CN103398324A - Packaging structure of light-emitting element and backlight module comprising same - Google Patents
Packaging structure of light-emitting element and backlight module comprising same Download PDFInfo
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- CN103398324A CN103398324A CN2013101749836A CN201310174983A CN103398324A CN 103398324 A CN103398324 A CN 103398324A CN 2013101749836 A CN2013101749836 A CN 2013101749836A CN 201310174983 A CN201310174983 A CN 201310174983A CN 103398324 A CN103398324 A CN 103398324A
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- 238000004806 packaging method and process Methods 0.000 title abstract 6
- 238000012856 packing Methods 0.000 claims description 10
- 208000002925 dental caries Diseases 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 2
- 230000000630 rising effect Effects 0.000 description 9
- 238000007598 dipping method Methods 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000000084 colloidal system Substances 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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Abstract
The invention provides a packaging structure of a light-emitting element and a backlight module comprising the same, and aims to provide a hot spot problem improvement method of the backlight module, wherein the packaging structure of the light-emitting element comprises a plurality of packaging main bodies, each packaging main body is provided with a cavity, the cavity comprises a first side wall, a second side wall and a bottom, the height of the first side wall is higher than that of the second side wall, and the packaging main bodies are arranged adjacently by the second side wall; the light emitting device package structure further comprises a plurality of light emitting devices disposed in the cavity.
Description
Technical field
The present invention relates to a kind of encapsulating structure of light-emitting component, especially relate to a kind of backlight module that is applied to the encapsulating structure of the light-emitting component in liquid crystal display and comprises it.
Background technology
Progress along with LCD Technology, lightweight and slimming have become the trend in market, the backlight module light emitting source of liquid crystal display is also gradually by light emitting diode (LED, Light Emitting Diode) replace the traditional cold cathode tube, the present invention namely relates to a kind of package structure for LED.
Please refer to Fig. 1, schematic top plan view for the light emitting diode in the prior art side light-entering type backlight module and photoconduction leading-in device, wherein a plurality of light emitting diodes 110 are welded on lamp bar (Light Bar) 101, and the light source that light emitting diode sends makes light uniformization by each corner that photoconduction leading-in device 120 conducts to the photoconduction leading-in device; But because of light emitting diode this as point source of light, cause the light source of its bright dipping side A not yet through photoconduction leading-in device homogenising, to produce the problems such as focus (Hot Spot) or dark space, and one of method that is traditionally head it off compensates for the photoconduction leading-in device is made light in micro-structurals such as regional area design configuration 120A, yet still can't deal with problems and increase the cost of manufacture of photoconduction leading-in device fully.
And, because of the lifting of light-emitting diode luminous efficiency, reduce so that reach the required light emitting diode quantity of liquid crystal display device module brightness specifications, so the spacing P1 of light emitting diode change is large, causes on the contrary hot issue more serious in the recent period.If but solve hot issue and with more light emitting diode 110 and micro-structural 120A, allow spacing P2 diminish, as shown in the schematic top plan view of the light emitting diode in the prior art side light-entering type backlight module of Fig. 2 and LGP, but the side effect that causes cost to rise, expend the energy.
Because of light-emitting diode (LED) backlight module be by at least one light emitting diode as light source, compared to the cold-cathode tube light source of traditional strip type, light emitting diode is point source of light.as shown in Figure 3, it is the luminous light shape figure of the existing light emitting diode of optical analog, wherein light shape curve 410 represents angle and the intensity distribution that light source comes out, ratio standard when angle is spent in the bright dipping 0 of using as luminous intensity 100%, can find out that half briliancy angle θ when curve 410 arrives luminous intensity 50% is about 60 degree angles, with this understanding, the hot spot phenomenon that analogy backlight module shown in Figure 2 produces, represent as Fig. 4, can obviously find out focus H01～H0N that the corresponding spot light of each LED package main body produces, also be problem to be solved by this invention.
Summary of the invention
For addressing the above problem, purpose of the present invention is for providing a kind of encapsulating structure of light-emitting component, this encapsulating structure comprises: a plurality of light-emitting component package main body, each package main body all has a cavity, this cavity is formed by a first side wall, one second sidewall and a bottom at least, wherein the height of this first side wall is higher than this second sidewall, and those package main body are with the adjacent arrangement of this second sidewall; And a plurality of light-emitting components, within being arranged at those cavitys.
According to embodiments of the invention, at least part of height of the second sidewall of this package main body is lower than the height of this first side wall.
According to embodiments of the invention, the second sidewall height of this package main body is 50%～95% of the first side wall height.
According to embodiments of the invention, this light-emitting component comprises at least one light emitting diode.
And another object of the present invention, for a kind of backlight module is provided, is assembled in a display, and this backlight module comprises: a photoconduction leading-in device, and it has an exiting surface and an incidence surface; An and luminous element packing structure, this encapsulating structure comprises: a plurality of light-emitting component package main body, each package main body all has a cavity, this cavity is formed by a first side wall, one second sidewall and a bottom at least, wherein the height of this first side wall is higher than the height of this second sidewall, and the normal vector of this package main body the second sidewall is perpendicular to the normal vector of photoconduction leading-in device exiting surface, and the normal vector of the first side wall of this package main body is parallel to the normal vector of photoconduction leading-in device exiting surface; And a plurality of light-emitting components, within being arranged at those cavitys.
According to the present invention as above, the light-emitting component package main body is adjacent arrangement in twos, and for increasing the side rising angle of luminous element packing structure, the sidewall of sides adjacent is reduced height, make the sidewall height of the sidewall height of sides adjacent lower than non-adjacent side, allow the light source can be luminous than wide-angle towards sides adjacent, to reach the purpose of improving hot issue.
Description of drawings
Fig. 1 is light emitting diode in the prior art side light-entering type backlight module and the schematic top plan view of LGP;
Fig. 2 is light emitting diode in the prior art side light-entering type backlight module and the schematic top plan view of LGP;
Fig. 3 is the luminous light shape figure of the existing luminous element packing structure of optical analog;
Fig. 4 is the focus simulation drawing that the corresponding spot light of LED package main body produces;
Fig. 5 is the encapsulating structure side view of a kind of light-emitting component of the first embodiment;
Fig. 6 is the enlarged drawing of the light-emitting component package main body of the first embodiment;
Fig. 7 A, Fig. 7 B have the focus simulation drawing of the luminous light shape figure of luminous element packing structure and the corresponding spot light generation of LED package main body now by the optical analog of the first embodiment;
Fig. 8 is the encapsulating structure side view of a kind of light-emitting component of the second embodiment;
Fig. 9 is the enlarged drawing of the light-emitting component package main body of the second embodiment;
Figure 10 A, Figure 10 B are two kinds of light-emitting component package main body enlarged drawings;
Figure 11 is a kind of display device structure assembling schematic diagram of the 3rd embodiment.
Reference numeral
120,220,1120: photoconduction leading-in device 120A: micro-structural
410,710: light shape curve
500,800,1100: luminous element packing structure
101,201,501,801,1101: circuit board
110,510,810,1110: the light-emitting component package main body
512,812: bottom 513,813: the long side wall
514,814,1014: minor face sidewall 515,815: LED wafer
516,816: colloid 517,817: opening part
519,819: cavity 1028: fence
1010A, 1010B: light-emitting component package main body 1130: display panels
1112: backlight module θ, θ ': half briliancy angle
H01, H02 ... H0 (N-1), H0N, H71, H72 ... H7 (N-1), H7N: focus
A: bright dipping side C: incidence surface
D: exiting surface E: the sidewall of sides adjacent
F: sidewall P1, the P2 of non-adjacent side: spacing
The specific embodiment
please refer to Fig. 5, the encapsulating structure 500 that it illustrates according to a kind of light-emitting component of first embodiment of the invention, comprise a circuit board 501 and a plurality of light-emitting component package main body 510, the enlarged drawing of the light-emitting component package main body 510 that goes out as shown in Figure 6, include cavity 519 on light-emitting component package main body 510 structures, cavity 519 has the structure of optical reflection characteristic for inwall, with opening part 517 bright dippings of reflection source to cavity 519, cavity 519 is by bottom 512, two long side walls 513, two minor face sidewalls 514 surround, and LED wafer 515 is arranged at bottom 512 so that light source to be provided, be filled in inside grooves and be mixed in phosphor powder in colloid 516 to send the light source of specific wavelength in order to excite, LED wafer can be selected more than single or two, to reach the demand of light-emitting component amount of light, the object of the invention is to increase the adjacent avris rising angle of a plurality of luminous element packing structures, in the present embodiment, reduce the height of minor face sidewall 514, make minor face sidewall 514 height lower than long side wall 513, allow the light source can be luminous than wide-angle towards side, but for keeping simultaneously the structural strength of encapsulating structure, sidewall has the importance that certainly exists, according to experimental result of the present invention, the degree that the minor face sidewall reduces be preferably the long side wall 50% to 95% between, can adjust in this scope according to the demand of design, better with the effect of 60% to 80% scope.
And according to the present embodiment, minor face sidewall 514 is reduced to 60% when height of long side wall 513, the visible Fig. 7 A of result that rising angle is simulated, half briliancy angle θ ' when angle luminous intensity 50% is spent in 710 arrival 0 of light shape curve is about 70 degree angles, the design of this encapsulating structure really can increase rising angle, and by the focus H71～H7N that simulates the corresponding spot light generation of each LED package main body, as shown in Figure 7 B, after rising angle increases, can alleviate the luminance difference of spot light and dark space between each spot light, and then improve hot issue.
please refer to Fig. 8, the encapsulating structure 800 that it illustrates according to a kind of light-emitting component of second embodiment of the invention, comprise a circuit board 801 and a plurality of light-emitting component package main body 810, the enlarged drawing of the light-emitting component package main body 810 that goes out as shown in Figure 9, include a cavity 819 on light-emitting component package main body 810 structures, cavity 819 has the structure of optical reflection characteristic for inwall, with upper opening place 817 bright dippings of reflection source to cavity 819, cavity 819 is surrounded by bottom 812, two long side walls 813, two minor face sidewalls 814, and LED wafer 815 is arranged at bottom 812 so that light source to be provided, and in order to excite, is filled in the phosphor powder of cavity 819 internal mix in colloid 816 to send the light source of specific wavelength, the present embodiment is because of the functional requirement of backlight module, the configuration mode of light-emitting component package main body 810 on encapsulating structure 800 takes the long limit of package main body adjacent one another are, therefore for reaching the purpose of the side rising angle that increases luminous element packing structure, need the long side wall 813 of side adjacent one another are is reduced height, make long side wall 813 height lower than minor face sidewall 814, allow the light source can be luminous than wide-angle towards side, but for keeping simultaneously the structural strength of encapsulating structure, sidewall has the importance that certainly exists, according to experimental result of the present invention, the degree suggestion that long side wall 813 reduces minor face sidewall 814 50% to 95% between, can adjust in this scope according to the demand of design, effect with 60% to 80% scope is better.
Further inquire into the design that reduces light-emitting component package main body sidewall, according to factors such as the strength of materials of package main body, rising angle demand, manufactures, adjust, also can implement according to this by two kinds of light-emitting component package main body enlarged drawings of Figure 10; Wherein a cardinal principle is to be not limited to linear for sidewall reduces structure, the design that also can adopt circular arc sidewall 1014 as light-emitting component package main body 1010A in Figure 10 A; Or in the side-walls that reduces, doing the fence design, the light-emitting component package main body 1010B that goes out as shown in Figure 10 B, can control side by the shape of fence 1028 and spacing and go out luminous intensity, rising angle or support side edge colloform texture.
Please refer to Figure 11, it illustrates the assembling schematic diagram according to a kind of display device structure 1111 of third embodiment of the invention, and it comprises display panels 1130 and backlight module 1112; Backlight module 1112 comprises the encapsulating structure 1100 and photoconduction leading-in device 1120 of light-emitting component, photoconduction leading-in device 1120 is a plate or taper structure, it has an incidence surface C and exiting surface D, the light source that light-emitting component distributes enters photoconduction leading-in device 1120 by incidence surface C, give entering display panels by exiting surface D after the homogenising diffusion, provide the display panels playing video required light source; And the encapsulating structure 1100 of light-emitting component comprises a circuit board 1101 and a plurality of light-emitting component package main body 1110, and wherein light-emitting component package main body structure is identical with light-emitting component package main body 510 structures in aforementioned the first embodiment, does not repeat them here; The adjacent arrangement in twos of this light-emitting component package main body, the normal vector of the sidewall E of its sides adjacent is perpendicular to the normal vector of the exiting surface D of photoconduction leading-in device, the normal vector of the sidewall F of its non-adjacent side is parallel to the normal vector of the exiting surface D of photoconduction leading-in device, and for increasing the side rising angle of luminous element packing structure, the sidewall of sides adjacent is reduced height, make the sidewall height of the sidewall height of sides adjacent lower than non-adjacent side, allow the light source can be luminous than wide-angle towards sides adjacent, to reach the purpose of improving hot issue.
In sum, luminous element packing structure of the present invention, by structure, device that the respective embodiments described above disclose, really can reach purpose and the effect of expection.
Although the present invention discloses as above with preferred embodiment; yet it is not in order to limit the present invention; any person skilled in the art; without departing from the spirit and scope of the present invention; can do a little change and modification, so protection scope of the present invention should be defined and is as the criterion by appending claims.
Claims (8)
1. the encapsulating structure of a light-emitting component, is characterized in that, this encapsulating structure comprises:
A plurality of light-emitting component package main body, each package main body all has a cavity, this cavity is formed by a first side wall, one second sidewall and a bottom at least, and wherein the height of this first side wall is higher than this second sidewall, and those package main body are with the adjacent arrangement of this second sidewall; And
A plurality of light-emitting components, within being arranged at those cavitys.
2. the encapsulating structure of light-emitting component according to claim 1, is characterized in that, at least part of height of the second sidewall of this package main body is lower than the height of this first side wall.
3. the encapsulating structure of light-emitting component according to claim 1, is characterized in that, the second sidewall height of this package main body is 50%～95% of the first side wall height.
4. the encapsulating structure of light-emitting component according to claim 1, is characterized in that, this light-emitting component comprises at least one light emitting diode.
5. a backlight module, is characterized in that, is assembled in a display, and this backlight module comprises:
One photoconduction leading-in device, it has an exiting surface and an incidence surface; And
One luminous element packing structure, this encapsulating structure comprises:
A plurality of light-emitting component package main body, each package main body all has a cavity, this cavity is formed by a first side wall, one second sidewall and a bottom at least, wherein the height of this first side wall is higher than the height of this second sidewall, and the normal vector of this package main body the second sidewall is perpendicular to the normal vector of photoconduction leading-in device exiting surface, and the normal vector of the first side wall of this package main body is parallel to the normal vector of photoconduction leading-in device exiting surface; And
A plurality of light-emitting components, within being arranged at those cavitys.
6. backlight module according to claim 5, is characterized in that, at least part of height of the second sidewall of this package main body is lower than the height of this first side wall.
7. backlight module according to claim 5, is characterized in that, the second sidewall height of this package main body is 50%～95% of the first side wall height.
8. backlight module according to claim 5, is characterized in that, this light-emitting component comprises at least one light emitting diode.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102110335 | 2013-03-22 | ||
| TW102110335A TWI537648B (en) | 2013-03-22 | 2013-03-22 | Package structure of light emitting element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103398324A true CN103398324A (en) | 2013-11-20 |
| CN103398324B CN103398324B (en) | 2015-09-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310174983.6A Expired - Fee Related CN103398324B (en) | 2013-03-22 | 2013-05-13 | Packaging structure of light-emitting element and backlight module comprising same |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103398324B (en) |
| TW (1) | TWI537648B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108511576A (en) * | 2017-02-27 | 2018-09-07 | 展晶科技(深圳)有限公司 | Light-emitting diode encapsulation structure |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1497744A (en) * | 2002-09-30 | 2004-05-19 | 西铁城电子股份有限公司 | Light-emitting diode and background light device |
| US20060221629A1 (en) * | 2005-04-04 | 2006-10-05 | Samsung Electronics Co., Ltd. | Backlight unit and liquid crystal display device employing the same |
| JP2008186914A (en) * | 2007-01-29 | 2008-08-14 | Hitachi Ltd | Linear light source device and back light device |
-
2013
- 2013-03-22 TW TW102110335A patent/TWI537648B/en not_active IP Right Cessation
- 2013-05-13 CN CN201310174983.6A patent/CN103398324B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1497744A (en) * | 2002-09-30 | 2004-05-19 | 西铁城电子股份有限公司 | Light-emitting diode and background light device |
| US20060221629A1 (en) * | 2005-04-04 | 2006-10-05 | Samsung Electronics Co., Ltd. | Backlight unit and liquid crystal display device employing the same |
| JP2008186914A (en) * | 2007-01-29 | 2008-08-14 | Hitachi Ltd | Linear light source device and back light device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108511576A (en) * | 2017-02-27 | 2018-09-07 | 展晶科技(深圳)有限公司 | Light-emitting diode encapsulation structure |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI537648B (en) | 2016-06-11 |
| TW201437726A (en) | 2014-10-01 |
| CN103398324B (en) | 2015-09-23 |
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Granted publication date: 20150923 Termination date: 20210513 |
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