CN103433611B - Vacuum percussion welding packaging device for packaging semiconductor device - Google Patents
Vacuum percussion welding packaging device for packaging semiconductor device Download PDFInfo
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- CN103433611B CN103433611B CN201310376530.1A CN201310376530A CN103433611B CN 103433611 B CN103433611 B CN 103433611B CN 201310376530 A CN201310376530 A CN 201310376530A CN 103433611 B CN103433611 B CN 103433611B
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Abstract
The invention discloses a vacuum percussion welding packaging device for packaging a semiconductor device. The vacuum percussion welding packaging device is composed of an upper electrode, a lower electrode, an upper magnet, a lower magnet, an upper electrode support, an upper outer cover, a lower outer cover, a flange corrugated pipe, an exhaust port and a tube base support all of which are combined to form a small sealing space internally containing a welding device. The vacuum percussion welding packaging device has the technological advantages that vacuum percussion welding packaging can be carried out on the device in a normal-temperature and open-type environment; the size of a cavity for providing a vacuum environment is small, therefore, the energy consumption is low and efficiency is high when vacuumizing is carried out.
Description
Technical field
The present invention relates to a kind of welding equipment, particularly relate to a kind of semiconductor packages vacuum power accumulating sealing assembling device.
Background technology
Packaging technology is the important process during semiconductor devices is produced, and it plays a part very important to the performance of semiconductor devices; For in the sealing packaging technology of semiconductor devices, Vacuum Package is generally acknowledged technological difficulties, due to some characteristics of semiconductor devices self, makes the Vacuum Package of semiconductor devices be difficult to use for reference the vacuum sealing technique of other field.
In prior art, when carrying out Vacuum Package to semiconductor devices, practice widely followed is: welding equipment need configure an airtight vacuumizing case, allows whole encapsulation process carry out in vacuumizing case; This Vacuum Package mode needs large-scale vaccum-pumping equipment to ensure the vacuum in confined space, and for the larger space of volume, temperature control device also will be adopted to regulate temperature when vacuumizing, with auxiliary vacuum pumping, and it is very time-consuming when vacuumizing at every turn, cause production cost higher, and this kind of vacuum power accumulating soldering equipment is expensive.
Summary of the invention
For the problem in background technology, the present invention proposes a kind of semiconductor packages vacuum power accumulating sealing assembling device, involved semiconductor devices comprises pipe cap and base, adopt energy storage to weld encapsulation between pipe cap and base, its innovation is: described vacuum power accumulating sealing assembling device is made up of top electrode, bottom electrode, upper magnet, lower magnet, top electrode bearing, upper outer cover, lower outer cover, flange bellows, exhaust outlet and base bearing; Upper outer cover upper surface is provided with guide through hole, and top electrode holder top is socketed in guide through hole; Top electrode bearing can slide axially along upper outer cover; Flange bellows is arranged between outer cover and top electrode bearing, is tightly connected in the middle part of flange bellows upper end and top electrode bearing, and flange bellows upper end is positioned on the downside of guide through hole, and top electrode bearing bottom is positioned at flange bellows; Flange bellows lower end and upper outer cover lower surface are tightly connected; Top electrode is fixed on top electrode bearing lower surface; Lower outer cover lower surface is provided with electrode mounting hole, be placed in the middle part of bottom electrode in electrode mounting hole, bottom electrode outer wall above electrode mounting hole is socketed with insulating nut, by lower outer cover and bottom electrode, locked (those skilled in the art should be understood that insulating nut, in order to realize vacuum, the lower sealing ring be also provided with between outer cover and bottom electrode for sealing); Upper outer cover and lower outer cover are coaxially arranged; Exhaust outlet is arranged on lower outer cover sidewall; Described top electrode lower end forms welding job face one, and welding job face one is loop configuration, and upper magnet is arranged in loop configuration; Bottom electrode is hollow cylindrical structure, and hollow cylindrical structure upper end forms welding job face two, and base bearing is fixed in bottom electrode, and lower magnet is arranged at base bearing upper end; Lower outer cover upper surface is provided with sealing ring; During welding, the weld of pipe cap and base is between welding job face two and welding job face one.
The operation principle of aforementioned means is: exhaust outlet is connected with vaccum-pumping equipment; Before welding, be in released state between upper outer cover and lower outer cover, meanwhile, flange bellows is in free state, and now, top electrode bearing is in maximum travel position place upwards under the supporting role of flange bellows.During piece installing, pipe cap is shifted near below top electrode, pipe cap absorption is just positioned in the endoporus of top electrode by upper magnet, base is moved to above bottom electrode, now base is just fixed (if base is also with pin by lower magnet absorption, then gap should be set between base holder and bottom electrode, for holding pin); After piece installing completes, outer cover and lower outer cover is allowed to close, now, the space that flange bellows interior and lower cover surround just defines an airtight cavity, then start vaccum-pumping equipment the gas in airtight cavity is extracted out from exhaust outlet, along with the extraction of gas, air pressure in airtight cavity declines gradually, flange bellows is compressed under the effect of atmospheric pressure, top electrode bearing is also along with the compression of flange bellows moves downward (in motion process, guide through hole plays guide effect to top electrode bearing); After vacuum pumping completes, pipe cap and base are fitted mutually under the extruding of upper and lower electrode, now, start the welding operation of stored energy welding equipment, weld pipe cap and base.After welding operation completes, by exhaust outlet, device is exitted, the device welded after opening outer cover, can be taken out.
The benefit of aforementioned means is: the basic goal vacuumized is to ensure that packaging inside is in vacuum state, also the space between pipe cap and base is namely allowed to keep vacuum, if and before vacuum pumping, allow in advance between pipe cap and base and fit, just be difficult to ensure that the vacuum of packaging inside is (because pipe cap and base are generally all provided with the ledge structure for coordinating guiding, if ledge structure coordinates the more tight internal gas that will make is sealed in pipe cap and base, namely encapsulating housing inside is allowed to vacuumize, also must waste time and energy), this is also will be why the reason of welding equipment special configuration one vacuumizing case in prior art, after adopting the present invention program, in vacuum pumping process, distance between pipe cap and base progressively shortens along with the motion of top electrode bearing, when vacuum acquires a certain degree, pipe cap and base just contact with each other, effectively ensure that packaging internal vacuum is consistent with external environment, the volume of airtight cavity is very little, vacuumizes efficiency very high, upper magnet and lower magnet adopt general magnet.After adopting the solution of the present invention, without the need to vacuum power accumulating sealing assembling device entirety is placed in vacuum environment, vacuum power accumulating sealing assembling device can work in normal temperature, open environment, vacuum power accumulating sealing assembling device itself can provide the airtight cavity that a volume is very little, thus the energy ezpenditure reduced when vacuumizing, and vacuum pumping can be made efficiently to complete, both saved energy and in turn ensure that working (machining) efficiency.
In order to avoid causing pipe cap and base to be fitted in advance because of upper magnet and attracting each other of lower magnet, the present invention has also done following improvement: upper magnet is relative with lower magnet homopolarity; After upper magnet is relative with lower magnet homopolarity, under the repulsion effect of upper and lower magnet, certain resistance can be caused to the motion of top electrode, to delay the contact between pipe cap and base, be beneficial to exhaust.
In order to improve the vacuum in encapsulating housing further, the present invention has also done following improvement: described top electrode holder top is provided with external screw thread, external screw thread place is socketed with setscrew nut, and setscrew nut is positioned at outside guide through hole, and setscrew nut external diameter is greater than guide through hole internal diameter.After adopting setscrew nut, the course of work and the aforementioned process of device are slightly different, its difference is: before vacuum pumping, with setscrew nut by locked for the position of top electrode bearing, top electrode bearing can not be moved downward along with air pressure change (basic goal is to ensure that pipe cap and base keep released state), after vacuum pumping completes, unclamp setscrew nut, flange bellows just drives the downward electrode movement of top electrode bearing, now pipe cap and base are just fitted, and can ensure the vacuum between pipe cap and base to greatest extent.
For the ease of taking out packaged device, the present invention has also done following improvement: the suction of described upper magnet is greater than lower magnet.After adopting this to improve, the device welded just can be mentioned by whole under the suction of upper magnet, is convenient to take out.
Picking and placeing for the ease of device, and avoid packaging to be subject to the rigidity of device extrude and be out of shape, the present invention has also done following improvement: be provided with bullet apical organ in described top electrode bearing, described bullet apical organ comprises: top electrode bearing lower surface is provided with blind hole, axially extending bore is provided with in the middle part of top electrode, axially extending bore is communicated with blind hole, axially extending bore inwall is provided with spacing ring, play in the middle part of apical organ and outer wall is provided with the spacing preiection mated with spacing ring, by the block effect of spacing ring to spacing preiection, bullet apical organ is stuck in blind hole by top electrode; Play apical organ to slide axially along blind hole, a spring housing is connected on and plays outside apical organ, and spring upper end contacts with the spring supporting face in blind hole, and lower spring end contacts with spacing preiection upper surface; Spring is in its pre-compressed state; Upper magnet is arranged at the lower end playing apical organ.In vacuum pumping process, play apical organ and can provide certain elastic allowance for the movement of upper magnet, pipe cap upper end is avoided to be extruded distortion, and after being combined with aforesaid upper and lower magnet homopolarity relative plan, playing apical organ can also under the repulsion effect of upper and lower magnet, delay contacting of pipe cap and base further, ensure the effect vacuumized; After welding is good, plays apical organ and the device that weld can be allowed again to expose below pole from power on, be convenient to taking-up.
In order to ensure the centering of top electrode and bottom electrode, the present invention has also done following improvement: be provided with step surface in the middle part of bottom electrode, and the bottom electrode external cylindrical surface above step surface is socketed with guide cylinder.
In order to avoid upper/lower electrode short circuit, preferably, insulation sleeve is provided with in described electrode mounting hole.
Advantageous Effects of the present invention is: in normal temperature, open environment, can carry out vacuum power accumulating welding encapsulation to device, for providing the cavity volume of vacuum environment less, when vacuumizing, energy ezpenditure is low, efficiency is high.
Accompanying drawing explanation
Fig. 1, upper outlet body and lower cover are in apparatus structure schematic diagram during released state;
Fig. 2, upper outlet body and lower cover are in the apparatus structure schematic diagram (in figure, 4 black circles are for airtight sealing ring) during closure state;
In figure, shown in each mark, parts are respectively: setscrew nut 1, upper outer cover 2, lower outer cover 3, base bearing 4, flange bellows 5, top electrode bearing 6, top electrode 7, bottom electrode 8, bullet apical organ 9, exhaust outlet 10, spring 11, guide cylinder 12, upper magnet 14, lower magnet 15, insulation sleeve 16, insulating nut 17, sealing ring 18, pipe cap A, base B.
Detailed description of the invention
A kind of semiconductor packages vacuum power accumulating sealing assembling device, involved semiconductor devices comprises pipe cap A and base B, adopt energy storage to weld encapsulation between pipe cap A and base B, its innovation is: described vacuum power accumulating sealing assembling device is made up of top electrode 7, bottom electrode 8, upper magnet 14, lower magnet 15, top electrode bearing 6, upper outer cover 2, lower outer cover 3, flange bellows 5, exhaust outlet 10 and base bearing 4; Upper outer cover 2 upper surface is provided with guide through hole, and top electrode bearing 6 upper socket is in guide through hole; Top electrode bearing 6 can slide axially along upper outer cover 2; Flange bellows 5 is arranged between outer cover 2 and top electrode bearing 6, is tightly connected in the middle part of flange bellows 5 upper end and top electrode bearing 6, and flange bellows 5 upper end is positioned on the downside of guide through hole, and top electrode bearing 6 bottom is positioned at flange bellows 5; Flange bellows 5 lower end and upper outer cover 2 lower surface are tightly connected; Top electrode 7 is fixed on top electrode bearing 6 lower surface; Lower outer cover 3 lower surface is provided with electrode mounting hole, is placed in electrode mounting hole in the middle part of bottom electrode 8, and bottom electrode 8 outer wall above electrode mounting hole is socketed with insulating nut, insulating nut by lower outer cover 3 and bottom electrode 8 locked; Upper outer cover 2 and lower outer cover 3 are coaxially arranged; Exhaust outlet 10 is arranged on lower outer cover 3 sidewall; Described top electrode 7 lower end forms welding job face one, and welding job face one is loop configuration, and upper magnet 14 is arranged in loop configuration; Bottom electrode 8 is hollow cylindrical structure, and hollow cylindrical structure upper end forms welding job face two, and base bearing 4 is fixed in bottom electrode 8, and lower magnet 15 is arranged at base bearing 4 upper end; Upper magnet 14 is relative with lower magnet 15 homopolarity; Lower outer cover 3 upper surface is provided with sealing ring; During welding, the weld of pipe cap A and base B is between welding job face two and welding job face one.
Further, described top electrode bearing 6 top is provided with external screw thread, and external screw thread place is socketed with setscrew nut 1, and setscrew nut 1 is positioned at outside guide through hole, and setscrew nut 1 external diameter is greater than guide through hole internal diameter.
Further, the suction of described upper magnet 14 is greater than lower magnet 15.
Further, be provided with in described top electrode bearing 6 and play apical organ 9, described bullet apical organ 9 comprises: top electrode bearing 6 lower surface is provided with blind hole, axially extending bore is provided with in the middle part of top electrode 7, axially extending bore is communicated with blind hole, and axially extending bore inwall is provided with spacing ring, plays in the middle part of apical organ 9 and outer wall is provided with the spacing preiection mated with spacing ring, by the block effect of spacing ring to spacing preiection, bullet apical organ 9 is stuck in blind hole by top electrode 7; Play apical organ 9 to slide axially along blind hole, a spring 11 is socketed in and plays outside apical organ 9, and spring 11 upper end contacts with the spring supporting face in blind hole, and spring 11 lower end contacts with spacing preiection upper surface; Spring 11 is in its pre-compressed state; Upper magnet 14 is arranged at the lower end playing apical organ 9.
Further, be provided with step surface in the middle part of bottom electrode 8, bottom electrode 8 external cylindrical surface above step surface is socketed with guide cylinder 12.
Further, insulation sleeve 16 is provided with in described electrode mounting hole.
Claims (6)
1. a semiconductor packages vacuum power accumulating sealing assembling device, involved semiconductor devices comprises pipe cap (A) and base (B), adopt energy storage to weld encapsulation between pipe cap (A) and base (B), it is characterized in that: described vacuum power accumulating sealing assembling device is made up of top electrode (7), bottom electrode (8), upper magnet (14), lower magnet (15), top electrode bearing (6), upper outer cover (2), lower outer cover (3), flange bellows (5), exhaust outlet (10) and base bearing (4);
Upper outer cover (2) upper surface is provided with guide through hole, and top electrode bearing (6) upper socket is in guide through hole; Top electrode bearing (6) can slide axially along upper outer cover (2);
Flange bellows (5) is arranged between outer cover (2) and top electrode bearing (6), flange bellows (5) upper end and top electrode bearing (6) middle part are tightly connected, flange bellows (5) upper end is positioned on the downside of guide through hole, and top electrode bearing (6) bottom is positioned at flange bellows (5); Flange bellows (5) lower end and upper outer cover (2) lower surface are tightly connected; Top electrode (7) is fixed on top electrode bearing (6) lower surface;
Lower outer cover (3) lower surface is provided with electrode mounting hole, bottom electrode (8) middle part be placed in electrode mounting hole, bottom electrode (8) outer wall above electrode mounting hole is socketed with insulating nut, insulating nut by lower outer cover (3) and bottom electrode (8) locked; Upper outer cover (2) and lower outer cover (3) are coaxially arranged; Exhaust outlet (10) is arranged on lower outer cover (3) sidewall;
Described top electrode (7) lower end forms welding job face one, and welding job face one is loop configuration, and upper magnet (14) is arranged in loop configuration; Bottom electrode (8) is hollow cylindrical structure, and hollow cylindrical structure upper end forms welding job face two, and base bearing (4) is fixed in bottom electrode (8), and lower magnet (15) is arranged at base bearing (4) upper end;
Lower outer cover (3) upper surface is provided with sealing ring;
During welding, the weld of pipe cap (A) and base (B) is between welding job face two and welding job face one.
2. semiconductor packages vacuum power accumulating sealing assembling device according to claim 1, is characterized in that: upper magnet (14) is relative with lower magnet (15) homopolarity.
3. semiconductor packages vacuum power accumulating sealing assembling device according to claim 1, it is characterized in that: described top electrode bearing (6) top is provided with external screw thread, external screw thread place is socketed with setscrew nut (1), setscrew nut (1) is positioned at outside guide through hole, and setscrew nut (1) external diameter is greater than guide through hole internal diameter.
4. semiconductor packages vacuum power accumulating sealing assembling device according to claim 1, is characterized in that: the suction of described upper magnet (14) is greater than lower magnet (15).
5. semiconductor packages vacuum power accumulating sealing assembling device according to claim 1, is characterized in that: bottom electrode (8) middle part is provided with step surface, and bottom electrode (8) external cylindrical surface above step surface is socketed with guide cylinder (12).
6. semiconductor packages vacuum power accumulating sealing assembling device according to claim 1, is characterized in that: be provided with insulation sleeve (16) in described electrode mounting hole.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310376530.1A CN103433611B (en) | 2013-08-27 | 2013-08-27 | Vacuum percussion welding packaging device for packaging semiconductor device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310376530.1A CN103433611B (en) | 2013-08-27 | 2013-08-27 | Vacuum percussion welding packaging device for packaging semiconductor device |
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| CN103433611A CN103433611A (en) | 2013-12-11 |
| CN103433611B true CN103433611B (en) | 2015-06-17 |
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| CN104078370B (en) * | 2014-04-25 | 2017-04-19 | 中国振华集团永光电子有限公司 | Method and device for packaging high-frequency low-power transistor |
| CN104141791B (en) * | 2014-07-31 | 2018-06-12 | 上海宝镀真空设备科技有限公司 | A kind of differential enclosed electrode |
| CN108598242B (en) * | 2018-04-19 | 2020-04-14 | 如皋市大昌电子有限公司 | Gallium nitride light-emitting diode and preparation method thereof |
| CN112736639B (en) * | 2020-12-29 | 2023-01-20 | 武汉优恒精密制造有限公司 | TO packaging clamp and packaging process |
| CN112518166B (en) * | 2021-02-10 | 2021-08-03 | 北京中科同志科技股份有限公司 | Packaging method for chip reliability vacuum packaging welding equipment |
| CN115219797B (en) * | 2022-07-27 | 2024-02-27 | 同济大学 | Electrode device and method for measuring dielectric parameters of polymer insulating film under low vacuum |
| CN115365627A (en) * | 2022-08-05 | 2022-11-22 | 云南国钛金属股份有限公司 | Device and method for improving strength of sponge titanium hard bright block die-casting electrode |
| CN116967673B (en) * | 2023-09-20 | 2023-12-19 | 合肥中航天成电子科技有限公司 | Packaging equipment of infrared sensor shell |
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| JP4412661B2 (en) * | 2004-10-15 | 2010-02-10 | 信越化学工業株式会社 | Plasma processing apparatus and plasma processing method |
| CN102380701A (en) * | 2010-09-01 | 2012-03-21 | 天津市天大北洋化工设备有限公司 | Power-frequency pulse resistance spot welder for red copper |
| CN102229022A (en) * | 2011-06-21 | 2011-11-02 | 西安理工大学 | Ultrasonically-assisted metastable alloy rapidly-solidifying welding device and method |
| CN203062081U (en) * | 2012-12-17 | 2013-07-17 | 厦门三优光电股份有限公司 | Seal welding tool |
| CN103008865B (en) * | 2012-12-31 | 2015-02-04 | 天津商科数控设备有限公司 | Process method for pulse width-adjustable AC (Alternating Current)-DC (Direct Current) inverter resistance welding |
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