CN103425307A

CN103425307A - Induced circuit structure of touch panel

Info

Publication number: CN103425307A
Application number: CN2012101576796A
Authority: CN
Inventors: 张祐严; 黄长煌
Original assignee: PSD TECHNOLOGY Co Ltd
Current assignee: PSD TECHNOLOGY Co Ltd
Priority date: 2012-05-18
Filing date: 2012-05-18
Publication date: 2013-12-04

Abstract

The invention discloses an induced circuit structure of a touch panel. The induced circuit structure is formed by setting X-axis carbon beams and Y-axis carbon beams on a transparent substrate provided with a cementing layer, wherein the X-axis carbon beams and the Y-axis carbon beams are mutually staggered. Each X-axis carbon beam and each Y-axis carbon beam are respectively provided with a conductor wire which is covered with an insulating layer. According to the manufacture procedure of the induced circuit, the X-axis carbon beams and the Y-axis carbon beams are staggered and then are directly arranged on the transparent substrate provided with the cementing layer, the cementing layer is solidified by being irradiated by ultraviolet rays, and then the X-axis carbon beams, the Y-axis carbon beams and the transparent substrate are combined into a whole. In the manufacturing process of the induced circuit, the insulated isolation process is not needed, manufacturing steps are simplified, and the manufacturing cost is lowered.

Description

The sensor circuit structure of contact panel

Technical field

The present invention is relevant with contact panel, refers to especially a kind of sensor circuit structure of contact panel.

Background technology

Contact panel (Touch Panel) mainly can be divided into the classifications such as condenser type and resistance-type according to principle of induction, and wherein capacitance type touch-control panel is the control mode of current main flow.

Consult Fig. 1, Fig. 2, capacitance type touch-control panel mainly be take a clear glass as substrate 11, and be provided with the first line layer 12 with a plurality of X-axis induction electrodes 121 that be arranged in parallel and there is the second line layer 13 of a plurality of Y-axis induction electrodes 131 that be arranged in parallel on substrate 11, and each X-axis induction electrode 121 is interlaced with each other with each Y-axis induction electrode 131, forms the induction array that is the checkerboard configuration shape.And, in order to ensure each X-axis induction electrode 121 and each Y-axis induction electrode 131 crossover place normal operations, therefore sentencing an insulation course 14 at each crossover makes its electric insulation, use the electrostatic field utilized in this induction array and change to calculate contacting points position.Certainly, capacitance type touch-control panel more includes other insulation course 15 and ground plane 16.

Yet, with regard to the processing procedure of the sensor circuit of contact panel, form respectively the first line layer 12 of a plurality of X-axis induction electrodes 121 and the second line layer 13 of a plurality of Y-axis induction electrodes 131 on the one side of single transparent substrate 11, because X, Y-axis induction electrode 121,131 are done the matrix arrangement, make each X-axis induction electrode 121 and each Y-axis induction electrode 131 have to intersect overlapping place, therefore isolation processing must be insulated, but the insulation isolation processing will increase fabrication steps, highlight the numerous and diverse defect of sensor circuit processing procedure of contact panel.

In addition, the another kind of processing procedure of the sensor circuit of known contact panel is that sputter has a plurality of X-axis induction electrodes that are linear on substrate, and sputter has and the discontiguous Y-axis induction electrode of X-axis induction electrode line segment between each X-axis induction electrode, be coated with insulation course subsequently on the X-axis induction electrode, and this insulation course is positioned on the path of each Y-axis induction electrode segment link, finally, by sputter, each line segment Y-axis induction electrode is electrically connected again, this kind of processing procedure more highlights the complicated tediously long and defect that cost is high of processing procedure.

Summary of the invention

The technical problem to be solved in the present invention is to provide a kind of sensor circuit structure of contact panel, can simplify fabrication steps, reduces the processing procedure cost, and can promote the sensitivity of touch-control sensing.

For solving the problems of the technologies described above, the invention provides a kind of sensor circuit structure of contact panel, comprise: a transparency carrier, have a use end face and be in reverse to described use end face in conjunction with end face; One cementing layer, be located at described transparency carrier in conjunction with end face; A plurality of X-axis carbon bundles, be set in parallel in describedly in conjunction with end face and cemented by described cementing layer, and each X-axis carbon bundle has the first dielectric film that one first conductor wire and coats described the first conductor wire; A plurality of Y-axis carbon bundles, be set in parallel in describedly in conjunction with end face and staggered and cemented by described cementing layer with each X-axis carbon bundle, and each Y-axis carbon bundle has the second dielectric film that one second conductor wire and coats described the second conductor wire.

Preferably, described cementing layer is a ultraviolet-curing adhesive agent.

Preferably, described the first conductor wire is carbon fiber.

Preferably, described the second conductor wire is carbon fiber.

The present invention mainly is located on the transparency carrier with cementing layer and is formed by interlaced X-axis carbon bundle and Y-axis carbon bundle, and each X-axis carbon bundle and Y-axis carbon bundle respectively have a conductor wire (carbon fiber) and and are insulated layer coating, therefore, sensor circuit can X-axis carbon bundle and Y-axis carbon bundle is staggered on processing procedure after, directly be located on the transparency carrier with cementing layer, finally by irradiation ultraviolet radiation (UV) solidifies cementing layer by X-axis carbon bundle, Y-axis carbon bundle and transparency carrier three are combined into one, sensor circuit is in the process of making, do not need the isolation processing that insulated, having simplified fabrication steps reaches, reduced the processing procedure cost.

The accompanying drawing explanation

Fig. 1 is known contact panel three-dimensional exploded view;

Fig. 2 is the part sectioned view of the sensor circuit of known contact panel;

Fig. 3 is three-dimensional exploded view of the present invention;

Fig. 4 is three-dimensional combination figure of the present invention;

Fig. 5 is the side view of Fig. 4;

Fig. 6 is the side view at another visual angle of Fig. 4;

Fig. 7 is the partial enlarged drawing of the another kind of enforcement state of the present invention, shows that X-axis carbon bundle and Y-axis carbon bundle weave webbed state.

Wherein description of reference numerals is as follows:

Substrate 11 first line layers 12

X-axis induction electrode 121 second line layers 13

Y-axis induction electrode 131

insulation courses

14,15

Ground plane 16

Transparency carrier 20 uses end face 21

In conjunction with end face 22

Cementing layer 30

X-axis carbon bundle 40 first conductor wires 41

The first dielectric film 42

Y-axis carbon bundle 50 second conductor wires 51

The second dielectric film 52

Embodiment

Below in conjunction with accompanying drawing and embodiment, the present invention is further detailed explanation.

Consult Fig. 3, Fig. 4, the sensor circuit structure of a kind of contact panel that the embodiment of the present invention provides, it mainly is comprised of a transparency carrier 20, a cementing layer 30, a plurality of X-axis carbon bundle 40 and a plurality of Y-axis carbon bundle 50.

Transparency carrier 20 have a use end face 21 and be in reverse to use end face 21 in conjunction with end face 22; Described transparency carrier 20 can be glass or transparent polymer sheet material.

Cementing layer 30 be coated on transparency carrier 20 in conjunction with end face 22; Cementing layer 30 in the present embodiment is a ultraviolet-curing adhesive agent.

Consult Fig. 5, each X-axis carbon bundle 40 is set in parallel in conjunction with end face 22 and cemented by cementing layer 30, and each X-axis carbon bundle 40 has the first dielectric film 42 that one first conductor wire 41 and coats the first conductor wire 41; In the present embodiment, this first conductor wire 41 is carbon fiber.

Consult Fig. 6, each Y-axis carbon bundle 50 is set in parallel in conjunction with end face 22 and staggered and cemented by cementing layer 30 with each X-axis carbon bundle 40, and each Y-axis carbon bundle 50 has the second dielectric film 52 that one second conductor wire 51 and coats the second conductor wire 51; In the present embodiment, this second conductor wire 51 is carbon fiber.

Structure and configuration explanation thereof that the above is each main member of the embodiment of the present invention, make the following instructions as for effect of the present invention.

Sensor circuit structure of the present invention mainly is located on the transparency carrier 20 with cementing layer 30 and is formed by interlaced X-axis carbon bundle 40 and Y-axis carbon bundle 50, because X-axis carbon bundle 40 and the conductor wire (carbon fiber) of Y-axis carbon bundle 50 are coated by an insulation course, therefore, after this sensor circuit can interlock X-axis carbon bundle 40 and Y-axis carbon bundle 50 on processing procedure, directly be located on the transparency carrier 20 with cementing layer 30, finally by irradiation ultraviolet radiation (UV) solidifies cementing layer 30 by X-axis carbon bundle 40, Y-axis carbon bundle 50 three are combined into one with transparency carrier 20, complete the sensor circuit structure of contact panel.Therefore, sensor circuit of the present invention, in the process of making, does not need the isolation processing that insulated, and does not more need by sputter process, X-axis carbon bundle 40, Y-axis carbon bundle 50 to be three are combined into one with transparency carrier 20, therefore, really can reach the purpose of simplifying fabrication steps and reducing the processing procedure cost.

It is worth mentioning that, sensor circuit structure of the present invention is in the emission and reception of signal, except usining X-axis carbon bundle 40 as transmitting terminal, using Y-axis carbon bundle 50 as receiving end, outside perhaps contrary, refer to shown in Fig. 7, because X-axis carbon bundle 40 and the conductor wire (carbon fiber) of Y-axis carbon bundle 50 are coated by an insulation course, therefore, can directly be woven into netted by X-axis carbon bundle 40 and Y-axis carbon bundle 50, electrical contact mutually not, and in the emission and reception of signal, carbon Shu Zuowei transmitting terminal with regard to available odd number, carbon Shu Zuowei receiving end with even number, perhaps contrary, accordingly, can form fast-changing electric capacity being on netted sensor circuit, promote the sensitivity of touch-control sensing.

In sum, above-described embodiment and accompanying drawing are preferred embodiment of the present invention, not in order to limit the present invention, anyly know above operator, within not breaking away from spirit of the present invention and scope, every equalization of doing according to the present patent application the scope of the claims changes and modifies, and all belongs to the scope that patent of the present invention contains.

Claims

1. the sensor circuit structure of a contact panel, is characterized in that, comprises:

One transparency carrier, have a use end face and be in reverse to described use end face in conjunction with end face;

One cementing layer, be located at described transparency carrier in conjunction with end face;

A plurality of X-axis carbon bundles, be set in parallel in describedly in conjunction with end face and cemented by described cementing layer, and each X-axis carbon bundle has the first dielectric film that one first conductor wire and coats described the first conductor wire;

A plurality of Y-axis carbon bundles, be set in parallel in describedly in conjunction with end face and staggered and cemented by described cementing layer with each X-axis carbon bundle, and each Y-axis carbon bundle has the second dielectric film that one second conductor wire and coats described the second conductor wire.

2. the sensor circuit structure of contact panel as claimed in claim 1, it is characterized in that: described cementing layer is a ultraviolet-curing adhesive agent.

3. the sensor circuit structure of contact panel as claimed in claim 1, it is characterized in that: described the first conductor wire is carbon fiber.

4. the sensor circuit structure of contact panel as claimed in claim 1, it is characterized in that: described the second conductor wire is carbon fiber.