CN103491762A - Element installing device and element installing method - Google Patents
Element installing device and element installing method Download PDFInfo
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- CN103491762A CN103491762A CN201310148212.XA CN201310148212A CN103491762A CN 103491762 A CN103491762 A CN 103491762A CN 201310148212 A CN201310148212 A CN 201310148212A CN 103491762 A CN103491762 A CN 103491762A
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Abstract
The invention aims to provide an element installing device and an element installing method that can make absorption position to be correct even when a micro-fine element is taken as an object and action speed is super high. An action mode predetermining speed mode of action speed of a lifting driving shaft of a suction and a horizontal driving shaft of an installation head can be switched between a generation one setting in a manner of shortening action time in a possible range and a low ratio action mode setting action speed lower than that in the generation action mode. If a device status change is detected in an element taking-out action, the action mode switching part switches the action mode into the low speed action mode and corrects the element absorption. After the action mode is switched to the low speed one, the action mode can be switched to the general one in an allowed range of position deviation.
Description
Technical field
The present invention relates to a kind of element fixing apparatus and component mounting method that electronic component is installed on to substrate.
Background technology
In element fixing apparatus, repeatedly carry out following element installation action: keep and take out electronic component from the component feeding section absorption that is disposed with the component supplying apparatus such as a plurality of tape feeders and forms by the suction nozzle that is arranged at mounting head, electronic element transferring is equipped on to substrate.In recent years, installation action precision High Level element fixing apparatus required along with the miniaturization of the miniaturization of electronic equipment, electronic component, consequently, require by suction nozzle with high positional precision absorption holding element.Therefore, use possesses the component supplying apparatus of so-called absorption position learning functionality, the appropriate location (for example, with reference to patent documentation 1) of suction nozzle when this absorption position learning functionality is proofreaied and correct the absorption holding element for the result according to detecting actual absorption holding element position deviation state afterwards.In the prior art shown in this patent documentation example, detection is by the departure between the center of the center of the element of suction nozzle absorption and suction nozzle, the corrected value when suction nozzle of the value after will on this departure, being multiplied by sensitivity coefficient when once adsorbing on opposing positions.
The prior art document
Patent documentation
Patent documentation 1: TOHKEMY 2002-50896 communique
Summary of the invention
Yet, in the prior art that comprises above-mentioned patent documentation example, the high speed of the responsiveness that the requirement improved due to the miniaturization of the element as manipulating object and productivity ratio produces, so produced the problem that absorption position study can not normally play a role.That is,, in the situation that fine element, the relative position deviation amount allowed between element and suction nozzle in the absorption action is compared little with common element, require higher aligning accuracy.Therefore, although need to be than in the past meticulousr absorption position learning functionality, the responsiveness when making suction nozzle approach element uprises, and produces the site error that suction nozzle positions while stopping by SERVO CONTROL and becomes large bad phenomenon.
That is, if responsiveness uprises, in the location action process, in the impact that micro-vibration that first-class mechanism partly occurs etc. is installed, become large, reach correct positioning states at this micro-vibration complete stability before, suction nozzle is connected to element and carries out element absorption.And, because of in this micro-vibration, under unsteady state, complete the settling position error that produces of location in each absorption action with different position deviation amount generations, so absorption position study can not normally play a role, even increase action frequency, also be difficult to converge to correct absorption position.So, there is following problem in existing element fixing apparatus: along with the miniaturization of the element as manipulating object and the high speed of responsiveness, and be difficult to realize the convergence to correct absorption position based on the absorption position learning functionality.
Therefore, the object of the present invention is to provide a kind of element fixing apparatus and component mounting method, even in the situation that using fine element as object and the responsiveness high speed also can normally be brought into play the absorption position learning functionality.
Element fixing apparatus of the present invention, the supply position of component feeding extremely being stipulated by the component feeding unit, make the suction nozzle that is arranged at mounting head move to the element absorption position, absorption keeps and takes out the described element be supplied to, by component recognition unit, the absorption hold mode of the described element that is removed is identified, after above a series of element takes out action, this element is transferred and is equipped on the installation site on substrate, described element fixing apparatus possesses: driving mechanism is installed, the horizontal drive shaft that at least possesses the lift drive shaft that makes described suction nozzle lifting and suction nozzle is moved horizontally together with mounting head, the pattern switching part, the pattern that to be stipulated the velocity mode of the responsiveness of described lift drive shaft and horizontal drive shaft is being switched between pattern and low speed pattern usually, described common pattern is the pattern that the mode that shortens within the bounds of possibility the operate time of the mounting head when will usually move is set, described low speed pattern is that the responsiveness of the part when at least making suction nozzle approach described element absorption position in a series of action is set as than the low pattern of responsiveness in described common pattern, state-detection section, whether the state that detects this element fixing apparatus meets predefined Status Change state, and control part, judge the state of the position deviation of described element according to the recognition result produced by described component recognition unit, and control described installation driving mechanism and pattern switching part according to the testing result produced by described state-detection section, when described control part detects described Status Change state in the described a series of element of carrying out according to described common pattern takes out action, by described pattern switching part, pattern is switched to the low speed pattern, and proofread and correct described element absorption position according to the state of described position deviation, in the time of in the allowed band of state in regulation of the position deviation of the described element in the described a series of element taking-up action of carrying out after switching to described low speed pattern, by described pattern switching part, pattern is switched to common pattern.
Component mounting method of the present invention, based on element fixing apparatus, in described element fixing apparatus, the supply position of component feeding extremely being stipulated by the component feeding unit, make the suction nozzle that is arranged at mounting head move to the element absorption position, absorption keeps and takes out the described element be supplied to, by component recognition unit, the absorption hold mode of the described element that is removed is identified, after above a series of element takes out action, this element is transferred and is equipped on the mounting points on substrate, described element fixing apparatus possesses: driving mechanism is installed, the horizontal drive shaft that at least possesses the lift drive shaft that makes described suction nozzle lifting and suction nozzle is moved horizontally together with mounting head, the pattern switching part, the pattern that to be stipulated the velocity mode of the responsiveness of described lift drive shaft and horizontal drive shaft is being switched between pattern and low speed pattern usually, described common pattern is the pattern that the mode that shortens within the bounds of possibility the operate time of the mounting head when will usually move is set, described low speed pattern is that the responsiveness of the part when at least making suction nozzle approach described element absorption position in a series of action is set as than the low pattern of responsiveness in described common pattern, state-detection section, whether the state that detects this element fixing apparatus meets predefined Status Change state, and control part, judge the state of the position deviation of described element according to the recognition result produced by described component recognition unit, control described installation driving mechanism and pattern switching part according to the testing result produced by described state-detection section, in described component mounting method, while in the described a series of element of carrying out according to described common pattern takes out action, detecting described Status Change state, by described pattern switching part, pattern is switched to the low speed pattern, and proofread and correct described element absorption position according to the state of described position deviation, in the time of in the allowed band of state in regulation of the position deviation of the element in the described a series of element taking-up action of carrying out after switching to described low speed pattern, by described pattern switching part, pattern is switched to common pattern.
The invention effect
According to the present invention, the pattern that the velocity mode of the responsiveness of the lift drive shaft to making the suction nozzle lifting and the horizontal drive shaft that suction nozzle is moved horizontally together with mounting head can be stipulated is being switched between pattern and low speed pattern usually, described common pattern is the pattern that the mode so that shortened operate time is within the bounds of possibility set, described low speed pattern is that responsiveness is set as to the pattern lower than common pattern, while in a series of element according to pattern is carried out usually takes out action, detecting the Status Change state, by the pattern switching part, pattern is switched to the low speed pattern, and carry out the correcting element absorption position according to the state of position deviation, in the time of in the allowed band of state in regulation of the position deviation of the element in a series of element taking-up action of carrying out after switching to the low speed pattern, by the pattern switching part, pattern is switched to common pattern, thus, even in the situation that using fine element as object and the responsiveness high speed also can make the absorption position learning functionality normally bring into play.
The accompanying drawing explanation
Fig. 1 is the vertical view of the element fixing apparatus of one embodiment of the present invention.
Fig. 2 is the partial section of the element fixing apparatus of one embodiment of the present invention.
Fig. 3 is the structure key diagram of the tape feeder of one embodiment of the present invention.
Fig. 4 means the block diagram of structure of control system of the element fixing apparatus of one embodiment of the present invention.
Fig. 5 is the key diagram that the absorption position deviation of the electronic component in the element fixing apparatus of one embodiment of the present invention detects.
Fig. 6 is the key diagram of the pattern (pattern usually) of the mounting head in the element fixing apparatus of one embodiment of the present invention.
Fig. 7 is the key diagram of the pattern (the first low speed pattern) of the mounting head in the element fixing apparatus of one embodiment of the present invention.
Fig. 8 is the key diagram of the pattern (the second low speed pattern) of the mounting head in the element fixing apparatus of one embodiment of the present invention.
Fig. 9 means the flow chart that the absorption position offset correction based on suction nozzle in the component mounting method of one embodiment of the present invention is processed.
Figure 10 means the flow chart that the absorption position offset correction based on suction nozzle in the component mounting method of one embodiment of the present invention is processed.
Reference numeral
1 element fixing apparatus
3 substrates
4 component feeding sections
5 tape feeders
6 component recognition cameras
9 mounting heads
The 9a suction nozzle
10 board-recognition camera
12 install driving mechanism
16 electronic components
Embodiment
Then, with reference to accompanying drawing, embodiments of the present invention are described.At first, with reference to Fig. 1, Fig. 2, the structure of element fixing apparatus 1 is described.In addition, Fig. 2 has meaned the A-A cross section in Fig. 1 partly.The central authorities of base station 1a in Fig. 1, dispose substrate conveying mechanism 2 along directions X (board carrying direction).Substrate conveying mechanism 2 is carried the substrate 3 of the object of the element installation exercise based on this element fixing apparatus 1 from upstream side unit feeding conduct along directions X, this substrate 3 is positioned to element installation exercise position.Dispose component feeding section 4 in the both sides of substrate conveying mechanism 2, in each component feeding section 4, be disposed with a plurality of tape feeders 5 as the component feeding unit.Tape feeder 5 has by keeping, as the carrier band of the electronic component (element) of mounting object, carrying out the spacing feeding, and electronic component is supplied to the function of element absorption position of the suction nozzle 9a of the mounting head 9 based on the following describes.
The end of a side of directions X on base station 1a upper surface, dispose the Y-axis travelling table 7 that possesses linear driving mechanism, on Y-axis travelling table 7, along Y-direction, moves and be combined with freely two X-axis travelling tables 8 that possess equally linear driving mechanism.On two X-axis travelling tables 8, move mounting head 9 is installed freely along directions X respectively.Mounting head 9 is the multi-type heads that possess a plurality of holding heads, in the bottom of each holding head, as shown in Figure 2, absorption is installed and keeps electronic component the suction nozzle 9a of lifting individually.
By driving Y-axis travelling table 7, X-axis travelling table 8, mounting head 9 moves along directions X, Y-direction.Thus, in two mounting heads 9, take out electronic component 16(with reference to Fig. 3 by suction nozzle 9a from the element absorption position of the tape feeder 5 of each self-corresponding component feeding section 4), this electronic component 16 is transferred to the mounting points that is equipped on the substrate 3 be positioned on substrate conveying mechanism 2.Y-axis travelling table 7, X-axis travelling table 8 and mounting head 9 form mounting head 9 by making to keep electronic component 16 and move and electronic component 16 is moved to the installation driving mechanism 12 that is equipped on substrate 3.That is, the structure that driving mechanism 12 is the horizontal drive shaft that at least possesses the lift drive shaft that makes suction nozzle 9a lifting and suction nozzle 9a is moved horizontally together with mounting head 9 is installed.
Between the substrate conveying mechanism 2 of component feeding section 4 and correspondence, dispose component recognition camera 6.When the mounting head 9 from component feeding section 4 takes out electronic component 16 moves above component recognition camera 6,6 pairs, component recognition camera is held in the electronic component 16 of the state of mounting head 9 and is taken and identify.On mounting head 9, be equipped with the lower face side that is positioned at X-axis travelling table 8 and respectively with mounting head 9 mobile board-recognition camera 10 integratedly.By mounting head 9, move, board-recognition camera 10 moves to the top of the substrate 3 be positioned on substrate conveying mechanism 2, and substrate 3 is taken and identified.In the installation action of the element to substrate 3 based on mounting head 9, add the recognition result of 6 pairs of electronic components 16 of component recognition camera and the substrate recognition result based on board-recognition camera 10 to carry out mounting position correcting.
; element fixing apparatus 1 has following function: by the component feeding unit, electronic component 16 is supplied to the supply position of regulation; make the suction nozzle 9a that is arranged at mounting head 9 move to the element absorption position; absorption keeps and takes out the electronic component 16 be supplied to; absorption hold mode by the 6 pairs of electronic components that are removed 16 of component recognition camera as component recognition unit is identified; after above a series of element takes out action, this electronic component 16 is transferred and is equipped on the mounting points on substrate 3.
As shown in Figure 2, be provided with in component feeding section 4 chassis 11 that the state of a plurality of tape feeders 5 has been installed in advance on loader pedestal 11a.With respect to the fixed pedestal 1b arranged on base station 1a, by clamp system 11b, loader pedestal 11a is clamped, thus in the fixing position of chassis 11 of component feeding section 4.Maintain supply spool 11c on chassis 11, this supply spool 11c takes in the carrier band 15 that maintains electronic component with reeling condition.The carrier band 15 of drawing from supply spool 11c carries out spacing by tape feeder 5 and is fed to the take-off location based on suction nozzle 9a.
Then, with reference to Fig. 3, structure and the function of tape feeder 5 are described.As shown in Figure 3, tape feeder 5 reaches for possessing main part 5a the structure of protruding the installation portion 5b of setting from the lower surface of main part 5a downwards.At the lower surface that makes main part 5a, along loader pedestal 11a, install under the state of tape feeder 5, the connecting portion 5c and the loader pedestal 11a that on installation portion 5b, arrange are chimeric.Thus, tape feeder 5 is fixedly installed in component feeding section 4, and tape feeder 5 is electrically connected to the control part 20 of element fixing apparatus 1.
In the inside of main part 5a, be provided with continuously band travel path 5d from the rearward end of main part 5a to leading section, this draws and is taken into the carrier band 15 in main part 5a with travel path 5d guiding from supply spool 11c.In the element fixing apparatus 1 shown in present embodiment, adopted connecting method, the beginning section of the second carrier band 15B that the seam section J of described connecting method by having used splicing tpae reinstalls when the tail portion of mounted the first carrier band 15A in tape feeder 5 and element are finished engages, thereby can not produce interruption because of the replacing of supply spool 11c, supply with carrier band 15 to tape feeder 5 constantly.
; in the element fixing apparatus 1 shown in present embodiment; form following mode: the carrier band 15 that will maintain electronic component 16 is installed on the tape feeder 5 of arranging in component feeding section 4; repeatedly carry out the splicing operation the second carrier band 15B of mounted the first carrier band 15A in tape feeder 5 and supply again engaged by splicing tpae; and carrier band 15 is carried out to the spacing feeding, thereby take out and be supplied to the electronic component 16 of take-off location and electronic component 16 is installed on to substrate 3 by mounting head 9.
At main part 5a, be built-in with for carrier band 15 being carried out to the band feeding section 17 of spacing feeding.With feeding section 17 possess sprocket wheel 13 to the leading section setting with travel path 5d be rotated driving with feeding motor 19 and control the loader control part 18 with feeding motor 19.At tape feeder 5, be installed under the state of loader pedestal 11a, loader control part 18 is connected with control part 20.
Be provided with the feeding pin 13a chimeric with feeding hole 15d with determining deviation on sprocket wheel 13, at these feeding pins, 13a is sticked under the state of feeding hole 15d, by rotating band feeding motor 19, makes sprocket wheel 13 intermittent rotaries, and carrier band 15 is the feeding of side spacing downstream.The nearby side of sprocket wheel 13 for the suction nozzle 9a by mounting head 9 from element resettlement section 15b vacuum suction and take out the element absorption position of electronic component 16.
The upper surface side of main part 5a sprocket wheel 13 near disposes the pressing component 14 of pressing and guide carrier band 15 from upper surface side.Be provided with accordingly absorption peristome 14a with the take-off location based on suction nozzle 9a on pressing component 14.The upstream extremity of absorption peristome 14a is for peeling off the heading tape stripping portion 14b of heading tape 15e.; in the process of advancing below pressing component 14 at carrier band 15; make heading tape 15e around heading tape stripping portion 14b upstream side draw; thereby the upstream side heading tape 15e of take-off location from base band 15a peel off and upstream side turn back, and be fed in the band recoverer arranged in main part 5a, reclaimed.Thus, the electronic component 16 in the 15b of element resettlement section exposes upward in absorption peristome 14a, the state that the element in carrying out the suction nozzle 9a based on mounting head 9 takes out.
In the present embodiment, because the electronic component 16 as manipulating object comprises fine element, so that the relative absorption position departure allowed in the action of absorption when element takes out is compared with common element is little, require higher aligning accuracy.Therefore, adopted the absorption position departure produced when detecting the taking-up of the electronic component 16 based on mounting head 9 and proofreaied and correct successively the absorption position mode of learning that makes the absorption position departure minimum.And, in the present embodiment, responsiveness when in order suitably to control, to make the approaching absorption peristome 14a of mounting head 9 and making suction nozzle 9a arrive the element absorption position, prepared a plurality of patterns in advance, according to the device operating condition, to select these patterns.
Then, with reference to Fig. 4, the structure of control system is described.In Fig. 4, control part 20, for processing arithmetic unit, by carrying out the various programs in storage part 21 storages, is controlled the each several part the following describes, and makes each several part carry out operation action and the various processing based on element fixing apparatus 1.When the control processing of carrying out based on control part 20, with reference to the installation data 22 in storage part 21 storages, pattern data 23, position deviation allowed band data 24, state definition data 25, absorption position learning data 26.
The data that position deviation allowed band data 24 are stipulated for the suction nozzle 9a to allowing by suction nozzle 9a vacuum suction and while taking out electronic component 16 and the relative position deviation amount between electronic component 16, stipulated by the element center of electronic component 16 and the position deviation amount between suction nozzle 9aZui center.State definition data 25 are to distinguish the definition data of the state of element fixing apparatus 1 from specific viewpoint, at this, the variation of the possibility impacted according to the element absorption position deviation produced to by suction nozzle 9a vacuum suction electronic component 16 time have or not to come the definition status change.
For example, after just starting of device, arrive through till the stipulated time, mechanism action is unstable.And, in the situation that reinstall tape feeder 5 in component feeding section 4, because of the change of the machine error producing component absorption position of loader.And, in tape feeder 5, if carry out in advance, the splicing operation that engaged of follow-up carrier band 15, can not avoid the generation of the element absorption position that caused by bonding error.Therefore, in the present embodiment, according to the execution of activity as described above, be defined as Status Change, by having or not of state-detection section's 31 detected states changes described later.Absorption position learning data 26 is learnt also the data of the element absorption position of renewal successively for the absorption position study section 29 by the following describes.
Mechanism's drive division 27 is controlled by control part 20, and substrate conveying mechanism 2, installation driving mechanism 12 are driven.Driving mechanism 12 is installed and is comprised horizontal drive shaft 12a, lift drive shaft 12b, θ driving shaft 12c, take out in action at the element based on mounting head 9, with reference to aforesaid pattern data 23.28 pairs of photographed datas of being obtained by component recognition camera 6, board-recognition camera 10 of identifying processing section carry out identifying processing.The photographed data of the electronic component 16 by the state to that obtain by component recognition camera 6, as to be held in suction nozzle 9a carries out identifying processing, can detecting element absorption position deviation state (with reference to Fig. 5).And, carry out identifying processing by the photographed data of the substrate 3 to being obtained by board-recognition camera 10, detect the position deviation of the mounting points of substrate 3.
Absorption position study section 29 is according to being handled as follows by identifying processing section 28 detected absorption position deviation state: it is the correct moving target position of suction nozzle 9a that study is also upgraded for by suction nozzle 9a, correctly adsorbing the suitable element absorption position that keeps electronic component 16 successively.Element absorption position after renewal is stored in storage part 21 as absorption position learning data 26.Pattern switching part 30 is by being controlled by control part 20 and taking out in action and carry out in the processing of switching pattern data 23 between pattern 23a and low speed pattern 23b usually at the element based on mounting head 9.
Whether the state that state-detection section 31 carries out detecting element erecting device 1 meets the processing that the state that pre-defines and be stored in storage part 21 defines data 25.That is the combination of the various signals that, send according to the input signal from guidance panel, timer of being disposed at the transducer of mechanism's each several part and being built in control part 20 etc. carrys out the state of judgment component erecting device 1.In said structure, control part 20 according to the recognition result based on identifying processing section 28 judge the state of the position deviation of electronic component 16 be the element center of electronic component 16 and the position deviation amount between suction nozzle 9aZui center whether in allowed band, and control and driving mechanism 12 be installed and pattern switching part 30 is optimized the processing that element takes out action.
And, in this is processed, when the state of control part 20 position deviation of electronic component 16 in a series of element according to pattern 23a carries out usually takes out action exceeds the regulation allowed band of position deviation allowed band data 24 defineds, by pattern switching part 30, pattern is switched to low speed pattern 23b, and carry out the correcting element absorption position by absorption position study section 29 according to the state of position deviation.Then, in the time of in the regulation allowed band of state in position deviation allowed band data 24 defineds of the position deviation of the electronic component 16 in a series of element taking-up action of carrying out after switching to low speed pattern 23b, be judged as operate condition stable, by pattern switching part 30, pattern switched to common pattern 23a.
Then, with reference to Fig. 5, the component recognition based on component recognition camera 6 is described.In the element installation action based on mounting head 9, as shown in Fig. 5 (a), made the scanning motion that has kept the mounting head 9 of electronic component 16 to move along prescribed direction by suction nozzle 9a absorption above component recognition camera 6.Thus, obtain the image of the electronic component 16 that adsorbs the state that is held in suction nozzle 9a.Then, by by the 28(of identifying processing section with reference to Fig. 4) this image is carried out to identifying processing, as shown in the identification picture 6a of Fig. 5 (b), the absorption position departure of detected electrons element 16.
; in identification picture 6a; the suction nozzle center NC of the center of the element center P C of the center of identification expression electronic component 16, expression suction nozzle 9a, absorption position departure Δ X, Δ Y, the Δ θ of the position deviation of the directions X between detection expression element center P C and suction nozzle center NC, Y-direction, θ direction.In the present embodiment, when this absorption position departure exceeds predefined allowed band, be judged as and mounting head 9 moved and the setting of target location element absorption position while making suction nozzle 9a approach electronic component 16 is inappropriate, be optimized as described above the processing that element takes out action.
Then, with reference to Fig. 6～Fig. 8, the details of pattern data 23 is described.At first, the common pattern 23a that the mode that Fig. 6 means to shorten within the bounds of possibility the operate time of the mounting head 9 when will usually move is set.In common pattern 23a, for the element absorption position Bing Shizui center that suction nozzle 9a is moved within the extremely short time electronic component 16 in the 15b of element resettlement section is adsorbed consistent with the element absorption position, as shown in Figure 6 (a), adopted and made down maneuver and move horizontally action superpose and make suction nozzle 9a describe the arcuate movement M1 of circular-arc track.
And, in arcuate movement M1, shortening for operate time, as shown in Figure 6 (b), velocity mode as horizontal drive shaft 12a, lift drive shaft 12b, adopted the velocity mode that in the scope to allow, the Vxy1 of hypervelocity, Vz1 is made as to upper limit stabilized speed in servo-actuating device.By the common pattern 23a of formation like this, can realize that element takes out the shortening of the operate time of action, expects the raising of productivity ratio.Yet, in common pattern 23a, produced the unstable unfavorable condition caused of the stop position precision inevitably produced by the high speed along with action.
Fig. 6 (c), (d) are illustrated in the unfavorable condition produced in above-mentioned common pattern 23a.That is, if responsiveness uprises, there is following situation: in the location action process, the micro-vibration complete stability occurred on mechanism's part and, before reaching correct positioning states, suction nozzle 9a is connected to electronic component 16 and carries out element absorption.Because of under this unsteady state, complete the settling position error that produces of location in each absorption action with different position deviation amount generations.For example, in the example shown in Fig. 6 (c), the ，Zui center is carried out element absorption with respect to the element absorption position under the state of the front side occurrence positions deviation with on the feeding direction.In addition, in the example shown in Fig. 6 (d), on the contrary, under the state of mouth center back side side occurrence positions deviation, carry out element absorption.And, for the position deviation caused by this settling position error, absorption position study can not normally play a role, so be difficult to avoid following unfavorable condition: even increase the absorption action frequency, also be difficult to converge to correct element absorption position.
Follow so that this in the unfavorable condition of the high speed of responsiveness and be reduced to purpose as far as possible, in the present embodiment, set the low speed pattern 23b that suppresses lowlyer by the upper limit stabilized speed in velocity mode.; as shown in Figure 7 (a); in low speed pattern 23b(the first low speed pattern) in; make suction nozzle 9a describe circular-arc track Er Jiangzui center to being arranged in the arcuate movement M2 of element absorption position; as shown in Figure 7 (b) shows; as the velocity mode of horizontal drive shaft 12a, lift drive shaft 12b, adopted the velocity mode that to take than Vxy2, the Vz2 of the Vxy1 in common pattern 23a, Vz1 low speed be upper limit stabilized speed.Low speed pattern 23b according to formation like this, although element takes out and compares common pattern 23a delay the operate time of action, but can under the micro-vibration-stable state when suction nozzle 9a stops, completing location, so can utilize fully the absorption position learning functionality, guarantee high absorption position precision.
And, as low speed pattern 23b(the second low speed pattern), as shown in Figure 8, also can not adopt arcuate movement, and use the pattern that action separates with down maneuver that moves horizontally of suction nozzle 9a.That is move horizontally action M3, from the state shown in Fig. 8 (a), execution graph 8(b), suction nozzle 9a moves to the top of the electronic component 16 of element resettlement section 15b.Micro-vibration while then, keeping this height and position to stop to suction nozzle 9a is stablized the Er Zui center correctly to till being positioned at the element absorption position.Thus, as shown in Fig. 8 (c), suction nozzle 9aJiang Zui center is correctly to being positioned at the element absorption position, subsequently as shown in Fig. 8 (d), carries out the down maneuver M4 till the absorption height that suction nozzle 9a is dropped to electronic component 16 is adsorbed.Equally, according to the low speed pattern 23b of formation like this, although element takes out, compare common pattern 23a delay the operate time of action, can guarantee high absorption position precision.
That is, low speed pattern 23b(the first low speed pattern, the second low speed pattern shown in Fig. 7, Fig. 8) be following manner of execution: the responsiveness of part when a series of action that will take out for the element based on mounting head 9 at least makes suction nozzle 9a approach the element absorption position is set as lower than the responsiveness in common pattern 23a.
Then, component mounting method element fixing apparatus 1 by said structure carried out as follows according to the flow process of Fig. 9, Figure 10 describes: by the suction nozzle 9a absorption that is arranged at mounting head 9, keep and take out the electronic component 16 of the supply position of component feeding extremely being stipulated by the component feeding unit, absorption hold mode by 6 pairs of electronic components that are removed 16 of component recognition camera is identified, after above a series of element takes out action, this electronic component 16 is transferred and is equipped on the mounting points on substrate 3.
At first, with reference to Fig. 9, the testing result according to state-detection section 31 being controlled to the example that driving mechanism 12 and pattern switching part 30 are installed describes.In Fig. 9, if start the running (ST1) of element fixing apparatus 1, by state-detection section 31 with reference to state definition data 25, the having or not of judgment means state (state) change (ST2).At this, if be judged as change, the pattern of by 30 switchings of pattern switching part, driving mechanism 12 being installed, transfer to low speed pattern 23b(ST3).Subsequently, under this state, make mounting head 9 move to the element absorption position of tape feeder 5 and carry out the element absorption action (ST4) based on suction nozzle 9a.
Then, make to keep the mounting head 9 of electronic component 16 to move to the top of component recognition camera 6 and carry out the element shooting, thereby obtain the component recognition absorption position departure (ST5) shown in Fig. 6, make subsequently mounting head 9 move and executive component installation action (ST6) on substrate 3.Then, by the absorption position learning functionality of absorption position study section 29, carry out absorption position according to the absorption position departure obtained at (ST5) and proofread and correct (ST7).Proofreading and correct result upgrades and is stored in storage part 21 as absorption position learning data 26.
At this, judge that correcting value is the state whether (ST8) in the regulation allowed band in position deviation allowed band data 24 defineds of the position deviation of electronic component 16, if in allowed band, the pattern of then confirming this moment is common pattern 23a or low speed pattern 23b(ST9).At this, if in the low speed action, by pattern switching part 30 switching patterns, return to common pattern 23a(ST10), then turn back to (ST2) and continue to carry out same thereafter action and process.And, in the situation that be not that low speed pattern 23b turns back to (ST2) too (ST9).
And, in the situation that the state of confirming as position deviation in (ST8) is in allowed band, the pattern of confirming too this moment is common pattern 23a or low speed pattern 23b(ST11).Then, if in the low speed action, turn back to (ST4) and continue executive component absorption action action afterwards and process.And, in the situation that, not in the low speed action, turn back to (ST3) and pattern is switched to low speed pattern 23b, then continue to carry out same action and process.
, in the component mounting method shown in Fig. 9, the a series of element of carrying out according to common pattern 23a takes out in action, while by state-detection section 31, detecting the defined Status Change state of state definition data 25, by pattern switching part 30, pattern is switched to low speed pattern 23b, and carry out the correcting element absorption position according to the state of position deviation, in the time of in the allowed band of state in regulation of the position deviation of the electronic component 16 in a series of element taking-up action of carrying out after switching to low speed pattern 23b, by pattern switching part 30, pattern is switched to common pattern 23a.
Controlling the example of driving mechanism 12 and pattern switching part 30 being installed and being transferred to low speed pattern 23b when the state that then, with reference to Figure 10, element is taken out to the position deviation of electronic component 16 in action exceeds the allowed band of regulation describes.At this, continue executive component taking-up action in common pattern 23a during, transfer to for the above reasons low speed pattern 23b.That is, in Figure 10, at first, make mounting head 9 move to the element absorption position of tape feeder 5, carry out the element absorption action (ST12) based on suction nozzle 9a.
Then, make to keep the mounting head 9 of electronic component 16 to move to the top of component recognition camera 6 and carry out the element shooting, thereby obtain the component recognition absorption position departure (ST13) shown in Fig. 6, whether the judgment component center in allowed band subsequently, judges position deviation amount whether (ST14) in the regulation allowed band in position deviation allowed band data 24 defineds.At this, if in allowed band, make mounting head 9 move and executive component installation action (ST15) on substrate 3.Then, by the absorption position learning functionality of absorption position study section 29, carry out absorption position according to the absorption position departure obtained at (ST13) and proofread and correct (ST16).Proofreading and correct result upgrades and is stored in storage part 21 as absorption position learning data 26.
In addition, in (ST14) the element center not in allowed band and position deviation amount while exceeding the allowed band of position deviation allowed band data 24 defineds is transferred to low speed pattern 23b(ST17 by pattern switching part 30 switching patterns).And, then, mounting head 9 is moved to the discarded position of the element of regulation, will exceed the electronic component 16 that kept by suction nozzle 9a under the position deviation state of allowed band as bad element discarded (ST18).
Then, by the absorption position learning functionality of absorption position study section 29, carry out absorption position according to the absorption position departure obtained at (ST13) and proofread and correct (ST19).Proofreading and correct result upgrades and is stored in storage part 21 as absorption position learning data 26.Then, in low speed pattern 23b, executive component takes out action.That is, make mounting head 9 move to the element absorption position of tape feeder 5, carry out the element absorption action (ST20) based on suction nozzle 9a.
Then, made to keep the mounting head 9 of electronic component 16 to move to the top of component recognition camera 6 and carry out the element shooting, thereby obtain the component recognition absorption position departure (ST21) shown in Fig. 6, whether the judgment component center in allowed band subsequently, judges position deviation amount whether (ST22) in the regulation allowed band in position deviation allowed band data 24 defineds.At this, if in allowed band, be judged as according to proofreading and correct and correctly set the element absorption position, return to common pattern 23a(ST23 by pattern switching part 30 switching patterns), then, repeatedly carrying out (ST15) action afterwards processes.In addition, when (ST22) meta offset residual quantity exceeds the regulation allowed band of position deviation allowed band data 24 defineds, turn back to (ST18) and repeatedly carry out the discarded absorption position study action afterwards of bad element, until confirm the improvement of absorption position deviation state in (ST22).
, in the component mounting method shown in Figure 10, the a series of element of carrying out according to common pattern 23a takes out in action, when the absorption position deviation state of electronic component 16 exceeds the regulation allowed band of position deviation allowed band data 24 defineds, by pattern switching part 30, pattern is switched to low speed pattern 23b, and carry out the correcting element absorption position according to the state of position deviation, in the time of in the allowed band of state in regulation of the position deviation of the electronic component 16 in a series of element taking-up action of carrying out after switching to low speed pattern 23b, by pattern switching part 30, pattern is switched to common pattern 23a.
As described above, element fixing apparatus shown in present embodiment and component mounting method are configured to, the common pattern 23a that can be set in the mode so that shortened operate time within the bounds of possibility and responsiveness is set as between the low speed pattern 23b lower than common pattern, the pattern that switching is stipulated the velocity mode of the responsiveness of the lift drive shaft 12b that makes suction nozzle 9a lifting and horizontal drive shaft 12a that suction nozzle 9a is moved horizontally together with mounting head 9.
And, in a series of element according to pattern 23a carries out usually takes out action, while by state-detection section 31, detecting the Status Change state pre-defined as state definition data 25, or the state of the position deviation of the electronic component 16 of judging by component recognition is while exceeding the allowed band of regulation, by pattern switching part 30, pattern is switched to low speed pattern 23b, and carry out the correcting element absorption position according to the state of position deviation, in the time of in the allowed band of state in regulation of the position deviation of the element in a series of element taking-up action of carrying out after switching to low speed pattern 23b, by pattern switching part 30, pattern is switched to common pattern 23a.
Thus, make to try one's best and suppress to follow the reduction in the productivity ratio of low speed action according to shortening operate time of low speed pattern 23b running, and lower than common action by needing responsiveness in time period of low speed action to be set as in absorption position study, even in the situation that using fine element as object and the responsiveness high speed also can make the absorption position learning functionality normally bring into play.
Utilizability on industry
Even element fixing apparatus of the present invention and component mounting method have, using fine element as object and the responsiveness high speed also can make the effect of the normal performance of absorption position learning functionality, the element that can be used for being supplied with by the component feeding unit be installed on the element installing area of substrate.
Claims (2)
1. an element fixing apparatus, the supply position of component feeding extremely being stipulated by the component feeding unit, make the suction nozzle that is arranged at mounting head move to the element absorption position, absorption keeps and takes out the described element be supplied to, by component recognition unit, the absorption hold mode of the described element that is removed is identified, after above a series of element takes out action, this element is transferred and is equipped on the installation site on substrate, described element fixing apparatus is characterised in that to possess:
Driving mechanism is installed, the horizontal drive shaft that at least possesses the lift drive shaft that makes described suction nozzle lifting and suction nozzle is moved horizontally together with mounting head;
The pattern switching part, the pattern that to be stipulated the velocity mode of the responsiveness of described lift drive shaft and horizontal drive shaft is being switched between pattern and low speed pattern usually, described common pattern is the pattern that the mode that shortens within the bounds of possibility the operate time of the mounting head when will usually move is set, described low speed pattern is that the responsiveness of the part when at least making suction nozzle approach described element absorption position in a series of action is set as than the low pattern of responsiveness in described common pattern,
State-detection section, whether the state that detects this element fixing apparatus meets predefined Status Change state; And
Control part, judge the state of the position deviation of described element according to the recognition result produced by described component recognition unit, and control described installation driving mechanism and pattern switching part according to the testing result produced by described state-detection section,
When described control part detects described Status Change state in the described a series of element of carrying out according to described common pattern takes out action, by described pattern switching part, pattern is switched to the low speed pattern, and proofread and correct described element absorption position according to the state of described position deviation
In the time of in the allowed band of state in regulation of the position deviation of the described element in the described a series of element taking-up action of carrying out, by described pattern switching part, pattern is switched to common pattern after switching to described low speed pattern.
2. a component mounting method, based on element fixing apparatus, in described element fixing apparatus, by the component feeding unit by component feeding the supply position to regulation, make the suction nozzle that is arranged at mounting head move to the element absorption position, absorption keeps and takes out the described element be supplied to, by component recognition unit, the absorption hold mode of the described element that is removed is identified, after above a series of element takes out action, this element is transferred and is equipped on the mounting points on substrate
Described element fixing apparatus possesses: driving mechanism is installed, the horizontal drive shaft that at least possesses the lift drive shaft that makes described suction nozzle lifting and suction nozzle is moved horizontally together with mounting head, the pattern switching part, the pattern that to be stipulated the velocity mode of the responsiveness of described lift drive shaft and horizontal drive shaft is being switched between pattern and low speed pattern usually, described common pattern is the pattern that the mode that shortens within the bounds of possibility the operate time of the mounting head when will usually move is set, described low speed pattern is that the responsiveness of the part when at least making suction nozzle approach described element absorption position in a series of action is set as than the low pattern of responsiveness in described common pattern, state-detection section, whether the state that detects this element fixing apparatus meets predefined Status Change state, and control part, judge the state of the position deviation of described element according to the recognition result produced by described component recognition unit, control described installation driving mechanism and pattern switching part according to the testing result produced by described state-detection section, described component mounting method is characterised in that
While in the described a series of element of carrying out according to described common pattern takes out action, detecting described Status Change state, by described pattern switching part, pattern is switched to the low speed pattern, and proofread and correct described element absorption position according to the state of described position deviation, in the time of in the allowed band of state in regulation of the position deviation of the element in the described a series of element taking-up action of carrying out, by described pattern switching part, pattern is switched to common pattern after switching to described low speed pattern.
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| Application Number | Priority Date | Filing Date | Title |
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| JP2012-130576 | 2012-06-08 | ||
| JP2012130576A JP5927497B2 (en) | 2012-06-08 | 2012-06-08 | Component mounting apparatus and component mounting method |
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| CN103491762A true CN103491762A (en) | 2014-01-01 |
| CN103491762B CN103491762B (en) | 2017-11-03 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110476496A (en) * | 2017-03-23 | 2019-11-19 | 株式会社富士 | Mounting device and installation method |
| CN112106457A (en) * | 2018-06-08 | 2020-12-18 | 株式会社富士 | Belt feeder |
| CN109076727B (en) * | 2016-04-13 | 2021-03-26 | 株式会社富士 | Mounting device and mounting method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6366190B2 (en) * | 2015-01-30 | 2018-08-01 | ヤマハ発動機株式会社 | Surface mounter, control method |
| JP6998113B2 (en) * | 2016-12-05 | 2022-01-18 | 株式会社Fuji | Electronic component mounting machine |
| US11330751B2 (en) * | 2017-03-31 | 2022-05-10 | Fuji Corporation | Board work machine |
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| CN1942093A (en) * | 2005-09-30 | 2007-04-04 | 株式会社日立高新技术仪器 | Apparatus for installing electronic components |
| JP2009176859A (en) * | 2008-01-23 | 2009-08-06 | Juki Corp | Method and device for mounting component |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5130030B2 (en) * | 2007-12-06 | 2013-01-30 | Ｊｕｋｉ株式会社 | Electronic component mounting device |
| JP5438434B2 (en) * | 2008-08-29 | 2014-03-12 | Ｊｕｋｉ株式会社 | Electronic component mounting equipment |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1942093A (en) * | 2005-09-30 | 2007-04-04 | 株式会社日立高新技术仪器 | Apparatus for installing electronic components |
| JP2009176859A (en) * | 2008-01-23 | 2009-08-06 | Juki Corp | Method and device for mounting component |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109076727B (en) * | 2016-04-13 | 2021-03-26 | 株式会社富士 | Mounting device and mounting method |
| US11039557B2 (en) | 2016-04-13 | 2021-06-15 | Fuji Corporation | Mounting apparatus and mounting method |
| CN110476496A (en) * | 2017-03-23 | 2019-11-19 | 株式会社富士 | Mounting device and installation method |
| CN112106457A (en) * | 2018-06-08 | 2020-12-18 | 株式会社富士 | Belt feeder |
| CN112106457B (en) * | 2018-06-08 | 2022-04-26 | 株式会社富士 | Belt feeder |
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| Publication number | Publication date |
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| JP2013254887A (en) | 2013-12-19 |
| JP5927497B2 (en) | 2016-06-01 |
| CN103491762B (en) | 2017-11-03 |
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