foam.The unit of this elasticity can be advantageously provided by this plastic foam cost-effective
Part.
Preferably, this flexibly and/or vibration damping ground structure element by means of being molded into another block
It is joined in the recess of circuit board on circuit board.Such as, this element flexibly constructed can
It is incorporated in intermediate layer by means of embedding grammar.Therefore, this circuit board it is parallel to neighboringly
Arrange another block circuit board can be formed vibration mounting and for flexible member and with this elasticity
The fixing point in the region, face that element is connected.
In one preferred embodiment, the element flexibly constructed is arranged in by this electricity
Between the plane that road plate and another block circuit board are formed.By this way, this region, face can have
The circuit board layout in profit ground and this region, face of encirclement is in identical plane.By by means of this
The disengaging of elastic element, no longer due to spring mass system in the circuit board composite members of multilamellar
System structure and in terms of height consumption s tructure space.
The present invention also relates to the electricity of a kind of circuit board assemblies with type as described above
Road is arranged.In this circuit arrangement, in the structural detail of circuit arrangement at least some of with
The zone machines ground, face of circuit board connects and/or additionally electrically connects, and this region, face forms antivibration
System, particularly spring-quality system, the bent strip of antivibration or the plate of counter-bending vibration.
Preferably, the area that this region, face has makes sensor can be fixed on this area.
Such as, the square region, face of spring-quality system has between one centimetre and five centimetres
The length of side.It can also be envisaged that the system of the antivibration in micrometer range, thus according to be achieved humorous
Vibration frequency, the MEMS sensor with the square size with 50 microns of length of sides is not having
At thin circuit board (such as with in multilamellar in the case of the electrical connections of MEMS sensor
The circuit board thickness of 100 to 150 microns of circuit board assemblies) in be smaller than 1 centimetre,
Preferably less than 500 microns.
Accompanying drawing explanation
Fig. 1 shows and with the antivibration formed by region, face and the spring element of circuit board is
The embodiment of the circuit board assemblies of system；
Fig. 2 shows top view with the circuit board assemblies shown in sectional view in FIG；
Fig. 3 shows with being formed by the region, face of circuit board and damping element with top view
The embodiment of the circuit board assemblies of the system of antivibration；
Fig. 4 shows the circuit board assemblies in Fig. 3 with sectional view；
Fig. 5 shows and with the antivibration formed by region, face and the damping element of circuit board is
The embodiment of the circuit board assemblies of system, wherein, described region is formed with free vibration
The leaf spring of end；
Fig. 6 shows the circuit board assemblies of Fig. 5 with sectional view；
Fig. 7 shows two transmission functions with circuit board assemblies in figures 3 and 4
Chart.
Detailed description of the invention
Fig. 1 shows the embodiment of circuit board assemblies 1.This circuit board assemblies 1 has circuit
Plate 5 and the circuit board 7 being connected with this circuit board 5.This circuit board 5 and 7 is in parallel with each other
Arrange, wherein, be at least disposed with in the part in face between circuit board 5 and 7 and make electricity
The intermediate layer 33 that road plate 5 and 7 is connected to each other.Such as, this circuit board 5 and 7 is that fiber adds
The epoxy circuit board strong, particularly glass fibre is strengthened.In this embodiment, electricity
Road board component 1 forms the circuit board of multilamellar, and wherein, circuit board 5 and 7 forms one respectively
Layer, intermediate layer 33 (also referred to as internal layer) is surrounded in-between by the two layer.Such as,
This intermediate layer 33 is formed by epoxy resin layer.Circuit board 5 and 7 has at least side respectively
There is Copper Foil.This Copper Foil such as can be formed by RCC-paper tinsel (RCC=resinize copper).At this
In embodiment, circuit board assemblies 1 also has the structural detail of multiple electronics.Show electronics
Structural detail 14 and 16, it is arranged in the side of circuit board 7.In this embodiment,
Structural detail 14 and 16 is formed by integrated circuit.Circuit board assemblies 1 also has the knot of electronics
Constitutive element part 20 and 22, it is respectively configured to electric capacity.This structural detail 20 and 22 is respectively arranged
In intermediate layer 33, and it is therefore disposed between circuit board 5 and 7.It is also shown for electronics
Structural detail 18, in this embodiment, it is integrated circuit, and this structural detail 18 is arranged
It is connected in the side of circuit board 5 and with circuit board 5, the particularly copper circuit of circuit board 5.
Circuit board 7 has region, face 9, its (such as by means of sawing) with circuit board 7
Separate.Thus, this region, face 9 forms a kind of lid, and the gap 25 that this lid is covered around this is wrapped
Enclose.This gap 25 is such as formed by sawing or cut circuit board 7.Advantageously, exist
This gap is formed before connecting circuit board 7 and circuit board 5.In thin circuit board, can be by
Polylith circuit board is stacked and jointly by cut or sawing.Therefore, this thin circuit
Plate will not rupture, and more advantageously, can form polylith electricity in cost-effective ground in an operation
Road plate.
The region, face 9 of circuit board 7 is connected with circuit board 5 by means of spring element 11.?
In this embodiment, this spring element 11 is formed by silicone rubber.In this embodiment, spring
Element 11 also has the performance of vibration damping.
The region, face 9 of circuit board 7 there also is provided sensor 13.This sensor 13 is such as
For pressure transducer, particularly sound conducting apparatus, acceleration transducer or speed probe.This biography
Sensor 13 is connected also with circuit board 7 with 37 by means of closing line (Bond-Draht) 35
And be connected with at least one copper conductor circuit in this place.In another embodiment, sensing
Device is electrically connected by means of Flip-Chip technology or by means of penetration type contact (also referred to as Via)
Connect.
Sensor 13 forms the system, particularly of antivibration together with the region, face 9 of circuit board 7
The quality of spring-quality system.In this embodiment, this spring element 11 is arranged in circuit board
Between 5 and 7.Intermediate layer 33 has recess in the region of spring element 11, thus at this
Place forms cavity, and spring element 11 is arranged in the cavity.Thus, spring element 11 cloth
Put between circuit board 7 and 5, particularly extend between region, face 9 and circuit board 5
In cavity.
System by means of the antivibration being consequently formed, it may be advantageous to make sensor 13 and circuit board
5 assemblies being connected with same circuit board 5 depart from terms of the vibration of machinery.
In this embodiment, the gap 25 of cincture is covered by the paper tinsel 30 adhered to.This adhesion
Paper tinsel 30 for example, polyimide foil, its coverage gap 25 and advantageously have additional
The performance of vibration damping.If sensor 13 vibrates together with region, face 9 on spring element 11,
Then this paper tinsel 30 can together with this oscillating movement flexibly motion and past by means of oscillating movement
The elastic deformation of multiple stroke produces the additional vibration damping of the damping property for spring element 11.
Resonant frequency f=ω/2 π of the spring-quality system being consequently formed is according to below equation meter
Calculate:
Wherein, ω=angular frequency,
The spring rate of s=spring element,
M=sensor and the quality of panel element.
Fig. 2 shows top view with the circuit board assemblies shown in sectional view in FIG.Show
Go out tool circuit board jaggy 7.
The panel element 9 that size is less than this breach it is disposed with in this breach, thus in panel element
In breach, the gap 25 of the enveloping surface element 9 of cincture is formed between 9 and circuit board 7.Pass
Sensor 13 is arranged on this region, face 9 of circuit board 7 and is connected with this region, face 9.
Fig. 3 shows the embodiment of circuit board assemblies 2.This circuit board assemblies 2 is in this enforcement
Example has two circuit boards 5 and 7.Circuit board 7 has the longlyest at the circuit of circuit board 7
The breach extended in board plane, it forms gap 29.District in an end in this gap 29
In territory, another gap 28 extends transverse to this gap 29.The other end in gap 29
In region, gap 24 upwardly extends in the side identical with gap 28.Gap 24 and 28
In the face of the end in gap 29 is separated with gap 29 by bridge part respectively, wherein, this bridge joint
Cage structure is in circuit board 7.Bridge part is such as by when sawing out gap 28,29 and 24
The circuit board material of the circuit board 7 retained is formed.Thus, described bridge part is molded in circuit
On plate 7.Gap 27 extends parallel to relative to gap 29 and in gap 24 and 28
Extend away from the region of the end in gap 29.Thus, by means of gap 24,28,29
With 27 regions, face 8 surrounding circuit board 7, this region, face 8 is by means of bridge part and circuit board
7 are connected.This region, face 8 can thus (in the way of being suspended on bridge part) at circuit board
In 7, the circuit board plane transverse to circuit board 7 is of reciprocating vibration.This region, face 8 of reciprocating vibration
Causing the deformation in region, face 8, it is such as at the first vibration mould of the end region towards amplitude
It it is the form of cushion pad in the case of formula.
Region, face 8 is disposed with sensor 13.This sensor 13 for example, pressure transducer,
Acceleration transducer or sound conducting apparatus.
Fig. 4 shows in figure 3 with the circuit board assemblies 2 shown in top view with sectional view.Should
Section passes gap 27.Be consequently formed the structure of the multilamellar of the circuit board assemblies of multilamellar, its
This embodiment includes three layers, i.e. circuit board 5 and circuit board 7 and layout are in-between
Intermediate layer 32.This intermediate layer 32 has cavity, damping element 12 cloth in this embodiment
Put wherein.This damping element 12 such as by plastic foam, particularly polyurethane foam,
Formed by silicone rubber or by gel component, particularly Silica hydrogel element.
This sensor can be reciprocal transverse to the circuit board plane of circuit board 7 together with region, face 8
Vibration, wherein, region, face 8 is suspended on bridge part and by means of this bridge part and circuit
Plate 7 is connected.
Thus, the vibration in region, face 8, particularly resonant frequency are basically by circuit board 7
The bending stiffness of circuit board material and size determine.This circuit board material for example, fiber
Epoxy resin that strengthen, that particularly glass fibre is strengthened.Shaking of the vibration in this region, face 8
Width is in this embodiment not only by the subtracting of region, face 8 of circuit board 7, particularly circuit board 7
Characteristic of shaking self is determined and is determined by the damping behavior of damping element 12, this vibration damping unit
Part make region, face 8 be connected with circuit board 5 and be arranged in region, face 8 and circuit board 5 it
Between space in.Such as in the case of the bending stiffness of default panel element 8, antivibration be
The resonant frequency of system can be determined by the length in gap 24,27,28 and 29.Such as, should
Resonant frequency can rule of thumb obtain.
Figure 7 illustrates the frequency curve of the vibration in region, face 8.
Fig. 5 shows the embodiment of circuit board assemblies 3.In this embodiment, this circuit board
Assembly 3 includes that three layers, the circuit board wherein strengthened by one block of fiber form one respectively
Layer, forms circuit board 5 and circuit board 7 the most in this embodiment.This circuit board 5 and 7 passes through
Intermediate layer 34 is connected with each other.This intermediate layer 34 is such as formed by epoxy resin layer.In this
Interbed 34 has cavity 31, is provided with damping element 15 in this cavity 31.In this enforcement
In example, this damping element 15 only partially fills cavity 31.In this embodiment, circuit
Plate 7 has the breach of U-shaped, and it forms the gap 26 of U-shaped.
The gap of this U-shaped surrounds the region, face 10 of circuit board 7, and wherein, cavity 31 is at circuit
Extend between region, face 10 and the circuit board 5 of plate 7.In this embodiment, region, face 10
There is the shape of longitudinal extension.Thus, this region, face 10 can be from by the U-shaped side in gap 26
39, the line that the end on limit connects starts to vibrate in cavity 31 and from circuit board surface 7
Vibration is out.
Here, region, face 10 can (with springboard similarly) the most curved along its longitudinal extension
Bent.The elastic characteristic of the system of the antivibration being thusly-formed, particularly resonant frequency are the most logical
Cross panel element 10 to determine and in panel element 10 along the bending stiffness of its longitudinal extension
Determined by the length of the free vibration of panel element 10 when width has determined that.
It is disposed with damping element 15 in the region of an end of panel element 10.This vibration damping unit
The end regions of panel element 10 is connected by part 15 with circuit board 5.This damping element 15 is arranged
In cavity 31 between circuit board 5 dough-making powder region 10.Can by means of this damping element 15
Weaken the region, face 3 oscillating movement transverse to the circuit board plane of circuit board 7.This vibration damping unit
Part 15 is such as formed by silicone rubber or gel component, particularly Silica hydrogel element.
Fig. 6 shows the top view of the most already shown circuit board assemblies 3.Illustrate
Sensor 13, it is in the face region of the longitudinal extension of the circuit board section forming circuit board 7
The Zhong Yumian region, region 10 of the end of 10 is connected.Also show enveloping surface region 10
Gap 26.This gap 26 can such as produce by means of sawing or cut.
Fig. 7 shows the transmission of the vibration in the region, face 8 of the circuit board 7 that figure 4 illustrates
Function.Sensor 13 is connected with this region, face 8.Thus, sensor 13 and this face district
Territory 8 forms the system of antivibration together.Fig. 7 shows chart 40.This chart 40 has frequency
Axle 42 and amplitude axe 44.Amplitude axe 44 shows the transmission capacity of vibration with decibel.Figure
Table 40 shows the transmission function 46 not being weakened vibration in region, face 8.In region, face 8
In the case of non-damping vibration, this circuit board assemblies 2 does not have damping element 12.Can be seen that
The significant resonant frequency 50 of panel element 8.This transmission function 46 drops to higher rapidly
Frequency.Thus the system of antivibration is attenuated to higher frequency.Thus, the system of this antivibration can
Advantageously depart from higher frequency.
Also show transmission function 48.This transmission function 48 reflects by means of damping element
The vibration in 12 regions, face 8 being connected with circuit board 5.Also show resonant frequency 52, its
More than resonant frequency 50.Can be seen that in the region of resonance 52 than transmitting the humorous of function 46
Shake amplitude less in the region of 50.This less amplitude is advantageous by damping element 12
Vibration damping cause.This transmission function starts to rapidly drop to higher frequency from resonant frequency 52,
Thus thus can effectively produce vibration and depart from.In this embodiment, this resonant frequency 50 exists
About 5000 hertz, resonant frequency 52 is about 7000 hertz.Can be seen that, sensor 13 from
Frequency more than 10000 hertz starts effectively to depart from vibration.Thus, this sensor 13
Can be effectively by the bending vibration of vibration, the particularly circuit board 5 and 7 of circuit board assemblies
Depart from.The most advantageously, the detection model of the detection range of sensor, particularly sensor 13
Enclose be positioned at the frequency range on resonant frequency 50 or 52 will not or only degree is tinily
The damaging of vibration by circuit board assemblies.
Claims (9)
1. a circuit board assemblies (1,2,3), it includes at least two pieces of cloth in parallel with each other
Put and interconnective circuit board (5,7), it is characterised in that make one piece of circuit board (7)
At least one region, face (8,9,10) be connected also with the structural detail (13) of electronics
And by means of flexibly and/or vibration damping the ground element (11,12,15) that constructs and described circuit
Another block circuit board (5) of board component (1,2,3) is connected so that by means of described
Described the region (8,9,10) of circuit board (7) and described element (11,12,15)
Formed antivibration system, wherein said flexibly and/or vibration damping ground structure element (11,12,
15) it is arranged between described two pieces of circuit boards, is wherein parallel to described circuit board (7) neighbouring
Ground arrange another block circuit board (5) formed vibration mounting and for described element (11,
12,15) fixing point in the region, face and with described element (11,12,15) being connected,
The face of wherein said region (8,9,10) and described circuit board is by means of paper tinsel (30) phase
Connect so that be sealed in the face of the antivibration of described circuit board (7) and described circuit board (7)
Space between region (8,9,10), the gap i.e. formed to depart from (24,25,
26,27,28,29), wherein said paper tinsel (30) has less than described circuit board (7)
Gauge.
2. according to the circuit board assemblies (1,2,3) described in claim 1, it is characterised in that
Described structural detail (13) is vibration receiver, and described vibration receiver can be according to reception
Vibration produce reflect described vibration sensor signal.
3. according to the circuit board assemblies (1,2,3) according to any one of the claims,
It is characterized in that, described region (8,9,10) and described circuit board (7) with described
Neighbouring face, region, face (8,9,10) departs from terms of vibration, wherein, and described circuit board
(7) there is the recess for described region (8,9,10) and described region layout
In described recess.
4. according to the circuit board assemblies (1,2,3) described in claim 1 or 2, its feature
Being, described element (11,12,15) has silicon.
5. according to the circuit board assemblies (1,2,3) described in claim 1 or 2, its feature
Being, described element (11,12,15) has plastic foam.
6. according to the circuit board assemblies (1,2,3) described in claim 1 or 2, its feature
Being, described element (11,12,15) is by means of being molded into another block circuit board (5) described
Above it is joined in the recess of described circuit board (7).
7. according to the circuit board assemblies (1,2,3) described in claim 1 or 2, its feature
Being, the system of described antivibration is spring-quality system.
8. according to the circuit board assemblies (1,2,3) described in claim 1 or 2, its feature
It is, by means of described region (8,9,10) and the described unit of described circuit board (7)
Part (11,12,15) forms bent strip or the plate of counter-bending vibration of antivibration.
9. with according to the circuit board assemblies (1,2,3) according to any one of the claims
Circuit arrangement, it is characterised in that in the structural detail (13) of described circuit arrangement extremely
The region, face (8,9,10) of few a part of antivibration with described circuit board assemblies (1,2,3)
Mechanically connected and/or additionally electrically connect.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102011017692A DE102011017692A1 (en) | 2011-04-28 | 2011-04-28 | Circuit board arrangement with a swingable system |
| DE102011017692.6 | 2011-04-28 | ||
| PCT/EP2012/057306 WO2012146547A1 (en) | 2011-04-28 | 2012-04-20 | Printed circuit board arrangement comprising an oscillatory system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103493606A CN103493606A (en) | 2014-01-01 |
| CN103493606B true CN103493606B (en) | 2016-11-30 |
Family
ID=
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1767737A (en) * | 2004-10-27 | 2006-05-03 | 北京华旗资讯数码科技有限公司 | Mobile hard disk and its mobile hard disk cartridge |
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1767737A (en) * | 2004-10-27 | 2006-05-03 | 北京华旗资讯数码科技有限公司 | Mobile hard disk and its mobile hard disk cartridge |
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