CN103455220A - Method for realizing single-layer multipoint capacitive screen through hop points - Google Patents

Abstract

Disclosed is a method for realizing a single-layer multipoint capacitive screen through hop points. The method includes the following steps: (1), printing silver glue points on the back of an ITO (indium tin oxide) layer for one time; (2), drying printing ink of the silver glue points; (3), performing printing insulation; (4), drying insulation printing ink, and respectively printing for two times and drying for two times; (5), printing line silver glue, and merging several passage lines of a lower half into a leading-out binding position; (6), drying silver printing ink; (7), sticking a protective film and sending to the next process. The method has the advantages that a design process of single-layer hop points is adopted, so that PAD at the press-fitting end is reduced into 86 passages, and more simplicity and more stability in press-fitting are realized.

Description

Realize the method for individual layer multiple spot capacitance plate by hop

Technical field

The present invention relates to a kind of method that realizes individual layer multiple spot capacitance plate by hop.

Background technology

The capacitance plate of individual layer multiple spot scheme in the market, a lot of producers are because will realize that the individual layer multiple spot carrys out Cost down. but, because the design concept of individual layer multiple spot is limit, much producers all do not realize.Think and need to realize the individual layer multiple spot, just need to accept its many Pin pin pressing, this part is the weakness of producer, is difficult to accomplish that factory's product are stable, and this technical barrier is the threshold that they realize the individual layer multiple spot always.By the design of the hop at FILM/Glass, realize the design description of individual layer multiple point touching.

Summary of the invention

The present invention relates to a kind of method that realizes individual layer multiple spot capacitance plate by hop, traditional implementation is direct outlet of passage of a line, individual layer hop technique is exactly to be merged into the design of a passage by a plurality of passages, thereby can reduce the outlet PIN number of pressing position.

The present invention is achieved in that method step is:

(1) print silver paste points after the ITO layer one time, be convenient to guarantee follow-up printing release's registering tolerance and reduce the height fall between circuit elargol and ITO layer, make silver paste points contact more stable with the circuit elargol;

(2) silver paste points printing ink is dried;

(3) printing insulation, will avoid covering silver point one time a silver paste points place insulation, is convenient to separate conducting between circuit elargol and ITO layer and forms short circuit;

(4) dielectric ink is dried, print respectively twice, dry twice;

(5) printed wire elargol, the port line of the latter half by several be merged into one draw the binding position;

(6) silver-colored printing ink is dried;

(7) pasting protective film is sent into next procedure and is got final product.

Technique effect of the present invention is: 1, the design technology of individual layer hop, the PAD of pressing end reduces into 86 passages, makes the pressing difficulty more simple, firm.2, by after walking wire jumper technique, the PAD width of pressing end increases to 0.4mm by the 0.15mm of normal design, and the increase of pressing area guarantees product function stability and reliability, enhances productivity, the difficulty of yield and binding technique.3, the individual layer hop is that a plurality of passages are merged into a passage appearance.

The accompanying drawing explanation

Fig. 1 is structural representation of the present invention.

The OGS touch screen structure figure that Fig. 2 is condenser type individual layer multiple spot of the present invention.

To be complete RX passage of the present invention intersect the signal comparison diagram with the TX passage to Fig. 3.

PET base material 2, ITO layer 3, insulation course 4, silver paste points 5, circuit elargol in the drawings, 1.

Embodiment

As shown in Figure 1, the structure that the method realizes is that PET base material 1 upper surface connects ITO layer 2, and ITO layer 2 upper surface are connected with insulation course 3, leave one time, space silver paste points 4 on insulation course 3 and are connected with ITO layer 2, silver paste points 4 connection line elargol 5.

Implementation method is that step is:

(1) print silver paste points after the ITO layer one time, be convenient to guarantee follow-up printing release's registering tolerance and reduce the height fall between circuit elargol and ITO layer, make silver paste points contact more stable with the circuit elargol;

(2) silver paste points printing ink is dried;

(3) printing insulation, will avoid covering silver point one time a silver paste points place insulation, is convenient to separate conducting between circuit elargol and ITO layer and forms short circuit;

(4) dielectric ink is dried, print respectively twice, dry twice;

(5) printed wire elargol, the port line of the latter half by several be merged into one draw the binding position;

(6) silver-colored printing ink is dried;

(7) pasting protective film is sent into next procedure and is got final product.

The principles illustrated that mutual appearance individual layer multi-point design of the present invention is realized is as follows:

1) represent the OGS touch-screen of unique condenser type individual layer multiple spot with brand-new crossing elimination design, the implementation method is shown in Fig. 2;

(1) Tx still designs in the mode of whole piece, is to coordinate the Rx design, and TX can be designed to S type or E type etc.. main

If guarantee that TX and RX are cross one another and have enough coupling capacitances to produce.

(2) method for designing of RX is: the Rx(size independent by a plurality of fritters is at 4 ~ 6mm), then at the PCB wiring, establish

Be merged into a complete RX passage in the time of meter.

2. complete RX passage and TX passage intersect the signal comparison diagram, still (a plurality of little RX passages are merged into a complete RX passage (as shown 3):

Normal TX needs two layers of electrode to intersect because of having with the RX cross chart, and neoteric TX and RX cross chart one deck electrode are avoided intersecting.

Remarks: as above scheme, RX1 has a plurality of R1 by the integrated complete RX1 of circuit design,

The design concept of RX2 by that analogy, according to the RX... passage of the size design equity of product.

Summary: for the demand of catering to market, most producer all are that G+F+F multiple spot (mutual capacitance type) capacitance plate, producing, has not only increased production cost and reduced on the contrary production efficiency and profit margin.Contrary individual layer hop technique has not tightly reduced production cost, has also improved production efficiency and yield, so occupy very large space in market competition.

Claims (1)

1. a method that realizes individual layer multiple spot capacitance plate by hop is characterized in that method step is:

(1) print silver paste points after the ITO layer one time, be convenient to guarantee follow-up printing release's registering tolerance and reduce the height fall between circuit elargol and ITO layer, make silver paste points contact more stable with the circuit elargol;

(2) silver paste points printing ink is dried;

(3) printing insulation, will avoid covering silver point one time a silver paste points place insulation, is convenient to separate conducting between circuit elargol and ITO layer and forms short circuit;

(4) dielectric ink is dried, print respectively twice, dry twice;

(5) printed wire elargol, the port line of the latter half by several be merged into one draw the binding position;

(6) silver-colored printing ink is dried;

(7) pasting protective film is sent into next procedure and is got final product.

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