CN103382016B - Adopt BioMEMS and the planar light circuit of integration packaging part - Google Patents
Adopt BioMEMS and the planar light circuit of integration packaging part Download PDFInfo
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- CN103382016B CN103382016B CN201310138552.4A CN201310138552A CN103382016B CN 103382016 B CN103382016 B CN 103382016B CN 201310138552 A CN201310138552 A CN 201310138552A CN 103382016 B CN103382016 B CN 103382016B
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Abstract
Adopt BioMEMS and the planar light circuit of integration packaging part.Disclose a kind of BioMEMS microelectromechanicdevices devices and manufacture method thereof.Substrate is provided, forms at least one signal pipe line over the substrate.The sacrifice layer that is made up of expendable material can be deposited and alternatively patterning is carried out to this sacrifice layer on signal pipe line and remove expendable material with portion overseas from package footprint.Can going up at least partially and sacrifice layer (if comprising) deposit bonding layer at signal pipe line.Planarized and patterning can be carried out to form one or more covering joint sheet and to limit territory, package footprint to bonding layer.Covering can be bonded on to limit overlay area on covering joint sheet, thus make signal pipe line extend to inside, overlay area from outside, overlay area.In addition, the test material of such as fluid can be provided in overlay area.
Description
Related application
This application claims the priority of the U.S. Provisional Application " 61/641,657 " number submitted on May 2nd, 2012, its full content is hereby expressly incorporated by reference.
Technical field
The present invention relates to the BioMEMSN and planar light circuit that adopt integration packaging part.
Background technology
BioMEMS device is the MEMS with sensing element for biologic applications, and usually have be connected to encapsulation fluidic hardware and external environment condition between light or signal of telecommunication pipeline.Usually use the covering surrounding encapsulation fluidic hardware and external environment condition and isolate, due to optical signal conduit arrive be coated to cover piece reservation fluent material so this covering is directly bonded to above optical signal conduit.Traditionally, covering can be used for be bonded on above signal pipe line by the adhesion joint of dimethyl silicone polymer (" PDMS ") or anodic bonding, but this needs pipeline to introduce minimum pattern change (such as, being less than 1000 dusts when anodic bonding).It is conventional for using PDMS to be directly bonded on pipeline as cement, due to its refractive index and SiO
2similar, the therefore operation of not stray light signal pipe line.Usually, the BioMEMS system of this use PDMS is easy to keep prototype and do not need clean room environment.But, in some cases because PDMS can not be bonded on securely have larger pattern change pipeline above, so PDMS brings the limitation that pipeline pattern causes, this limitation needs the height of signal pipe line to be less than 200 nanometers usually.In addition, PDMS absorbs the molecule to the such as fluorogen that the generation of signal plays a crucial role in overlay area, and PDMS can be also porous in some cases, thus makes water pass seal evaporation.
In addition, anodic bonding or be directly bonded on pipeline by electrostatic field and need high voltage, is particularly exceeded the pipeline of hundreds of dust, usually needs about 800V to 1000V to realize suitable joint for thickness.The high-energy relevant to this anodic bonding may change the physical property of light or electric pipe, thus make pipeline efficiency reduce or improper in other respects.And, anodic bonding also there will be the limitation (< 100nm) that pipeline pattern causes, and sometimes need the temperature up to about 400 to 500 degrees Celsius, this may make it and manufacture BioMEMS device in CMOS wafer incompatible.
The adhesion joining technique of fluidic hardware additive method used comprises and uses glue or epoxy resin directly to be joined on pipeline by Merlon covering.But, the function of these materials possibility interfering signal pipelines used in this technology.
Summary of the invention
In order to solve problems of the prior art, according to an aspect of the present invention, provide a kind of micro electro mechanical device, comprising: substrate; At least one signal pipe line, is arranged over the substrate; At least one covering joint sheet, arrange over the substrate with the top of a part for described signal pipe line; And covering, be arranged to and form overlay area, described covering is arranged at least one covering joint sheet described, and at least one signal pipe line wherein said extends to inside, described overlay area from outside, described overlay area; Wherein, described covering is configured to keep the controlled environment in described overlay area.
Described device comprises further and is arranged in described overlay area and is configured to acceptor interactional with the target molecule of predefined type.
In described device, described signal pipe line is optical signal conduit.In one embodiment, described device is included in the photodetector that described substrate is arranged further, and wherein, described optical signal conduit is configured to transport light to target molecule, and described photodetector is configured to detect the response from described target molecule.
In described device, described signal pipe line is signal of telecommunication pipeline.
In described device, described covering joint sheet is the oxide of refractive index lower than the refractive index of described signal pipe line.
In described device, described covering joins described covering joint sheet to by the one in adhesive, anodic bonding or melting joint.
In described device, described overlay area is filled with fluid test materials at least in part.
According to a further aspect in the invention, provide a kind of micro electro mechanical device, comprising: substrate; At least one signal pipe line, is arranged over the substrate; At least one covering joint sheet, there is smooth first surface and arrange over the substrate with the top of a part for described signal pipe line; Input structure, is connected with described signal pipe line; And covering, be arranged to and form overlay area, described covering is arranged on the smooth first surface of at least one covering joint sheet described, and at least one signal pipe line wherein said extends to inside, described overlay area from outside, described overlay area.
Described device comprises further and is arranged in described overlay area and is configured to the interactional surface chemistry layer with target molecule.In one embodiment, described device comprises further and is arranged in described overlay area and is configured to acceptor interactional with the target molecule of predefined type.In another embodiment, described device comprises further and is arranged on described substrate and is configured to interactional one or more electrode with described target molecule.
According to another aspect of the invention, provide a kind of method for the formation of microelectromechanicdevices devices, comprising: substrate is provided; Form at least one signal pipe line arranged over the substrate; At least one signal pipe line described at least partially on form the sacrifice layer be made up of expendable material; At least one signal pipe line described at least partially on deposit bonding layer; Bonding layer described in patterning is to form one or more covering joint sheet and to limit territory, package footprint; And joining covering to covering joint sheet, at least one signal pipe line wherein said extends to territory, described package footprint from overseas portion, described package footprint inner.
In the described method, before the described bonding layer of deposition, form described sacrifice layer, wherein bonding layer described in the disposed thereon of at least one signal pipe line described and described sacrifice layer.In one embodiment, described method comprises further: after bonding layer described in patterning, removes expendable material from territory, described package footprint.
Described method comprises further: planarized described bonding layer before bonding layer described in patterning.
In the described method, one or more electrodes that described substrate is arranged are provided described substrate to comprise to be provided in.In one embodiment, described covering joint sheet is thicker than described signal pipe line.
In the described method, described covering is joined to described covering joint sheet by the one in anodic bonding, melting joint or epoxy resin joint.
Described method comprises further: be provided in the fluid test materials arranged in the region that limited by described covering.
Accompanying drawing explanation
For understanding the embodiment of the present invention and advantage thereof more fully, now by following description done by reference to the accompanying drawings as a reference, wherein:
Fig. 1 is the top view that the covering applied above signal pipe line is shown;
Fig. 2 A and Fig. 2 B is the side view of light tunnel and the light input structure illustrating below covering and arrange in overlay area;
Fig. 3 A to Fig. 3 B illustrates the sectional view using fluidic hardware embodiment;
Fig. 4 A to Fig. 4 F and Fig. 5 A to Fig. 5 B is the schematic diagram of the embodiment of the method illustrated for the formation of BioMEMS device architecture.
Detailed description of the invention
Discuss manufacture and the use of the embodiment of the present invention below in detail.But, should be appreciated that, the invention provides many applicable inventive concepts that can realize in various specific environment.The specific embodiment discussed is only the illustrative of specific ways manufacturing and use disclosed theme, and is not used in the scope limiting different embodiment.Below for specific environment, embodiment will be described, namely for the formation of the system and method for BioMEMS device architecture.
Disclosed herein is a kind of device (especially microfluid) for the application of BioMEMS packaging part and form the method for this device.Embodiment disclosed herein avoids the interference of signal pipe line or damage and overcomes the pattern limitation applied by signal pipe line.Signal pipe line allow packaging part or overlay area inside and outside between control or induction.This document describes the accompanying drawing that the principle of the invention is shown, but and do not mean that restriction, and accompanying drawing is not drawn in proportion.
Fig. 1 is the top view that the covering applied above light tunnel according to the present invention is shown, obtains BioMEMS device architecture 100.Substrate 106 can have one or more signal pipe line or waveguide pipe 102, and it can be arranged on light on substrate or electric pipe or waveguide pipe alternatively, and wherein input structure is configured to input source to be connected with signal pipe line.Input structure can be coupled structure, such as, but not limited to grating coupler 110 or the cable splice structure 112 of the interface served as between light source and optical signal conduit 102.Alternatively, signal pipe line 102 can conducting electrical signals to send the signal of telecommunication or make the signal of telecommunication enter into overlay area 108 or inner 108 collect signals from overlay area, and input structure can be configured to the electrical connection of installing such as wire or cross tie part.Such as, signal pipe line 102 can interact with the material of inside, overlay area 108.In certain embodiments, signal pipe line 102 can carry out measurement impedance by the electric current applying AC voltage and the material of measurement in overlay area 108.
Covering wall 104 can be arranged on above signal pipe line 102 to limit and to hold the overlay area 108 closed.Overlay area 108 can be configured to a closed constant volume and keep controlled environment to contact with signal pipe line 102.Such as, overlay area 108 can be fluid reservoir (fluid reservoir), or can air inclusion environment or any combination of materials.In a useful embodiment, overlay area 108 can be filled with fluid at least in part, and this fluid can have the material for testing.Those skilled in the art will recognize that, although principle disclosed herein is partly described as the transmission of light and light, advantageously, the electromagnetic radiation of any frequency can be used in the embodiments described.Therefore, alternative visible ray can be carried out with infrared ray and ultraviolet radiation, wireless radio transmission, x-ray, gamma ray and any other radiation.
Fig. 2 A is the side view of the embodiment of the part 200 that BioMEMS device architecture is shown, wherein signal pipe line 102 is arranged on below covering 202 with in overlay area 108.Signal pipe line has optical cable 210 input being positioned at outside, overlay area 108.The covering 202 with covering wall 104 and covering top 206 can be arranged on the top of covering joint sheet 204 to limit overlay area 108.Therefore, covering 202 can keep test material to be separated and preventing pollution with external environment condition.
Signal pipe line 102 can be formed on substrate 106 with covering 202 below, wherein covering 202 and signal pipe line 102 are separated by covering joint sheet 204.Can optical cable 210 be joined to substrate 106 thus make the light core 212 of optical cable 210 arrive the light path of signal pipe line 102 for incident light 214 provides.Can by the adhesive 208 of such as PDMS, by the system of being adhesively fixed, by anodic bonding, be engaged by melting or engaged by another or optical cable 210 to engage and to be fixed to suitable position by connected system.
In addition, the covering 202 of restriction overlay area 108 can have the one or more openings for introducing test material.Therefore, in inside, overlay area 108 without any producing BioMEMS test component when specific environment, then sample can be caught by the time point below in overlay area 108.
Fig. 2 B is the side view of the embodiment of the part 220 that BioMEMS device architecture is shown, wherein light tunnel 102 is arranged on below covering 202 with in overlay area 108.Pipeline has the grating coupler 110 being positioned at outside, overlay area 108.In this embodiment, laser or other light sources long-rangely can be provided and can laser or other light sources be directed in grating coupler 110, being then transferred in light tunnel 102.
Fig. 3 A is the sectional view of the operation of the transducing part 300 of the embodiment that BioMEMS device architecture is shown.Photodetector 308 or other light-sensitive devices can be set in substrate 106, such as, but not limited to photodiode, CMOS active pixel sensor, phototransistor, photo-resistor, charge-coupled image sensor etc.Alternatively, in the substrate or electricity or chemical sensor can be set on substrate, and this electricity or chemical sensor can be configured to come detection perform or reaction when interacting with signal pipe line 102 by target molecule 302.Advantageously, light tunnel 102 can also be arranged on the surface of substrate 106, and can have surface chemistry layer 306 and be configured to and the interactional acceptor 304 of target molecule 302 that is specific or predefined type.Surface chemistry layer 306 can be arranged on any other vantage point on signal pipe line 102 or in overlay area 108 alternatively, and can be configured to attract target molecule 302 or interact with target molecule 302.Alternatively, surface chemistry layer 306 can be filter, and can be adjusted to the fluorescence filtering and send from target molecule 302 specially.Advantageously, acceptor 304 can be molecule, protein, antibody, enzyme, polymerase, bacterium, cell etc.Target molecule 302 can be such as the analysis thing with fluorescent dye, or can be fluorescin, fluorescently-labeled antibody, fluorescently-labeled DNA etc. alternatively.Such as excite fluorescent dye, mark or the albumen in target molecule 302 from the optical transport of the evanescent wave of signal pipe line 102, and detect the fluorescence response from target molecule 302 by photodetector 308.As shown in Figure 3 B, one or more electrode 310 can be set at substrate 106.Such as, electrode 310 can be, but not limited to be arranged on substrate 106 surface on or be included in substrate 106.
Electrode 310 can be configured to interact from the digital independent of target molecule and target molecule 302 by such as controlling or measuring.In one embodiment, electrode 310 resistance heated can be included in fluid in overlay area 108 or environment.In an alternate embodiment of the invention, electrode 310 can apply AC voltage for helping analysis thing or target molecule 302 to be directed to signal pipe line 102 or acceptor 304 by dielectrophoresis.In another embodiment, electrode 310 can be configured to the electrical characteristic of the material read in target molecule 302 or overlay area 108.Such as, electrode 310 can apply AC voltage to overlay area 108, and reads impedance or the electric current of overlay area 108.
Fig. 4 A to Fig. 4 F and Fig. 5 A to Fig. 5 B is the sectional view of the BioMEMS device architecture in each stage being in manufacture according to one or more embodiment.At first, Fig. 4 A illustrates the BioMEMS device architecture 400 being in and manufacturing initial stage.Signal pipe line 102 can be arranged on substrate 106, and wherein substrate 106 is the materials such as, but not limited to glass, silicon (Si), GaAs (GaAs), glass fibre, metal etc.In addition, substrate 106 can comprise the circuit such as such as cmos device, interconnection line, sensor, electrode, photodetector, doped region alternatively.In one embodiment, can patterning signal pipe line 102 with dispersed light or the pipe section providing separation.Optical signal conduit 102 can be such as high-g value, such as silicon nitride (Si
3n
4), silicon oxynitride (SiON), hafnium oxide (HfO
2), tantalum pentoxide (Ta
2o
5) etc.Alternatively, signal of telecommunication pipeline 102 can be such as metal or other conductive materials, such as gold (Au), aluminium (Al), copper (Cu), titanium nitride (TiN) and their alloy etc.The thickness of typical signal pipe line 102 can between about 500 dusts and about 6000 dusts.In one embodiment of the invention, dry etching technology can be used to carry out patterning optical signal conduit 102, and dry etching technology can provide light tunnel critical dimension control more better than wet etching.And some embodiments can have the optical signal conduit 102 with smooth outer surface, thus make optical signal more effectively transmit.
Fig. 4 B illustrates at the sectional view forming the BioMEMS device architecture 400 after sacrifice layer 412.In one embodiment, sacrifice layer 412 can be hard material or the non-polymer materials such as such as germanium (Ge), silicon (Si), titanium-tungsten (TiW), aluminium (Al), and advantageously can be deposited on the top of substrate 106 and signal pipe line 102 by plasma vapor deposition, chemical vapor deposition or PVD etc.In one embodiment, the thickness of sacrifice layer 412 can between about 2000 dusts and about 6000 dusts.
Fig. 4 C illustrates the sectional view of the BioMEMS device architecture 400 after sacrificial patterned 412.By photoetching or any other suitable for patterning sacrifice layer 412 or sacrifice layer 412 can be removed from the region of outside, territory, package footprint 422 in the future, only leave the material of the sacrifice layer 412 being arranged in territory, package footprint 422.Can be completed the removal of sacrifice layer 412 by the etchant being suitable for specific sacrifice layer 412 material, described etchant includes but not limited to hydrogen peroxide (H
2o
2), phosphoric acid (H
3pO
4), potassium hydroxide (KOH), TMAH (TMAH), ethylene diamine pyrocatechol (EDP), xenon difluoride (XeF
2) etc.
Fig. 4 D illustrates at the sectional view forming the BioMEMS device architecture 400 after bonding layer.Bonding layer 434 can be deposited on the sacrifice layer 412 of patterning and the top of signal pipe line 102.In one embodiment, bonding layer 434 can be applied thus make bonding layer be arranged in engaging zones 432 to cover signal pipe line 102 and to be provided for the pad of joint covering member wall 104 above signal pipe line 102.In certain embodiments, bonding layer 434 can be the oxides such as such as silica, and can pass through such as chemical vapor deposition process, plasma enhanced deposition technique or any other suitable process deposits.Alternatively, bonding layer 434 can be nitride, metal level, polysilicon layer etc., and can select bonding layer materials according to the performance of signal pipe line 102.
To remove in the region of bonding layer 434 subsequently, sacrifice layer 412 can make it engage with the bonding layer 434 of top by guard signal pipeline 102.
In one embodiment of the invention, it may be favourable for below bonding layer 434, having hard sacrifice layer 412 instead of sacrifice photoresist (PR), because polymer residues may disturb the surface chemistry layer 306 of BioMEMS device sensing arrangement.In addition, may also can have problems, because oxide is positioned on soft material sacrificing the planarized of bonding layer 434 that photoresist layer deposits: in planarized period by the stress of planarized generation with the photoresist of polymer type can be caused to be out of shape for pressure and bonding layer lost efficacy.But, the photoresist of bio-compatible can be used, and can by expecting that the test material being used for overlay area 108 determines the chemical action of the photoresist of this bio-compatible.In this case, will the photoresist of the preferred bio-compatible of the chemical action of not disturbed test program and any target molecule 302.
Bonding layer 434 is deposited on the thickness of substrate 106 surface can between about 4 micron (40,000 dust) and 0.5 micron (5,000 dust) between, and can use subsequently such as chemically mechanical polishing downwards planarized its thickness that makes between about 2 micron (20,000 dust) extremely between about 0.4 micron (4,000 dust).Bonding layer 434 can provide the planarized surface that can accept joining technique scope, allows the thickness of signal pipe line 102 high to about 600 nanometers (6,000 dust) simultaneously.Therefore, a useful embodiment can be between thick about 200 nanometers of signal pipe line (2,000 dust) to about 600 nanometers (6,000 dust), and bonding layer covers signal pipe line 102 has planarized composition surface simultaneously.
Fig. 4 E illustrates the sectional view of the BioMEMS device architecture 400 after patterning bonding layer 434.Can bonding layer 434 patterning be made by etching or be formed in covering joint sheet 204 to remove the material of bonding layer 434, thus limit or form territory, package footprint 422, be wherein retained in the material of the bonding layer 434 in engaging zones 432 as the target spot for joint covering member wall 104.In a useful especially embodiment, the dry etching technology of such as plasma etching or ion sputtering can be used to etch bonding layer 434.Alternatively, advantageously, according to the material of bonding layer 434, the etching of wet etching or any other type can be used to carry out patterning bonding layer 434.In one embodiment; can planarized bonding layer 434 before patterning, the damage of this substrate of involuntary exposure that the mask that may be caused by pattern during patterning or photoresist coverage deficiency can be avoided to cause or a part for signal pipe line or pollution.In addition, the region that before patterning, planarized bonding layer 434 has been patterned removal by its bonding layer planarized is reduced or stops damage or destroy.
Fig. 4 F illustrates the sectional view exposing the BioMEMS device architecture 400 of signal pipe line 102 after removing sacrifice layer 412.Can be etched with and the removal similar fashion described in sacrifice layer 412 patterning being implemented to sacrifice layer 412 above by such as wet etching or vapour phase.Therefore, in territory, package footprint 422, signal pipe line 102 is exposed.
Fig. 5 A and Fig. 5 B illustrates that one or more embodiment according to the present invention is bonded to the BioMEMS device architecture 400 of covering 206.Fig. 5 A illustrates to have and to be arranged on below covering wall 104 and to cover the embodiment being positioned at the BioMEMS device architecture 400 of the covering joint sheet 204 of the signal pipe line 102 of outside, overlay area 108.Fig. 5 B to illustrate in the region having and be arranged on below covering wall 104 but exposes the embodiment of the BioMEMS device architecture 400 of the covering joint sheet 204 of the Outboard Sections of signal pipe line 102.During the step shown in Fig. 4 B to Fig. 4 F, can remove be retained in outside, overlay area covering joint sheet 204 and expendable material 412 to expose the Outboard Sections of signal pipe line 102.Alternatively, the Outboard Sections of signal pipe line 102 can be exposed in a separate step, such as, after covering 202 is applied to covering joint sheet 204.
The technology that the adhesive of such as epoxy resin is engaged by melting or any other is suitable can be used to join covering wall 104 to covering joint sheet 204.In a useful embodiment, such as, be in the embodiment of oxide at the material of covering joint sheet 204, it may be suitable that the melting using low temperature (< 300 DEG C) to anneal engages.Covering top 206 can be joined to covering wall 104 to form covering 202 and to limit overlay area 108.Gaseous environment or fluent material can be provided by sealable opening to overlay area 108 before joint covering member top 206 or after joint covering member top 206.Retain covering 202 in the embodiment of fluent material can preferably be configured to keep waterproof or liquid-tight in overlay area.Similarly, retain in the embodiment of gas material in overlay area 108, covering 202, the structure and the joint close that comprise covering will be all air-locked.
Then be flattened because bonding layer 434 and covering joint sheet 204 are positioned at above signal pipe line 102 and substrate 106, therefore by covering joint sheet 204 grafting material and covering wall 104 separated with signal pipe line 102 and allow smooth composition surface.Due to by planarized for joint sheet 204, therefore this covering joint sheet 204 may be used for making up may be present in signal pipe line 102 on the surface with the out-of-flatness on substrate 106.Those skilled in the art will recognize that, in order to keep suitable flat surfaces, the thickness of covering joint sheet 204 will at least equal the height of signal pipe line 102, thus covering joint sheet 204 is positioned on the top of signal pipe line 102.In useful especially embodiment, signal pipe line 102 is less than about 600 nanometers, and wherein planarized covering joint sheet 204 is thicker than signal pipe line 102.
Therefore, in order to form BioMEMS microelectromechanicdevices devices, practitioner can provide substrate and be deposited at least one signal pipe line that substrate is arranged.Sacrifice layer 412 can be deposited on signal pipe line and to be patterned the material to remove sacrifice layer 412 from the outside in territory, package footprint 422 alternatively.Bonding layer 434 can be deposited on going up at least partially of signal pipe line and sacrifice layer 412 (if comprising).Planarized and patterning can be carried out to form one or more covering joint sheet 204 and to limit territory, package footprint 422 to bonding layer 434.Covering 202 can be bonded on to limit overlay area 108 on covering joint sheet 204, thus it is inner to make signal pipe line extend to overlay area 108 from outside, overlay area 108.In addition, the test material of such as fluid can be provided in overlay area 108.
In useful embodiment, especially in the embodiment with optical signal conduit 102, the joining technique that use is different from PDMS adhesive avoids the fluorogen absorption and porosity problems that affect signal detection in Bio-optical fluidic system.In addition, when epoxy resin is directly coated to optical signal conduit 102 as grafting material, the refractive index of epoxy resin may stray light signal pipe line 102.Optical signal conduit use oxide may be favourable as bonding layer 434 and follow-up covering joint sheet 204, because oxide has the refractive index lower than signal pipe line usually, therefore, the lightray propagation of oxide not stray light pipeline 102, thus avoid to epoxy resin as the relevant problem of grafting material.
Although describe in detail the embodiment of the present invention and advantage thereof, should be appreciated that, when not deviating from design and the scope of the embodiment that claims limit, various change, replacement and change can have been carried out.Such as, many parts discussed above and function can be implemented and on various substrates for encapsulating various closed system, and especially those have the closed system that optical signal conduit is installed on surface.As another example, those skilled in the art will be readily appreciated that, the purposes of the position of pipeline, the quantity of pipeline, pipeline and pipeline material can be changes, and still retain within the scope of the invention.
And, the scope of the application be not limited in describe in this description technique, machine, manufacture, material component, device, method and step specific embodiment.Should be readily appreciated that according to the present invention as those of ordinary skill in the art, according to the present invention can utilize existing or Future Development for performing the function substantially the same to corresponding embodiment described herein or obtaining the technique of substantially the same result, machine, manufacture, material component, device, method or step.Therefore, claims expection comprises such technique, machine, manufacture, material component, device, method or step within the scope of it.
Claims (19)
1. a micro electro mechanical device, comprising:
Substrate;
At least one signal pipe line, is arranged over the substrate;
At least one covering joint sheet, arrange over the substrate with the top of a part for described signal pipe line, wherein, described covering joint sheet is the oxide of refractive index lower than the refractive index of described signal pipe line; And
Covering, is arranged to and forms overlay area, and described covering is arranged at least one covering joint sheet described, and at least one signal pipe line wherein said extends to inside, described overlay area from outside, described overlay area;
Wherein, described covering is configured to keep the controlled environment in described overlay area.
2. device according to claim 1, comprises further and is arranged in described overlay area and is configured to acceptor interactional with the target molecule of predefined type.
3. device according to claim 1, wherein, described signal pipe line is optical signal conduit.
4. device according to claim 3, be included in the photodetector that described substrate is arranged further, wherein, described optical signal conduit is configured to transport light to target molecule, and described photodetector is configured to detect the response from described target molecule.
5. device according to claim 1, wherein, described signal pipe line is signal of telecommunication pipeline.
6. device according to claim 1, wherein, described covering joins described covering joint sheet to by the one in adhesive, anodic bonding or melting joint.
7. device according to claim 1, wherein, described overlay area is filled with fluid test materials at least in part.
8. a micro electro mechanical device, comprising:
Substrate;
At least one signal pipe line, is arranged over the substrate;
At least one covering joint sheet, there is smooth first surface and arrange over the substrate with the top of a part for described signal pipe line, wherein, at least one covering joint sheet described is the oxide of refractive index lower than the refractive index of described signal pipe line;
Input structure, is connected with described signal pipe line; And
Covering, is arranged to and forms overlay area, and described covering is arranged on the smooth first surface of at least one covering joint sheet described, and at least one signal pipe line wherein said extends to inside, described overlay area from outside, described overlay area.
9. device according to claim 8, comprises further and is arranged in described overlay area and is configured to the interactional surface chemistry layer with target molecule.
10. device according to claim 9, comprises further and is arranged in described overlay area and is configured to acceptor interactional with the target molecule of predefined type.
11. devices according to claim 9, comprise further and are arranged on described substrate and are configured to interactional one or more electrode with described target molecule.
12. 1 kinds, for the formation of the method for microelectromechanicdevices devices, comprising:
Substrate is provided;
Form at least one signal pipe line arranged over the substrate;
At least one signal pipe line described at least partially on form the sacrifice layer be made up of expendable material;
At least one signal pipe line described at least partially on deposit bonding layer;
Bonding layer described in patterning is to form one or more covering joint sheet and to limit territory, package footprint, and wherein, described covering joint sheet is the oxide of refractive index lower than the refractive index of at least one signal pipe line described; And
Covering is joined to covering joint sheet, at least one signal pipe line wherein said extends to territory, described package footprint from overseas portion, described package footprint inner.
13. methods according to claim 12, wherein, formed described sacrifice layer before the described bonding layer of deposition, wherein bonding layer described in the disposed thereon of at least one signal pipe line described and described sacrifice layer.
14. methods according to claim 13, comprise: further after bonding layer described in patterning, remove expendable material from territory, described package footprint.
15. methods according to claim 12, comprise further: planarized described bonding layer before bonding layer described in patterning.
16. methods according to claim 12, wherein, provide described substrate to comprise to be provided in one or more electrodes that described substrate is arranged.
17. methods according to claim 16, wherein, described covering joint sheet is thicker than described signal pipe line.
18. methods according to claim 12, wherein, join described covering to described covering joint sheet by the one during anodic bonding, melting joint or epoxy resin engage.
19. methods according to claim 12, comprise further: be provided in the fluid test materials arranged in the region that limited by described covering.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261641657P | 2012-05-02 | 2012-05-02 | |
| US61/641,657 | 2012-05-02 | ||
| US13/652,999 | 2012-10-16 | ||
| US13/652,999 US8791557B2 (en) | 2012-05-02 | 2012-10-16 | Microelectromechanical device with integrated package |
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| Publication Number | Publication Date |
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| CN103382016A CN103382016A (en) | 2013-11-06 |
| CN103382016B true CN103382016B (en) | 2015-11-04 |
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| FR2961899A1 (en) * | 2010-06-29 | 2011-12-30 | Commissariat Energie Atomique | METHOD FOR FUNCTIONALIZING THE FLUIDIC VEINS CONTAINED IN A MICROMECHANICAL DEVICE, MICROMECHANICAL DEVICE, MICROMECHANICAL DEVICE COMPRISING FUNCTIONALIZED VEINS AND METHOD FOR PRODUCING THE SAME |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6929974B2 (en) * | 2002-10-18 | 2005-08-16 | Motorola, Inc. | Feedthrough design and method for a hermetically sealed microdevice |
| US7807506B2 (en) * | 2006-02-03 | 2010-10-05 | Infineon Technologies Ag | Microelectromechanical semiconductor component with cavity structure and method for producing the same |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102081041A (en) * | 2009-11-27 | 2011-06-01 | 采钰科技股份有限公司 | Biosensor devices and method for fabricating the same |
| FR2961899A1 (en) * | 2010-06-29 | 2011-12-30 | Commissariat Energie Atomique | METHOD FOR FUNCTIONALIZING THE FLUIDIC VEINS CONTAINED IN A MICROMECHANICAL DEVICE, MICROMECHANICAL DEVICE, MICROMECHANICAL DEVICE COMPRISING FUNCTIONALIZED VEINS AND METHOD FOR PRODUCING THE SAME |
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