CN103398364B - A kind of LED lamp - Google Patents
A kind of LED lamp Download PDFInfo
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- CN103398364B CN103398364B CN201310323516.5A CN201310323516A CN103398364B CN 103398364 B CN103398364 B CN 103398364B CN 201310323516 A CN201310323516 A CN 201310323516A CN 103398364 B CN103398364 B CN 103398364B
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Abstract
The invention provides a kind of LED lamp, it comprises lamp housing, substrate, is arranged on LED light emitting module, the lampshade on substrate and is arranged on the radiator under substrate, on described substrate and radiator, be equipped with the through hole that power supply source line passes, between described power line and through hole, be also provided with encapsulant, the component of described encapsulant and percentage by weight are: Kynoar: 15.2%-18.5%; Hexafluoropropene: 5.3%-7.8%; Polytetrafluoroethylene (PTFE): 12%-15%; Surplus is ethyl orthosilicate. The present invention by choose Kynoar, hexafluoropropene and the polytetrafluoroethylene (PTFE) of proper content and those reactants are mixed with ethyl orthosilicate after make the encapsulant that hardness is high, hot strength is low, compression set rate is low, in the time sealing material being arranged between power line and LED lamp substrate through hole, along with the continuous swing of power line or pull, thereby thereby encapsulant can be fast thereupon deformation make steam or dust can not enter the inner LED lamp longer service life that makes of LED.
Description
Technical field:
The present invention relates to lighting technical field, relate in particular to a kind of LED lamp of good seal performance.
Background technology:
LED light fixture has the advantage of energy-saving and environmental protection, has become main trend in the development of light fixture industry. Present LED lamp is applicable to traditional field more, has in the environment for use of requirement for water proof and dust proof, and the LED lamp that has now technology may not be very applicable, and the LED lamp of prior art uses service life shorter in humidity or the more environment of dust like this.
Existing patent documentation, the Chinese patent " sealed waterproof LED lamp " that for example publication number is CN201521934U discloses a kind of sealed waterproof LED lamp, it by offering closed hole on base, cushion block is set in closed hole, cushion block is pressed in closed hole, make LED light fixture have good sealing effectiveness.
The Chinese patent " a kind of hermetically-sealed construction of LED street lamp " that and for example publication number is CN201866745U, it discloses a kind of hermetically-sealed construction of LED street lamp, by establishing cover plate in LED lamp upper cover, packing sealing inside cover plate, in LED lampshade, place drier, to reach sealing and moistureproof effect.
For another example the Chinese patent " closed type Multifunctional LED aquatic animals lamp " that publication number is CN202708807U, it discloses a kind of closed type Multifunctional LED aquatic animals lamp, by groove being set at U-shaped aluminum hull openend, at the gap-fill encapsulant of light cover and groove and several LED ultraviolet lights are installed on LED circuit substrate, make LED lamp good sealing effect and there is bactericidal effect.
Above-mentioned patent is all to adopt the mode of architecture advances to improve the sealing property of LED lamp, but because steam and dust belong to the material that particle is very little, the improvement of sealing structure is difficult to stop completely the intrusion of steam and dust.
Summary of the invention:
Technical problem to be solved by this invention is, for the above-mentioned deficiency of prior art, provides a kind of sealing effectiveness better, uses the LED lamp of the high-seal of growing service life in humidity or the more environment of dust.
The technical solution adopted in the present invention is: a kind of LED lamp, comprise lamp housing, substrate, be arranged on LED light emitting module, the lampshade on substrate and be arranged on the radiator under substrate, on described substrate and radiator, be equipped with the through hole that power supply source line passes, it is characterized in that: between described power line and through hole, be also provided with encapsulant, the component of described encapsulant and percentage by weight are:
Kynoar 15.2%-18.5%
Hexafluoropropene 5.3%-7.8%
Polytetrafluoroethylene (PTFE) 12%-15%
Surplus is ethyl orthosilicate.
The present invention by choose Kynoar, hexafluoropropene and the polytetrafluoroethylene (PTFE) of proper content and those reactants are mixed with ethyl orthosilicate after make the encapsulant that hardness is high, hot strength is low, compression set rate is low, in the time sealing material being arranged between power line and LED lamp substrate through hole, along with the continuous swing of power line or pull, thereby thereby encapsulant can be fast thereupon deformation make steam or dust can not enter the inner LED lamp longer service life that makes of LED.
Further, the component of described encapsulant and percentage by weight are:
Kynoar 17%-18%
Hexafluoropropene 6%-7%
Polytetrafluoroethylene (PTFE) 13%
Surplus is ethyl orthosilicate.
Further, the component of described encapsulant and percentage by weight are:
Kynoar 17%
Hexafluoropropene 7%
Polytetrafluoroethylene (PTFE) 14%
Surplus is ethyl orthosilicate.
Further, between described lamp housing and lampshade, be provided with zero RunddichtringO, and between described lampshade and lamp housing, be provided with for by the pressure ring of the compression of lampshade, zero RunddichtringO, lamp housing. Be arranged so that like this sealing property between lampshade and lamp housing is higher.
Further, described substrate periphery is tightly connected by fluid sealant and lamp housing. The sealing property that substrate and lamp housing are set is like this higher.
Further, described encapsulant is prepared in the following way:
S1: match well and get after raw material according to above-mentioned formula, be heated to 120-135 DEG C of reaction 5-7 hour after Kynoar, polytetrafluoroethylene (PTFE) are mixed with ethyl orthosilicate under inert gas shielding;
S2: add hexafluoropropene cooling after 150-175 DEG C of dehydration 2-3 hour.
Further, described encapsulant is prepared in the following way:
S1: match well and get after raw material according to above-mentioned formula, be heated to 130 DEG C of reactions 5.7 hours after Kynoar, polytetrafluoroethylene (PTFE) are mixed with ethyl orthosilicate under inert gas shielding;
S2: add hexafluoropropene cooling after 2 hours 165 DEG C of dehydrations.
The present invention compared with prior art has the following advantages: substrate periphery and lamp housing are tightly connected, lampshade and lamp housing are tightly connected, and be provided with encapsulant between power line and through hole, so just can well keep LED light emitting module in a sealed environment, make whole LED lamp can well adapt to humidity or the more environment of dust, make the service life of whole LED lamp higher. The encapsulant that adopts special material to make has good hardness and very low hot strength and compression set rate, make power line in swing process, promptly deformation thereupon of encapsulant, therefore can not produce gap and make steam etc. enter the service life of LED lamp internal influence LED lamp between encapsulant and electric wire.
Brief description of the drawings:
Fig. 1 is the structural representation of the LED lamp of a kind of high-seal of the present invention;
Fig. 2 is the preparation flow schematic diagram of encapsulant of the present invention.
As shown in the figure: 1, lamp housing; 2, substrate; 3, LED light emitting module; 4, lampshade 5, radiator; 6, through hole 7, zero RunddichtringO 8, pressure ring; 100, encapsulant.
Detailed description of the invention:
Below in conjunction with accompanying drawing and detailed description of the invention, the present invention is described further, but the present invention is not limited only to following detailed description of the invention.
As shown in the figure: a kind of LED lamp of high-seal, comprise lamp housing 1, substrate 2, be arranged on LED light emitting module 3, the lampshade 4 on substrate 2 and be arranged on the radiator 5 under substrate 2, on described substrate 2 and radiator 5, be equipped with the through hole 6 that power supply source line passes, described lamp housing 1 is tightly connected with lampshade 4, described substrate 2 peripheries and lamp housing 1 are tightly connected, and are also provided with encapsulant 100 between power line and through hole 6.
Between described lamp housing 1 and lampshade 4, be provided with zero RunddichtringO 7, and between described lampshade 4 and lamp housing 1, be provided with for by the pressure ring 8 of the compression of lampshade 4, zero RunddichtringO 7, lamp housing 1.
Described substrate 2 peripheries are tightly connected by fluid sealant and lamp housing 1.
Embodiment 1
The component of encapsulant 100 and percentage by weight are:
Kynoar 15.2%
Hexafluoropropene 5.3%
Polytetrafluoroethylene (PTFE) 12%
Surplus is ethyl orthosilicate.
Above-mentioned encapsulant is prepared by preparation flow as shown in Figure 2:
S1: match well and get after raw material according to above-mentioned formula, be heated to 120-135 DEG C of reaction 5-7 hour after Kynoar, polytetrafluoroethylene (PTFE) are mixed with ethyl orthosilicate under inert gas shielding;
Adding thermal response is to make three react more rapid, and as preferably, can also add other catalyst that add fast response and other does not affect the additive of key reaction performance, for example carbon black, look mother.
S2: add hexafluoropropene cooling after 150-175 DEG C of dehydration 2-3 hour.
Hardness, hot strength and the compression set rate of the encapsulant that test finally prepares obtain test data in table one.
Wherein, hardness adopts Shore durometer test; Hot strength adopts conventional instron; Compression set rate adopts GB/T7759 standard testing.
Embodiment 2
The component of encapsulant 100 and percentage by weight are:
Kynoar 17%
Hexafluoropropene 7%
Polytetrafluoroethylene (PTFE) 14%
Surplus is ethyl orthosilicate.
Above-mentioned encapsulant is prepared by preparation flow as shown in Figure 2:
S1: match well and get after raw material according to above-mentioned formula, be heated to 130 DEG C of reactions 5.7 hours after Kynoar, polytetrafluoroethylene (PTFE) are mixed with ethyl orthosilicate under inert gas shielding;
Adding thermal response is to make three react more rapid, and as preferably, can also add other catalyst that add fast response and other does not affect the additive of key reaction performance, for example carbon black, look mother.
S2: add hexafluoropropene cooling after 2 hours 165 DEG C of dehydrations.
Hardness, hot strength and the compression set rate of the encapsulant that test finally prepares obtain test data in table one.
Embodiment 3
The component of encapsulant 100 and percentage by weight are:
Kynoar 18.5%
Hexafluoropropene 7.8%
Polytetrafluoroethylene (PTFE) 15%
Surplus is ethyl orthosilicate.
Above-mentioned encapsulant is prepared by preparation flow as shown in Figure 2:
S1: match well and get after raw material according to above-mentioned formula, be heated to 120 DEG C of reaction 5-7 hour after Kynoar, polytetrafluoroethylene (PTFE) are mixed with ethyl orthosilicate under inert gas shielding;
Adding thermal response is to make three react more rapid, and as preferably, can also add other catalyst that add fast response and other does not affect the additive of key reaction performance, for example carbon black, look mother.
S2: add hexafluoropropene cooling after 175 DEG C of dehydration 2-3 hours.
Hardness, hot strength and the compression set rate of the encapsulant that test finally prepares obtain test data in table one.
Test data
Table one
As can be seen from the above table, encapsulant of the present invention has good sealing property, its hardness is high, hot strength is low, compression set rate is low, be highly suitable for the sealing demand between the interior electric wire of LED bulb and through hole, when electric wire when pulled, thereby encapsulant also can not produce gap between the two and make steam enter LED lamp internal influence its service life thereupon there is rapidly deformation.
Specific embodiment described herein is only to the explanation for example of the present invention's spirit. Those skilled in the art can make various amendments or supplement or adopt similar mode to substitute described specific embodiment, but can't depart from spirit of the present invention or surmount the defined scope of appended claims.
Claims (7)
1. a LED lamp, comprises that lamp housing (1), substrate (2), the LED being arranged on substrate (2) send outOptical module (3), lampshade (4) and be arranged on the radiator (5) under substrate (2), described substrate (2)And on radiator (5), be equipped with the through hole (6) that power supply source line passes, it is characterized in that: described power lineAnd through hole is also provided with encapsulant between (6); The component of described encapsulant and percentage by weight are:
Kynoar 15.2%-18.5%
Hexafluoropropene 5.3%-7.8%
Polytetrafluoroethylene (PTFE) 12%-15%
Surplus is ethyl orthosilicate.
2. LED lamp according to claim 1, is characterized in that: the component of described encapsulant and heavyAmount percentage is:
Kynoar 17%-18%
Hexafluoropropene 6%-7%
Polytetrafluoroethylene (PTFE) 13%
Surplus is ethyl orthosilicate.
3. LED lamp according to claim 1, is characterized in that: the component of described encapsulant and heavyAmount percentage is:
Kynoar 17%
Hexafluoropropene 7%
Polytetrafluoroethylene (PTFE) 14%
Surplus is ethyl orthosilicate.
4. according to the LED lamp described in claims 1 to 3 any one, it is characterized in that: described lamp housing (1)And between lampshade (4), be provided with zero RunddichtringO (7), and be provided with between described lampshade (4) and lamp housing (1)For the pressure ring (8) that lampshade (4), zero RunddichtringO (7), lamp housing (1) are compressed.
5. according to the LED lamp described in claims 1 to 3 any one, it is characterized in that: described substrate (2)Periphery is tightly connected by fluid sealant and lamp housing (1).
6. according to the LED lamp described in claims 1 to 3 any one, it is characterized in that: described encapsulantPreparation in the following way:
S1: match well and get after raw material according to the component of encapsulant and weight percent, by Kynoar, poly-fourAfter mixing with ethyl orthosilicate, PVF is heated to 120-135 DEG C of reaction 5-7 little under inert gas shieldingTime;
S2: add hexafluoropropene cooling after 150-175 DEG C of dehydration 2-3 hour.
7. LED lamp according to claim 6, is characterized in that: described encapsulant passes through as belowFormula preparation:
S1: match well and get after raw material according to the component of encapsulant and weight percent, by Kynoar, poly-fourAfter mixing with ethyl orthosilicate, PVF is heated to 130 DEG C of reactions 5.7 hours under inert gas shielding;
S2: add hexafluoropropene cooling after 2 hours 165 DEG C of dehydrations.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310323516.5A CN103398364B (en) | 2013-07-23 | 2013-07-23 | A kind of LED lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310323516.5A CN103398364B (en) | 2013-07-23 | 2013-07-23 | A kind of LED lamp |
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| Publication Number | Publication Date |
|---|---|
| CN103398364A CN103398364A (en) | 2013-11-20 |
| CN103398364B true CN103398364B (en) | 2016-05-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310323516.5A Active CN103398364B (en) | 2013-07-23 | 2013-07-23 | A kind of LED lamp |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103939804B (en) * | 2014-04-16 | 2016-04-20 | 宁波天派智能科技有限公司 | Distribution box LED |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102032475A (en) * | 2009-08-23 | 2011-04-27 | 彭云滔 | Combined type high-power LED lamp |
| CN202327727U (en) * | 2011-10-29 | 2012-07-11 | 金松山 | Plastic cement coated light emitting diode (LED) lamp |
| DE202013100429U1 (en) * | 2012-02-07 | 2013-03-11 | GEM Weltronics TWN Corporation | Integrally formed multilayer light-emitting device |
| CN103062682A (en) * | 2013-01-01 | 2013-04-24 | 西安重装渭南光电科技有限公司 | LED streetlamp |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1834990B1 (en) * | 2004-12-20 | 2012-03-07 | Nippon Valqua Industries, Ltd. | Rubber composition and sealing material for plasma treatment device |
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2013
- 2013-07-23 CN CN201310323516.5A patent/CN103398364B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102032475A (en) * | 2009-08-23 | 2011-04-27 | 彭云滔 | Combined type high-power LED lamp |
| CN202327727U (en) * | 2011-10-29 | 2012-07-11 | 金松山 | Plastic cement coated light emitting diode (LED) lamp |
| DE202013100429U1 (en) * | 2012-02-07 | 2013-03-11 | GEM Weltronics TWN Corporation | Integrally formed multilayer light-emitting device |
| CN103062682A (en) * | 2013-01-01 | 2013-04-24 | 西安重装渭南光电科技有限公司 | LED streetlamp |
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| Publication number | Publication date |
|---|---|
| CN103398364A (en) | 2013-11-20 |
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Address after: 315000 Zhujiaqiao village, jishigang Town, Haishu District, Ningbo City, Zhejiang Province Patentee after: Ningbo Aishi Electric Equipment Co.,Ltd. Address before: 315171 Zhejiang city of Ningbo province Yinzhou District Ji Shi Gang Zhen Zhu Jia Qiao Cun Patentee before: Ningbo Aishi Electric Equipment Co.,Ltd. |