CN103442510A - SMT printing steel plate and manufacturing technology thereof - Google Patents
SMT printing steel plate and manufacturing technology thereof Download PDFInfo
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- CN103442510A CN103442510A CN2013103002362A CN201310300236A CN103442510A CN 103442510 A CN103442510 A CN 103442510A CN 2013103002362 A CN2013103002362 A CN 2013103002362A CN 201310300236 A CN201310300236 A CN 201310300236A CN 103442510 A CN103442510 A CN 103442510A
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Abstract
The invention relates to an SMT printing steel plate and a manufacturing technology of the SMT printing steel plate. Nanometer coatings are arranged on the surface of the printing steel plate and the outer layer of the inner wall of each steel plate hole; the nanometer coatings are made from alkoxy silane materials. The manufacturing technology of the printing steel plate is that a PVD vacuum splattering process is adopted for the printing steel plate, the nanometer coatings are formed on the surface of the printing steel plate and the outer layer of the inner wall of each steel plate hole, wherein the nanometer coatings are made from the alkoxy silane materials. According to the SMT printing steel plate and the manufacturing technology of the SMT printing steel plate, the uneven positions of the wall of each hole of the printing steel plate can be filled flat, and surface hardness and surface tension are improved. Therefore, solder paste is not prone to being left over beside the wall of each hole when being applied. The printing steel plate with the vacuum sputtering nanometer coatings has the advantages that the quality of solder paste applying is improved, the frequency of solder paste applying is increased, the frequency of cleaning is decreased, cleaning is performed free of solvent, productivity is enhanced, the yield is improved, pollution is reduced, energy is saved, and carbon emissions are reduced.
Description
Technical field
The present invention relates to surface installation technique (SMT) field, printed steel plate and the production technology of refering in particular to a kind of SMT here.
Background technology
The PCB packaging technology mainly is divided into two kinds, and surface mount technology (SMT solder) and traditional wave soldering are crossed tin stove (wave solder).No matter surface mount technology (SMT solder) and traditional wave soldering were crossed tin stove (wave solder) and are all used containing chlorine fluorine carbon (CFC) for solvent, scaling powder to be washed off in the past, since cut-off on January 1 in 1996, containing after chloro-fluorocarbon (CFC), wave soldering was crossed tin stove (wave solder) technique by containing chloro-fluorocarbon (CFC), using HCFC (HCFC), washing and disposable instead; But, aspect surface mount technology (SMT solder), surpass 7 one-tenth above dealers and made disposable processing procedure into.
The main technique of SMT technology is, stamp tin cream on the weld pad of PCB after, the SMT part to be placed on tin cream, then is welded in above PCB through high temperature reflux electrode holder SMT part.With dissolving containing chloro-fluorocarbon (CFC) solvent clean, so can not affect solder joint and electrical in the past.But the weldering ability that helps of SMT tin cream can not be too strong in disposable processing procedure, otherwise can increase the surface insulation impedance of two close parts, and the rheology that makes to leak electricity is large, causing whole electronic system can't normal operation, and severe patient may corrode the tin point.So need do surface insulation impedance (SIR) test while using disposable backflow to be welded in SMT.Its method is that tin cream is imprinted on to the IPC-B-25 standard test panel, and through being placed on 85 ℃ after Reflow Soldering, 85% RH and add 50V voltage in climatic chamber observed its impedance, if it is qualified to be greater than 108 Ω after 168 hours.
The activity of dissolving in hence one can see that SMT is used for tin cream can not be too strong, for the active scarce capacity of the dissolving that makes up the SMT technology, the yields that must set about just making disposable SMT technique from other aspects with before containing chloro-fluorocarbon (CFC) clean dissolve the same good.At present, mainly by improving the steel plate quality, increase the yields of disposable SMT processing procedure.
At present the main production method of domestic production steel plate has two kinds of chemical method for etching and laser etching methods, and wherein maximum with chemical method for etching, main cause may be that technology is more ripe, and it is very fast that equipment cheaply reaches throughput rate.Steel plate print request steel plate requires except size is correct, and the requirement of steel plate hole inwall has binomial in addition, and the one, there is no undercutting (undercut), another is that surface roughness is wanted carefully.The steel plate hole inwall do not have undercutting (undercut) and roughness thinner, theory is above to print tin cream on the weld pad of PCB, the shape of its tin cream should be more clear.After Reflow Soldering (reflow), the insulation impedance between two weld pads can be less, if insulation impedance descends, the leakage current of weld pad increases, and may cause electrical functionality to lose efficacy, and this phenomenon shortens more serious under high frequency or because of the distance of weld pad.
In the SMT processing procedure, require the steel plate hole inwall there is no undercutting (undercut), when main reason is printing, undercutting (undercut) can be advanced by the impedance tin cream, while approximately printing 1 to 3 time, the limit of WU cream shape is also very straight, but after the number of times printing reaches more than 3 times, the shape that prints the tin cream that goes down can be unintelligible, simultaneously also can reduce the amount of tin cream, general tin cream shape is unintelligible, and the most obviously can to see the tin cream profile uneven, and this phenomenon easily causes increase or the short circuit of surface insulation impedance between weld pad.So draw between two weld pads with blade, can eliminate surface insulation impedance and short circuit phenomenon, therefore approximately print, need to use for five to six times alcohol or solvent to carry out the surface of steel plate wiping, after printing at the end of the day carry out ultrasonic wave comprehensively clean once.
The steel plate hole inner wall roughness is bad, easily causes the tin cream powder residual, print the shape of tin cream unintelligible, can produce equally lower surface insulation impedance.
Therefore, how to solve steel plate hole inner wall roughness problem, become the key factor that solves surface mount technology (SMT solder) welding quality, become important technical task.
Summary of the invention
The object of the invention is to overcome weak point of the prior art, a kind of lower tin is provided, reduces clean wiping, exempts from printed steel plate and production technology with the SMT of solvent clean.
For achieving the above object, the present invention adopts following technical scheme:
The printed steel plate of a kind of SMT, the surface of described printed steel plate and steel plate hole inwall skin are provided with nano coating.
Described nano coating adopts the alkoxy silane material.
The production technology of described printed steel plate, adopt PVD vacuum splashing and plating technique by described printed steel plate, at surface and the steel plate hole inwall formation nano coating of printed steel plate.
The formation nano-coating material is alkoxy silane.
Its technological process is as follows:
1) printed steel plate is placed in the vacuum splashing and plating machine, carries out surface cleaning, remove printed steel plate surface impurity and attachment;
2) and to surface and the steel plate hole inwall of printed steel plate carry out plasma treatment, to clean and to activate the steel plate hole inwall;
3) carry out silica-treated at the steel plate hole inwall to printed steel plate;
4) inject the alkoxy silane material, at the steel plate hole inwall formation nano coating of printed steel plate.
Beneficial effect of the present invention is: of the present inventionly make hole wall out-of-flatness place of printed steel plate fill, promote case hardness and surface tension, thereby when lower tin cream, tin cream is difficult for remaining in by hole wall, make the printed steel plate of doing the vacuum splashing and plating nano coating, can promote tin number of times under lower tin, increase, reduce and clean, exempt to pollute carbon reduction with solvent clean, increase production capacity, raising yields, minimizing.
Embodiment
Below the invention will be further described:
The present invention makes an explanation to following technical term:
SMT solder-surface mount technology reflow-Reflow Soldering
CFC-is containing chloro-fluorocarbon HCFC-HCFC
PCB-printed circuit board (PCB) undercut-undercutting (offset, little back-off)
PVD is English Physical Vapor Deposition(physical vapour deposition (PVD)) abbreviation, refer under vacuum condition, adopt the arc-discharge technique of low-voltage, large electric current, utilize gas discharge that target is evaporated and make to be evaporated material and gas all ionizes, utilize the acceleration of electric field, make to be evaporated material and product is deposited on workpiece.
The printed steel plate of a kind of SMT, the surface of described printed steel plate and steel plate hole inwall skin are provided with nano coating.
Described nano coating adopts the alkoxy silane material.
The production technology of described printed steel plate, adopt PVD vacuum splashing and plating technique by described printed steel plate, at surface and the steel plate hole inwall formation nano coating of printed steel plate.
The formation nano-coating material is alkoxy silane.
Its technological process is as follows:
1) printed steel plate is placed in the vacuum splashing and plating machine, carries out surface cleaning, remove printed steel plate surface impurity and attachment;
2) and to surface and the steel plate hole inwall of printed steel plate carry out plasma treatment, to clean and to activate the steel plate hole inwall;
3) carry out silica-treated at the steel plate hole inwall to printed steel plate;
4) inject the alkoxy silane material, in the steel plate hole inwall formation of printed steel plate.
Of the present inventionly make hole wall out-of-flatness place of printed steel plate fill, promote case hardness and surface tension, by simple dropper test, drip water and drop in the surface tension of surface of steel plate with test, surface contact angle can reach 115 degree as a result, for technology in existing nano coating the highest.Thereby, when lower tin cream, tin cream is difficult for remaining in by hole wall, makes the printed steel plate of doing the vacuum splashing and plating nano coating, can promotes lower tin, increase lower tin number of times, reduce and clean, exempt from by solvent clean, increase production capacity, the yields that improves.
Experimental results show that, when the present invention is applied in the steel plate printing of using main board for notebook computer, a slice steel plate is about printing 90,000 times useful life, more can reach printing at the printing initial stage and do wiped clean 100 times, sum up 90,000 life-spans on average get off approximately to print 30 left and right do once clean, and then just promote production capacity, so can there be the stickiness of being stained with on the nano coating surface with tin cream, so printing is not being cleaned with the ultrasonic wave board at the end of the day comprehensively.
In addition, nano-coating material, can come off gradually because the print pass increase causes the nano coating surface, prove in actual use, when the alkoxy silane material of this nano coating comes off, can not cause physics or chemical reaction after being heating and curing because of tin cream, any atomizating phenomenon can not arranged on the tin cream surface yet, therefore the raw material of nano coating can not make the product after printing that any variation is arranged, make client not have doubt to the application processing procedure of the disposable printed steel plate of this SMT nanometer, to this technique, can have more confidence.
The more applicable material of technique of the present invention more is widely used in glass, diaphragm, metal, carbon fiber, plastics, pottery, ceramic tile, cement, timber etc., all has the good property filled up, surface tension and hardness to promote.
The above is only to preferred embodiment of the present invention; not scope of the present invention is limited; therefore design under the prerequisite of spirit not breaking away from the present invention; the equivalence that the common engineers and technicians in this area do structure of the present invention, feature and principle changes or decorates, and all should fall in the protection range of the present patent application patent.
Claims (5)
1. the printed steel plate of a SMT, it is characterized in that: the surface of described printed steel plate and steel plate hole inwall skin are provided with nano coating.
2. printed steel plate according to claim 1, is characterized in that: described nano coating employing alkoxy silane material.
3. the production technology of printed steel plate according to claim 1, is characterized in that: described printed steel plate is adopted to PVD vacuum splashing and plating technique, at surface and the steel plate hole inwall formation nano coating of printed steel plate.
4. the production technology of printed steel plate according to claim 3, it is characterized in that: the formation nano-coating material is alkoxy silane.
5. SMT attachment process according to claim 1 and 2, it is characterized in that: its technological process is as follows:
1) printed steel plate is placed in the vacuum splashing and plating machine, carries out surface cleaning, remove printed steel plate surface impurity and attachment;
2) and to surface and the steel plate hole inwall of printed steel plate carry out plasma treatment, to clean and to activate the steel plate hole inwall;
3) carry out silica-treated at the steel plate hole inwall to printed steel plate;
4) inject the alkoxy silane material, at the steel plate hole inwall formation nano coating of printed steel plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013103002362A CN103442510A (en) | 2013-07-17 | 2013-07-17 | SMT printing steel plate and manufacturing technology thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013103002362A CN103442510A (en) | 2013-07-17 | 2013-07-17 | SMT printing steel plate and manufacturing technology thereof |
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| CN103442510A true CN103442510A (en) | 2013-12-11 |
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| CN2013103002362A Pending CN103442510A (en) | 2013-07-17 | 2013-07-17 | SMT printing steel plate and manufacturing technology thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017092674A1 (en) * | 2015-11-30 | 2017-06-08 | Dazzeon Technology Co., Ltd. | Electrical device capable of water-resisting, vapor resistant and electrically conducting in moisture-containing environment and method for making the same |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010502468A (en) * | 2006-09-11 | 2010-01-28 | エンバイオ リミテッド | Surface doping method |
| US20110045238A1 (en) * | 2005-09-22 | 2011-02-24 | Heinrich Zeininger | Printing Template of an SMT Process and Method of Coating It |
| CN102615932A (en) * | 2012-04-06 | 2012-08-01 | 深圳光韵达光电科技股份有限公司 | Metal printing template, manufacturing method of metal printing template and coating solution used in metal printing template |
-
2013
- 2013-07-17 CN CN2013103002362A patent/CN103442510A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110045238A1 (en) * | 2005-09-22 | 2011-02-24 | Heinrich Zeininger | Printing Template of an SMT Process and Method of Coating It |
| JP2010502468A (en) * | 2006-09-11 | 2010-01-28 | エンバイオ リミテッド | Surface doping method |
| CN102615932A (en) * | 2012-04-06 | 2012-08-01 | 深圳光韵达光电科技股份有限公司 | Metal printing template, manufacturing method of metal printing template and coating solution used in metal printing template |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017092674A1 (en) * | 2015-11-30 | 2017-06-08 | Dazzeon Technology Co., Ltd. | Electrical device capable of water-resisting, vapor resistant and electrically conducting in moisture-containing environment and method for making the same |
| US10717881B2 (en) | 2015-11-30 | 2020-07-21 | Dazzeon Technology Co., LTD | Electrical device capable of water-resisting, vapor resistant and electrically conducting in moisture-containing environment and method for making the same |
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Application publication date: 20131211 |