CN103407226A - Preparation method of ceramic film on surface of metal structural part - Google Patents
Preparation method of ceramic film on surface of metal structural part Download PDFInfo
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- CN103407226A CN103407226A CN201310313687XA CN201310313687A CN103407226A CN 103407226 A CN103407226 A CN 103407226A CN 201310313687X A CN201310313687X A CN 201310313687XA CN 201310313687 A CN201310313687 A CN 201310313687A CN 103407226 A CN103407226 A CN 103407226A
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Abstract
The invention discloses a preparation method of a ceramic film on the surface of a metal structural part, and belongs to the field of material technology. The preparation method comprises following steps: 1) an alloy thin film is deposited on the surface of the metal structural part, wherein the difference of the thermal expansion coefficient of the alloy thin film and the thermal expansion coefficient of the metal structural part is not more than 20% of the thermal expansion coefficient of the metal structural part; 2) the alloy thin film is subjected to high-temperature thermal oxidation, so that a compact oxide thin film is produced on the surface of the alloy thin film; and 3) the ceramic thin film is deposited on the oxide thin film. The preparation method is capable of improving the adhesive force of metal/ceramic interfaces.
Description
Technical field
The present invention relates to the material technology field.
Background technology
Metal material has good toughness and machinability, yet its corrosion resistance, hardness etc. are poor, pottery is very excellent in the performance of the aspects such as corrosion resistance and hardness, and its toughness and machinability are too poor, if this bi-material can be combined, its character is learnt from other's strong points to offset one's weaknesses, obtain good result.A kind of feasible method is exactly at metal material and hardware surface deposition one deck ceramic membrane.
In fact, have existed since ancient times at metal surface coated with ceramic material, and modal is exactly enamel technology and enamel product.Yet, the development of modern society requires more and more higher to the ceramic material property that is coated in metal surface, be far from that the enamel technology can meet, its main demand is mainly reflected in the protection of the hardware of work under various adverse circumstances (high temperature, high pressure, heat-flash fatigue, air blast impact etc.), as: gas turbine blade, blade of aviation engine etc.
Day by day urgent along with the worsening shortages of fossil fuel and environmental protection; the service efficiency that how to improve traditional energy has just become the key of energy-saving and emission-reduction; for this reason; the ignition temperature that improves various energy source devices becomes now the most real energy-conserving and emission-cutting technology scheme, as: the right coal power generation technology of ultra supercritical, F level gas turbine technology etc. is all its Typical Representative.
Aviation aircraft is also that another that improve at present energy use efficiency paid close attention to object, in order to ensure safety, the burning of present aviation fuels is also insufficient, this not only causes huge waste, also environment is caused and has a strong impact on, therefore, take advantage of a personnel of aircraft trip to become the international Very Important Person source of buying the carbon emission mechanism of exchange.Along with improving constantly of fuel combustion efficiency, the temperature of engine blade and combustion chamber is also more and more higher, although the blade of aircraft engine is mainly manufactured with high temperature alloy, but still can not meet the demands.
Along with improving constantly of ignition temperature, the component materials such as blade of working under high temperature have also been proposed to more and more higher requirement, hardware surface coating protective coating becoming reality comparatively solution.In present stage, people adopt high temperature alloy as barrier material more, but, because high temperature alloy, under high temperature, high pressure, oxidation will occur inevitably, adopt the life-span of high-temperature alloy protecting coating to remain a unavoidable problem.Following protective coating must will be take inorganic non-metallic material ceramic material as main, as: take SiON, AlON, SiAlON etc. will become the main candidate material of following surface protection coating as the high temperature nitrogen oxide of representative.Because pottery is widely different with the physical property of metal blade material, if do not adopt certain technical measures, directly at its adhesive force of ceramic membrane of hardware surface deposition, usually can not meet the requirement of environment for use.
For above background, the present invention proposes a kind of technical method of ceramic membrane at the hardware surface adhesion force that improve, that is: by the introducing of cushion, make interface by metallic character, be transitioned into ceramic characteristics gradually, thereby solve the problem of metal/ceramic interface poor adhesive force.
Summary of the invention
Technical problem to be solved by this invention is, a kind of hardware surface ceramic method for manufacturing thin film is provided, and the ceramic membrane of preparation has good adhesive force.
The technical scheme that the present invention solve the technical problem employing is that hardware surface ceramic method for manufacturing thin film, is characterized in that, comprises the steps:
1) at hardware surface deposition one deck alloy firm, the difference of the thermal coefficient of expansion of the thermal coefficient of expansion of described alloy firm and hardware material be not more than the hardware material thermal coefficient of expansion 20%; That is, the thermal coefficient of expansion of establishing alloy firm is X, and the thermal coefficient of expansion of hardware material is Y, and X is between 0.8Y and 1.2Y.
2) the high-temperature thermal oxidation processing is carried out in the alloy firm of deposition, make the thin oxide layer of its Surface Creation one deck densification;
3) ceramic deposition film on thin oxide layer.
Further, in described step 1), in the material composition of described alloy firm, comprise at least a in the material composition of hardware.
Described hardware is Ni based high-temperature alloy structural member, and alloy firm is the NiCrAlY alloy firm, and described ceramic membrane is Al
2O
3Ceramic membrane.
Perhaps, described hardware is the stainless steel structure part, and alloy firm is the NiCrSi alloy firm, and described ceramic membrane is SiO
2Ceramic membrane.
The invention has the beneficial effects as follows, due to alloy firm and close as the metal material character of substrate, the adhesive force of itself and hardware is good, again because thermal oxide layer from alloy firm surface Nature creating, the adhesive force between this thermal oxide layer and alloy firm is naturally fine.After introducing a kind of like this cushion, ceramic membrane is actually and is deposited on the thermal oxide layer surface, due to this thermal oxide layer, belong to ceramic material in nature, therefore, the ceramic membrane deposited and the adhesive force between thermal oxide layer are also very good, therefore, the technology of the present invention has solved the adhesion problem at metal/ceramic interface well.
The accompanying drawing explanation
Fig. 1 is the buffer layer structure schematic diagram that the present invention proposes.
Fig. 2 is the scatter chart of NiCrAlY alloy-layer composition through-thickness after thermal oxide.
Fig. 3 is the buffer layer structure schematic diagram on Ni based high-temperature alloy surface.
Fig. 4 is the scatter chart of NiCrSi alloy-layer composition through-thickness after thermal oxide.
Fig. 5 is the buffer layer structure schematic diagram of stainless steel surfaces.
The specific embodiment
The present invention is first at hardware surface deposition one deck alloy firm, this alloy material is all close with the hardware material at aspects such as composition, character, and the metallic element that contains easy oxidation carries out the high-temperature thermal oxidation processing to the alloy firm deposited again, make the thin oxide layer of its Surface Creation one deck densification.Alloy firm forms cushion together with its surperficial thermal oxide thin layer thus, then on cushion, prepare insulating barrier, sensitive layer and overcoat.As shown in Figure 1.
As a kind of embodiment, hardware surface ceramic method for manufacturing thin film, is characterized in that, comprises the steps:
1) at hardware surface deposition one deck alloy firm, the material composition of described alloy firm is close with the hardware material, namely in the material composition of alloy firm, comprises at least a in the material composition of hardware;
2) the high-temperature thermal oxidation processing is carried out in the alloy firm of deposition, make the thin oxide layer of its Surface Creation one deck densification;
3) ceramic deposition film on thin oxide layer.
Embodiment 1 Ni based high-temperature alloy surface deposition Al
2O
3Ceramic membrane
The present embodiment at Ni based high-temperature alloy aircraft engine blade surface deposition Al
2O
3Ceramic membrane.First at Ni base alloy aircraft engine blade surface deposition NiCrAlY alloy firm, and after under ultrahigh vacuum, the NiCrAlY alloy firm being processed, then it is carried out to thermal oxidation.Adopt the x-ray photoelectron power spectrum to analyze the distribution of after treatment sample composition through-thickness, analysis result is as shown in Figure 2, visible: at NiCrAlY alloy firm Surface Creation one deck Al
2O
3.
Aircraft engine blade uses concrete its thermal coefficient of expansion of composition of Ni based high-temperature alloy basis usually between 12 * 10
-6～14 * 10
-6/ ℃ between, the difference of the thermal coefficient of expansion of selected alloy firm NiCrAlY material and the thermal coefficient of expansion of Ni based high-temperature alloy usually should be controlled at and be less than 20% for good, preferably is less than 10%.
Thermal oxide Al by NiCrAlY alloy firm and its Surface Creation
2O
3Layer has formed cushion together, and its structure as shown in Figure 3.Because the material character of NiCrAlY film and Ni based high-temperature alloy is very approaching, so the NiCrAlY film is good at the adhesive force on Ni based high-temperature alloy surface; Because thermal oxide layer is come by the NiCrAlY film oxidation, so the adhesive force between this thermal oxide layer and NiCrAlY film is also very good.
On the thermal oxide layer surface, adopt electron beam evaporation growth Al
2O
3Ceramic membrane, test result shows: adhesive force is good.
Embodiment 2 is at stainless steel surfaces ceramic deposition film
As Fig. 4,5.The present embodiment has deposited SiO on stainless steel substrate
2Ceramic membrane.Adopt NiCrSi as alloy-layer, first at stainless steel surfaces deposition NiCrSi alloy firm, and after under ultrahigh vacuum, the NiCrSi alloy firm being processed, then it is carried out to thermal oxidation.Adopt the x-ray photoelectron power spectrum to analyze the distribution of after treatment sample composition through-thickness, analysis result shows: at NiCrSi alloy firm Surface Creation one deck SiO
2.
Stainless thermal coefficient of expansion is usually between 15 * 10
-6/ ℃～16 * 10
-6/ ℃, the thermal coefficient of expansion of selected alloy firm NiCrSi material and the difference of stainless thermal coefficient of expansion are controlled at and are not more than 20%.
Thermal oxide SiO by NiCrSi alloy firm and its Surface Creation
2Layer has formed cushion together, and its structure as shown in Figure 5.Due to the NiCrSi film and stainless character very approaching, so the NiCrSi film is good at the adhesive force of stainless steel surfaces; Because thermal oxide layer is come by the NiCrSi film oxidation, so between this thermal oxide layer and NiCrSi film, adhesive force is also very good.
On the thermal oxide layer surface, adopt electron beam evaporation growth SiO
2Ceramic membrane, test result shows: adhesive force is good.
Claims (4)
1. hardware surface ceramic method for manufacturing thin film, is characterized in that, comprises the steps:
1) at hardware surface deposition one deck alloy firm, the difference of the thermal coefficient of expansion of the thermal coefficient of expansion of described alloy firm and hardware material be not more than the hardware material thermal coefficient of expansion 20%;
2) the high-temperature thermal oxidation processing is carried out in the alloy firm of deposition, make the thin oxide layer of its Surface Creation one deck densification;
3) ceramic deposition film on thin oxide layer.
2. hardware surface ceramic method for manufacturing thin film as claimed in claim 1, is characterized in that, in described step 1), in the material composition of described alloy firm, comprises at least a in the material composition of hardware.
3. hardware surface ceramic method for manufacturing thin film as claimed in claim 1, is characterized in that, described hardware is Ni based high-temperature alloy structural member, and alloy firm is the NiCrAlY alloy firm, and described ceramic membrane is Al
2O
3Ceramic membrane.
4. hardware surface ceramic method for manufacturing thin film as claimed in claim 1, is characterized in that, described hardware is the stainless steel structure part, and alloy firm is the NiCrSi alloy firm, and described ceramic membrane is SiO
2Ceramic membrane.
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| CN201310313687XA CN103407226A (en) | 2013-07-24 | 2013-07-24 | Preparation method of ceramic film on surface of metal structural part |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103921500A (en) * | 2014-04-30 | 2014-07-16 | 电子科技大学 | Thin film strainometer and preparation method thereof |
| CN112111706A (en) * | 2020-07-27 | 2020-12-22 | 合肥镭士客微电路有限公司 | Ceramic element with metal plated surface and metal plating method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3975165A (en) * | 1973-12-26 | 1976-08-17 | Union Carbide Corporation | Graded metal-to-ceramic structure for high temperature abradable seal applications and a method of producing said |
| JPS63165725A (en) * | 1986-12-26 | 1988-07-09 | Aisin Seiki Co Ltd | Strain gauge for pressure sensor |
| CN102804803A (en) * | 2010-02-01 | 2012-11-28 | 西门子能量股份有限公司 | Instrumented component for wireless telemetry |
-
2013
- 2013-07-24 CN CN201310313687XA patent/CN103407226A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3975165A (en) * | 1973-12-26 | 1976-08-17 | Union Carbide Corporation | Graded metal-to-ceramic structure for high temperature abradable seal applications and a method of producing said |
| JPS63165725A (en) * | 1986-12-26 | 1988-07-09 | Aisin Seiki Co Ltd | Strain gauge for pressure sensor |
| CN102804803A (en) * | 2010-02-01 | 2012-11-28 | 西门子能量股份有限公司 | Instrumented component for wireless telemetry |
Non-Patent Citations (1)
| Title |
|---|
| 王从瑞等: "功能-结构一体化NiCr/NiSi薄膜热电偶的制备", 《测控技术》 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103921500A (en) * | 2014-04-30 | 2014-07-16 | 电子科技大学 | Thin film strainometer and preparation method thereof |
| CN103921500B (en) * | 2014-04-30 | 2016-01-13 | 电子科技大学 | A kind of thin film strain takes into account its preparation method |
| CN112111706A (en) * | 2020-07-27 | 2020-12-22 | 合肥镭士客微电路有限公司 | Ceramic element with metal plated surface and metal plating method thereof |
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Application publication date: 20131127 |